A flexible circuit board etching process

Abstract

The present invention relates to the technical field of flexible circuit boards, and in particular to a flexible circuit board etching process, comprising the following steps: A. obtaining a slot distribution and slot width W' on a flexible circuit board; B. performing a slotting process on a substrate based on the slot distribution and slot width W' to obtain positioning slots, wherein the positioning slot distribution coincides with the slot distribution; C. masking the substrate, then exposing and developing the substrate to form an etch-resistant layer; the etch-resistant layer formed by the exposure and development only exposes the positioning slots; D. spraying an etching liquid on the substrate to fill the positioning slots with the etching liquid, and etching the inner walls of the positioning slots with the etching liquid within the positioning slots; and E. cleaning the substrate. The present invention utilizes etching liquid to fill the positioning slots, i.e., utilizes side etching to achieve slot formation, so that the etching direction can be controlled, which facilitates the low-cost preparation of vertical slots.

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