A self-centering planarization head for planarizing a square substrate

Abstract

The application discloses a self-centering leveling and polishing head for square substrate planarization, which comprises a lower annular base, an upper annular base coaxially arranged in the middle of the lower annular base, a fluororubber gasket ring arranged between the upper annular base and the lower annular base and fixedly connected with the upper annular base and the lower annular base respectively, a guide shaft with an upper end movably sleeved with the upper annular base and a lower end fixedly sleeved with the lower annular base, so that the fluororubber gasket ring, the upper annular base, the guide shaft and the lower annular base jointly form an upper pressure cavity, a polishing head flange fixedly connected with the upper end of the upper annular base, and a guide ring fixedly connected with the bottom of the lower annular base and used for embedding a square substrate to be processed, wherein the polishing head flange is provided with a first air channel, the upper annular base is provided with a second air channel penetrating along the axial direction and in communication with the first air channel, and the other end of the second air channel relative to the first air channel is in communication with the upper pressure cavity. The application has the characteristics of reasonable design.

Description

Technical Field

[0001] This invention relates to the field of polishing, and in particular, to a self-centering leveling polishing head for planarizing square substrates. Background Technology

[0002] The mask substrate is a core component of extreme ultraviolet (EUV) lithography machines, and its performance directly determines the resolution of the lithography machine and the yield of chip manufacturing. Since EUV lithography uses extreme ultraviolet light with a wavelength of 13.5nm, almost all materials strongly absorb this wavelength of light, making traditional transmissive masks unsuitable. Therefore, EUV masks must rely on reflective multilayer film structures (such as molybdenum / silicon multilayer films). The mask substrate, as the physical support of this structure, has surface roughness (sub-nanometer level) and topographic flatness that directly affect the reflection efficiency and optical phase accuracy of the multilayer film. Any tiny defects or thermal expansion deformation (requiring the use of low thermal expansion materials such as ULE glass) will cause light scattering or pattern shift, thereby reducing pattern fidelity. Therefore, the substrate must be planarized at the atomic level through ultra-precision polishing.

[0003] In this process, the surface design and precision of the polishing mold are key to the planarization effect. Its contour must be highly matched with the substrate morphology to remove material uniformly. At the same time, dynamic pressure control technology is combined to ensure uniform stress distribution in the polishing contact area and avoid subsurface damage or residual stress accumulation caused by local overpressure or underpressure. Stress control runs through the entire polishing process. From material removal rate and temperature gradient management to polishing fluid flow field optimization, all need to be precisely coordinated to suppress substrate warping or micro-strain caused by thermo-mechanical coupling effect. Ultimately, it achieves synergistic control of nanometer-level surface precision and sub-nanometer-level roughness, meeting the stringent requirements of extreme ultraviolet lithography for mask substrates to be "ultra-flat, ultra-smooth, and ultra-low stress". Summary of the Invention

[0004] In view of this, the purpose of this invention is to provide a self-centering and leveling polishing head for planarizing square substrates, which has a reasonable design.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: A self-aligning leveling head for planarizing square substrates includes: Lower ring matrix; The upper annular matrix is ​​coaxially positioned in the middle of the lower annular matrix; A fluororubber gasket ring is located between the upper annular base and the lower annular base, and is fixedly connected to the upper annular base and the lower annular base respectively; The guide shaft has its upper end movably sleeved with the upper annular base and its lower end fixedly sleeved with the lower annular base, so that the fluororubber gasket, the upper annular base, the guide shaft and the lower annular base together form the upper pressure chamber. The flange is fixedly connected to the upper end of the upper annular base; And a guide ring, which is fixedly connected to the bottom of the lower annular base and nested with a square substrate to be processed; The flange of the throwing head is provided with a first air passage, and the upper annular base is provided with a second air passage that is connected and communicated with the first air passage along the axial direction. The other end of the second air passage is connected to the upper pressure chamber.

[0006] Preferably, the guide shaft includes a shaft body and an annular cover integrally formed at the lower end of the shaft body; A shaft hole is provided axially through the middle of the upper annular base, and the shaft is movably sleeved in the shaft hole; The outer wall of the ring cover is integrally formed with a first convex ring; the inner side of the lower annular base is provided with a second convex ring, a lower gasket is provided between the first convex ring and the second convex ring, and an upper gasket is provided on the upper end face of the ring cover; a gasket pressing ring for pressing the upper gasket, the first convex ring and the lower gasket against the second convex ring is fixedly connected to the lower annular base.

[0007] Preferably, it further includes a first inner pressure ring and a first outer pressure ring; the first inner pressure ring is fixedly connected to the upper annular base to press the fluororubber gasket ring against the upper annular base; the first outer pressure ring is fixedly connected to the lower annular base to press the fluororubber gasket ring against the lower annular base.

[0008] Preferably, a second inner pressure ring is further provided between the first inner pressure ring and the fluororubber gasket ring; a second outer pressure ring is further provided between the first outer pressure ring and the fluororubber gasket ring.

[0009] Preferably, an annular airbag clamp is fixedly connected to the bottom of the lower annular base, and the bottom of the airbag clamp has an annular groove; a first silicone rubber gasket is clamped between the lower annular base and the guide ring; a lower pressure ring is fixedly connected to the airbag clamp, and the lower pressure ring is used to press the first silicone rubber gasket against the lower end face of the airbag clamp. The annular groove and the first silicone rubber gasket ring form a lower pressure chamber; The ejector flange is provided with a third air passage, and the upper annular base is provided with a fourth air passage that is connected and communicates with the third air passage. The fourth air passage is equipped with a first quick connector. The lower annular base is provided with a fifth air passage, and the upper end of the fifth air passage is equipped with a second quick connector. The first quick connector and the second quick connector are connected by a connecting pipe. The airbag clamp is provided with a sixth air passage for connecting the fifth air passage and the lower pressure chamber. A first sealing ring is provided between the airbag clamp and the lower annular base.

[0010] Preferably, a heightening pad is clamped between the first silicone rubber pad ring and the guide ring.

[0011] Preferably, an inner heightening pad is clamped between the first silicone rubber pad ring and the lower pressure ring.

[0012] Preferably, a second silicone rubber pad is fixedly connected to the bottom of the first silicone rubber pad and between the airbag clamp and the guide ring; the thickness of the second silicone rubber pad is greater than that of the first silicone rubber pad.

[0013] Preferably, the edge of the guide ring is provided with a wedge-shaped chamfer.

[0014] The main technical effects of this invention are reflected in the following aspects: 1. The self-centering structure of the sprue head can solve the stress dispersion problem of square substrates.

[0015] 2. The centering and locking structure with an outer circle and inner square of the blasting head and wedge-shaped chamfers around the edges can achieve detailed pressure control at the corners and improve the accuracy of mask substrate planarization. Attached Figure Description

[0016] Figure 1-2 This is a three-dimensional model of the self-centering and leveling polishing head in the embodiment; Figure 3-4 This is a cross-sectional view of the self-centering and leveling throwing head in the embodiment.

[0017] Reference numerals: 1. Flange; 101. First air passage; 102. Third air passage; 2. Upper annular base; 201. Second air passage; 202. Fourth air passage; 3. Guide shaft; 301. Shaft body; 302. Ring cover; 303. First convex ring; 4. Second sealing ring; 5. Fluororubber gasket ring; 6. Second inner pressure ring; 7. First inner pressure ring; 8. Second outer pressure ring; 9. First outer pressure ring; 10. Lower annular base; 1001. Fifth air passage; 1002. 11. Second convex ring; 12. Upper gasket; 13. Gasket pressure ring; 14. Lower gasket; 15. Airbag clamp; 16. Annular groove; 17. Sixth air passage; 18. First sealing ring; 19. First silicone rubber gasket ring; 20. Second silicone rubber gasket ring; 21. Inner heightening gasket ring; 22. Lower pressure ring; 23. Outer heightening gasket ring; 24. Guide ring; 25. Wedge-shaped guide angle; 26. First quick connector; 27. Second quick connector; A. Upper pressure chamber; B. Lower pressure chamber. Detailed Implementation

[0018] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, so that the technical solution of the present invention can be more easily understood and mastered.

[0019] Reference Figures 1-4This embodiment provides a self-aligning and leveling polishing head for planarizing square substrates, including an upper annular base 2, a lower annular base 10, a fluororubber gasket ring 5, a guide shaft 3, a polishing head flange 1, a guide ring 21, a first inner pressure ring 7, a first outer pressure ring 9, an airbag clamp 14, and a first silicone rubber gasket ring 16.

[0020] The throwing head flange 1 is fixedly connected to the upper end of the upper annular base 2, and the throwing head flange 1 is provided with the first gas and the third gas passage 102.

[0021] The upper annular base 2 is coaxially placed in the middle of the lower annular base 10.

[0022] The guide shaft 3 includes a shaft body 301 and an annular cover 302 integrally formed at the lower end of the shaft body 301. A shaft hole is axially provided through the middle of the upper annular base 2, and the shaft body 301 is movably fitted into the shaft hole; a second sealing ring 4 is also nested on the outer wall of the shaft body 301. A first convex ring 303 is integrally formed on the outer wall of the annular cover 302; a second convex ring 1002 is provided on the inner side of the lower annular base 10, and a lower gasket 13 is provided between the first convex ring 303 and the second convex ring 1002; an upper gasket 11 is provided on the upper end face of the annular cover 302; a gasket pressure ring 12 is fixedly connected to the lower annular base 10 to press the upper gasket 11, the first convex ring 303, and the lower gasket 13 against the second convex ring 1002. This structure enables the upper end of the guide shaft 3 to be movably fitted with the upper annular base 2, and the lower end of the guide shaft 3 to be fixedly fitted with the lower annular base 10.

[0023] A fluororubber gasket 5 is located between the upper annular base 2 and the lower annular base 10, and is fixedly connected to both the upper annular base 2 and the lower annular base 10. More specifically, a first inner pressure ring 7 is fixedly connected to the upper annular base 2 to press the fluororubber gasket 5 tightly against the upper annular base 2; a first outer pressure ring 9 is fixedly connected to the lower annular base 10 to press the fluororubber gasket 5 tightly against the lower annular base 10. A second inner pressure ring 6 is also provided between the first inner pressure ring 7 and the fluororubber gasket 5; a second outer pressure ring 8 is also provided between the first outer pressure ring 9 and the fluororubber gasket 5. Through the above structure, the fluororubber gasket 5 can be firmly and tightly connected to the upper annular base 2 and the lower annular base 10 respectively. At the same time, the fluororubber gasket 5, the upper annular base 2, the guide shaft 3, and the lower annular base 10 together constitute the upper pressure chamber A.

[0024] The flange 1 of the blasting head is provided with a first air passage 101, and the upper annular base 2 is provided with a second air passage 201 that is connected and communicated with the first air passage 101 through the axial direction. The other end of the second air passage 201 relative to the first air passage 101 is connected to the upper pressure chamber A.

[0025] By applying pressure to the upward pressure chamber A, the guide ring 21 can be pressed against the polishing mold, and the upper surface of the polishing mold can be made flat, thereby controlling the local flatness.

[0026] The guide ring 21 is fixedly connected to the bottom of the lower annular base 10 and is nested with the square substrate to be processed. The edge of the guide ring 21 is provided with a wedge-shaped chamfer.

[0027] The airbag clamp 14 is fixedly connected to the bottom of the lower annular base 10, and the airbag clamp 14 is annular. The bottom of the airbag clamp 14 has an annular groove 141; a first silicone rubber gasket 16 is clamped between the lower annular base 10 and the guide ring 21; a lower pressure ring 19 is fixedly connected to the airbag clamp 14, and the lower pressure ring 19 is used to press the first silicone rubber gasket 16 against the lower end face of the airbag clamp 14. In addition, an outer raising gasket 20 is clamped between the first silicone rubber gasket 16 and the guide ring 21; an inner raising gasket 18 is clamped between the first silicone rubber gasket 16 and the lower pressure ring 19. With the above structure, a lower pressure chamber B is formed between the annular groove 141 and the first silicone rubber gasket 16.

[0028] The ejector flange 1 is provided with a third air passage 102. The upper annular base 2 is provided with a fourth air passage 202 that is connected to the third air passage 102. The fourth air passage 202 is equipped with a first quick connector 22. The lower annular base 10 is provided with a fifth air passage 1001. The upper end of the fifth air passage 1001 is equipped with a second quick connector 23. The first quick connector 22 and the second quick connector 23 are connected by a connecting pipe. The airbag clamp 14 is provided with a sixth air passage 142 for connecting the fifth air passage 1001 and the lower pressure chamber B. A first sealing ring 15 is provided between the airbag clamp 14 and the lower annular base 10.

[0029] Additionally, a second silicone rubber pad 17 is fixedly connected at the bottom of the first silicone rubber pad 16 and between the airbag clamp 14 and the guide ring 21; the thickness of the second silicone rubber pad 17 is greater than that of the first silicone rubber pad 16.

[0030] By applying pressure to the downward pressure chamber B, processing pressure is applied to the back of the square substrate through the second silicone rubber pad ring 17, adjusting the removal rate for localized areas while simultaneously accelerating the removal rate.

[0031] Of course, the above are just typical examples of the present invention. In addition, the present invention may have many other specific embodiments. All technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of protection claimed by the present invention.

Claims

1. A self-aligning leveling head for planarizing square substrates, characterized in that, include: Lower annular matrix (10); The upper annular matrix (2) is coaxially placed in the middle of the lower annular matrix (10); Fluororubber gasket ring (5) is located between the upper annular base (2) and the lower annular base (10), and is fixedly connected to the upper annular base (2) and the lower annular base (10) respectively. The guide shaft (3) is movably sleeved with the upper annular base (2) at its upper end and fixedly sleeved with the lower annular base (10) at its lower end, so that the fluororubber gasket (5), the upper annular base (2), the guide shaft (3) and the lower annular base (10) together constitute the upper pressure chamber (A). The flange (1) is fixedly connected to the upper end of the upper annular base (2); And a guide ring (21), which is fixedly connected to the bottom of the lower annular base (10) and nested with a square substrate to be processed; The ball-throwing flange (1) is provided with a first air passage (101), and the upper annular base (2) is provided with a second air passage (201) that is connected and communicated with the first air passage (101) along the axial direction. The other end of the second air passage (201) relative to the first air passage (101) is connected to the upper pressure chamber (A). A ring-shaped airbag clamp (14) is fixedly connected to the bottom of the lower annular base (10), and the bottom of the airbag clamp (14) has an annular groove (141); a first silicone rubber pad ring (16) is clamped between the lower annular base (10) and the guide ring (21); a lower pressure ring (19) is fixedly connected to the airbag clamp (14), and the lower pressure ring (19) is used to press the first silicone rubber pad ring (16) against the lower end face of the airbag clamp (14); The annular groove (141) and the first silicone rubber gasket (16) form a lower pressure chamber (B); The throwing head flange (1) is provided with a third air passage (102), and the upper annular base (2) is provided with a fourth air passage (202) that is connected and communicates with the third air passage (102). The fourth air passage (202) is equipped with a first quick connector (22). The lower annular base (10) is provided with a fifth air passage (1001), and the upper end of the fifth air passage (1001) is equipped with a second quick connector (23). The first quick connector (22) and the second quick connector (23) are connected by a connecting pipe. The airbag clamp (14) is provided with a sixth air passage (142) for connecting the fifth air passage (1001) and the lower pressure chamber (B). A first sealing ring (15) is provided between the airbag clamp (14) and the lower annular base (10).

2. The self-aligning leveling head for planarizing square substrates as described in claim 1, characterized in that, The guide shaft (3) includes a shaft body (301) and an annular cover (302) integrally formed at the lower end of the shaft body (301); The upper annular base (2) has a shaft hole that extends through the middle along the axial direction, and the shaft (301) is movably sleeved in the shaft hole; The outer wall of the ring cover (302) is integrally formed with a first convex ring (303); the inner side of the lower annular base (10) is provided with a second convex ring (1002), a lower gasket (13) is provided between the first convex ring (303) and the second convex ring (1002), and an upper gasket (11) is provided on the upper end face of the ring cover (302); a gasket pressing ring (12) for pressing the upper gasket (11), the first convex ring (303) and the lower gasket (13) against the second convex ring (1002) is fixedly connected to the lower annular base (10).

3. The self-aligning leveling head for planarizing square substrates as described in claim 1, characterized in that, It also includes a first inner pressure ring (7) and a first outer pressure ring (9); the first inner pressure ring (7) is fixedly connected to the upper annular base (2) to press the fluororubber gasket (5) against the upper annular base (2); the first outer pressure ring (9) is fixedly connected to the lower annular base (10) to press the fluororubber gasket (5) against the lower annular base (10).

4. The self-aligning leveling head for planarizing square substrates as described in claim 3, characterized in that, A second inner pressure ring (6) is also provided between the first inner pressure ring (7) and the fluororubber gasket ring (5); a second outer pressure ring (8) is also provided between the first outer pressure ring (9) and the fluororubber gasket ring (5).

5. The self-aligning leveling head for planarizing square substrates as described in claim 1, characterized in that, A heightening pad is clamped between the first silicone rubber pad ring (16) and the guide ring (21).

6. The self-aligning leveling head for planarizing square substrates as described in claim 5, characterized in that, An inner heightening pad (18) is clamped between the first silicone rubber pad ring (16) and the lower pressure ring (19).

7. The self-aligning leveling head for planarizing square substrates as described in claim 1, characterized in that, A second silicone rubber pad (17) is fixedly connected to the bottom of the first silicone rubber pad (16) and between the airbag clamp (14) and the guide ring (21); the thickness of the second silicone rubber pad (17) is greater than that of the first silicone rubber pad (16).

8. The self-aligning leveling head for planarizing square substrates as described in claim 1, characterized in that, The edge of the guide ring (21) is provided with a wedge-shaped chamfer (211).

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