Inductor component

Abstract

Provided is an inductor component capable of improving inductance acquisition efficiency. The inductor component includes: a green body including a first main surface and a second main surface facing each other; a coil which is provided on the body and is wound in a spiral shape along an axis; and a first external electrode and a second external electrode that are provided on the body, are electrically connected to the coil, and are disposed such that the axis of the coil is parallel to the first main surface, the coil including: a plurality of first coil wirings that are provided on the first main surface side with respect to the axis, and that are arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on the opposite side to the first through wiring with respect to the axis, arranged along the axis, and constituting at least a portion of a spiral shape by sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring. The first through wiring and the second through wiring are not parallel when viewed from the axial direction.

Description

Technical Field

[0001] The present disclosure relates to an inductor component. Background Art

[0002] Conventionally, as an inductor component, there is a component described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has a green compact, a coil disposed in the green compact and wound along an axial direction, and a first external electrode and a second external electrode disposed on the green compact and electrically connected to the coil.

[0003] The coil has a plurality of coil patterns laminated along the axis. The coil patterns adjacent to each other in the axial direction are connected via a conductive through hole. The coil pattern has a wiring portion extending in a direction orthogonal to the axis and a pad portion provided at an end of the wiring portion and connected to the conductive through hole. In order to improve the connectivity between the pad portion and the conductive through hole, the width of the pad portion is wider than the width of the wiring portion.

[0004] Patent Document 1: Japanese Patent No. 6652280

[0005] However, in the inductor component as described above, since the width of the pad portion is wider than the width of the wiring portion, a part of the pad portion is located on the inner side in the radial direction of the coil as compared with the wiring portion. Therefore, the inner diameter of the coil becomes smaller, and the acquisition efficiency of the inductance is not necessarily high. Summary of the Invention

[0006] Therefore, the present disclosure provides an inductor component capable of improving the acquisition efficiency of inductance.

[0007] In order to solve the above problems, an inductor component according to an aspect of the present disclosure includes:

[0008] A green compact including a first main surface and a second main surface facing each other;

[0009] A coil disposed on the green compact and wound in a spiral shape along an axis; and

[0010] A first external electrode and a second external electrode disposed on the green compact and electrically connected to the coil,

[0011] The axis of the coil is arranged parallel to the first main surface,

[0012] The coil includes:

[0013] A plurality of first coil wirings disposed on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface;

[0014] A plurality of second coil wirings disposed on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface;

[0015] A plurality of first through wirings extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring and are arranged along the above-mentioned axis; and

[0016] A plurality of second through wirings extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring, are provided on the opposite side of the above-mentioned axis from the above-mentioned first through wirings, and are arranged along the above-mentioned axis,

[0017] By sequentially connecting the above-mentioned first coil wiring, the above-mentioned first through wiring, the above-mentioned second coil wiring, and the above-mentioned second through wiring, at least a part of the above-mentioned spiral shape is formed,

[0018] The above-mentioned first through wiring and the above-mentioned second through wiring are non-parallel when viewed from the above-mentioned axis.

[0019] In this specification, the "axis" refers to the intersection line of a first plane passing through the center between the first coil wiring and the second coil wiring and a second plane passing through the center between the first through wiring and the second through wiring.

[0020] "The first through wiring and the second through wiring are non-parallel when viewed from the axis" means that the center lines of the first through wiring and the second through wiring are not parallel when viewed from the axis. In addition, the center lines of the first through wiring and the second through wiring refer to the lines passing through the centers on the planes orthogonal to the extending directions of the respective through wirings.

[0021] "The external electrode is provided on the green body" specifically means that the external electrode is provided on the outer surface side of the green body. For example, it includes the case where the external electrode is provided directly above the outer surface of the green body, the case where the external electrode is provided outside the green body via other components on the green body, and the case where the external electrode is provided on the outer surface in a state where a part of the external electrode is buried in the green body.

[0022] According to the above-mentioned aspect, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. By sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring, at least a part of the spiral shape is formed. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0023] Moreover, since the first through wiring and the second through wiring are non-parallel when viewed from the axis, the design freedom of the first through wiring and the second through wiring can be improved. For example, the Q value can be increased, or the self-resonant frequency can be improved.

[0024] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the first main surface, the first through-wiring and the second through-wiring are symmetric with respect to the axis.

[0025] According to the above embodiment, the symmetry of the coil with respect to the axis can be ensured, and the design of the coil can be easily performed.

[0026] Preferably, in one embodiment of the inductor component, when viewed from the axial direction, the first through-wiring and the second through-wiring are symmetric with respect to a straight line that is orthogonal to the first main surface and includes the axis.

[0027] According to the above embodiment, the symmetry of the coil with respect to the axis can be ensured, and the design of the coil can be easily performed.

[0028] Preferably, in one embodiment of the inductor component, the line-edge roughness of the first through-wiring is larger than the line-edge roughness of the first coil-wiring.

[0029] Here, the line-edge roughness of the first through-wiring refers to the line-edge roughness of the inner-diameter-side surface of the side surface of the first through-wiring in a cross-section that is orthogonal to the axis of the coil and includes the center line of the first through-wiring. The line-edge roughness of the first coil-wiring refers to the line-edge roughness of the side surface of the first coil-wiring in a cross-section that is orthogonal to the first main surface and includes the center line of the first coil-wiring.

[0030] According to the above embodiment, due to the anchoring effect, the adhesion between the first through-wiring and the green body is improved.

[0031] Preferably, in one embodiment of the inductor component, the line-edge roughness of the first through-wiring is the same as or smaller than the line-edge roughness of the first coil-wiring.

[0032] According to the above embodiment, since the side surface of the first through-wiring is smooth, an increase in resistance at high frequencies caused by the skin effect can be suppressed, and the Q value can be improved.

[0033] Preferably, in one embodiment of the inductor component, the width of the first through-wiring is different from the width of the second through-wiring.

[0034] Here, the width of the first through-wiring refers to the circular equivalent diameter obtained from the cross-sectional area of the first through-wiring in a cross-section that is parallel to the first main surface and passes through the center of the extension direction of the first through-wiring. The width of the second through-wiring refers to the circular equivalent diameter obtained from the cross-sectional area of the second through-wiring in a cross-section that is parallel to the first main surface and passes through the center of the extension direction of the second through-wiring.

[0035] According to the above-described embodiment, the design freedom of the first through-wiring and the second through-wiring can be improved.

[0036] In one embodiment of the inductor component, preferably,

[0037] When viewed from the above-mentioned axial direction, the above-mentioned first through-wiring has an outer peripheral portion located outside the radial direction of the above-mentioned coil compared with the above-mentioned first coil wiring and the above-mentioned second coil wiring.

[0038] The above-mentioned outer peripheral portion is arranged between 0.3 and 0.7 of the height in the direction orthogonal to the above-mentioned first main surface of the above-mentioned green body with the above-mentioned first main surface as a reference.

[0039] Here, being located outside the radial direction of the coil compared with the first coil wiring and the second coil wiring means that when viewed from the axial direction, it is located outside the radial direction of the coil compared with the tangent line, and this tangent line is connected to the end surface of the first coil wiring in the direction parallel to the first main surface and the end surface of the second coil wiring in the direction parallel to the first main surface.

[0040] According to the above-described embodiment, since the first through-wiring has an outer peripheral portion, the inner diameter of the coil can be increased and the Q value can be improved. In addition, since the outer peripheral portion is arranged between 0.3 and 0.7 of the height of the green body, the outer peripheral portion can be provided only in a part of the height of the green body. Thus, the possibility of the first through-wiring being exposed from the green body during monolithic integration can be reduced.

[0041] In one embodiment of the inductor component, preferably, it further includes:

[0042] A second coil, which is provided on the above-mentioned green body and wound in a spiral shape along a second axis parallel to the above-mentioned axis; and

[0043] A third external electrode and a fourth external electrode, which are provided on the above-mentioned green body and electrically connected to the above-mentioned second coil.

[0044] The above-mentioned second coil includes:

[0045] A plurality of third coil wirings, which are arranged on the first main surface side with respect to the above-mentioned second axis and arranged along the above-mentioned second axis in a plane parallel to the above-mentioned first main surface;

[0046] A plurality of fourth coil wirings, which are arranged on the second main surface side with respect to the above-mentioned second axis and arranged along the above-mentioned second axis in a plane parallel to the above-mentioned second main surface;

[0047] A plurality of third through-wirings, which extend from the above-mentioned third coil wirings toward the above-mentioned fourth coil wirings and are arranged along the above-mentioned second axis; and

[0048] A plurality of fourth through wirings extend from the above-described third coil wiring toward the above-described fourth coil wiring, are provided on the opposite side of the above-described third through wiring with respect to the above-described second axis, and are arranged along the above-described second axis.

[0049] By sequentially connecting the above-described third coil wiring, the above-described third through wiring, the above-described fourth coil wiring, and the above-described fourth through wiring, at least a part of the spiral shape of the above-described second coil is formed.

[0050] The above-described second through wiring is adjacent to the above-described third through wiring.

[0051] According to the above-described embodiment, similar to the coil, the inductance acquisition efficiency can also be improved in the second coil, and in addition, the design freedom can be increased.

[0052] Preferably, in one embodiment of the inductor component,

[0053] When viewed from the above-described axial direction of the above-described coil, the above-described first through wiring and the above-described second through wiring are line-symmetric with respect to the central line between the above-described first coil and the above-described second coil with respect to the above-described third through wiring and the above-described fourth through wiring.

[0054] According to the above-described embodiment, first coils and second coils with similar characteristics can be easily obtained.

[0055] Preferably, in one embodiment of the inductor component,

[0056] When viewed from the above-described axial direction of the above-described coil, the above-described second through wiring is arranged in parallel with the above-described third through wiring.

[0057] According to the above-described embodiment, since the second through wiring is arranged in parallel with the third through wiring, the distance between the adjacent coil and the second coil can be reduced, and the inductor component can be made smaller.

[0058] Preferably, in one embodiment of the inductor component,

[0059] When viewed from the above-described axial direction, the above-described first through wiring and the above-described second through wiring are non-line-symmetric with respect to a straight line orthogonal to the above-described first main surface and including the above-described axis.

[0060] According to the above-described embodiment, in the first coil, since the first through wiring and the second through wiring are non-line-symmetric with respect to a straight line orthogonal to the first main surface and including the axis when viewed from the axial direction, the design freedom of the first through wiring and the second through wiring can be further increased.

[0061] Preferably, in one embodiment of the inductor component,

[0062] The above-mentioned third through-wiring and the above-mentioned fourth through-wiring are non-parallel when viewed from the above-mentioned second axial direction.

[0063] According to the above embodiment, the distance between the third through-wiring and the fourth through-wiring can be increased, the inner diameter of the second coil can be increased, and the Q value can be improved.

[0064] Preferably, in one embodiment of the inductor component,

[0065] The above-mentioned first through-wiring has a first connection surface connected to the above-mentioned first coil wiring and a second connection surface connected to the above-mentioned second coil wiring.

[0066] The above-mentioned first external electrode is provided on the above-mentioned first main surface side and overlaps at least a part of the above-mentioned first connection surface when viewed from the direction orthogonal to the above-mentioned first main surface.

[0067] When viewed from the above-mentioned axial direction, the inclination angle on the above-mentioned axial side formed by the straight line connecting the center of the above-mentioned first connection surface and the center of the above-mentioned second connection surface and the connection surface of the above-mentioned second coil wiring connected to the above-mentioned first through-wiring is 60° or more and less than 90°.

[0068] According to the above embodiment, since the inclination angle is less than 90°, the area of the first coil wiring overlapping with the first external electrode when viewed from the direction orthogonal to the first main surface can be reduced. Thereby, the parasitic capacitance between the first external electrode and the first coil wiring can be reduced, and the self-resonant frequency can be improved. In addition, since the inclination angle is 60° or more, the inner diameter of the coil can be ensured and the Q value can be ensured.

[0069] Preferably, in one embodiment of the inductor component, when viewed from the direction orthogonal to the above-mentioned first main surface, a part of the above-mentioned first connection surface overlaps with a part of the above-mentioned second connection surface.

[0070] According to the above embodiment, when viewed from the direction orthogonal to the first main surface, a part of the first connection surface overlaps with a part of the second connection surface. Therefore, when forming a through-hole in the green body, a seed layer is provided on the inner surface of the through-hole, and the first through-wiring is formed on the seed layer by electrolytic plating, the formation of the seed layer becomes easy.

[0071] Preferably, in one embodiment of the inductor component, when viewed from the direction orthogonal to the above-mentioned first main surface, the center of the above-mentioned first connection surface is closer to the above-mentioned axis than the center of the above-mentioned second connection surface.

[0072] According to the above-described embodiment, when viewed from a direction orthogonal to the first main surface, the first connection surface is disposed inside the coil as compared with the second connection surface. Thereby, it is possible to reduce the area of the first coil wiring that overlaps with the first external electrode when viewed from a direction orthogonal to the first main surface, reduce the parasitic capacitance between the first external electrode and the first coil wiring, and increase the self-resonant frequency.

[0073] Preferably, in one embodiment of the inductor component, the first through-wiring has a conductive layer located on the outer peripheral side when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer.

[0074] According to the above-described embodiment, when used in a high-frequency band, due to the skin effect, the current mainly flows on the surface of the first through-wiring. Therefore, by providing the conductive layer on the outer peripheral side, the Q value is not reduced. In addition, by providing the non-conductive layer on the inner side, stress can be alleviated, and the manufacturing cost can be reduced by not using a conductor.

[0075] Preferably, in one embodiment of the inductor component, the cross-sectional area of at least one of the both end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

[0076] According to the above-described embodiment, it is possible to increase the cross-sectional area of the end portion of the first through-wiring, and improve the connectivity between the first through-wiring and at least one of the first coil wiring and the second coil wiring. In addition, when a hole is formed in the green body and a conductive material is filled in the hole by electroplating or the like to form the first through-wiring in the hole of the green body, it is easy to fill the conductive material on the opening side of the hole. Moreover, since the cross-sectional area of the end portion of the first through-wiring is large and the cross-sectional area of the central portion of the first through-wiring is small, it is easy to form the first through-wiring.

[0077] Preferably, in one embodiment of the inductor component, the thickness of the inductor component is 200 μm or less.

[0078] According to the above-described embodiment, the inductor component can be made thinner.

[0079] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside as compared with the outer surface of the green body.

[0080] According to the above-described embodiment, since the first external electrode and the second external electrode do not contact the outer surface of the green body, when singulating into individual inductor components, the load applied to the first external electrode and the second external electrode can be reduced, and deformation and peeling of the first external electrode and the second external electrode can be suppressed. Therefore, even if the inductor component is miniaturized, deformation and peeling of the first external electrode and the second external electrode can be prevented.

[0081] Preferably, in one embodiment of the inductor component, an organic insulator provided on the first main surface is further provided. The green body is an inorganic insulator, and when viewed from a direction orthogonal to the first main surface, the organic insulator is located inside compared to the outer surface of the inorganic insulator.

[0082] According to the above-described embodiment, since there is an organic insulator, the organic insulator is easy to impart fluidity. When covering the first coil wiring with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, and insulation can be improved. In addition, since the organic insulator does not contact the outer surface of the inorganic insulator, when singulating into individual inductor components, the load applied to the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0083] According to the inductor component which is one aspect of the present disclosure, the acquisition efficiency of inductance can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0084] Figure 1 is a schematic bottom view of the inductor component according to the first embodiment as viewed from the bottom side.

[0085] Figure 2 is Figure 1 a sectional view taken along line II-II.

[0086] Figure 3 is Figure 1 a sectional view taken along line III-III.

[0087] Figure 4 is Figure 2 an enlarged view of a part of

[0088] Figure 5A is a schematic sectional view for explaining a manufacturing method of the inductor component.

[0089] Figure 5B is a schematic sectional view for explaining a manufacturing method of the inductor component.

[0090] Figure 5C is a schematic sectional view for explaining a manufacturing method of the inductor component.

[0091] Figure 5DIt is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0092] Figure 5E It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0093] Figure 5F It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0094] Figure 5G It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0095] Figure 5H It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0096] Figure 5I It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0097] Figure 5J It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0098] Figure 5K It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0099] Figure 5L It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0100] Figure 5M It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0101] Figure 6A It is a cross-sectional view showing a first modification of the inductor component.

[0102] Figure 6B It is a cross-sectional view showing a second modification of the inductor component.

[0103] Figure 6C It is a cross-sectional view showing a third modification of the inductor component.

[0104] Figure 6D It is a cross-sectional view showing a fourth modification of the inductor component.

[0105] Figure 6E It is a cross-sectional view showing a fifth modification of the inductor component.

[0106] Figure 7 It is a schematic bottom view of the inductor component according to the second embodiment as viewed from the bottom side.

[0107] Figure 8 It is Figure 7 Cross-sectional view VIII-VIII of

[0108] Figure 9 is Figure 8 an enlarged view of a part of

[0109] Figure 10A is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0110] Figure 10B is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0111] Figure 10C is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0112] Figure 10D is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0113] Figure 10E is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0114] Figure 10F is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0115] Figure 10G is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0116] Figure 10H is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0117] Figure 11A is a cross-sectional view showing a first modification of the inductor component.

[0118] Figure 11B is a cross-sectional view showing a second modification of the inductor component. Detailed Description of the Embodiments

[0119] Hereinafter, an inductor component as one aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. In addition, the drawings include some schematic drawings, and there are cases where the actual dimensions and ratios are not reflected.

[0120] <First Embodiment>

[0121] The inductor component 1 of the first embodiment will be described below. Figure 1 is a schematic bottom view of the inductor component 1 viewed from the bottom side. Figure 2 is Figure 1 the II-II cross-sectional view of Figure 3 is Figure 1 the III-III cross-sectional view of Figure 1 In Figure 1In the figure, the green body 10 is depicted transparently in order to facilitate understanding of the structure, but it may also be translucent or opaque.

[0122] 1. General Structure

[0123] The general structure of the inductor component 1 will be described. The inductor component 1 is, for example, a surface-mounted inductor component for a high-frequency signal transmission circuit. As Figure 1 , Figure 2 and Figure 3 shown, the inductor component 1 includes a green body 10, a coil 110 that is provided on the green body 10 and wound in a spiral shape along the axis AX, and a first external electrode 121 and a second external electrode 122 that are provided on the green body 10 and electrically connected to the coil 110.

[0124] The green body 10 has a length, a width, and a height. The green body 10 has a first end face 100e1 and a second end face 100e2 on both end sides in the length direction, a first side face 100s1 and a second side face 100s2 on both end sides in the width direction, and a bottom face 100b and a top face 100t on both end sides in the height direction. In other words, the outer surface 100 of the green body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b and the top face 100t. The bottom face 100b is an example of the "first main face" described in the claims, and the top face 100t is an example of the "second main face" described in the claims.

[0125] In addition, as shown in the drawings, hereinafter, for the sake of convenience of description, the length direction (long side direction) of the green body 10, and the direction from the first end face 100e1 toward the second end face 100e2 is set as the X direction. Further, the width direction of the green body 10, and the direction from the first side face 100s1 toward the second side face 100s2 is set as the Y direction. Further, the height direction of the green body 10, and the direction from the bottom face 100b toward the top face 100t is set as the Z direction. The X direction, the Y direction, and the Z direction are mutually orthogonal directions, and when arranged in the order of X, Y, Z, they form a right-handed system.

[0126] In this specification, the "outer surface 100 of the green body" including the first end face 100e1, the second end face 100e2, the first side face 100s1, the second side face 100s2, the bottom face 100b, and the top face 100t of the green body 10 does not merely mean the faces facing the outer peripheral side of the green body 10, but rather the faces that form the boundary between the outside and the inside of the green body 10. In addition, "above the outer surface 100 of the green body 10" does not refer to an absolute direction such as vertically above defined in the direction of gravity, but rather refers to the direction towards the outside among the outside and the inside with the outer surface 100 as the boundary, based on the outer surface 100. Therefore, "above the outer surface 100" refers to a relative direction determined according to the orientation of the outer surface 100. In addition, for a certain element, "above" includes not only the position above the element separated therefrom, that is, the upper side position of other objects on the element, the upper side position separated by an interval, but also the directly above position (on) in contact with the element.

[0127] The axis AX of the coil 110 is arranged parallel to the bottom face 100b. The coil 110 includes a plurality of bottom wirings 11b disposed on the bottom face 100b side with respect to the axis AX and arranged along the axis AX in a plane parallel to the bottom face 100b, a plurality of top wirings 11t disposed on the top face 100t side with respect to the axis AX and arranged along the axis AX in a plane parallel to the top face 100t, a plurality of first through wirings 13 extending from the bottom wirings 11b towards the top wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom wirings 11b towards the top wirings 11t, disposed on the side opposite to the first through wirings 13 with respect to the axis AX, and arranged along the axis AX. By sequentially connecting the bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14, at least a part of a spiral shape is formed.

[0128] The bottom wiring 11b corresponds to an example of the "first coil wiring" described in the claims, and the top wiring 11t corresponds to an example of the "second coil wiring" described in the claims. The axis AX refers to the intersection line of the first plane passing through the center between the bottom wiring 11b and the top wiring 11t and the second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction orthogonal to the axis AX.

[0129] According to the above structure, the coil 110 includes a bottom surface wiring 11b, a first through wiring 13, a top surface wiring 11t, and a second through wiring 14. By sequentially connecting the bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14, at least a part of a spiral shape is formed, so that the inner diameter of the coil 110 can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0130] Specifically, the pad portion of the conventional inductor component, the bottom surface wiring 11b, and the top surface wiring 11t of the present embodiment are the "bearing portions" of the wirings (the conductive through holes of the conventional inductor component or the first through wiring 13 and the second through wiring 14 of the present embodiment) that penetrate the green body, so they become shapes that expand perpendicular to the direction of the through green body. Here, in the structure of the conventional inductor component, since the conductive through holes extend in the direction parallel to the axis of the coil, the pad portion expands in the direction perpendicular to the axis of the coil, and it is likely to become a structure that blocks the magnetic flux generated in the axial direction of the coil.

[0131] In contrast, in the present embodiment, since the first through wiring 13 and the second through wiring 14 extend in the direction perpendicular to the axis AX of the coil 110, the bottom surface wiring 11b and the top surface wiring 11t expand in the direction parallel to the axis AX of the coil 110. As a result, the bottom surface wiring 11b and the top surface wiring 11t are not likely to become structures that block the magnetic flux generated in the direction of the axis AX. That is, in the present embodiment, it is possible to form a structure that is not likely to block the magnetic flux, and the inductance acquisition efficiency and the Q value can be improved.

[0132] As Figure 2 shown, the first through wiring 13 and the second through wiring 14 are not parallel when viewed from the axis AX direction. In other words, the center line 13a of the first through wiring 13 and the center line 14a of the second through wiring 14 are not parallel when viewed from the axis AX direction.

[0133] According to the above structure, since the first through wiring 13 and the second through wiring 14 are not parallel when viewed from the axis AX direction, the design freedom of the first through wiring 13 and the second through wiring 14 can be improved. For example, the Q value can be increased, or the self-resonant frequency can be improved. Specifically, the distance between the first through wiring 13 and the second through wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be increased.

[0134] In addition, it is preferable that all of the first through-wiring 13 and all of the second through-wiring 14 are non-parallel when viewed from the direction of the axis AX. It is sufficient that at least one first through-wiring 13 and at least one second through-wiring 14 are non-parallel when viewed from the direction of the axis AX. It is preferable that the first through-wiring 13 and the second through-wiring 14 that intersect the same plane orthogonal to the axis AX are non-parallel when viewed from the direction of the axis AX.

[0135] In addition, although all of the first through-wiring 13 coincide when viewed from the direction of the axis AX, there may be first through-wiring 13 among all of the first through-wiring 13 that do not coincide when viewed from the direction of the axis AX. The same applies to the second through-wiring 14.

[0136] 2. Structure of Each Part

[0137] (Inductor Component 1)

[0138] The volume of the inductor component 1 is 0.08 mm 3 or less, and the size of the long side of the inductor component 1 is 0.65 mm or less. The size of the long side of the inductor component 1 refers to the maximum value among the length, width, and height of the inductor component 1, and in this embodiment, it refers to the length in the X direction. According to the above structure, since the volume of the inductor component 1 is small and the long side of the inductor component 1 is also short, the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. In addition, it is preferable that the thickness of the inductor component 1 is 200 μm or less. Accordingly, the inductor component 1 can be made thin.

[0139] Specifically, the dimensions (length (X direction) × width (Y direction) × height (Z direction)) of the inductor component 1 are 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. In addition, the width and height may not be equal, and for example, it may also be 0.4 mm × 0.2 mm × 0.3 mm, etc.

[0140] (Green Body 10)

[0141] The green body 10 contains SiO 2 . Accordingly, insulation and rigidity can be imparted to the green body 10. The green body 10 is composed of a glass sintered body, for example. The glass sintered body may also contain alumina, and the strength of the green body can be further improved.

[0142] For example, a glass sintered body is formed by laminating insulating layers each containing a plurality of glasses. The lamination direction of the plurality of insulating layers is the Z direction. That is, the insulating layer is in a layered form having a main surface extending in the XY plane. In addition, in the green body 10, due to firing or the like, the interfaces between the plurality of insulating layers may become unclear.

[0143] In addition, for example, the green body 10 can also be composed of a glass substrate. The glass substrate can also be a single-layer glass substrate. Since most of the green body is glass, losses such as eddy current loss at high frequencies can be suppressed.

[0144] (Coil 110)

[0145] The coil 110 includes a plurality of bottom surface wirings 11b, a plurality of top surface wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are connected in sequence to form at least a part of the coil 110 wound in the axial direction of the axis AX.

[0146] According to the above structure, since the coil 110 is a so-called spiral-shaped coil 110, in a cross-section orthogonal to the axis AX, the area where the bottom surface wiring 11b, the top surface wiring 11t, the first through wiring 13, and the second through wiring 14 are parallel along the winding direction of the coil 110 can be reduced, and the stray capacitance in the coil 110 can be reduced.

[0147] Here, the spiral shape means that the number of turns of the entire coil is greater than one turn, and the number of turns of the coil in a cross-section orthogonal to the axis is less than one turn. More than one turn means that in a cross-section orthogonal to the axis, the wiring of the coil has a state where the parts are adjacent in the radial direction and parallel in the winding direction when viewed from the axial direction, and less than one turn means that in a cross-section orthogonal to the axis, the wiring of the coil does not have a state where the parts are adjacent in the radial direction and parallel in the winding direction when viewed from the axial direction.

[0148] The bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b extends in the Y direction while being slightly inclined in the X direction. All the bottom surface wirings 11b are arranged in parallel along the X direction. Here, in the lithography process, if, for example, deformed illumination such as annular illumination or dipole illumination is used, the pattern resolution in a specific direction can be improved, and a finer pattern can be formed. According to the above structure, since the bottom surface wiring 11b extends only in one direction and all the bottom surface wirings 11b are arranged in parallel, by using, for example, deformed illumination in the lithography process, a fine bottom surface wiring 11b can be formed, and the inductor component 1 can be miniaturized.

[0149] The top surface wiring 11t extends only in one direction. Specifically, the top surface wiring 11t has a shape extending in the Y direction. All the top surface wirings 11t are arranged in parallel along the X direction. According to the above structure, since the top surface wiring 11t extends only in one direction and all the top surface wirings 11t are arranged in parallel, by using, for example, deformed illumination in the lithography process, a fine top surface wiring 11t can be formed, and the inductor component 1 can be miniaturized.

[0150] The bottom surface wiring 11b and the top surface wiring 11t are made of a good conductor material such as copper, silver, gold, or their alloys. The bottom surface wiring 11b and the top surface wiring 11t may be a metal film formed by electroplating, evaporation plating, sputtering, etc., or a metal sintered body obtained by coating a conductor paste and sintering it. In addition, the bottom surface wiring 11b and the top surface wiring 11t may also be a multilayer structure in which a plurality of metal layers are stacked. Preferably, the thickness of the bottom surface wiring 11b and the top surface wiring 11t is 5 μm or more and 50 μm or less.

[0151] The first through-wiring 13 is disposed on the first side surface 100s1 side with respect to the axis AX in the through-hole V of the green body 10, and the second through-wiring 14 is disposed on the second side surface 100s2 side with respect to the axis AX in the through-hole V of the green body 10. The first through-wiring 13 and the second through-wiring 14 extend in directions orthogonal to the bottom surface 100b and the top surface 100t, respectively. Accordingly, the lengths of the first through-wiring 13 and the second through-wiring 14 can be shortened, so that the DC resistance (Rdc) can be suppressed. All of the first through-wirings 13 and all of the second through-wirings 14 are arranged in parallel along the X direction.

[0152] The first through-wiring 13 and the second through-wiring 14 are non-parallel when viewed from the axis AX direction. Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center such that the distance therebetween becomes wider toward the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 toward the center in the Z direction. In addition, the first through-wiring 13 and the second through-wiring 14 each have a stepped shape along the Z direction. With the above structure, in the case where the first through-wiring 13 and the second through-wiring 14 are formed by laminating a plurality of conductor layers, respectively, the first through-wiring 13 and the second through-wiring 14 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0153] Preferably, as Figure 1 shown, the first through-wiring 13 and the second through-wiring 14 are line-symmetrical with respect to the axis AX when viewed from a direction orthogonal to the bottom surface 100b. Accordingly, the symmetry of the coil 110 with respect to the axis AX can be ensured, and the design of the coil 110 can be easily performed. In addition, the situation where a part of the through-wiring enters the inner diameter of the coil 110 can be reduced, and the Q value can be improved.

[0154] Preferably, as Figure 2As shown, when viewed in the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are line-symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX. Accordingly, the symmetry of the coil 110 with respect to the axis AX can be ensured, and the design of the coil 110 can be easily performed. In addition, the situation where a part of the through-wiring enters the inner diameter of the coil 110 can be reduced, and the Q value can be increased.

[0155] Preferably, the line edge roughness (hereinafter, also referred to as LER (Line Edge Roughness)) of the first through-wiring 13 is larger than the line edge roughness of the bottom surface wiring 11b. Specifically, the line edge roughness of the first through-wiring 13 refers to the line edge roughness of the inner diameter side surface of the coil 110 in the side surface of the first through-wiring 13 in a cross-section that is orthogonal to the axis AX of the coil 110 and includes the center line 13a of the first through-wiring 13. The line edge roughness of the bottom surface wiring 11b refers to the line edge roughness of the side surface of the bottom surface wiring 11b in a cross-section that is orthogonal to the bottom surface 100b and includes the center line 14a of the bottom surface wiring 11b. Accordingly, the adhesion between the first through-wiring 13 and the green body 10 is improved by the anchoring effect.

[0156] The LER of the first through-wiring 13 refers to the dimensional deviation of the width of the first through-wiring 13. The width of the first through-wiring 13 is the dimension in the direction orthogonal to the center line 13a in the cross-section of the first through-wiring 13 that includes the center line 13a. The measurement method of LER follows the SEMI standard (SEMI Standard P47-0307, Test Method for Evaluation of Line-Edge Roughness and Line width Roughness).

[0157] In the present embodiment, an SEM image (or an optical image) of the first through-wiring 13 is obtained at a magnification of 1 / 3 or more of the length in the extending direction of the first through-wiring 13, and WinROOF2018, which is image processing software, is used to calculate the LER of the first through-wiring 13. Similarly, for the bottom surface wiring 11b, an SEM image of the bottom surface wiring 11b is obtained at a magnification of 1 / 3 or more of the length in the extending direction of the bottom surface wiring 11b to calculate the LER of the bottom surface wiring 11b. In addition, unless otherwise specified, the LER in this specification refers to the average value of the LER calculated at three or more positions in the image obtained as described above, and the calculation positions of the three or more points include at least two points with a distance between two points of more than half of the obtained image.

[0158] In addition, similarly, the line edge roughness of the first through-wiring 13 may be larger than that of the top surface wiring 11t, and the adhesion between the first through-wiring 13 and the green body 10 is improved by the anchoring effect.

[0159] In addition, similarly, the line edge roughness of the second through-wiring 14 may be larger than that of the bottom surface wiring 11b, and the adhesion between the second through-wiring 14 and the green body 10 is improved by the anchoring effect. Similarly, the line edge roughness of the second through-wiring 14 may be larger than that of the top surface wiring 11t, and the adhesion between the second through-wiring 14 and the green body 10 is improved by the anchoring effect.

[0160] Here, the line edge roughness of the first through-wiring 13 may be the same as or smaller than that of the bottom surface wiring 11b. Accordingly, since the side surface of the first through-wiring 13 is smooth, an increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved.

[0161] In addition, similarly, the line edge roughness of the first through-wiring 13 may be the same as or smaller than that of the top surface wiring 11t. In addition, similarly, the line edge roughness of the second through-wiring 14 may be the same as or smaller than that of the bottom surface wiring 11b. Since the side surface of the second through-wiring 14 is smooth, an increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved. Similarly, the line edge roughness of the second through-wiring 14 may be the same as or smaller than that of the top surface wiring 11t.

[0162] Preferably, the width of the first through-wiring 13 is different from the width of the second through-wiring 14. The width of the first through-wiring 13 refers to the circular equivalent diameter obtained from the cross-sectional area of the first through-wiring 13 in a cross-section that passes through the center in the extending direction of the first through-wiring 13 and is parallel to the bottom surface 100b. The width of the second through-wiring 14 refers to the circular equivalent diameter obtained from the cross-sectional area of the second through-wiring 14 in a cross-section that passes through the center in the extending direction of the second through-wiring 14 and is parallel to the bottom surface 100b. Specifically, in the height direction, the first through-wiring 13 is divided into three equal parts: upper, middle, and lower, and the average value of the circular equivalent diameters of the cross-sectional areas of the three equal parts is taken as the width. In addition, when the width of the first through-wiring 13 and the width of the second through-wiring 14 differ by 10% or more relatively, it is regarded that the width of the first through-wiring 13 is different from the width of the second through-wiring 14.

[0163] According to the above structure, the design freedom of the first through-wiring 13 and the second through-wiring 14 can be improved. For example, if the through-wiring is inclined or bent, the DC resistance becomes high. Therefore, the width of the through-wiring on the side with the longer line length is increased so that the DC resistances of the through-wirings with different shapes and different line lengths are the same.

[0164] Figure 4 is Figure 2 an enlarged view of a part of. As Figure 4 shown, when the first through-wiring 13 is viewed in the direction of the axis AX, it has an outer peripheral portion 131 that is located radially outside the coil 110 compared to the bottom surface wiring 11b and the top surface wiring 11t. The outer peripheral portion 131 is located radially outside the coil 110 compared to the tangent line L2 when viewed in the direction of the axis AX, and this tangent line is tangent to the end surface 11b1 of the bottom surface wiring 11b in the direction parallel to the bottom surface 100b and the end surface 11t1 of the top surface wiring 11t in the direction parallel to the bottom surface 100b. The outer peripheral portion 131 is arranged between 0.3 and 0.7 of the height Z1 in the direction orthogonal to the bottom surface 100b of the green body 10 with respect to the bottom surface 100b. The height Z1 of the green body 10 is the distance from the bottom surface 100b to the top surface 100t. The position of 1.0 of the height Z1 of the green body 10 corresponds to the top surface 100t.

[0165] According to the above structure, since the first through-wiring 13 has the outer peripheral portion 131, the inner diameter of the coil 110 can be increased and the Q value can be improved. In addition, since the outer peripheral portion 131 is arranged between 0.3 and 0.7 of the height Z1 of the green body, the outer peripheral portion 131 can be provided only in a part of the height Z1 of the green body 10. Thus, the possibility of the first through-wiring 13 being exposed from the green body 10 during singulation can be reduced.

[0166] Similarly, when the second through-wiring 14 is viewed in the direction of the axis AX, it has an outer peripheral portion that is located radially outside the coil 110 compared to the bottom surface wiring 11b and the top surface wiring 11t, and the outer peripheral portion is arranged between 0.3 and 0.7 of the height Z1 of the green body 10. Thus, the inner diameter of the coil 110 can be increased to improve the Q value, and in addition, the possibility of the second through-wiring 14 being exposed from the green body 10 during singulation can be reduced.

[0167] Preferably, the first through-wiring 13 contains SiO 2 . Accordingly, in the case where the green body 10 contains SiO 2 , the coefficient of linear expansion of the first through-wiring 13 can be made consistent with the coefficient of linear expansion of the green body 10, and cracks between the first through-wiring 13 and the green body 10 can be suppressed. The first through-wiring 13 uses, for example, a conductive paste. The conductive material is Ag, Cu, etc. Preferably, the second through-wiring 14 also contains SiO2 。

[0168] As Figure 2 shown, preferably when viewed from a direction orthogonal to the bottom surface 100b, the first end portion of the bottom surface wiring 11b overlaps with the first end portion of the top surface wiring 11t, and the angle θ formed between the bottom surface wiring 11b and the top surface wiring 11t is an acute angle. The angle θ means the angle between the center line ( Figure 2 dash-dotted line) of the width of the bottom surface wiring 11b and the center line ( Figure 2 dash-dotted line) of the width of the top surface wiring 11t when viewed from a direction orthogonal to the bottom surface 100b.

[0169] As Figure 2 shown, preferably when viewed from a direction orthogonal to the bottom surface 100b, the angle θ formed between the bottom surface wiring 11b and the top surface wiring 11t connected to the same first through-wiring 13 is 5° or more and 45° or less. The angle θ means the angle between the center line ( Figure 2 dash-dotted line) of the width of the bottom surface wiring 11b and the center line ( Figure 2 dash-dotted line) of the width of the top surface wiring 11t when viewed from a direction orthogonal to the bottom surface 100b.

[0170] According to the above structure, since the coil 110 is wound tightly, the inductance can be increased. Since the angle θ is 45° or less, the coil length becomes shorter, the leakage magnetic flux is reduced, and the Q value is increased. The coil length means the interval between the two end portions located at the outermost position in the direction closest to the axis AX among the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14. Since the angle θ is 5° or more, the possibility of contact between two adjacent first through-wirings 13 in the axis AX direction can be reduced, and in addition, the possibility of contact between two adjacent second through-wirings 14 in the axis AX direction can be reduced. Furthermore, it is sufficient that the angle θ is 5° or more and 45° or less in at least one set of the bottom surface wiring 11b and the top surface wiring 11t among all the bottom surface wirings 11b and the top surface wirings 11t.

[0171] Similarly, preferably when viewed from a direction orthogonal to the bottom surface 100b, the angle θ formed between the bottom surface wiring 11b and the top surface wiring 11t connected to the same second through-wiring 14 is 5° or more and 45° or less. Based on this, since the coil 110 is wound tightly, the inductance can be increased.

[0172] Preferably, at least one of the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 includes a void portion or a resin portion. Accordingly, the stress caused by the difference in the linear expansion coefficients of the wiring and the green body 10 can be absorbed by the void portion or the resin portion, and the stress can be alleviated. As a method of forming the void portion, for example, a component that burns out by sintering can be used in the material of the wiring, and the void portion can be formed by sintering the wiring. As a method of forming the resin portion, for example, the resin portion can be formed by using a conductive paste in the material of the wiring.

[0173] Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t contains SiO 2 . Accordingly, when the green body 10 contains SiO 2 , the linear expansion coefficient of the wiring can be made to coincide with the linear expansion coefficient of the green body 10, and cracks between the wiring and the green body 10 can be suppressed.

[0174] (The first external electrode 121 and the second external electrode 122)

[0175] The first external electrode 121 is connected to the first end portion of the coil 110, and the second external electrode 122 is connected to the second end portion of the coil 110. The first external electrode 121 is provided on the first end surface 100e1 side with respect to the center of the green body 10 in the X direction so as to be exposed from the outer surface 100 of the green body 10. The second external electrode 122 is provided on the second end surface 100e2 side with respect to the center of the green body 10 in the X direction so as to be exposed from the outer surface 100 of the green body 10.

[0176] When viewed from a direction orthogonal to the bottom surface 100b, the first external electrode 121 and the second external electrode 122 are located inside compared to the outer surface 100 of the green body 10. In other words, the first external electrode 121 and the second external electrode 122 are located inside compared to the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, and the second side surface 100s2 of the green body 10.

[0177] According to the above structure, since the first external electrode 121 and the second external electrode 122 do not contact the outer surface 100 of the green body 10, when singulating each inductor component, the load applied to the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component is miniaturized, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0178] In addition, the first external electrode 121 may also be continuously provided on the bottom surface 100b and the first end surface 100e1. Accordingly, since the first external electrode 121 is an electrode in a so-called L shape, when the inductor component 1 is mounted on the mounting substrate, solder feet can be formed on the first external electrode 121. Similarly, the second external electrode 122 may also be continuously provided on the bottom surface 100b and the second end surface 100e2.

[0179] The first external electrode 121 has a bottom surface portion 121b provided on the bottom surface 100b and a conduction portion 121v embedded in the bottom surface 100b. The conduction portion 121v is connected to the bottom surface portion 121b. The conduction portion 121v is connected to the end of the bottom surface wiring 11b on the side of the first end surface 100e1 in the direction of the axis AX.

[0180] The second external electrode 122 has a bottom surface portion 122b provided on the bottom surface 100b and a conduction portion 122v embedded in the bottom surface 100b. The conduction portion 122v is connected to the bottom surface portion 122b. The conduction portion 122v is connected to the end of the bottom surface wiring 11b on the side of the second end surface 100e2 in the direction of the axis AX.

[0181] The first external electrode 121 has a base layer 121e1 and a plating layer 121e2 covering the base layer 121e1. The base layer 121e1 contains conductive materials such as Ag and Cu, for example. The plating layer 121e2 contains conductive materials such as Ni and Sn, for example. A part of the bottom surface portion 121b and the conduction portion 121v are constituted by the base layer 121e1. Another part of the bottom surface portion 121b is constituted by the plating layer 121e2. Similarly, the second external electrode 122 has a base layer and a plating layer covering the base layer. In addition, the first external electrode 121 and the second external electrode 122 may also be constituted by a single-layer conductive material.

[0182] (Manufacturing method of the inductor component 1)

[0183] Next, use Figures 5A - 5M to explain the manufacturing method of the inductor component 1. Figures 5A - 5H 、 Figure 5K 、 Figure 5L is a figure corresponding to the II-II cross-section of Figure 1 . Figure 5I 、 Figure 5J 、 Figure 5M is a figure corresponding to the III-III cross-section of Figure 1 .

[0184] As shown in Figure 5AAs shown in the figure, a first insulating layer 1011 is provided on a base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc., and the material of the first insulating layer 1011 is, for example, a resin such as epoxy resin or polyimide, or an inorganic insulating film such as SiO or SiN.

[0185] As Figure 5B shown in the figure, a second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed, for example, by a photolithography process. In addition, the groove may be formed as a printing pattern from the beginning.

[0186] As Figure 5C shown in the figure, a top surface conductor layer 1011t is provided on the groove 1012a by printing. The material of the top surface conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc. At this time, for example, the top surface conductor layer 1011t is formed to remain only on the groove 1012a as a printing pattern. In addition, after printing the top surface conductor layer 1011t on the second insulating layer 1012, the top surface conductor layer 1011t may be made to remain only on the groove 1012a by a photolithography process.

[0187] As Figure 5D shown in the figure, a third insulating layer 1013 is provided on the second insulating layer 1012 by printing. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed by the same method as Figure 5B the same.

[0188] As Figure 5E shown in the figure, a first through-conductor layer 1131 of the first layer is provided in the first groove 1013a by printing, and a second through-conductor layer 1141 of the first layer is provided in the second groove 1013b by printing. The first through-conductor layer 1131 of the first layer and the second through-conductor layer 1141 of the first layer are formed by the same method as Figure 5C the same.

[0189] Repeat the above process. As Figure 5FAs shown, a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a first through-conductor layer 1132 of the second layer and a second through-conductor layer 1142 of the second layer are respectively provided on two grooves provided in the fourth insulating layer 1014. Further, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a first through-conductor layer 1133 of the third layer and a second through-conductor layer 1143 of the third layer are respectively provided on two grooves provided in the fifth insulating layer 1015. Further, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a first through-conductor layer 1134 of the fourth layer and a second through-conductor layer 1144 of the fourth layer are respectively provided on two grooves provided in the sixth insulating layer 1016. Further, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016, and a first through-conductor layer 1135 of the fifth layer and a second through-conductor layer 1145 of the fifth layer are respectively provided on two grooves provided in the seventh insulating layer 1017.

[0190] At this time, the first through-conductor layer 1131 of the first layer, the first through-conductor layer 1132 of the second layer, and the first through-conductor layer 1133 of the third layer are sequentially stacked so as to be offset toward the radially outer side of the coil, and the first through-conductor layer 1133 of the third layer, the first through-conductor layer 1134 of the fourth layer, and the first through-conductor layer 1135 of the fifth layer are sequentially stacked so as to be offset toward the radially inner side of the coil. Similarly, the second through-conductor layer 1141 of the first layer, the second through-conductor layer 1142 of the second layer, and the second through-conductor layer 1143 of the third layer are sequentially stacked so as to be offset toward the radially outer side of the coil, and the second through-conductor layer 1143 of the third layer, the second through-conductor layer 1144 of the fourth layer, and the second through-conductor layer 1145 of the fifth layer are sequentially stacked so as to be offset toward the radially inner side of the coil.

[0191] As Figure 5G shown, an eighth insulating layer 1018 is provided on the seventh insulating layer 1017, and a bottom conductor layer 1011b is provided in a groove provided in the eighth insulating layer 1018. The material of the bottom conductor layer 1011b is the same as that of the top conductor layer 1011t. As Figure 5H shown, a ninth insulating layer 1019 is provided on the eighth insulating layer 1018.

[0192] As Figure 5I shown, a groove 1019a is provided in the ninth insulating layer 1019 to expose a part of the bottom conductor layer 1011b. As Figure 5J shown, a base conductor layer 1121e1 is provided on the ninth insulating layer 1019 and in the groove 1019a. The material of the base conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.

[0193] As Figure 5KAs shown, the entire laminate is sintered in a furnace at a high temperature (e.g., 500°C or higher). The first to ninth insulating layers 1011 to 1019 are sintered to form a green body 10, the top surface conductor layer 1011t is sintered to form the top surface wiring 11t, the bottom surface conductor layer 1011b is sintered to form the bottom surface wiring 11b, the first through-conductor layers 1131 to 1135 of the first to fifth layers are sintered to form the first through-wiring 13, the second through-conductor layers 1141 to 1145 of the first to fifth layers are sintered to form the second through-wiring 14, and the base conductor layer 1121e1 is sintered to form the base layer 121e1. Therefore, sintering the insulating layer can improve the strength. In addition, by sintering the conductor layer, unnecessary resin components contained in the conductor layer can be volatilized, and the conductor material contained in the conductor layer is melted to achieve a high conductivity. The base substrate 1000 can be peeled off by surface decomposition during sintering, or can be removed mechanically by grinding or the like before and after sintering, or can be removed chemically by etching or the like before and after sintering.

[0194] As Figure 5L shown, singulation is performed with a dicing line C. As Figure 5M shown, a plating layer 121e2 is formed by barrel plating to cover the base layer 121e1, and the first external electrode 121 is formed. Thus, as Figure 2 shown, the inductor component 1 is manufactured.

[0195] 3. Modification

[0196] (First Modification)

[0197] Figure 6A is a diagram corresponding to the II-II cross-section of the first modification of the inductor component and Figure 1 . As Figure 6A shown, in the inductor component 1A of the first modification, when viewed from the axis AX direction, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0198] Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center such that the distance between them is wider at the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 at the center in the Z direction.

[0199] In addition, the first through-wiring 13 and the second through-wiring 14 each have an arc shape along the Z direction. In other words, the inner side surface of the first through-wiring 13 has a concave curved surface, and the outer side surface of the first through-wiring 13 has a convex curved surface. The inner side surface of the second through-wiring 14 has a concave curved surface, and the outer side surface of the second through-wiring 14 has a convex curved surface. The inner side surfaces of the first through-wiring 13 and the second through-wiring 14 are the surfaces on the inner diameter side of the coil 110, and the outer side surfaces of the first through-wiring 13 and the second through-wiring 14 are the surfaces on the outer diameter side of the coil 110.

[0200] According to the above structure, the inner side surfaces and the outer side surfaces of the first through-wiring 13 and the second through-wiring 14 can be made smooth, and the DC resistance can be reduced. In particular, since the inner side surfaces of the first through-wiring 13 and the second through-wiring 14 are smooth, the increase in resistance at high frequencies caused by the skin effect can be suppressed, and the Q value can be increased.

[0201] (Second modification example)

[0202] Figure 6B is a diagram corresponding to the II-II cross-section of the second modification example of the inductor component Figure 1 As shown in Figure 6B In the inductor component 1B of the second modification example, when viewed from the axis AX direction, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be increased.

[0203] Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the interval therebetween is wider on the top surface wiring 11t side in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 as they approach the top surface wiring 11t in the Z direction. Thus, when viewed from the axis AX direction, the coil 110 has a trapezoidal shape.

[0204] According to the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a straight shape to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0205] (Third modification example)

[0206] Figure 6C is a diagram corresponding to the II-II cross-section of the third modification example of the inductor component Figure 1 As shown in Figure 6C In the inductor component 1C of the third modification example, Figure 2Compared with the inductor component 1 shown, it includes a first coil 110A and a second coil 110B. The first coil 110A corresponds to Figure 2 the coil 110 of the inductor component 1 shown.

[0207] The second coil 110B is the same as the first coil 110A, is provided on the green body 10, is wound in a spiral shape along the axis AX (an example of the second axis), and is connected to a third external electrode and a fourth external electrode (not shown). The third external electrode and the fourth external electrode have the same structure as Figure 1 the first external electrode 121 and the second external electrode 122 of the inductor component 1 shown.

[0208] The second coil 110B is the same as the first coil 110A and includes a bottom surface wiring 11b (an example of a third coil wiring), a top surface wiring 11t (an example of a fourth coil wiring), a first through wiring 13 (an example of a third through wiring), and a second through wiring 14 (an example of a fourth through wiring).

[0209] In the first coil 110A, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel. Accordingly, the distance between the first through wiring 13 and the second through wiring 14 can be enlarged, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0210] Specifically, the first through wiring 13 has the same structure as Figure 2 the first through wiring 13 of the inductor component 1 shown. On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the interval between the first through wiring 13 and the second through wiring 14 is wider at the center in the Z direction. The first through wiring 13 has a stepped shape along the Z direction. According to the above structure, in the case of forming the first through wiring 13 by laminating a plurality of conductor layers, the first through wiring 13 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0211] In the second coil 110B, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel. Accordingly, the distance between the first through wiring 13 and the second through wiring 14 can be enlarged, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0212] Specifically, the second through wiring 14 is the same as Figure 2The second through-wiring 14 of the inductor component 1 has the same structure. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is bent at the center such that the interval between the first through-wiring 13 and the second through-wiring 14 is wider at the center in the Z direction. The second through-wiring 14 has a stepped shape along the Z direction. According to the above structure, in the case where the second through-wiring 14 is formed by laminating a plurality of conductor layers, the second through-wiring 14 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0213] Preferably, as Figure 6C shown, the axis AX of the first coil 110A is arranged in parallel with the axis AX of the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the first through-wiring 13 and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M line between the first coil 110A and the second coil 110B. The center line M refers to the line passing through the center between the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B when viewed from the direction of the axis AX of the first coil 110A. Specifically, the first through-wiring 13 of the first coil 110A and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M line, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are symmetric with respect to the center line M line. Accordingly, the first coil 110A and the second coil 110B having the same characteristics can be easily obtained.

[0214] Preferably, as Figure 6C shown, the axis AX of the first coil 110A is arranged in parallel with the axis AX of the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A is adjacent to the first through-wiring 13 of the second coil 110B, and the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B. Accordingly, since the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B, the distance between the adjacent first coil 110A and the second coil 110B can be reduced, and the inductor component 1C can be made small.

[0215] Preferably, as Figure 6CAs shown, the axis AX of the first coil 110A is arranged in parallel with the axis AX of the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A is adjacent to the first through-wiring 13 of the second coil 110B, and the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B. In the first coil 110A, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are non-linearly symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX.

[0216] According to the above structure, since the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B, the distance between the adjacent first coil 110A and the second coil 110B can be reduced, and the inductor component 1C can be miniaturized. In addition, in the first coil 110A, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are non-linearly symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX, so the design freedom of the first through-wiring 13 and the second through-wiring 14 can be further improved.

[0217] In addition, similarly, in the second coil 110B, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 can be non-linearly symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX.

[0218] (Fourth modification example)

[0219] Figure 6D is a diagram corresponding to the II-II cross-section of the fourth modification example of the inductor component Figure 1 As shown in Figure 6D In the inductor component 1D of the fourth modification example, compared with the inductor component 1A shown in Figure 6A the coil includes the first coil 110A and the second coil 110B.

[0220] In the first coil 110A, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be enlarged, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0221] Specifically, the first through-wiring 13 is Figure 6AThe same structure as the first through-wiring 13 of the inductor component 1A. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is bent at the center such that the interval between the first through-wiring 13 and the second through-wiring 14 is wider at the center in the Z direction. The first through-wiring 13 has an arc shape along the Z direction. With the above structure, the side surface of the first through-wiring 13 can be smoothed, and the DC resistance of the first through-wiring 13 can be reduced.

[0222] In the second coil 110B, when viewed from the axis AX direction, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, and the inner diameter of the coil 110B can be increased to improve the Q value.

[0223] Specifically, the second through-wiring 14 is of the same structure as the Figure 6A second through-wiring 14 of the inductor component 1A. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is bent at the center such that the interval between the first through-wiring 13 and the second through-wiring 14 is wider at the center in the Z direction. The second through-wiring 14 has an arc shape along the Z direction. With the above structure, the side surface of the second through-wiring 14 can be smoothed, and the DC resistance of the second through-wiring 14 can be reduced.

[0224] Preferably, as Figure 6D shown, the axis AX of the first coil 110A is arranged parallel to the axis AX of the second coil 110B. When viewed from the axis AX direction of the first coil 110A, the first through-wiring 13 and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M line between the first coil 110A and the second coil 110B. Specifically, the first through-wiring 13 of the first coil 110A and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M line, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are symmetric with respect to the center line M line. Accordingly, the first coil 110A and the second coil 110B with the same characteristics can be easily obtained.

[0225] Preferably, as Figure 6DAs shown, the axis AX of the first coil 110A is arranged in parallel with the axis AX of the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A is adjacent to the first through-wiring 13 of the second coil 110B, and the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B. Accordingly, since the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B, the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1D can be miniaturized.

[0226] Preferably, as Figure 6D shown, the axis AX of the first coil 110A is arranged in parallel with the axis AX of the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A is adjacent to the first through-wiring 13 of the second coil 110B, and the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B. In the first coil 110A, when viewed from the axis AX direction, the first through-wiring 13 and the second through-wiring 14 are non-line-symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX.

[0227] According to the above structure, since the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B, the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1D can be miniaturized. In addition, in the first coil 110A, when viewed from the axis AX direction, the first through-wiring 13 and the second through-wiring 14 are non-line-symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX, so the design freedom of the first through-wiring 13 and the second through-wiring 14 can be further improved.

[0228] In addition, similarly, in the second coil 110B, when viewed from the axis AX direction, the first through-wiring 13 and the second through-wiring 14 can be non-line-symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX.

[0229] (Fifth Modified Example)

[0230] Figure 6E is a diagram corresponding to the II-II cross-section of the fifth modified example of the inductor component and Figure 1 of. As Figure 6E shown, in the inductor component 1E of the fifth modified example, compared with the inductor component 1B of the second modified example shown in Figure 6B , it includes the first coil 110A and the second coil 110B.

[0231] In the first coil 110A, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0232] Specifically, the first through-wiring 13 has the same structure as the first through-wiring 13 of the inductor component 1B of the second modification. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the top surface wiring 11t side in the Z direction. According to the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0233] In the second coil 110B, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0234] Specifically, the second through-wiring 14 has the same structure as the second through-wiring 14 of the inductor component 1B of the second modification. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the top surface wiring 11t side in the Z direction. According to the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape, and the resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0235] Preferably, as Figure 6E shown, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged in parallel. When viewed from the direction of the axis AX of the first coil 110A, the first through-wiring 13 and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M line between the first coil 110A and the second coil 110B. Specifically, the first through-wiring 13 of the first coil 110A and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M line, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are symmetric with respect to the center line M line. Accordingly, the first coil 110A and the second coil 110B having the same characteristics can be easily obtained.

[0236] Preferably, as Figure 6E shown, the axis AX of the first coil 110A is arranged in parallel with the axis AX of the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A is adjacent to the first through-wiring 13 of the second coil 110B, and the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B. Accordingly, since the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B, the distance between the adjacent first coil 110A and the second coil 110B can be reduced, and the inductor component 1E can be miniaturized.

[0237] Preferably, as Figure 6E shown, the axis AX of the first coil 110A is arranged in parallel with the axis AX of the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A is adjacent to the first through-wiring 13 of the second coil 110B, and the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B. In the first coil 110A, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are non-line-symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX.

[0238] According to the above structure, since the second through-wiring 14 of the first coil 110A is arranged in parallel with the first through-wiring 13 of the second coil 110B, the distance between the adjacent first coil 110A and the second coil 110B can be reduced, and the inductor component 1E can be miniaturized. In addition, in the first coil 110A, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 are non-line-symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX, so the design freedom of the first through-wiring 13 and the second through-wiring 14 can be further improved.

[0239] In addition, similarly, in the second coil 110B, when viewed from the direction of the axis AX, the first through-wiring 13 and the second through-wiring 14 can be non-line-symmetric with respect to the straight line L1 that is orthogonal to the bottom surface 100b and includes the axis AX.

[0240] <Second Embodiment>

[0241] Figure 7 is a schematic bottom view showing a second embodiment of the inductor component as viewed from the bottom surface side. Figure 8 is Figure 7 the VIII-VIII cross-sectional view. In Figure 7In the figure, for convenience, the description of the insulating layer is omitted, and the external electrodes are depicted by double-dashed lines. Additionally, in Figure 7 in order to easily understand the structure, the green body 10 is depicted transparently. The second embodiment is mainly different from the first embodiment in the position of the axis of the coil, the material of the green body, and the provision of the insulating layer. The following mainly describes these different structures. Other structures are the same as those of the first embodiment, and their descriptions are omitted.

[0242] 1. Structure of each part

[0243] (Inductor component 1F)

[0244] As Figure 7 shown, in the inductor component 1F, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the green body 10 in the X direction. Accordingly, the interference of the first external electrode 121 and the second external electrode 122 with the magnetic flux of the coil 110 can be reduced, and the acquisition efficiency of the inductance can be improved.

[0245] The length of the coil 110 in the direction of the axis AX is shorter than the inner diameter of the coil 110. The length of the coil 110 in the direction of the axis AX is also referred to as the coil length. Accordingly, since the coil length becomes shorter and the inner diameter of the coil becomes larger, the Q value can be improved. The inner diameter of the coil refers to the circular equivalent diameter based on the minimum area of the region surrounded by the coil 110 when viewed through in the direction of the axis AX.

[0246] (Green body 10)

[0247] The green body 10 is an inorganic insulator. Preferably, the material of the green body 10 is glass. Accordingly, since the insulation of glass is relatively high, eddy currents can be suppressed, and the Q value can be improved. Preferably, the green body 10 contains Si elements. Accordingly, the thermal stability of the green body 10 is improved. Therefore, variations in the dimensions of the green body 10 caused by heat can be suppressed, and electrical property deviations can be reduced.

[0248] Preferably, the green body 10 is a single-layer glass plate. Accordingly, the strength of the green body 10 can be ensured. Additionally, in the case of a single-layer glass plate, since the dielectric loss is small, the Q value at high frequencies can be improved. Additionally, since there is no sintering process like that of a sintered body, deformation of the green body 10 during sintering can be suppressed, thereby suppressing pattern misalignment, and an inductor component with a smaller inductance tolerance can be provided.

[0249] As the material of the single-layer glass plate, from the viewpoint of the manufacturing method, a photosensitive glass plate typified by Foturan II (registered trademark of Schott AG) is preferred. In particular, it is preferred that the single-layer glass plate contains cerium oxide (cerium oxide: CeO 2 ). In this case, the cerium oxide becomes a sensitizer, and processing based on photolithography becomes easier.

[0250] However, the single-layer glass plate can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching processing using a photoresist-metal mask, laser processing, etc., so it can also be a glass plate that does not have photosensitivity. In addition, the single-layer glass plate can be a glass plate obtained by sintering glass paste or can be formed by a known method such as the float method.

[0251] (Insulator 22)

[0252] As Figure 8 shown, the inductor component 1F has an insulator 22. The insulator 22 covers the bottom surface 100b and the top surface 100t of the green body 10, respectively. In addition, the insulator 22 can also be provided only on the bottom surface 100b among the bottom surface 100b and the top surface 1100t.

[0253] The insulator 22 is a component that covers the wiring (bottom surface wiring 11b, top surface wiring 11t) and has the functions of protecting the wiring from external forces and preventing damage to the wiring and improving the insulation of the wiring. It is preferable that the insulator 22 is an organic insulator. For example, the insulator 22 can be a resin film such as epoxy resin or polyimide that is easy to form. In particular, it is preferable that the insulator 22 is made of a material with a low dielectric constant. Thus, when there is an insulator 22 between the coil 110 and the external electrodes 121 and 122, the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 can be reduced. For example, the insulator 22 can be formed by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.) or coating a paste-like resin and then performing thermal curing, etc. In addition, the insulator 22 can also be an inorganic film such as an oxide, nitride, or oxynitride of silicon, hafnium, etc., which has excellent insulation and thin film properties.

[0254] It is preferable that the green body 10 is an inorganic insulator. When the insulator 22 is an organic insulator, when viewed from a direction orthogonal to the bottom surface 100b, the outer surface of the organic insulator is located inside compared to the inorganic insulator 100. Accordingly, since there is an organic insulator, the organic insulator is easy to impart fluidity, and when covering the wiring (bottom surface wiring 11b, top surface wiring 11t) with the organic insulator, the organic insulator can be easily filled between adjacent wirings, and the insulation can be improved. In addition, since the organic insulator does not contact the outer surface of the inorganic insulator, when singulating each inductor component, the load applied to the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0255] (Coil 110)

[0256] As Figure 7As shown, the bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b has a shape extending in the X direction. All the bottom surface wirings 11b are arranged in parallel along the Y direction. The top surface wiring 11t extends only in one direction. Specifically, the top surface wiring 11t extends in the X direction while being slightly inclined in the Y direction. All the top surface wirings 11t are arranged in parallel along the Y direction.

[0257] As Figure 7 and Figure 8 shown, the first through-wiring 13 is disposed on the first end face 100e1 side with respect to the axis AX within the through-hole V of the green body 10, and the second through-wiring 14 is disposed on the second end face 100e2 side with respect to the axis AX within the through-hole V of the green body 10. The first through-wiring 13 and the second through-wiring 14 extend in directions orthogonal to the bottom surface 100b and the top surface 100t, respectively. A plurality of first through-wirings 13 and a plurality of second through-wirings 14 are arranged in parallel along the Y direction, respectively.

[0258] The first through-wiring 13 and the second through-wiring 14 are non-parallel when viewed from the axis AX direction. Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance therebetween becomes wider on the top surface wiring 11t side in the Z direction. The first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 on the top surface wiring 11t side in the Z direction. The coil 110 has a trapezoidal shape when viewed from the axis AX direction. With the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a straight shape to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0259] Figure 9 is Figure 8 a partial enlarged view of. As Figure 7 、 Figure 8 and Figure 9 shown, the first through-wiring 13 has a first connection surface 13y1 connected to the bottom surface wiring 11b and a second connection surface 13y2 connected to the top surface wiring 11t. The first external electrode 121 is provided on the bottom surface 100b side, and at least a part of the first external electrode 121 overlaps with the first connection surface 13y1 when viewed from a direction orthogonal to the bottom surface 100b. When viewed from the axis AX direction, the inclination angle α on the axis AX side formed by the straight line L3 connecting the centers of the first connection surface 13y1 and the second connection surface 13y2 and the connection surface 11t2 of the top surface wiring 11t connected to the first through-wiring 13 is 60° or more and less than 90°.

[0260] According to the above structure, since the inclination angle α is less than 90°, it is possible to reduce the area of the bottom surface wiring 11b that overlaps with the first external electrode 121 when viewed from a direction orthogonal to the bottom surface 100b. Thereby, the parasitic capacitance between the first external electrode 121 and the bottom surface wiring 11b can be reduced, and the self-resonant frequency can be increased. In addition, since the inclination angle α is 60° or more, the inner diameter of the coil 110 can be ensured to ensure the Q value.

[0261] In addition, similarly, the second through-wiring 14 may have a first connection surface 14y1 connected to the bottom surface wiring 11b and a second connection surface 14y2 connected to the top surface wiring 11t. The second external electrode 122 is provided on the bottom surface 100b side, and at least a part of the second external electrode 122 overlaps with the first connection surface 14y1 when viewed from a direction orthogonal to the bottom surface 100b. At this time, when viewed from the axis AX direction, the inclination angle β on the axis AX side formed by the straight line L4 connecting the center of the first connection surface 14y1 and the center of the second connection surface 14y2 and the connection surface 11t3 of the top surface wiring 11t to which the second through-wiring 14 is connected may be 60° or more and less than 90°.

[0262] According to the above structure, since the inclination angle β is less than 90°, it is possible to reduce the area of the bottom surface wiring 11b that overlaps with the second external electrode 122 when viewed from a direction orthogonal to the bottom surface 100b. Thereby, the parasitic capacitance between the second external electrode 122 and the bottom surface wiring 11b can be reduced, and the self-resonant frequency can be increased. In addition, since the inclination angle β is 60° or more, the inner diameter of the coil 110 can be ensured to ensure the Q value.

[0263] Preferably, as Figure 7 shown, in the first through-wiring 13, when viewed from a direction orthogonal to the bottom surface 100b, a part of the first connection surface 13y1 overlaps with a part of the second connection surface 13y2. Accordingly, when a through-hole V is formed in the green body 10, a seed layer is provided on the inner surface of the through-hole V, and the first through-wiring 13 is formed on the seed layer by electrolytic plating, the formation of the seed layer becomes easy. In addition, similarly, in the second through-wiring 14, when viewed from a direction orthogonal to the bottom surface 100b, a part of the first connection surface 14y1 may overlap with a part of the second connection surface 14y2.

[0264] Preferably, as Figure 7As shown, in the first through-wiring 13, when viewed from a direction orthogonal to the bottom surface 100b, the center of the first connection surface 13y1 is closer to the axis AX than the center of the second connection surface 13y2. Accordingly, when viewed from a direction orthogonal to the bottom surface 100b, the first connection surface 13y1 is disposed inside the coil 110 as compared with the second connection surface 13y2. Thereby, it is possible to reduce the area of the bottom surface wiring 11b that overlaps with the first external electrode 121 when viewed from a direction orthogonal to the bottom surface 100b, it is possible to reduce the parasitic capacitance between the first external electrode 121 and the bottom surface wiring 11b, and the self-resonant frequency can be increased. Further, similarly, in the second through-wiring 14, when viewed from a direction orthogonal to the bottom surface 100b, the center of the first connection surface 14y1 may be closer to the axis AX than the center of the second connection surface 14y2.

[0265] (Method of manufacturing the inductor component 1F)

[0266] Next, Figures 10A - 10H the method of manufacturing the inductor component 1F will be described. Figures 10A - 10H is a diagram corresponding to the VIII-VIII cross-section of Figure 7 .

[0267] As Figure 10A shown, a copper foil 2001 is provided on the base substrate 2000 by printing. The material of the base substrate 2000 is the same as that of the base substrate 1000 of the first embodiment.

[0268] As Figure 10B shown, a glass substrate 2010 that becomes a green body 10 is provided on the base substrate 2000. For example, a jig such as a conductive tape, a pin, or a frame is used to closely adhere the base substrate 2000 and the glass substrate 2010. The glass substrate 2010 has a first through-hole V1 and a second through-hole V2. The first through-hole V1 and the second through-hole V2 are non-parallel. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. The TGV substrate is a substrate in which through-holes are formed in advance by laser, photolithography, or the like. The glass substrate 2010 may also be, for example, a TSV (Through Silicon Via) substrate, or may be otherwise. Further, Ti / Cu or other necessary conductive materials may be vapor-deposited on the surface of the glass substrate 2010 in advance by sputtering or the like as a seed.

[0269] As Figure 10CAs shown, a first through-conductor layer 2013 that forms a first through-wiring 13 is formed within a first through-hole V1. A second through-conductor layer that forms a second through-wiring 14 is formed within a second through-hole V2. Specifically, by supplying power from a copper foil 2001 on a base substrate 2000, the first through-conductor layer 2013 is formed by electrolytic electroplating in the first through-hole V1, and the second through-conductor layer 2014 is formed by electrolytic electroplating in the second through-hole V2. In addition to this, a seed layer can also be formed on the surface of the glass substrate 2010 and the inner surfaces of the through-holes V1 and V2 by sputtering or the like, and a through-conductor layer can be formed using methods such as filling electroplating, conformal electroplating, and printing and filling methods of conductive paste based on known methods. When there is unwanted plating growth on the surface of the glass substrate 2010, the unwanted portions are removed by grinding, CMP, wet etching (etching), or dry etching.

[0270] As Figure 10D shown, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 can be removed by mechanical methods such as grinding, or it can also be removed by chemical methods such as etching.

[0271] As Figure 10E shown, a bottom surface conductor layer 2011b that forms a bottom surface wiring 11b and a top surface conductor layer 2011t that forms a top surface wiring 11t are formed on the glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed by electrolytic electroplating on the seed layer at the opening of the photoresist. The photoresist and the seed layer are removed by wet etching or dry etching. Thus, the bottom surface conductor layer 2011b and the top surface conductor layer 2011t patterned into arbitrary shapes are formed. At this time, the bottom surface conductor layer 2011b and the top surface conductor layer 2011t can be formed one by one, or both can be formed simultaneously.

[0272] As Figure 10F shown, an insulating layer 2022 that forms an insulator 22 is provided on the top surface and the bottom surface of the glass substrate 2010 to cover the conductor layer. At this time, the bottom surface side insulating layer 2022 and the top surface side insulating layer 2022 can be formed one by one, or both can be formed simultaneously. Thereafter, holes 2022a are provided on the bottom surface conductor layer 2011b of the bottom surface side insulating layer 2022 using photolithography or laser processing.

[0273] As Figure 10GAs shown, a first external electrode conductor layer 2121 that serves as the first external electrode 121 is provided on the insulating layer 2022 on the bottom surface side. At this time, the first external electrode conductor layer 2121 is connected to the bottom surface conductor layer 2011b. Specifically, a Pd catalyst (not shown) is provided on the insulating layer 2022 on the bottom surface side, and Ni and Au plating layers are formed by electroless plating. A patterned photoresist is formed on the plating layer. The plating layer in the opening of the photoresist is removed by wet etching or dry etching. Thus, the first external electrode conductor layer 2121 patterned into an arbitrary shape is formed. Alternatively, a seed layer (not shown) is provided on the insulating layer 2022 on the bottom surface side, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the opening of the photoresist is removed by wet etching or dry etching. Ni and Au plating layers can also be formed by electroless plating on the remaining seed layer. Similarly, a second external electrode conductor layer 2122 that serves as the second external electrode 122 is provided on the insulating layer 2022 on the bottom surface side.

[0274] As Figure 10H shown, singulation is performed along the dicing line C. Thus, as Figure 8 shown, the inductor component 1F is manufactured.

[0275] 2. Modified Example

[0276] (First Modified Example)

[0277] Figure 11A is a diagram corresponding to a part of the VIII-VIII cross-section of the first modified example of the inductor component and Figure 7 As Figure 11A shown, in the inductor component 1G of the first modified example, the cross-sectional areas of both end portions 13e in the extending direction of the first through-wiring 13 are larger than the cross-sectional area of the central portion 13m in the extending direction of the first through-wiring 13. The cross-sectional area of the first through-wiring 13 is the area of the cross-section of the first through-wiring 13 in the direction orthogonal to the bottom surface 100b. In the cross-section of the first through-wiring 13 along the extending direction, the width of the first through-wiring 13 in the direction orthogonal to the bottom surface 100b continuously increases from the central portion 13m toward the end portions 13e.

[0278] Accordingly, the cross-sectional area of the end portion 13e of the first through-wiring 13 can be increased, and the connectivity between the first through-wiring 13 and at least one of the bottom surface wiring 11b and the top surface wiring 11t can be improved. In addition, when a through-hole V as a hole portion is formed in the green body 10 and a conductive material is filled in the through-hole V by electroplating or the like to form the first through-wiring 13 in the through-hole V, it is easy to fill the conductive material on the opening side of the through-hole V. Moreover, since the cross-sectional area of the end portion 13e of the first through-wiring 13 is large and the cross-sectional area of the central portion 13m of the first through-wiring 13 is small, it is easy to form the first through-wiring 13.

[0279] In addition, it is sufficient that the cross-sectional area of one end portion 13e of the first through-wiring 13 is larger than the cross-sectional area of the central portion 13m of the first through-wiring 13. Similarly, the cross-sectional area of at least one end portion of the second through-wiring 14 may be larger than the cross-sectional area of the central portion 13m of the first through-wiring 13.

[0280] (Second Modified Example)

[0281] Figure 11B is a diagram corresponding to a part of the VIII-VIII cross-section of the second modified example of the inductor component Figure 7 As shown in FIG. Figure 11B In the inductor component 1H of the second modified example, the first through-wiring 13 has a conductive layer 13s located on the outer peripheral side and a non-conductive layer 13u located inside the conductive layer 13s when viewed in the extending direction of the first through-wiring 13. Accordingly, when used in the high-frequency band, due to the skin effect, the current mainly flows on the surface of the first through-wiring 13, so the Q value is not reduced due to the conductive layer 13s being provided on the outer peripheral side. In addition, by providing the non-conductive layer 13u inside, stress can be alleviated, and in addition, the manufacturing cost can be reduced by not using a conductor.

[0282] An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through-hole V of the green body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electroplating. In this way, a plurality of conductive layers 13s such as Ti / Cu / Electrolytic Cu or Pd / Electroless Cu / Electrolytic Cu can be formed on the outer peripheral side of the first through-wiring 13. Thereafter, the inside of the conductive layer 13s is sealed with resin by printing or hot pressing or the like to form a non-conductive layer 13u made of resin. In this way, the current can flow on the surface (conductive layer 13s) of the first through-wiring 13, and the stress can be alleviated by the non-conductive layer 13u inside the first through-wiring 13.

[0283] Similarly, the second through-wiring 14 may also have a conductive layer on the outer peripheral side when viewed in the direction extending from the second through-wiring 14, and a non-conductive layer on the inner side of the conductive layer. In addition, although the cross-sectional area of each of the both end portions in the extending direction of the first through-wiring 13 is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring 13, it is also possible that the cross-sectional area of each of the both end portions in the extending direction of the first through-wiring 13 is the same as the cross-sectional area of the central portion in the extending direction of the first through-wiring 13.

[0284] In addition, the present disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the gist of the present disclosure. For example, various combinations of the characteristic points of the first and second embodiments can also be made.

[0285] The present disclosure includes the following aspects.

[0286] <1> An inductor component, comprising:

[0287] A green body including a first main surface and a second main surface facing each other;

[0288] A coil provided on the above green body and wound in a spiral shape along an axis; and

[0289] A first external electrode and a second external electrode provided on the above green body and electrically connected to the above coil,

[0290] The above axis of the above coil is arranged parallel to the above first main surface,

[0291] The above coil includes:

[0292] A plurality of first coil wirings provided on the first main surface side with respect to the above axis and arranged along the above axis in a plane parallel to the above first main surface;

[0293] A plurality of second coil wirings provided on the second main surface side with respect to the above axis and arranged along the above axis in a plane parallel to the above second main surface;

[0294] A plurality of first through-wirings extending from the above first coil wirings toward the above second coil wirings and arranged along the above axis; and

[0295] A plurality of second through-wirings extending from the above first coil wirings toward the above second coil wirings, provided on the side opposite to the above first through-wirings with respect to the above axis, and arranged along the above axis,

[0296] By sequentially connecting the above first coil wirings, the above first through-wirings, the above second coil wirings, and the above second through-wirings, at least a part of the above spiral shape is formed.

[0297] When viewed from the axial direction, the first through-wiring and the second through-wiring are not parallel.

[0298] <2> The inductor component according to <1>,

[0299] When viewed from a direction orthogonal to the first main surface, the first through-wiring and the second through-wiring are symmetric with respect to the axis.

[0300] <3> The inductor component according to <1> or <2>,

[0301] When viewed from the axial direction, the first through-wiring and the second through-wiring are symmetric with respect to a straight line that is orthogonal to the first main surface and includes the axis.

[0302] <4> The inductor component according to any one of <1> to <3>,

[0303] The line edge roughness of the first through-wiring is greater than the line edge roughness of the first coil wiring.

[0304] <5> The inductor component according to any one of <1> to <3>,

[0305] The line edge roughness of the first through-wiring is the same as or smaller than the line edge roughness of the first coil wiring.

[0306] <6> The inductor component according to <1>,

[0307] The width of the first through-wiring is different from the width of the second through-wiring.

[0308] <7> The inductor component according to any one of <1> to <6>,

[0309] When viewed from the axial direction, the first through-wiring has an outer peripheral portion that is located radially outside the first coil wiring and the second coil wiring,

[0310] The outer peripheral portion is disposed between 0.3 and 0.7 of the height in the direction orthogonal to the first main surface of the green body with respect to the first main surface as a reference.

[0311] <8> The inductor component according to any one of <1> to <7> further includes:

[0312] A second coil, disposed on the green body and wound in a spiral shape along a second axis parallel to the axis; and

[0313] A third external electrode and a fourth external electrode, disposed on the green body and electrically connected to the second coil,

[0314] The above-mentioned second coil includes:

[0315] A plurality of third coil wirings, disposed on the first main surface side with respect to the above-mentioned second axis, and arranged along the above-mentioned second axis in a plane parallel to the above-mentioned first main surface;

[0316] A plurality of fourth coil wirings, disposed on the second main surface side with respect to the above-mentioned second axis, and arranged along the above-mentioned second axis in a plane parallel to the above-mentioned second main surface;

[0317] A plurality of third through wirings, extending from the above-mentioned third coil wiring toward the above-mentioned fourth coil wiring, and arranged along the above-mentioned second axis; and

[0318] A plurality of fourth through wirings, extending from the above-mentioned third coil wiring toward the above-mentioned fourth coil wiring, disposed on the opposite side of the above-mentioned third through wiring with respect to the above-mentioned second axis, and arranged along the above-mentioned second axis,

[0319] By sequentially connecting the above-mentioned third coil wiring, the above-mentioned third through wiring, the above-mentioned fourth coil wiring, and the above-mentioned fourth through wiring, at least a part of the spiral shape of the above-mentioned second coil is formed,

[0320] The above-mentioned second through wiring is adjacent to the above-mentioned third through wiring.

[0321] <9> The inductor component according to <8>,

[0322] When viewed from the above-mentioned axial direction of the above-mentioned coil, the above-mentioned first through wiring and the above-mentioned second through wiring are line-symmetric with respect to the above-mentioned third through wiring and the above-mentioned fourth through wiring with respect to the center line between the above-mentioned coil and the above-mentioned second coil.

[0323] <10> The inductor component according to <8> or <9>,

[0324] When viewed from the above-mentioned axial direction of the above-mentioned coil, the above-mentioned second through wiring is arranged in parallel with the above-mentioned third through wiring.

[0325] <11> The inductor component according to <9>,

[0326] When viewed from the above-mentioned axial direction, the above-mentioned first through wiring and the above-mentioned second through wiring are non-line-symmetric with respect to the straight line orthogonal to the above-mentioned first main surface and including the above-mentioned axis.

[0327] <12> The inductor component according to <8>,

[0328] When viewed from the above-mentioned second axial direction, the above-mentioned third through wiring and the above-mentioned fourth through wiring are non-parallel.

[0329] <13> The inductor component according to any one of <1> to <12>.

[0330] The first through-wiring has a first connection surface and a second connection surface. The first connection surface is connected to the first coil wiring, and the second connection surface is connected to the second coil wiring.

[0331] The first external electrode is provided on the first main surface side and overlaps at least a part of the first connection surface when viewed from a direction orthogonal to the first main surface.

[0332] When viewed from the axial direction, the inclination angle of the axis side formed by the straight line connecting the center of the first connection surface and the center of the second connection surface with the connection surface of the second coil wiring connected to the first through-wiring is 60° or more and less than 90°.

[0333] <14> The inductor component according to <13>.

[0334] When viewed from a direction orthogonal to the first main surface, a part of the first connection surface overlaps a part of the second connection surface.

[0335] <15> The inductor component according to <13> or <14>.

[0336] When viewed from a direction orthogonal to the first main surface, the center of the first connection surface is closer to the axis than the center of the second connection surface.

[0337] <16> The inductor component according to any one of <1> to <15>.

[0338] The first through-wiring has a conductive layer located on the outer peripheral side when viewed from the extending direction of the first through-wiring, and a non-conductive layer located inside the conductive layer.

[0339] <17> The inductor component according to any one of <1> to <16>.

[0340] The cross-sectional area of at least one of the both end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

[0341] <18> The inductor component according to any one of <1> to <17>.

[0342] The thickness of the inductor component is 200 μm or less.

[0343] <19> The inductor component according to any one of <1> to <18>.

[0344] When viewed from a direction orthogonal to the first major surface, the first external electrode and the second external electrode are located inside compared to the outer peripheral surface of the green compact.

[0345] <20>The inductor component according to any one of <1> to <19>,

[0346] further includes an organic insulator, and the organic insulator is provided on the first major surface,

[0347] the green compact is an inorganic insulator, and when viewed from a direction orthogonal to the first major surface, the organic insulator is located inside compared to the outer surface of the inorganic insulator.

[0348] Description of Reference Numerals

[0349] 1, 1A - 1H... inductor components, 10... green compact, 11b... bottom surface wiring (first coil wiring), 11b1... end face, 11t... top surface wiring (second coil wiring), 11t1... end face, 11t2... connection surface, 11t3... connection surface, 13... first through wiring, 131... outer peripheral portion, 13a... center line, 13e... end portion, 13m... central portion, 13s... conductive layer, 13u... non-conductive layer, 13y1... first connection surface, 13y2... second connection surface, 14... second through wiring, 14a... center line, 14y1... first connection surface, 14y2... second connection surface, 22... insulator, 100b... bottom surface (first major surface), 100t... top surface (second major surface), 110, 110A, 110B... coils, 121... first external electrode, 121b... bottom surface portion, 121v... conduction portion, 121e1... base layer, 121e2... plating layer, 122... second external electrode, 122b... bottom surface portion, 122v... conduction portion, AX... axis, L1, L2, L4... straight lines, L3... tangent line, M... center line, V... through hole, Z1... height, θ... angle formed by the bottom surface wiring and the top surface wiring, α, β... inclination angles.

Claims

1. An inductor component, wherein, it includes: a green body including a first main surface and a second main surface facing each other; a coil disposed on the green body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode disposed on the green body and electrically connected to the coil, the axis of the coil is arranged parallel to the first main surface, the coil includes: a plurality of first coil wirings disposed on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface; a plurality of second coil wirings disposed on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wirings toward the second coil wirings and arranged along the axis; and a plurality of second through wirings extending from the first coil wirings toward the second coil wirings, disposed on the side opposite to the first through wirings with respect to the axis, and arranged along the axis, by connecting the first coil wirings, the first through wirings, the second coil wirings, and the second through wirings in this order successively, at least a part of the spiral shape is formed, the first through wiring and the second through wiring are non-parallel when viewed from the axial direction.

2. The inductor component according to claim 1, wherein, when viewed from a direction orthogonal to the first main surface, the first through wiring and the second through wiring are symmetric with respect to the axis line.

3. The inductor component according to claim 1 or 2, wherein, when viewed from the axial direction, the first through wiring and the second through wiring are symmetric with respect to a straight line orthogonal to the first main surface and including the axis.

4. The inductor component according to any one of claims 1 to 3, wherein, the line edge roughness of the first through wiring is larger than the line edge roughness of the first coil wiring.

5. The inductor component according to any one of claims 1 to 3, wherein, the line edge roughness of the first through wiring is the same as or smaller than the line edge roughness of the first coil wiring.

6. The inductor component according to claim 1, wherein, the width of the first through wiring is different from the width of the second through wiring.

7. The inductor component according to any one of claims 1 to 6, wherein, when viewed from the axial direction, the first through wiring has an outer peripheral portion located outside the radial direction of the coil compared with the first coil wiring and the second coil wiring, the outer peripheral portion is arranged between 0.3 or more and 0.7 or less of the height in the direction orthogonal to the first main surface of the green body with the first main surface as a reference.

8. The inductor component according to any one of claims 1 to 7, wherein, it further includes: a second coil disposed on the green body and wound in a spiral shape along a second axis parallel to the axis; and The third external electrode and the fourth external electrode are provided on the green body and are electrically connected to the second coil. The second coil includes: A plurality of third coil wirings, which are provided on the first main surface side with respect to the second axis and are arranged along the second axis in a plane parallel to the first main surface; A plurality of fourth coil wirings, which are provided on the second main surface side with respect to the second axis and are arranged along the second axis in a plane parallel to the second main surface; A plurality of third through wirings, which extend from the third coil wiring toward the fourth coil wiring and are arranged along the second axis; and A plurality of fourth through wirings, which extend from the third coil wiring toward the fourth coil wiring, are provided on the side opposite to the third through wiring with respect to the second axis, and are arranged along the second axis, By connecting the third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring in this order, at least a part of the spiral shape of the second coil is formed. The second through wiring is adjacent to the third through wiring.

9. The inductor component according to claim 8, wherein, When viewed from the axial direction of the coil, the first through wiring and the second through wiring are line-symmetric with respect to the third through wiring and the fourth through wiring with respect to the center line between the coil and the second coil.

10. The inductor component according to claim 8 or 9, wherein, When viewed from the axial direction of the coil, the second through wiring and the third through wiring are arranged in parallel.

11. The inductor component according to claim 9, wherein, When viewed from the axial direction, the first through wiring and the second through wiring are non-line-symmetric with respect to a straight line orthogonal to the first main surface and including the axis.

12. The inductor component according to claim 8, wherein, The third through wiring and the fourth through wiring are non-parallel when viewed from the second axial direction.

13. The inductor component according to any one of claims 1 to 12, wherein, The first through wiring has a first connection surface and a second connection surface. The first connection surface is connected to the first coil wiring, and the second connection surface is connected to the second coil wiring. The first external electrode is provided on the first main surface side and overlaps at least a part of the first connection surface when viewed from a direction orthogonal to the first main surface. When viewed from the axial direction, the inclination angle on the axis side formed by the straight line connecting the center of the first connection surface and the center of the second connection surface and the connection surface of the second coil wiring connected to the first through wiring is 60° or more and less than 90°.

14. The inductor component according to claim 13, wherein, When viewed from a direction orthogonal to the first main surface, a part of the first connection surface overlaps a part of the second connection surface.

15. The inductor component according to claim 13 or 14, wherein, when viewed from a direction orthogonal to the first main surface, the center of the first connection surface is closer to the axis than the center of the second connection surface.

16. The inductor component according to any one of claims 1 to 15, wherein, the first through-wiring has a conductive layer and a non-conductive layer, the conductive layer is located on the outer peripheral side when viewed from the direction in which the first through-wiring extends, and the non-conductive layer is located inside the conductive layer.

17. The inductor component according to any one of claims 1 to 16, wherein, the cross-sectional area of at least one of the both end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

18. The inductor component according to any one of claims 1 to 17, wherein, the thickness of the inductor component is 200 μm or less.

19. The inductor component according to any one of claims 1 to 18, wherein, when viewed from a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside compared with the outer peripheral surface of the green body.

20. The inductor component according to any one of claims 1 to 19, wherein, it further includes an organic insulator provided on the first main surface, the green body is an inorganic insulator, and the organic insulator is located inside compared with the outer surface of the inorganic insulator when viewed from a direction orthogonal to the first main surface.

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