一种用于电子产品外壳的热转印工艺
By preparing a microporous transition layer on a silicone shell and using specific heat transfer inks, combined with high-frequency vibration and negative pressure treatment, the problems of pattern adhesion and accuracy in traditional heat transfer processes are solved, achieving a heat transfer effect with high adhesion and high accuracy.
CN120134821BActive Publication Date: 2026-07-17AIMI NEW MATERIALS (DONGGUAN) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AIMI NEW MATERIALS (DONGGUAN) CO LTD
- Filing Date
- 2025-03-26
- Publication Date
- 2026-07-17
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Figure CN120134821B_ABST
Abstract
本发明涉及热转印技术领域，具体地说是一种用于电子产品外壳的热转印工艺。一种用于电子产品外壳的热转印工艺，包括以下步骤：外壳处理剂的制备及硅胶外壳的处理；热转印油墨的制备；微孔过渡层硅胶外壳的热转印。本发明通过将聚丙烯酸钠和氧化铝水溶胶混合均匀后升温，然后在搅拌下依次加入荷叶蜡质、聚氨酯水性树脂、乙二醇、魔芋葡甘聚糖和环氧大豆油，高速剪切得到热转印油墨，各成分复合的油墨具有高相容性和抗沉降性，配合外壳处理剂形成的微孔过渡层能够大幅提升转印图案的精准性以及强度，并且所得转印图案的附着力也大幅增强。
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