An electronic chip defect detection apparatus and method

Abstract

The application relates to the technical field of chip defect detection, and specifically discloses an electronic chip defect detection device and method, wherein the device comprises a machine body with a warehouse door mounted on the surface; a detection cavity is arranged in the machine body; a detection station and a detection assembly are respectively arranged in the detection cavity; the detection station comprises a station disc; a groove is arranged at the middle position of the station disc; a plurality of clamping pieces for clamping the to-be-detected chip are arranged at the upper part of the groove; the clamping pieces are connected with a rotating mechanism arranged at the lower part of the station disc and are driven to rotate by the rotating mechanism; the detection assembly is arranged above the station disc and comprises a detection rod and a detection head; the bottom of the detection rod is connected with the detection head; the detection rod and the detection cavity are connected through an angle swinging mechanism; the detection angle of the detection head is adjusted through the angle swinging mechanism; the to-be-detected chip is comprehensively and multi-angle detected; and the detection efficiency and the detection precision of the device are improved.

Description

Technical Field

[0001] This invention relates to the field of chip defect detection technology, and specifically discloses an electronic chip defect detection device and method. Background Technology

[0002] As a core component of modern electronic devices, the integrity of the surface and structure of electronic chips directly affects product performance and reliability. With the refinement of chip manufacturing processes, the difficulty of detecting surface defects (such as micro-scratches and cracks) has increased significantly. These defects may lead to potential risks such as short circuits and signal interference, making high-precision testing technology a necessity in the industry.

[0003] Traditional electronic chip defect detection devices mostly use a fixed-angle detection head (such as a vertically mounted camera) to scan the chip surface from a single perspective. For example, the existing patent application number 202210285697.6 discloses a semiconductor chip defect detection device. Although it has a detection mechanism, a scanner that can automatically detect semiconductor chips located on the conveying mechanism, and a rejection component that works with a vacuum component and a transmission component to automatically separate and collect defective semiconductor chips, and uses a counter for re-inspection, it still has certain shortcomings in the detection process:

[0004] In other words, when there are tiny scratches or damage on the surface of the chip under test, due to the reflective properties of the smooth surface, the vertical scanner has difficulty capturing the defect features at a specific angle, which may lead to missed or false detections in the test results, thus affecting the test effect.

[0005] Therefore, the industry urgently needs to develop a device and method that can perform multi-angle, high-precision detection of surface defects in electronic chips. Summary of the Invention

[0006] The purpose of this invention is to provide an electronic chip defect detection device to solve the technical problem that traditional devices using fixed-angle detection heads have difficulty capturing defect features at specific angles, which leads to unfavorable limitations on their detection results and accuracy.

[0007] Specifically, the present invention is achieved through the following technical solution:

[0008] An electronic chip defect detection device includes a body with a door mounted on its surface, and a detection chamber is provided inside the body. A detection station and a detection component are respectively installed in the detection chamber.

[0009] The testing station includes a testing plate with a groove in the middle. Multiple clamping components for holding the chip under test are provided on the upper part of the groove. The clamping components are connected to a rotating mechanism located at the lower part of the testing plate, and the rotating mechanism is used to drive the clamping components to rotate.

[0010] The detection component is located above the workstation panel and includes a detection rod and a detection head. The bottom of the detection rod is connected to the detection head, and the detection rod is connected to the detection cavity through an angle swing mechanism. The detection angle of the detection head is adjusted by swinging the angle swing mechanism.

[0011] The angle swing mechanism includes swing rods, which are vertically attached to the two symmetrical sides of the detection cavity opposite to the work plate. The two ends of the detection rod are connected across the tops of the two swing rods, and the bottom ends of each swing rod are hinged to the side of the detection cavity through hinges. On the back of one of the swing rods, there is also a swing drive for driving the swing rod to swing left and right with the hinge as the reference point.

[0012] Based on the above technical solution, it should be noted that this solution combines the detection head with the angle swing mechanism. The swing drive drives the swing rod to swing left and right around the hinge as the reference point, thereby making the detection rod and the detection head swing synchronously and periodically. This breaks through the limitations of traditional fixed angle detection and can scan the chip surface from different angles. It is especially suitable for detecting those minute defects that only show features at specific angles. That is, when the detection head observes the chip surface from a side tilt angle, the light reflection characteristics change. The minute scratches and damage that are difficult to detect in the vertical direction will become more obvious due to the scattering of light and the shadow effect, thus significantly improving the sensitivity and accuracy of detection.

[0013] Furthermore, the comprehensiveness of the inspection is further enhanced by setting up a rotating mechanism at the inspection station. That is, by driving the clamping parts and the chip to rotate through the rotating mechanism, and coordinating with the swing of the inspection head, the chip surface can be inspected from all directions and from multiple angles. The collaborative working mechanism of the two ensures that every area of ​​the chip can be fully inspected, effectively avoiding the omission of defects caused by a single inspection angle or a fixed chip position, thereby greatly improving the inspection efficiency of the device and the accuracy of the inspection results.

[0014] In the above scheme, the rotating mechanism is vertically installed in the detection chamber at the lower part of the workstation plate via a support rod, and includes:

[0015] A rotating sleeve is rotatably sleeved on the outside of the support rod, and a rotating ring is rotatably embedded around the outside of the workstation plate by means of a bracket at the top of the rotating sleeve. Multiple clamping elements are arrayed on the rotating ring.

[0016] The drive motor is installed on one side of the bottom of the detection cavity and located directly below any swing arm;

[0017] The transmission gear set is located between the output shaft of the drive motor and the rotating sleeve, and is used to transmit the output torque of the drive motor output shaft to the rotating sleeve.

[0018] The rotating mechanism disclosed in the above scheme achieves stable rotation of the chip under test through the coordinated work of the support rod, rotating sleeve, rotating ring, drive motor and transmission gear set.

[0019] In the above scheme, the transmission gear set further includes two bevel gears that mesh with each other and form a certain angle. One of the bevel gears is mounted on the output shaft of the drive motor, while the other bevel gear is rotatably sleeved on the outside of the support rod and connected to the bottom end of the rotating sleeve. Based on the specific mechanism of the transmission gear set disclosed above, it is convenient that when the drive shaft of the drive motor drives one of the bevel gears to rotate, it can simultaneously drive the other bevel gear meshing with it to rotate. Thus, through the two meshing bevel gears, the power output of the drive shaft of the drive motor can be stably transmitted to the rotating sleeve, which is beneficial to the rotation of the rotating sleeve.

[0020] Specifically, in the above scheme, the swing drive includes:

[0021] A rotating disk is rotatably connected to the side wall of the detection chamber. An eccentric protrusion is provided on the surface of the rotating disk. The end of the protrusion away from the rotating disk extends into a strip groove formed in the middle of the swing rod. The protrusion slides and adapts to the strip groove. The rotating disk is connected to the output shaft of the drive motor of the rotating mechanism through a transmission belt.

[0022] Based on the specific structure of the swing drive component disclosed in the above scheme, it cleverly transforms the rotational motion of the drive shaft of the drive motor into the left-right periodic swing of the swing rod through the structural design of the rotating disk, the eccentrically set protruding rod, the swing rod and the strip groove. This enables the detection head to swing left and right without the need for an additional power source, so as to realize the detection head to perform multi-angle coverage detection of the chip under test, improve the detection accuracy of the detection head, greatly reduce the complexity of the equipment, and reduce the interference caused by the complexity of the equipment to the normal detection work of the detection head.

[0023] In the above solution, more preferably, a plurality of bottom detection components for detecting the bottom of the chip under test are arrayed within the groove. Each bottom detection component includes a support block whose bottom is connected to the groove via an elastic element. A plurality of rolling balls that roll in contact with the bottom of the chip under test are arrayed on the upper part of the support block. A pressure sensor is disposed inside the elastic element. This solution, through the bottom detection components disclosed above, further achieves comprehensive detection of the bottom of the chip.

[0024] In the above scheme, the detection head includes multiple line-scan optical cameras arrayed along the length of the detection rod at its bottom. The line-scan optical cameras enable line-by-line scanning of the rotating surface of the chip under test during detection, ensuring comprehensive coverage of the entire surface.

[0025] In the above scheme, the projection point of the center point of the chip under test on the side wall where the detection cavity and the swing rod are hinged is located on the extension line of the center line of the swing rod, and the hinge at the bottom of the swing rod is also located on the center line of the swing rod. Based on the above design, it is ensured that when the swing rod drives the detection rod and the detection head to swing, it can always swing symmetrically around the central axis of the chip. This allows the detection head to perform comprehensive detection of the chip surface at different angles, avoiding uneven detection range or detection blind spots caused by the positional deviation of the swing rod. It also helps to improve the stability and detection accuracy of the detection device, ensuring the reliability and consistency of the detection results.

[0026] Based on the electronic chip defect detection device disclosed in the above scheme, an electronic chip defect detection method is proposed here. Specifically, the method includes the following steps:

[0027] Step 1, chip clamping: Place the chip to be tested in the work station tray and clamp and fix the chip to be tested by the clamping member, while the ball of the bottom detection member contacts the bottom of the chip to be tested.

[0028] Step 2, surface defect detection: Start the rotation mechanism to drive the clamping part and rotate the chip under test in the workstation. At the same time, start the swing drive of the swing mechanism to drive the swing rod to swing left and right with the hinge at its bottom as the reference point. After the swing rod swings, it drives the detection rod to swing synchronously and periodically, so that the detection head at the bottom of the detection rod can perform multi-angle image detection on the surface of the rotating chip under test.

[0029] Step 3, bottom flatness detection: When the chip under test rotates with the clamping component, the bottom detection component contacts the bottom surface of the chip through the rolling ball. Combining the compression of the elastic component and the pressure sensor data, the flatness of the bottom surface of the chip under test is detected.

[0030] Step 4: Output the results. By connecting to an external control terminal, read the pressure sensor data and the detection head image data to obtain the detection results, determine whether the chip quality is qualified, and stop the machine to remove the chip under test.

[0031] Based on the detection scheme disclosed above, it achieves accurate detection of the flatness of the chip bottom, solving the problem of insufficient detection of the chip bottom by traditional detection methods.

[0032] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0033] 1. This invention solves the problem of limited viewing angle in traditional fixed-angle detection by setting up a rotation mechanism and an angle swing mechanism, which work together to solve the problem of limited viewing angle in traditional fixed-angle detection. Specifically, when the chip is driven to rotate by the rotation mechanism, the swing drive component is driven to convert the rotation of the motor into the periodic tilting swing of the detection head, so as to form a multi-angle comprehensive detection of the chip under test. This allows the detection head to detect the surface condition of the chip under test at different scanning angles, thereby effectively capturing the subtle defects that are difficult to detect by traditional fixed-angle detection, thus significantly improving the detection accuracy of the device. At the same time, under the power drive of the same electric motor, the invention achieves high integration of the device in a limited space through the ingenious structural design of the rotation mechanism and the swing drive component. It effectively synchronizes the swinging motion of the scanning head with the rotation motion of the chip under test, greatly reducing the complexity of the detection device, simplifying the control logic, and avoiding the problems of complex device equipment and detection interference caused by traditional multiple power sources.

[0034] 2. This invention achieves dynamic quantitative detection of the bottom surface of the chip under test by setting a bottom detection component and introducing a combination design of a ball array, an elastic component, and a pressure sensor. That is, when the chip rotates, the ball rolls and contacts the bottom surface. The compression of the elastic component and the pressure change data of the pressure sensor are used to reflect in real time whether there are local defects on the bottom of the chip under test, such as deformation, cracks, pits, etc., thereby greatly improving the comprehensiveness of the device in detecting the chip under test and making the device's detection effect better. Attached Figure Description

[0035] The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0036] Figure 1 This is a schematic diagram of the overall external structure of the present invention;

[0037] Figure 2 This is a side view of the internal structure of the present invention, intended to show its specific internal structure;

[0038] Figure 3 This is a frontal view of the internal structure of the present invention;

[0039] Figure 4 For the present invention Figure 2 The enlarged structural diagram at point A in the diagram is intended to show the specific structure of the clamping component and the bottom detection component.

[0040] Figure 5 This is a schematic diagram of the swing rod swing structure of the present invention, intended to illustrate its swing state;

[0041] Figure 6 This is a schematic diagram of the vertical direction detection scanning of the detection head of the present invention;

[0042] Figure 7 This is a flowchart illustrating the detection method of the present invention.

[0043] The reference numerals in the attached figures represent:

[0044] 1. Machine body; 11. Door; 2. Inspection station; 21. Station plate; 22. Clamping parts; 221. L-shaped plate; 222. Pressure plate; 223. Chuck; 224. Adjusting bolt; 231. Rotating sleeve; 232. Drive motor; 233. Bevel gear; 234. Rotating ring; 24. Bottom inspection parts; 241. Support block; 242. Ball bearing; 243. Elastic element; 244. Pressure sensor; 3. Inspection components; 31. Inspection rod; 331. Inspection head; 321. Swing rod; 322. Rotary disk; 323. Protruding rod; 324. Strip groove; 325. Transmission belt. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments and accompanying drawings. The illustrative embodiments and descriptions of this invention are for illustrative purposes only and are not intended to limit the invention. It should be noted that this invention is already in the actual research and development stage.

[0046] Example 1;

[0047] Please see Figures 1 to 3 As shown, this embodiment discloses an electronic chip defect detection device, including a body 1 with a door 11 mounted on its surface, a detection chamber inside the body 1, and a detection station 2 and a detection component 3 respectively installed in the detection chamber;

[0048] The testing station 2 includes a station disk 21, with a groove in the middle of the station disk 21. Multiple clamping members 22 for clamping the chip to be tested are provided on the upper part of the groove. The clamping members 22 are connected to a rotating mechanism located at the lower part of the station disk 21. The rotating mechanism is used to drive the clamping members 22 to rotate.

[0049] The detection component 3 is located above the workstation plate 21 and includes a detection rod 31 and a detection head 331. The bottom of the detection rod 31 is connected to the detection head 331, and the detection rod 31 is connected to the detection cavity through an angle swing mechanism. The detection angle of the detection head 331 is adjusted by swinging through the angle swing mechanism.

[0050] The angle swing mechanism includes a swing rod 321, which is vertically attached to two symmetrical sides of the detection cavity relative to the work station plate 21. The two ends of the detection rod 31 are connected across the top ends of the two swing rods 321, and the bottom ends of each swing rod 321 are hinged to the side of the detection cavity through a hinge. On the back of one of the swing rods 321, there is also a swing drive for driving the swing rod 321 to swing left and right with the hinge as the reference point.

[0051] It should be noted that the electronic chip addressed in this embodiment is a circular, sheet-like chip board. While traditional electronic chip inspection devices can detect defects on the chip surface to some extent, they are limited in their detection capabilities and struggle to accurately identify minute scratches and damage. Specifically, this is because some minute defects are difficult to detect when observed at specific angles (such as vertically) due to light reflection and viewing angle. For example, when observing the chip surface vertically, the surface of the chip under test reflects a large amount of light, making it difficult to detect minute scratches or damage. This is because the depth and width of these defects may be very small, failing to create obvious shadows or reflection differences at direct light angles. Therefore, this greatly limits the detection efficiency and accuracy of the inspection device. Therefore, in this embodiment, by combining the detection head 331 with the angle swing mechanism, the swing rod 321 is driven by the swing drive to swing left and right around the hinge as the reference point, thereby making the detection rod 31 and the detection head 331 swing synchronously and periodically. This breaks through the limitations of traditional fixed angle detection and can scan the chip surface from different angles. It is especially suitable for detecting those minute defects (such as surface scratches) that only show features at specific angles. That is, when the detection head 331 observes the chip surface from a side tilt angle, the light reflection characteristics change. Minor scratches and damage that are difficult to detect in the vertical direction will become more obvious due to light scattering and shadow effects, thereby significantly improving the sensitivity and accuracy of detection.

[0052] Furthermore, the comprehensiveness of the inspection is further enhanced by setting a rotating mechanism at inspection station 2. That is, the rotating mechanism drives the clamping member 22 and the chip to rotate, and in conjunction with the swing of the inspection head 331 (which causes the scanning trajectory of the inspection head 331 to usually form a spiral or approximately elliptical path, so that the surface of the chip under test can be fully inspected by the combination of rotation and swing motion, thus ensuring coverage of the entire surface area of ​​the chip under test), realizing all-round, multi-angle inspection of the chip surface. The collaborative working mechanism of the two ensures that every area of ​​the chip can be fully inspected, effectively avoiding the omission of defects caused by a single inspection angle or fixed chip position, thereby greatly improving the inspection efficiency of the device and the accuracy of the inspection results.

[0053] Based on the above embodiments, it should be added that the lower part of the workstation plate 21 is vertically installed in the detection cavity by a support rod, and the rotating mechanism will be further described here, such as... Figure 2 and Figure 3 As shown, the rotating mechanism includes a rotating sleeve 231, a drive motor 232, and a transmission gear set. The rotating sleeve 231 is rotatably sleeved on the outside of the support rod, and a rotating ring 234 rotatably embedded around the outside of the workstation disk 21 is connected to the top of the rotating sleeve 231 by a bracket. A plurality of clamping members 22 are arrayed on the rotating ring 234. The drive motor 232 is installed on one side of the bottom of the detection cavity and is located directly below any swing rod 321. The transmission gear set is located between the output shaft of the drive motor 232 and the rotating sleeve 231, and is used to transmit the output torque of the output shaft of the drive motor 232 to the rotating sleeve 231.

[0054] The rotating mechanism disclosed in the above embodiments achieves stable rotation of the chip under test through the coordinated operation of the support rod, rotating sleeve 231, rotating ring 234, drive motor 232, and transmission gear set. Specifically, the rotation process is as follows:

[0055] When the drive motor 232 starts, its output shaft transmits torque to the rotating sleeve 231 through a transmission gear set. As the rotating sleeve 231 rotates, the bracket at its top drives the rotating ring 234 to rotate as well. Since multiple clamping elements 22 are arrayed on the rotating ring 234, the clamping elements 22 rotate along with the rotating ring 234. The chip under test fixed on the clamping elements 22 also rotates accordingly.

[0056] Based on the above embodiments, further, in Figure 2As shown in the diagram, the transmission gear set includes two bevel gears 233 that mesh with each other and form a certain angle. One of the bevel gears 233 is mounted on the output shaft of the drive motor 232, while the other bevel gear 233 is rotatably sleeved on the outside of the support rod and connected to the bottom end of the rotating sleeve 231. It should be noted that the included angle between the two bevel gears 233 is 90 degrees, that is, the two bevel gears 233 mesh with each other and are perpendicular.

[0057] Based on the specific mechanism of the transmission gear set disclosed above, when the drive shaft of the drive motor 232 drives one of the bevel gears 233 to rotate, it can simultaneously drive the other bevel gear 233 that meshes with it to rotate. Thus, through the two meshing bevel gears 233, the power output of the drive shaft of the drive motor 232 can be stably transmitted to the rotating sleeve 231, so as to facilitate the rotation of the rotating sleeve 231.

[0058] For more details regarding the above plan, please refer to the following: Figure 2 and Figure 3 The swing drive component includes a rotating disk 322, which is rotatably connected to the side wall of the detection chamber. A protruding rod 323 is eccentrically provided on the surface of the rotating disk 322. One end of the protruding rod 323 away from the rotating disk 322 extends into a strip groove 324 formed in the middle of the swing rod 321. The protruding rod 323 is slidably adapted to the strip groove 324. The rotating disk 322 is connected to the output shaft of the drive motor 232 of the rotating mechanism via a transmission belt 325. Preferably, a toothed ring that meshes with the drive belt is provided at the contact points between the rotating disk 322, the drive shaft of the drive motor 232, and the transmission belt 325, so as to make the power connection between the transmission belt 325 and the rotating disk 322 and the drive shaft more stable and to prevent the transmission belt 325 from slipping.

[0059] Based on the specific structure of the swing drive disclosed in the above embodiments, through the structural design of the rotating disk 322, the eccentrically arranged protruding rod 323, the swing rod 321 and the strip groove 324, the rotational motion of the drive shaft of the drive motor 232 is cleverly converted into the left and right periodic swing of the swing rod 321. This enables the detection angle of the detection head 331 to swing left and right without the need for an additional power source, so as to realize the multi-angle coverage detection of the chip under test by the detection head 331, improve the detection accuracy of the detection head 331, greatly reduce the complexity of the equipment, and reduce the interference caused by the complexity of the equipment to the normal detection work of the detection head 331.

[0060] It should be further explained that among the existing detection devices, there are still some that use multi-angle camera arrays or robotic arms to adjust the detection angle to cover more perspectives. However, these detection devices generally suffer from high equipment complexity, low detection efficiency, and high cost. At the same time, when performing detection, the existing detection devices have difficulty coordinating the dynamic adjustment of the detection angle with the chip rotation, which affects the detection efficiency and accuracy of the detection device.

[0061] In view of this, this embodiment specifically achieves synchronized coordination between the oscillation motion of the scanning head and the rotation motion of the chip under test through the structural design of the aforementioned rotating mechanism, transmission gear set, and oscillating drive component. This ensures that, under the power of the same drive motor, the chip under test can be rotated and the detection head 331 can be oscillated simultaneously. This achieves high integration of the device within the limited space of the detection cavity, greatly reducing the complexity of the detection device, simplifying the control logic, and avoiding the complexity of the device and detection interference problems caused by the traditional use of multiple power sources. In other words, the technical solution disclosed in the above embodiment is significantly different from the prior art in that it adopts a single-motor driven rotation-oscillation coordinated control mechanism. Through the combination of vertical transmission of the bevel gear 233 set and horizontal transmission of the transmission belt 325, the power of the drive motor 232 is synchronously distributed to the two motion dimensions of the chip under test rotation and the detection head 331 oscillation. This achieves strict synchronization of the rotation and oscillation of the detection device using a single motor, thereby greatly improving the detection efficiency of the detection device and realizing efficient and comprehensive surface defect detection of the chip under test. Meanwhile, by synchronizing the swing of the detection head 331 with the rotation of the chip under test, the scattered light signal captured by the line scan camera at the tilt angle can be dynamically enhanced due to the relative motion, thereby improving the detection accuracy of the device to a certain extent.

[0062] Regarding the above embodiments, it should be noted that the detection head 331 includes a plurality of line-scan optical cameras arrayed along the length of the detection rod 31 at its bottom. Furthermore, the scanning projection area of ​​the line-scan optical camera on the chip under test is a rectangular frame, and the length of the rectangular frame is greater than or equal to the diameter of the chip under test. Figure 6 As shown, a line-scan optical camera can scan the rotating surface of the chip under test line by line during inspection, ensuring comprehensive coverage of the entire surface.

[0063] Furthermore, it should be noted that the projection of the center point of the chip under test onto the side wall where the detection cavity and the swing rod 321 are hinged is located on the extension line of the centerline of the swing rod 321, and the hinge at the bottom of the swing rod 321 is also located on the centerline of the swing rod 321. Based on the above design, it is ensured that when the swing rod 321 drives the detection rod 31 and the detection head 331 to swing, it can always swing symmetrically around the central axis of the chip. Figure 6 As shown, this allows the detection head 331 to perform comprehensive detection on the chip surface at different angles, avoiding uneven detection range or blind spots caused by the positional offset of the swing arm 321, and helps to improve the stability and detection accuracy of the detection device, ensuring the reliability and consistency of the detection results.

[0064] Example 2;

[0065] Please see Figure 2 As shown, this embodiment is based on embodiment 1, and the clamping member 22 is further described in detail here. The clamping member 22 is arranged in an array on the rotating ring 234 to facilitate clamping the chip to be tested. Specifically, the number of clamping members 22 is preferably 3, and they are evenly arranged in a circumferential array on the rotating ring 234 to form a three-point clamping structure. The three-point clamping structure ensures that the chip to be tested is subjected to uniform force, and avoids excessive clamping that may cause deformation and damage to the chip or rotational displacement due to uneven clamping force.

[0066] For the structure of each clamping member 22, please refer to [link / reference]. Figure 4 It includes an L-shaped plate 221, and a flexible contact part made of silicone or polyurethane is covered on the surface of the L-shaped plate 221 at the position where it contacts the chip under test. A pressure plate 222 is provided on the upper part of the L-shaped plate 221, and the pressure plate 222 and the L-shaped plate 221 are rotatably connected by a rotating pin. A clamp 223 is also provided between the pressure plate 222 and the L-shaped plate 221 and is connected to the pressure plate 222 by an adjusting bolt 224. A rubber pad is provided at the bottom of the clamp 223 where it contacts the chip under test.

[0067] Based on the clamping member 22 disclosed in the above embodiments, it is worth noting that it solves the technical problems existing in the traditional chip clamping process. It can be predicted that by adopting a three-point clamping structure, it ensures that the chip under test is subjected to uniform force during the testing process, avoiding chip rotational displacement caused by uneven clamping force or chip deformation and damage caused by excessive clamping. Simultaneously, the L-shaped plate 221 of the clamping member 22 is covered with a flexible contact part made of silicone or polyurethane at the contact position with the chip under test. This flexible material can provide uniform contact pressure during clamping, reducing damage to the chip surface while ensuring sufficient clamping force on the chip under test. When the chip under test rotates, the rubber pad can absorb centrifugal vibration through its own slight elastic deformation, and combined with the rigid support of the rotating ring 234, it can prevent the chip under test from shaking. A pressure plate 222 is provided on the upper part of the L-shaped plate 221, and the pressure plate 222 and the L-shaped plate 221 are rotatably connected by a rotating pin. This allows the pressure plate 222 to adjust its angle within a certain range to accommodate chips of different sizes and shapes. In addition, a clamp 223 is provided between the pressure plate 222 and the L-shaped plate 221 and is connected to the pressure plate 222 by an adjusting bolt 224. A rubber pad is provided at the bottom of the clamp 223 where it contacts the chip under test, which further enhances the stability of clamping and the protection of the chip.

[0068] The specific clamping process is as follows: First, the pressure plate 222 is flipped upward to facilitate the placement of the chip under test. After the chip under test is placed, the pressure plate 222 is rotated in the opposite direction to bring it close to the chip under test and limit the upper part of the chip under test. By rotating the adjusting bolt 224, the position of the chuck 223 and the magnitude of the clamping force can be precisely controlled, so that the chuck 223 moves downward to clamp the chip under test. In this way, the clamping component 22 can effectively clamp chips under test of different thicknesses, thereby further increasing the applicability and effectiveness of the clamping component 22.

[0069] Example 3;

[0070] Please refer to further information. Figure 4This embodiment is based on Embodiment 2. It should be further explained that for electronic chips, the flatness of their bottom surface directly affects the reliability of their soldering to the circuit board. Traditional testing devices often focus on surface defects of the chip under test, ignoring hidden defects such as bottom deformation or localized protrusions / dimples. These defects may lead to poor contact or stress concentration after chip installation, causing long-term reliability problems. Therefore, this embodiment proposes a more preferred implementation method. Specifically, multiple bottom detection elements 24 for detecting the bottom of the chip under test are arrayed within the groove. Each bottom detection element 24 includes a support block 241 whose bottom is connected to the groove via an elastic element 243. Multiple rolling balls 242 that roll in contact with the bottom of the chip under test are arrayed on the upper part of the support block 241. A pressure sensor 244 is provided inside the elastic element 243. Furthermore, the measuring end of the pressure sensor 244 is in contact with the bottom of the elastic element 243 so that pressure can be applied to the pressure sensor 244 promptly after the elastic element 243 deforms.

[0071] It should be understood that this embodiment achieves comprehensive detection of the bottom of the chip through the bottom detection component 24 disclosed above. Specifically, the bottom detection component 24 is composed of an elastic component 243, a support block 241 and a ball 242. The elastic component 243 (preferably an arc-shaped metal spring sheet, made by bending a thin steel sheet to give it good elastic deformation) is equipped with a pressure sensor 244. When the chip is placed in the workstation tray 21, the ball 242 contacts the bottom of the chip, the elastic element 243 deforms, and the pressure sensor 244 records the pressure change. In the specific working process, when the chip rotates with the clamping member 22, the ball 242 of the bottom detection member 24 contacts the bottom surface of the chip and rolls. The elastic element 243 generates different degrees of compression according to the flatness of the bottom of the chip. The pressure sensor 244 converts these compression amounts into electrical signals, thereby obtaining the overall shape information of the bottom of the chip. This allows the device to not only detect the flatness of the bottom of the chip, but also to determine whether there are local defects on the bottom of the chip under test, such as deformation, cracks, pits, etc., by observing the distribution of pressure data changes. This greatly improves the comprehensiveness of the device's detection of the chip under test and makes its detection effect better.

[0072] Example 4;

[0073] Please see Figure 7 This embodiment, based on the electronic chip defect detection device disclosed in the above embodiments, proposes an electronic chip defect detection method, specifically comprising the following steps:

[0074] Step 1, chip clamping: Place the chip to be tested in the work station tray 21, clamp and fix the chip to be tested by the clamping member 22, and at the same time, make the rolling ball 242 of the bottom detection member 24 contact the bottom of the chip to be tested;

[0075] Step 2, surface defect detection: Start the rotation mechanism to drive the clamping member 22 and rotate the chip under test in the work station 21. At the same time, start the swing drive of the swing mechanism to drive the swing rod 321 to swing left and right with the hinge at its bottom end as the reference point. After the swing rod 321 swings, it drives the detection rod 31 to swing synchronously and periodically, so that the detection head 331 at the bottom of the detection rod 31 can perform multi-angle image detection on the surface of the rotating chip under test.

[0076] Step 3, bottom flatness detection: When the chip under test rotates with the clamping member 22, the bottom detection member 24 contacts the bottom surface of the chip through the ball 242. Combined with the compression of the elastic member 243 and the data of the pressure sensor 244, the flatness of the bottom surface of the chip under test is detected.

[0077] Step 4: Output the results. By connecting to an external control terminal, read the data from the pressure sensor 244 and the image data from the detection head 331 to obtain the detection results, determine whether the chip quality is qualified, and stop the machine to remove the chip under test.

[0078] Based on the disclosed detection method, it achieves comprehensive and high-precision detection of electronic chips through steps such as chip clamping, surface defect detection, bottom flatness detection, and result output. Specifically, during chip clamping, the clamping member 22 fixes the chip in the groove of the workstation plate 21, ensuring the stability of the chip during the detection process and providing a reliable foundation for subsequent detection. In the surface defect detection step, the rotating mechanism drives the chip to rotate, while the oscillating drive member drives the detection head 331 to oscillate periodically, realizing multi-angle image acquisition of the chip surface, effectively improving the comprehensiveness and accuracy of the detection, and capturing defects that are difficult to detect using traditional fixed-angle methods. By detecting minute defects, and through the bottom flatness detection step, the rolling ball 242 of the bottom detection component 24 contacts the bottom surface of the chip, combined with the compression of the elastic component 243 and the data from the pressure sensor 244, accurate detection of the bottom flatness of the chip is achieved. This solves the problem of insufficient detection of the bottom of the chip by traditional detection methods. Finally, the data is read and the chip quality is determined by the external control terminal, ensuring the reliability and consistency of the detection results. This detection method not only improves detection efficiency and accuracy, but also reduces the probability of missed detections and false detections, significantly improving the overall quality control level of electronic chips and providing a more effective quality inspection solution for the chip manufacturing industry.

[0079] It should also be noted that the line scan optical camera is existing technology and can be purchased on the market. In this embodiment, the selected model is XG-8500L, which has the characteristics of high resolution and high line frequency and is suitable for the detection of surface defects of electronic chips.

[0080] For the pressure sensor 244, in this embodiment, the model GP-M001T is selected, which has the characteristics of high precision, high stability and high response speed, and can meet the requirements of electronic chip defect detection for precision and reliability.

[0081] The external control terminal mainly refers to the central data processing and control system that communicates with the testing device via a network. It is responsible for key tasks such as data acquisition, analysis and processing, and quality judgment. It generally includes industrial computers, PLCs, and embedded systems. In this solution, in specific implementation, it is preferable to use an industrial control computer that communicates with the testing device, so as to utilize its powerful data processing capabilities and rich interface resources to efficiently complete the testing task. As for industrial control computers, they are existing conventional technologies, and will not be described in detail in this embodiment.

[0082] The above detailed embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention. It should be noted that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are illustrative diagrams, intended only to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the present invention, should still fall within the scope of the technical content disclosed in the present invention. Furthermore, terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity of description and are not intended to limit the scope of implementation of the present invention. Changes or adjustments in their relative relationships, without substantially altering the technical content, should also be considered within the scope of implementation of the present invention.

Claims

1. An electronic chip defect detection device, comprising a body (1) with a door (11) mounted on its surface, characterized in that, The machine body (1) has a detection chamber inside, and a detection station (2) and a detection component (3) are installed in the detection chamber respectively. The testing station (2) includes a station disk (21), a groove is opened in the middle of the station disk (21), and a plurality of clamping parts (22) for clamping the chip to be tested are provided on the upper part of the groove. The clamping parts (22) are connected to a rotating mechanism located at the lower part of the station disk (21). The detection component (3) is located above the workstation plate (21) and includes a detection rod (31) and a detection head (331). The bottom of the detection rod (31) is connected to the detection head (331), and the detection rod (31) is connected to the detection cavity through an angle swing mechanism. The angle swing mechanism includes a swing rod (321), which is vertically attached to two symmetrical sides of the detection cavity relative to the work station plate (21). The two ends of the detection rod (31) are connected across the top of the two swing rods (321), and the bottom end of each swing rod (321) is hinged to the side of the detection cavity through a hinge. On the back of one of the swing rods (321), there is also a swing drive for driving the swing rod (321) to swing left and right with the hinge as the reference point. The rotating mechanism is vertically mounted in the detection chamber at the lower part of the workstation plate (21) via a support rod, and includes: A rotating sleeve (231) is rotatably sleeved on the outside of the support rod, and a rotating ring (234) is rotatably embedded around the outside of the workstation plate (21) by means of a bracket at the top of the rotating sleeve (231). A plurality of clamping elements (22) are arranged in an array on the rotating ring (234). The drive motor (232) is installed on one side of the bottom of the detection cavity and located directly below any swing arm (321); The transmission gear set is located between the output shaft of the drive motor (232) and the rotating sleeve (231) and is used to transmit the output torque of the output shaft of the drive motor (232) to the rotating sleeve (231); The swing drive component includes: A rotating disk (322) is rotatably connected to the side wall of the detection chamber. A protruding rod (323) is eccentrically provided on the surface of the rotating disk (322). One end of the protruding rod (323) away from the rotating disk (322) extends into a strip groove (324) in the middle of the swing rod (321). The protruding rod (323) and the strip groove (324) are slidably adapted to each other. The rotating disk (322) is connected to the output shaft of the drive motor (232) of the rotating mechanism through a transmission belt (325). Multiple bottom detection elements (24) for detecting the bottom of the chip under test are also arranged in the groove. Each bottom detection element (24) includes a support block (241) whose bottom is connected to the groove through an elastic element (243). Multiple rolling balls (242) that roll in contact with the bottom of the chip under test are arranged in the upper part of the support block (241). A pressure sensor (244) is provided inside the elastic element (243). The projection point of the center point of the chip under test on the side wall where the detection cavity is hinged to the swing rod (321) is located on the extension line of the center line of the swing rod (321), and the hinge at the bottom of the swing rod (321) is also located on the center line of the swing rod (321).

2. The electronic chip defect detection device according to claim 1, characterized in that: The transmission gear set includes two bevel gears (233) that mesh with each other and form a certain angle. One of the bevel gears (233) is mounted on the output shaft of the drive motor (232), while the other bevel gear (233) is rotatably sleeved on the outside of the support rod and connected to the bottom end of the rotating sleeve (231).

3. The electronic chip defect detection device according to claim 1, characterized in that: The detection head (331) includes a plurality of line scan optical cameras arrayed at its bottom along the length of the detection rod (31).

4. A method for detecting defects in electronic chips, characterized in that: According to claim 1, the method of the electronic chip defect detection device includes the following steps: Step 1, chip clamping: Place the chip to be tested in the work station tray (21), clamp and fix the chip to be tested by the clamping member (22), and at the same time, make the ball (242) of the bottom detection member (24) contact the bottom of the chip to be tested; Step 2, surface defect detection: Start the rotation mechanism to drive the clamping part (22) and rotate the chip under test in the work station disk (21). At the same time, start the swing drive of the angle swing mechanism to drive the swing rod (321) to swing left and right with the hinge at its bottom end as the reference point. After the swing rod (321) swings, it drives the detection rod (31) to swing synchronously and periodically, so that the detection head (331) at the bottom of the detection rod (31) performs multi-angle image detection on the surface of the rotating chip under test. Step 3, bottom flatness detection: When the chip under test rotates with the clamping member (22), the bottom detection member (24) contacts the bottom surface of the chip through the rolling ball (242). Combined with the compression amount of the elastic member (243) and the data of the pressure sensor (244), the flatness of the bottom surface of the chip under test is detected. Step 4, result output: By connecting to the external control terminal, read the data from the pressure sensor (244) and the image data from the detection head (331), obtain the detection results, determine whether the chip quality is qualified, and stop the machine to remove the chip to be tested.

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