Wafer package solder joint quality multi-view detection device

Abstract

The application relates to the technical field of wafer solder joint quality detection, and discloses a wafer packaging solder joint quality multi-view detection equipment which comprises a light source module and a shooting module. The number of the light source modules is two, one light source module is movably arranged at the top middle part of a detection shell, and the other light source module is movably arranged on the upper half of the right side wall of the detection shell. The number of the shooting modules is three, one shooting module is movably arranged on the upper half of the left side wall of the detection shell, the light source module and the shooting module are symmetrically arranged, two shooting modules are movably arranged on the lower half of the side wall of the detection shell respectively, and the two shooting modules are symmetrically arranged. The layout design of the light source module and the shooting module is adopted to realize multi-light-source multi-view detection, so that the reflection and shadow interference in optical detection is reduced, the solder joint images on the wafer are synchronously captured from different angles, the accuracy of solder joint identification is improved, and the reliability of the detection result is enhanced.

Description

Technical Field

[0001] This application relates to the field of wafer solder joint quality inspection technology, and in particular to a multi-view inspection device for wafer packaging solder joint quality. Background Technology

[0002] Wafer packaging solder joints are critical connection points in semiconductor packaging processes, used to achieve electrical and mechanical connections between the chip and the packaging substrate or lead frame. The quality of these solder joints has a significant impact on subsequent packaging and electrical performance. To promptly inspect the quality of solder joints after soldering and ensure that problems are identified and corrected before subsequent processes, it is necessary to use inspection equipment to identify and inspect the solder joint quality.

[0003] Inspection equipment is a mechanical device that uses optical imaging technology and computer image processing technology to detect and identify various features of solder joints, such as appearance, size, and position. It uses a combination of camera and supplementary light source to complete functions such as identification, measurement, and positioning, effectively improving the inspection speed and accuracy of the production line, thereby increasing the output and quality of solder joints.

[0004] However, existing inspection equipment still has some shortcomings in use: the inspection equipment uses a traditional automated optical inspection (AOI) system to visually inspect solder joints, often using a single light source and a fixed viewing angle to detect defects such as missing, excessive, misaligned, or abnormally shaped solder joints. However, the single light source may cause shadows, reflections, or some minor defects to be unidentified, thus affecting the reliability of the inspection results. The single viewing angle is usually not convenient for visual inspection of the lower surface of the solder joint, and the inspection of the side of the solder joint is not comprehensive enough, resulting in blind spots. This may lead to insufficient information acquisition of the solder joint, thus affecting the reliability of the inspection results. Summary of the Invention

[0005] This application proposes a multi-view inspection device for wafer packaging solder joint quality. It has the advantages of using a layout design of light source module and imaging module, and adopting multi-light source and multi-view inspection to significantly improve the inspection accuracy. It solves the problem of poor inspection effect caused by single light source and fixed viewing angle of traditional inspection equipment.

[0006] To achieve the above objectives, this application adopts the following technical solution: a multi-view inspection device for wafer packaging solder joint quality, comprising:

[0007] A detection housing, the interior of which is the detection area;

[0008] The light source module has two components, with one light source module movably disposed at the top center of the detection housing and the other light source module movably disposed at the upper half of the right side wall of the detection housing.

[0009] The camera module has three modules: one camera module is movably disposed on the upper half of the left side wall of the detection housing, and the light source module is symmetrically disposed with the camera module; the other two camera modules are movably disposed on the lower half of the side wall of the detection housing, and the two camera modules are symmetrically disposed.

[0010] By utilizing the layout design of the light source module and the imaging module, and employing multi-light source and multi-view detection, the accuracy of solder joint quality detection is improved.

[0011] Furthermore, the light source module consists of a supplementary light source, a connecting rod, and an adjusting rod, and the shooting module consists of a camera assembly, a connecting rod, and an adjusting rod. The side wall of the connecting rod is threadedly connected to the wall of the detection housing, and one end of the connecting rod is movably engaged with the top of the supplementary light source or the camera assembly. Four adjusting rods are threadedly connected to the wall of the detection housing surrounding the connecting rod, and one end of the adjusting rod abuts against the top of the supplementary light source or the camera assembly.

[0012] Furthermore, the detection housing is movably equipped with sealing components on both its front and rear sides, and the detection housing, light source module, imaging module, and sealing components together form a detection mechanism. The sealing components include:

[0013] A sealing plate is movably sleeved on the top of the detection housing, and the side wall of the sealing plate is in contact with the inner wall of the detection housing;

[0014] The hydraulic component has its two side walls of the detection housing fixedly sleeved with the lower half of the hydraulic component, and its upper half fixedly snapped with the two sides of the sealing plate.

[0015] Furthermore, it also includes:

[0016] The bottom end of the detection housing is fixedly connected to the top end of the frame;

[0017] A fixing mechanism is fixedly installed at the top of the frame. The left side of the fixing mechanism passes through the detection area, and the right side of the fixing mechanism passes through the loading and unloading area. Three working positions are provided at the top of the frame outside the right side of the fixing mechanism.

[0018] The loading mechanism has several loading mechanisms inside the fixing mechanism.

[0019] Furthermore, the fixing mechanism includes:

[0020] A fixed track is provided, the bottom end of which is fixedly sleeved with the top end of the frame, and a track groove is provided at the top end of the fixed track. The lower half of the closed plate is adapted to the track groove of the fixed track.

[0021] The fixed rack has two fixed racks fixedly connected to the bottom of the inner side of the fixed track, and the two fixed racks are respectively attached to the inner walls on both sides of the fixed track. The lower half of the closed plate is adapted to the fixed racks.

[0022] The fixed magnetic strip has fixed grooves on the upper half of the inner walls on both sides of the fixed track, and the fixed track is fixedly connected to the fixed magnetic strip through the fixed grooves. The fixed magnetic strip consists of a first magnetic area, a second magnetic area, and a third magnetic area. The first magnetic area is located in the detection area, the third magnetic area is located in the loading and unloading area, and a second magnetic area is provided between the first magnetic area and the third magnetic area. Both the first magnetic area and the second magnetic area have N-type magnetism, and the magnetic quantity of the first magnetic area is greater than that of the second magnetic area. The third magnetic area has S-type magnetism.

[0023] Furthermore, the loading mechanism includes:

[0024] A movable body is placed in the track groove of the fixed track;

[0025] The power assembly has its bottom two sides fixedly sleeved with the upper half of the power assembly, and the lower half of the power assembly's sidewall meshes with the sidewall of the fixed rack.

[0026] A rotating assembly, wherein the top center of the movable body is fixedly sleeved with the lower half of the rotating assembly;

[0027] The rotating assembly is fixedly connected to the bottom center of the carrier, and the carrier is placed above the fixed magnetic strip. The cross-sectional shape of the carrier is an inverted T-shape. The height of the shooting module is higher than the top surface of the carrier. A wafer can be placed in the top center of the carrier.

[0028] The support rod has a gap between the moving body and the carrying object. The top end of the moving body and the bottom end of the carrying object are both provided with annular grooves. The moving body and the carrying object are movably engaged with the two ends of the support rod through the annular grooves. There are several support rods, and the support rods are evenly arranged around the moving body.

[0029] Furthermore, the loading mechanism also includes:

[0030] An adsorption component is provided inside the carrier.

[0031] Furthermore, the adsorption component includes:

[0032] An air pump is provided, wherein a central cavity is provided inside the object, and the object is fixedly connected to the air pump through the central cavity.

[0033] An air intake module is provided inside the carrier located above the central cavity. There are six air intake modules, which are evenly arranged around the carrier. The bottom end of the air intake module is connected to the air inlet of the air pump. The air intake module consists of a first air intake hole and a second air intake hole. The first air intake hole is connected to the external space on the top surface of the carrier, and the second air intake hole is connected to the external space on the side surface of the carrier.

[0034] An exhaust module is provided inside the carrier located below the central cavity. There are six exhaust modules, and one exhaust module is set between two intake modules. The top of the exhaust module is connected to the exhaust port of the air pump. The exhaust module consists of a first exhaust hole and a second exhaust hole. The first exhaust hole is connected to the external space on the side of the carrier, and the second exhaust hole is connected to the external space on the bottom of the carrier.

[0035] The suction pipe is fixedly sleeved on the carrier, with one end of the suction pipe connected to the second suction hole and the other end of the suction pipe connected to the external space at the bottom of the carrier.

[0036] By setting the intake module, exhaust module, and intake pipe inside the carrier, the gas in the intake pipe, which is connected to the second intake port, flows between the moving body and the carrier, and the gas in the second exhaust port flows between the moving body and the carrier. This creates a gas flow between the moving body and the carrier, effectively applying airflow to the rotating components and support rods that are in operation, thereby reducing the heat generated during operation and improving their service life.

[0037] Furthermore, the loading mechanism also includes:

[0038] The movable ring plate has a movable cavity in the middle of the load, and the load is movably connected to the movable ring plate through the movable cavity. The outer ring of the movable ring plate is located above the fixed magnetic strip, and the inner ring of the movable ring plate is located below the second air intake hole. The movable ring plate is movably connected to the air intake pipe.

[0039] The movable vertical plate has a vertical hole inside the object being loaded, and the vertical hole connects the second air intake hole and the movable cavity. The top of the movable ring plate is fixedly connected to the movable vertical plate, and the movable vertical plate is movably fitted into the vertical hole. There are six movable vertical plates, and each movable vertical plate corresponds to one of the second air intake holes.

[0040] By incorporating an adsorption assembly, a movable ring plate, and a movable vertical plate within the carrier, and with the adsorption assembly consisting of an air pump, an air intake module, and an air exhaust module, negative pressure adsorption of the wafer is achieved using a first air intake hole. Simultaneously, a fixed magnetic strip, composed of a first magnetic region, a second magnetic region, and a third magnetic region, is installed on a fixed track. As the carrier moves within the fixed track, the magnetic force exerted by the fixed magnetic strip on the movable ring plate changes the position of the movable ring plate within the movable cavity as the carrier moves to different areas. This controls the size of the orifice of the air exhaust module on the movable vertical plate, thereby dynamically regulating the adsorption effect of the carrier on the wafer. This results in strong adsorption force during rotational inspection of the solder joints, moderate adsorption force during horizontal movement, and weak adsorption force during loading and unloading, thus improving the stability of wafer placement and operational convenience at different times.

[0041] Furthermore, the fixing mechanism also includes:

[0042] The fixed track is equipped with four sets of pressure sensors. One set of pressure sensors is located on the fixed track where the light source module and the shooting module are located, and three sets of pressure sensors are located on the fixed tracks where the three working positions are located. Each set of pressure sensors consists of two sensors, and the two pressure sensors are symmetrically arranged on both sides of the fixed track. The height of the pressure sensors is equal to the port height of the first exhaust hole.

[0043] By symmetrically arranging exhaust modules within the carrier, with the first exhaust port of the exhaust module facing the sidewall of the fixed track, and by installing a pressure sensor within the sidewall of the fixed track, the back pressure can be detected when the constant airflow from the first exhaust port blows towards the pressure sensor. This allows the sensor to detect whether the distances between the two sidewalls of the carrier and the two sidewalls of the fixed track are equal. If they are not equal, adjustments need to be made in time, thereby ensuring that the carrier always rotates along the central axis of the fixed track. Consequently, the position of the carrier remains relatively unchanged relative to the light source module and the imaging module, effectively controlling the variables during solder joint imaging and further improving the accuracy of solder joint recognition.

[0044] The beneficial effects of this invention are as follows:

[0045] This application provides a multi-view inspection device for the quality of solder joints in wafer packaging. By setting two light source modules on the inspection housing, one light source module is positioned directly above the inspection area for frontal supplementary lighting, and the other light source module is positioned diagonally above the inspection area for side supplementary lighting. The angle and intensity of the light source modules can be adjusted to enhance the inspection effect of different materials. The lighting conditions can also be dynamically adjusted according to the characteristics of the solder joint material. In summary, this reduces the interference of reflection and shadow in optical inspection, thereby improving the accuracy of solder joint identification and enhancing the reliability of the inspection results.

[0046] By setting three imaging modules on the detection housing, with one imaging module positioned opposite the light source module located diagonally above it and the other two imaging modules positioned diagonally below the detection area, the three imaging modules simultaneously capture images of solder joints on the wafer from different angles, thereby improving the accuracy of solder joint identification, enhancing the accuracy of three-dimensional structure analysis, and further strengthening the reliability of the detection results.

[0047] By setting up multiple loading mechanisms within a fixed track, each loading mechanism consists of a moving body, a power component, a rotating component, and a loading object. When the loading mechanism moves to the detection area within the detection housing, it stops moving horizontally and rotates intermittently to detect the solder joints. This allows the imaging module to capture images of the solder joints from multiple perspectives, solving the problem that the sides of the solder joints cannot be detected from all angles and further improving the accuracy of solder joint recognition. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort:

[0049] Figure 1 This is a three-dimensional structural diagram of the entire invention;

[0050] Figure 2 This is a frontal cross-sectional three-dimensional structural diagram of the entire invention;

[0051] Figure 3 In this invention Figure 2 Enlarged structural diagram at point A;

[0052] Figure 4 This is a three-dimensional structural diagram of the frame and fixing mechanism in this invention;

[0053] Figure 5 This is a three-dimensional structural diagram of the fixed rack and fixed magnetic strip in this invention;

[0054] Figure 6 This is a three-dimensional structural diagram of the detection mechanism in this invention;

[0055] Figure 7 This is a three-dimensional cross-sectional view of the detection mechanism located at the enclosed component in this invention;

[0056] Figure 8 This is a three-dimensional cross-sectional view of the detection mechanism located at the light source module and the imaging module in this invention;

[0057] Figure 9 This is a three-dimensional structural diagram of the light source module in this invention;

[0058] Figure 10 This is a three-dimensional structural diagram of the loading mechanism in this invention;

[0059] Figure 11 This is a side cross-sectional perspective view of the loading mechanism in this invention.

[0060] Figure 12 This is a three-dimensional structural diagram of the object and its internal components in this invention;

[0061] Figure 13 This is a cross-sectional three-dimensional structural diagram of the carrier object and its internal components in this invention;

[0062] Figure 14 This is a three-dimensional structural diagram of the movable ring plate and the movable vertical plate in this invention;

[0063] Figure 15 This is a three-dimensional structural diagram of the intake module, exhaust module, and intake pipe in this invention.

[0064] In the diagram: 1. Frame; 2. Fixing mechanism; 21. Fixed track; 22. Fixed rack; 23. Fixed magnetic strip; 23a. First magnetic zone; 23b. Second magnetic zone; 23c. Third magnetic zone; 3. Detection mechanism; 31. Detection housing; 4a. Light source module; 4b. Shooting module; 41. Supplementary light source; 42. Camera assembly; 43. Connecting rod; 44. Adjusting rod; 5. Sealing assembly; 51. Sealing plate; 52. Hydraulic component; 6. Loading mechanism; 61. Moving body; 62. Power assembly; 63. Rotating assembly; 64. Loaded object; 65. Support rod; 7. Adsorption assembly; 71. Air pump; 72. Suction module; 721. First suction port; 722. Second suction port; 73. Exhaust module; 731. First exhaust port; 732. Second exhaust port; 74. Suction pipe; 8. Movable ring plate; 9. Movable vertical plate. Detailed Implementation

[0065] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0066] Example 1: A multi-view inspection device for wafer packaging solder joint quality, such as... Figures 1-2 It includes a frame 1, the top of which is fixedly connected to the bottom of the detection housing 31, and the interior of the detection housing 31 is a detection area, which provides space for placing the working machinery.

[0067] like Figure 2, Figure 6 , Figure 8 , Figure 9 There are two light source modules 4a. One light source module 4a is movably positioned at the top center of the detection housing 31, that is, it is positioned directly above the detection area, and can provide supplementary lighting to the wafer and its solder joints. The other light source module 4a is movably positioned on the upper half of the right side wall of the detection housing 31, that is, it is positioned diagonally above the detection area, and can provide supplementary lighting to the wafer and its solder joints from the side. The angle and intensity of the light source modules 4a can be adjusted. It should be noted that the light source modules 4a can emit multi-wavelength light sources, such as visible light, infrared light, and polarized light, to enhance the detection effect of different materials. At the same time, the light source modules 4a can dynamically adjust the illumination conditions according to the characteristics of the solder joint material, thereby reducing reflection and shadow interference in optical detection, thus improving the accuracy of solder joint identification and enhancing the reliability of the detection results.

[0068] like Figure 2 , Figure 6 , Figure 8 The device employs three imaging modules 4b. One imaging module 4b is movably positioned on the upper half of the left side wall of the detection housing 31, with the light source module 4a symmetrically positioned to capture the upper half of the solder joint. The other two imaging modules 4b are movably positioned on the lower half of the side wall of the detection housing 31, also symmetrically positioned, to capture the lower half of the solder joint. The three imaging modules 4b simultaneously capture images of the solder joints on the wafer from different angles, effectively improving the accuracy of solder joint identification and thus enhancing the accuracy of three-dimensional structure analysis, further strengthening the reliability of the detection results. The images captured by the imaging modules 4b are then transmitted to the system, where image features are extracted and fused using a model. Based on image data under different lighting conditions and viewing angles, the quality of the solder joints is inspected to determine whether they are abnormal. If abnormal, rework is required; if normal, the next process can proceed, effectively improving production efficiency. Furthermore, this device is suitable for different types of solder joints, including copper pillar bumps, micro-bumps, and non-traditional solder balls.

[0069] like Figure 2 , Figure 6 , Figure 8 , Figure 9The light source module 4a consists of a supplementary light source 41, a connecting rod 43, and an adjusting rod 44, while the imaging module 4b consists of an imaging component 42, a connecting rod 43, and an adjusting rod 44. The side wall of the connecting rod 43 is threadedly connected to the wall of the detection housing 31, and one end of the connecting rod 43 is movably engaged with the top of the supplementary light source 41 or the imaging component 42, so that the supplementary light source 41 or the imaging component 42 is connected by the connecting rod 43, and the supplementary light source 41 or the imaging component 42 can rotate around the connecting rod 43, thereby providing conditions for adjusting the angle of the supplementary light source 41 or the imaging component 42. Four adjusting rods 44 are threadedly connected to the wall of the detection housing 31 surrounding the connecting rod 43, and one end of the adjusting rod 44 abuts against the top of the supplementary light source 41 or the imaging component 42. By using the horizontal movement of the adjusting rod 44, the supplementary light source 41 or the imaging component 42 is pushed to deflect, thereby adjusting the angle of the supplementary light source 41 or the imaging component 42, thereby enhancing the detection effect of different materials.

[0070] like Figure 2 , Figures 6-8 The detection housing 31 has movably installed sealing components 5 on both its front and rear sides. The sealing components 5 include sealing plates 51 and hydraulic components 52. The sealing plates 51 are movably sleeved on the top of the detection housing 31, and the side walls of the sealing plates 51 are in contact with the inner walls of the detection housing 31. When the sealing plates 51 are in the lower position, they can fully seal the detection area of ​​the detection housing 31 to prevent external ambient light from affecting the detection of solder joints. The side walls of the detection housing 31 are fixedly sleeved with the lower half of the hydraulic components 52, and the upper half of the hydraulic components 52 is fixedly snapped with the sides of the sealing plates 51. The hydraulic components 52 can drive the sealing plates 51 to rise and fall, which can effectively assist in the detection of solder joints. Specifically, when the loading mechanism 6 loads the wafer and moves it into the detection housing 31, the hydraulic components 52 control the sealing plates 51 to move down to seal the detection area. When the loading mechanism 6 needs to move out of the detection housing 31, the hydraulic components 52 control the sealing plates 51 to move up to open the detection area.

[0071] In summary, the detection housing 31, the light source module 4a, the imaging module 4b, and the enclosure component 5 together constitute the detection mechanism 3, which is used to detect the quality of solder joints. At the same time, the detection mechanism 3 can utilize the layout design of the light source module 4a and the imaging module 4b to adopt multi-light source and multi-view detection, so as to improve the detection accuracy of solder joint quality, reduce the false judgment rate, and solve the problem of poor detection effect caused by the single light source and fixed viewing angle of traditional detection equipment.

[0072] Example 2, based on Example 1, a multi-view inspection device for wafer packaging solder joint quality further includes:

[0073] like Figure 1-4A fixing mechanism 2 is fixedly installed at the top of the rack 1 to provide space for the cyclic movement of the carrying mechanism 6. The left side of the fixing mechanism 2 passes through the inspection area, and the right side of the fixing mechanism 2 passes through the loading and unloading area. Three working positions are set at the top of the rack 1 located outside the right side of the fixing mechanism 2, and a first transfer robotic arm, a second transfer robotic arm, and a third transfer robotic arm are placed on the three working positions in sequence. The first transfer robotic arm is used to move the inspected wafers with normal quality to the next process. The second transfer robotic arm is used to rework the inspected wafers with abnormal quality. The third transfer robotic arm is used to place new wafers on the carrying mechanism 6. It should be noted that the carrying mechanism 6 needs to pause for a certain period of time when it moves to the position of each working position to facilitate the deployment of each transfer robotic arm.

[0074] like Figures 2-5 The fixing mechanism 2 includes a fixing track 21 and a fixing rack 22. The bottom end of the fixing track 21 is fixedly sleeved with the top end of the frame 1, and the top end of the fixing track 21 has a track groove to provide space for placing the loading mechanism 6. The fixing track 21 is a splicing design. In actual assembly, the fixing track 21 can be assembled according to the site size to improve the adaptability of the fixing track 21. The lower half of the sealing plate 51 is adapted to the track groove of the fixing track 21 to further ensure the airtightness of the sealing plate 51 to the detection area when it is in the lower position. The bottom end of the fixing track 21 is fixedly connected to two fixing racks 22, and the two fixing racks 22 are respectively attached to the inner walls on both sides of the fixing track 21 to help the loading mechanism 6 move horizontally within the fixing track 21. The lower half of the sealing plate 51 is adapted to the fixing racks 22 to further ensure the airtightness of the sealing plate 51 to the detection area when it is in the lower position.

[0075] like Figures 1-3 The fixing mechanism 2 has several loading mechanisms 6 inside for loading and moving wafers. Each loading mechanism 6 includes a moving body 61, a power assembly 62, a rotating assembly 63, a load body 64, and a support rod 65. Figures 10-11A movable body 61 is placed in the track groove of the fixed track 21. The bottom two sides of the movable body 61 are fixedly sleeved with the upper half of the power component 62, and the lower half of the side wall of the power component 62 meshes with the side wall of the fixed rack 22. The self-rotation of the power component 62 can drive the movable body 61 to move along the fixed rack 22, realizing the stable horizontal movement of the carrying mechanism 6 within the fixed track 21. The top middle of the movable body 61 is fixedly sleeved with the lower half of the rotating component 63, and the upper half of the rotating component 63 is fixedly connected to the bottom middle of the carrying object 64. The cross-sectional shape of the carrying object 64 is inverted T-shaped. The height of the shooting module 4b is higher than the top surface of the carrying object 64, effectively ensuring that when the carrying object 64 moves within the fixed track 21, the light source module 4a, the shooting module 4b, and the carrying object 64 are in good working order. The wafers on it do not interfere with each other. The top center of the carrier 64 can be used to place the wafers. The carrier 64 can be rotated by the self-rotation of the rotating component 63. According to actual needs, the carrier 64 will pause after rotating a certain angle so that the shooting module 4b can shoot the solder joints, thereby realizing all-round imaging of the side of the solder joints. There is a gap between the moving body 61 and the carrier 64. The top of the moving body 61 and the bottom of the carrier 64 are provided with annular grooves. The moving body 61 and the carrier 64 are respectively movably engaged with the two ends of the support rod 65 through the annular grooves. There are several support rods 65, and the support rods 65 are evenly arranged around the moving body 61. The support rods 65 can effectively connect the moving body 61 and the carrier 64 and support the carrier 64 to enhance the stability of the carrier 64.

[0076] In summary, by utilizing the design of the carrier mechanism 6, and in conjunction with the fixed track 21 and the fixed rack 22, the carrier mechanism 6 can carry wafers for movement. When the carrier mechanism 6 moves to the detection area within the detection housing 31, in order to detect the solder joints, the carrier mechanism 6 stops moving horizontally and rotates intermittently, allowing the imaging module 4b to capture images of the solder joints from multiple angles. This solves the problem that the sides of the solder joints cannot be detected from all angles, further improving the accuracy of solder joint identification.

[0077] In Example 3, based on Example 2, the loading mechanism 6 further includes an adsorption component 7, such as... Figures 2-3 The carrier 64 is internally equipped with an adsorption component 7 for negative pressure adsorption of the wafer, improving the stability of the wafer during movement. The adsorption component 7 includes an air pump 71, an air intake module 72, an air exhaust module 73, and an air intake pipe 74. Figures 10-13 The carrier 64 has a central cavity at its center, and the carrier 64 is fixedly connected to the air pump 71 through the central cavity, which can provide power for negative pressure adsorption of wafers, such as... Figure 13 , Figure 15An air intake module 72 is provided inside the carrier 64 located above the central cavity. Six air intake modules 72 are evenly arranged around the carrier 64. The bottom end of each air intake module 72 is connected to the air inlet of the air pump 71, allowing the air intake module 72 to uniformly intake air from the carrier 64 in a circumferential direction. Each air intake module 72 consists of a first air intake hole 721 and a second air intake hole 722. The first air intake hole 721 connects to the external space above the top surface of the carrier 64, and the second air intake hole 722 connects to the external space on the side surface of the carrier 64. When the air pump 71 operates, air is drawn through the first air intake hole... 721 can perform negative pressure adsorption on the wafer, and the magnitude of the negative pressure adsorption force applied to the wafer by the first air intake 721 can be dynamically adjusted through the setting of the second air intake 722. The air intake pipe 74 is fixedly sleeved on the carrier 64, and one end of the air intake pipe 74 is connected to the second air intake 722, while the other end of the air intake pipe 74 is connected to the external space under the bottom of the carrier 64. When the air pump 71 is working, air can be drawn downwards from the carrier 64 through the second air intake 722, so that there is gas flow between the moving body 61 and the carrier 64, effectively applying pressure to the rotating component 63 and the support rod 65 that are working. Airflow is used to reduce heat during operation and improve service life. An exhaust module 73 is provided inside the carrier 64 located below the central cavity. There are six exhaust modules 73, with one module positioned between two intake modules 72. The top of each exhaust module 73 is connected to the exhaust port of the air pump 71, allowing the intake modules 72 to produce uniform circumferential exhaust to the carrier 64. Each exhaust module 73 consists of a first exhaust port 731 and a second exhaust port 732. The first exhaust port 731 connects to the external space on the side of the carrier 64, and the second exhaust port 732 connects to the external space on the side of the carrier 64. When the air pump 71 is working, the external space at the bottom of the object 64 can exhaust air to the outside of the object 64 through the first exhaust port 731. The back pressure of the pressure sensor is used to detect whether the object 64 is in the central axis position of the fixed track 21, so as to ensure the accuracy of the position of the object 64 during operation. The second exhaust port 732 can exhaust air to the bottom of the object 64, so that there is gas flow between the moving body 61 and the object 64. This effectively applies airflow to the rotating component 63 and the support rod 65, which are working, to reduce the heat of both during operation and improve their service life.

[0078] like Figure 4 , Figure 5The fixing mechanism 2 also includes pressure sensors. Four sets of pressure sensors are installed on the wall of the fixing track 21. One set of pressure sensors is located on the fixing track 21 at the positions of the light source module 4a and the shooting module 4b, and three sets of pressure sensors are located on the fixing tracks 21 at the three working positions. When the carrying mechanism 6 is stationary at the four positions on the fixing track 21, the first exhaust port 731 inside the carrying object 64 can blow air into the pressure sensors. The distance is calculated by the change in air pressure. If the distance is smaller, the airflow resistance is greater, and the air pressure increases, and vice versa. This allows the detection of the distance between the carrying object 64 and the fixing track 21. Each set of pressure sensors consists of two sensors, and two pressure sensors... The sensors are symmetrically arranged on both sides of the fixed track 21. The height of the pressure sensor is equal to the port height of the first exhaust port 731. This allows the sensors to detect whether the distances between the two side walls of the object 64 and the two side walls of the fixed track 21 are equal. If they are not equal, they need to be adjusted in time to ensure that the object 64 rotates along the central axis of the fixed track 21 when it rotates, so that the position of the object 64 remains unchanged relative to the fixed track 21. This effectively controls the variables during the welding point imaging and further improves the accuracy of welding point identification. In addition, the detection of this distance can also effectively prevent the loading mechanism 6 from being excessively offset, which would cause wear to the fixed mechanism 2 and the loading mechanism 6, and improve the service life of both.

[0079] In Example 4, based on Example 3, the fixing mechanism 2 further includes a fixing magnetic strip 23, such as... Figures 2-5 The upper half of the inner walls on both sides of the fixed track 21 are provided with fixing grooves, and the fixed track 21 is fixedly connected to the fixed magnetic strip 23 through the fixing grooves. The carrier 64 is placed above the fixed magnetic strip 23, which facilitates the fixed magnetic strip 23 to apply magnetic force to the components inside the carrier 64. This helps the carrier mechanism 6 to dynamically adjust the negative pressure adsorption force on the wafer. The fixed magnetic strip 23 is composed of a first magnetic region 23a, a second magnetic region 23b, and a third magnetic region 23c. Figure 5The first magnetic region 23a is located in the detection area, the third magnetic region 23c is located in the loading and unloading area, and a second magnetic region 23b is disposed between the first magnetic region 23a and the third magnetic region 23c. Both the first magnetic region 23a and the second magnetic region 23b have N-type magnetism, and the magnetic quantity of the first magnetic region 23a is greater than that of the second magnetic region 23b. The third magnetic region 23c has S-type magnetism. When the carrier 64 moves the movable ring plate 8 to each area of ​​the fixed magnetic strip 23, the magnetic field of each area of ​​the fixed magnetic strip 23 is used to set up... This facilitates the vertical movement of the movable ring plate 8. Specifically, when the movable ring plate 8 moves to the position of the third magnetic zone 23c, it is lowered to the lowest position by the magnetic attraction of the third magnetic zone 23c. When the movable ring plate 8 moves to the position of the second magnetic zone 23b, it is moved to the middle position by the magnetic repulsion of the second magnetic zone 23b. When the movable ring plate 8 moves to the position of the first magnetic zone 23a, it is raised to the highest position by the magnetic attraction of the first magnetic zone 23a.

[0080] The loading mechanism 6 also includes a movable ring plate 8 and a movable vertical plate 9, specifically:

[0081] like Figures 2-3 , Figure 11 , Figures 13-14 The carrier 64 has a movable cavity in the middle, and the carrier 64 is movably connected to the movable ring plate 8 through the movable cavity. The outer ring of the movable ring plate 8 is located above the fixed magnetic strip 23, and the inner ring of the movable ring plate 8 is located below the second air intake hole 722, so that the movable ring plate 8 can simultaneously cover the fixed magnetic strip 23 and the second air intake hole 722, thereby providing assistance for the fixed magnetic strip 23 to drive the movable ring plate 8 to move and change the second air intake hole 722. The movable ring plate 8 is movably connected to the air intake pipe 74 to prevent the setting of the air intake pipe 74 from affecting the movement of the movable ring plate 8. The movable ring plate 8 has N-type magnetism, so the movable ring plate 8 can move vertically along the movable cavity under the magnetic force of the fixed magnetic strip 23.

[0082] like Figures 2-3 , Figure 11 , Figures 13-14The carrier 64 has a vertical hole inside, which connects the second suction hole 722 to the movable cavity. A movable vertical plate 9 is fixedly connected to the top of the movable ring plate 8 and is movably fitted into the vertical hole. There are six movable vertical plates 9, each corresponding to a second suction hole 722. When the movable ring plate 8 moves upward under magnetic force, the movable vertical plate 9 moves upward and gradually blocks the second suction hole 722, reducing the amount of gas entering the second suction hole 722, thereby enhancing the negative pressure suction of the first suction hole 721 on the wafer. The additional effect is to stably position the wafer on the carrier 64, thereby helping to improve the stability of horizontal and rotational movement. When the movable ring plate 8 moves downward under the action of magnetic force, the movable vertical plate 9 can move upward and gradually open the second suction hole 722 to increase the amount of gas entering the second suction hole 722, thereby reducing the negative pressure adsorption effect of the first suction hole 721 on the wafer, so that the wafer is no longer subject to adsorption force and can be loaded and unloaded. It should be noted that the air pump 71 is in continuous operation mode during the above process, with fast response and stable pressure.

[0083] The working principle of the method of using this invention is as follows:

[0084] When the carrier mechanism 6 loads the wafer, the power component 62 is activated to engage with the fixed rack 22, causing the carrier mechanism 6 to move horizontally along the track groove of the fixed track 21. When the carrier mechanism 6 moves to the light source module 4a and the imaging module 4b in the detection area, and is about to be detected, the hydraulic component 52 is activated to drive the sealing plate 51 to descend, thereby sealing both ends of the detection housing 31 and providing an interference-free environment for solder joint detection. At this time, the carrier mechanism 6 stops moving horizontally, and the two light source modules 4a provide multi-source illumination for the solder joint, effectively preventing shadows, reflections, or some minor defects from being inaccurately identified due to a single light source, thus improving the accuracy of solder joint identification and enhancing the reliability of the detection results. At the same time, the three imaging modules 4b simultaneously capture images of the solder joints on the wafer from different angles, effectively preventing blind spots caused by a single detection perspective, further improving the accuracy of solder joint identification, thereby enhancing the accuracy of the three-dimensional structure analysis and further enhancing the reliability of the detection results.

[0085] During the detection process, the stationary object 64 is initially positioned at the original point. The imaging module 4b captures images of the solder joint in its original state. Then, the rotating component 63 rotates the object 64 by a certain angle and stops again. The imaging module 4b then captures images of the rotated solder joint once more. This process is repeated until the rotating component 63 rotates the object 64 one full rotation. This allows the imaging module 4b to capture images of the solder joint from multiple perspectives, thus solving the problem that the sides of the solder joint cannot be detected from all angles and further improving the accuracy of solder joint recognition.

[0086] After the inspection is completed, the hydraulic component 52 drives the sealing plate 51 to rise, opening both ends of the inspection housing 31. The power component 62 is restarted to move horizontally along the track groove of the fixed track 21 until it reaches the working position in the loading and unloading area. Since the inspection result of the solder joint quality on the wafer has been transmitted to the transfer robotic arm by the system, if the quality is normal, the first transfer robotic arm will pick up the wafer and move it to the next process. If the quality is abnormal, the second transfer robotic arm will pick up the wafer and rework it. Then the carrying mechanism 6 moves to the third working position, and the third transfer robotic arm places the new wafer on the carrying mechanism 6 for the next inspection.

[0087] As the carrier mechanism 6 moves along the fixed track 21, the air pump 71 continuously operates to achieve negative pressure adsorption of the wafer. Due to the magnetic force setting of the fixed magnetic strip 23 on the movable ring plate 8, the magnetic force experienced by the movable ring plate 8 varies depending on the region of the fixed magnetic strip 23. This dynamically controls the magnitude of the negative pressure adsorption force applied to the wafer by the first suction hole 721. Specifically, when the carrier mechanism 6 is in the loading area, the movable ring plate 8 moves downward, causing the movable vertical plate 9 to increase the aperture of the second suction hole 722, thereby reducing the negative pressure adsorption force on the wafer. When the carrier mechanism 6 is in the non-loading area, the movable ring plate 8 moves upward, causing the movable vertical plate 9 to decrease the aperture of the second suction hole 722, thereby increasing the negative pressure adsorption force on the wafer. In particular, when the wafer is in the detection area, the negative pressure adsorption force is the greatest, effectively ensuring the stability of the wafer during detection.

[0088] In addition, when the carrier mechanism 6 moves to various positions where horizontal movement needs to be stopped, since the first exhaust port 731 is set opposite to the pressure sensor, the constant airflow discharged from the first exhaust port 731 blows towards the pressure sensor. The pressure sensor detects the back pressure to detect whether the distance between the two side walls of the carrier 64 and the two side walls of the fixed track 21 is equal. If they are not equal, they need to be adjusted in time to ensure that the carrier 64 always rotates along the central axis of the fixed track 21. Thus, the position of the carrier 64 remains relatively unchanged relative to the light source module 4a and the shooting module 4b, thereby effectively controlling the variables during solder joint shooting and further improving the accuracy of solder joint recognition.

[0089] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-view inspection device for wafer packaging solder joint quality, characterized in that, include: The detection housing (31) has an interior area for detection. The light source module (4a) has two components, with one light source module (4a) movably disposed at the top center of the detection housing (31) and the other light source module (4a) movably disposed at the upper half of the right side wall of the detection housing (31). The number of the shooting modules (4b) is three. One shooting module (4b) is movably disposed on the upper half of the left side wall of the detection housing (31), and the light source module (4a) and the shooting module (4b) are symmetrically disposed. The two shooting modules (4b) are respectively movably disposed on the lower half of the side wall of the detection housing (31), and the two shooting modules (4b) are symmetrically disposed. The detection housing (31) is movably provided with a sealing component (5) on both the front and rear sides. The detection housing (31), the light source module (4a), the shooting module (4b) and the sealing component (5) together form the detection mechanism (3). The sealing component (5) includes: a sealing plate (51), which is movably sleeved on the top of the detection housing (31) and the side wall of the sealing plate (51) is in contact with the inner wall of the detection housing (31); and a hydraulic component (52), which is fixedly sleeved on the lower half of the hydraulic component (52) on both sides of the detection housing (31) and the upper half of the hydraulic component (52) is fixedly snapped onto both sides of the sealing plate (51). The bottom end of the detection housing (31) is fixedly connected to the top end of the frame (1); A fixing mechanism (2) is fixedly installed at the top of the frame (1). The left side of the fixing mechanism (2) passes through the detection area, and the right side of the fixing mechanism (2) passes through the loading and unloading area. Three working positions are provided at the top of the frame (1) located outside the right side of the fixing mechanism (2). The fixing mechanism (2) includes: a fixing rail (21), the bottom end of the fixing rail (21) is fixedly sleeved with the top of the frame (1), and the top of the fixing rail (21) is provided with a rail groove. The lower half of the sealing plate (51) is adapted to the rail groove of the fixing rail (21); a fixing rack (22), two fixing racks (22) are fixedly connected to the bottom of the inner side of the fixing rail (21), and the two fixing racks (22) are respectively attached to the inner walls of the two sides of the fixing rail (21). The sealing plate (51) The lower half is adapted to the fixed rack (22); the fixed magnetic strip (23) has a fixed groove on the upper half of the inner wall of both sides of the fixed track (21), and the fixed track (21) is fixedly connected to the fixed magnetic strip (23) through the fixed groove. The fixed magnetic strip (23) is composed of a first magnetic area (23a), a second magnetic area (23b) and a third magnetic area (23c). The first magnetic area (23a) is located in the detection area, the third magnetic area (23c) is located in the loading and unloading area, and a second magnetic area (23b) is provided between the first magnetic area (23a) and the third magnetic area (23c). The first magnetic area (23a) and the second magnetic area (23b) both have N-type magnetism, and the magnetic quantity of the first magnetic area (23a) is greater than that of the second magnetic area (23b). The third magnetic area (23c) has S-type magnetism. The loading mechanism (6) is provided with a plurality of loading mechanisms (6) inside the fixing mechanism (2). The loading mechanism (6) includes: a moving body (61), which is placed in the track groove of the fixed track (21); a power component (62), the bottom two sides of the moving body (61) are fixedly sleeved with the upper half of the power component (62), and the lower half sidewall of the power component (62) meshes with the sidewall of the fixed rack (22); a rotating component (63), the top middle part of the moving body (61) is fixedly sleeved with the lower half of the rotating component (63); and a carrying object (64), the upper half of the rotating component (63) is fixedly sleeved with the bottom middle part of the carrying object (64). The connection is made, and the carrier (64) is placed above the fixed magnetic strip (23). The cross-sectional shape of the carrier (64) is an inverted T-shape. The height of the shooting module (4b) is higher than the top surface of the carrier (64). A wafer can be placed in the middle of the top of the carrier (64). There is a gap between the moving body (61) and the carrier (64). The top of the moving body (61) and the bottom of the carrier (64) are both provided with annular grooves. The moving body (61) and the carrier (64) are movably engaged with the two ends of the support rod (65) through the annular grooves. There are several support rods (65), and the support rods (65) are evenly arranged around the moving body (61).

2. The multi-view inspection equipment for wafer packaging solder joint quality according to claim 1, characterized in that, The light source module (4a) consists of a supplementary light source (41), a connecting rod (43), and an adjusting rod (44), and the shooting module (4b) consists of a camera assembly (42), a connecting rod (43), and an adjusting rod (44). The side wall of the connecting rod (43) is threadedly connected to the wall of the detection housing (31), and one end of the connecting rod (43) is movably engaged with the top of the supplementary light source (41) or the camera assembly (42). Four adjusting rods (44) are threadedly connected to the wall of the detection housing (31) surrounding the connecting rod (43), and one end of the adjusting rod (44) abuts against the top of the supplementary light source (41) or the camera assembly (42).

3. The multi-view inspection equipment for wafer packaging solder joint quality according to claim 2, characterized in that, The loading mechanism (6) further includes: Adsorption component (7) is provided inside the carrier (64).

4. The multi-view inspection equipment for wafer packaging solder joint quality according to claim 3, characterized in that, The adsorption component (7) includes: The air pump (71) has a central cavity in the center of the interior of the carrier (64), and the carrier (64) is fixedly connected to the air pump (71) through the central cavity; An air intake module (72) is provided inside the carrier (64) above the central cavity. There are six air intake modules (72), and the six air intake modules (72) are evenly arranged around the carrier (64). The bottom end of the air intake module (72) is connected to the air inlet of the air pump (71). The air intake module (72) is composed of a first air intake hole (721) and a second air intake hole (722). The first air intake hole (721) is connected to the external space on the top surface of the carrier (64), and the second air intake hole (722) is connected to the external space on the side surface of the carrier (64). An exhaust module (73) is provided inside the carrier (64) located below the central cavity. There are six exhaust modules (73), and one exhaust module (73) is located between two intake modules (72). The top of the exhaust module (73) is connected to the exhaust port of the air pump (71). The exhaust module (73) consists of a first exhaust hole (731) and a second exhaust hole (732). The first exhaust hole (731) is connected to the external space on the side of the carrier (64), and the second exhaust hole (732) is connected to the external space on the bottom surface of the carrier (64). The suction pipe (74) is fixedly sleeved on the carrier (64), and one end of the suction pipe (74) is connected to the second suction hole (722), and the other end of the suction pipe (74) is connected to the external space of the bottom surface of the carrier (64).

5. The multi-view inspection equipment for wafer packaging solder joint quality according to claim 4, characterized in that, The loading mechanism (6) further includes: The movable ring plate (8) has a movable cavity in the middle of the carrier (64), and the carrier (64) is movably connected to the movable ring plate (8) through the movable cavity. The outer ring of the movable ring plate (8) is located above the fixed magnetic strip (23), and the inner ring of the movable ring plate (8) is located below the second air intake hole (722). The movable ring plate (8) is movably connected to the air intake pipe (74). The movable vertical plate (9) has a vertical hole inside the load (64), and the vertical hole connects the second air intake hole (722) and the movable cavity. The top of the movable ring plate (8) is fixedly connected to the movable vertical plate (9), and the movable vertical plate (9) is movably sleeved in the vertical hole. There are six movable vertical plates (9), and the movable vertical plates (9) correspond one-to-one with the second air intake hole (722).

6. The multi-view inspection equipment for wafer packaging solder joint quality according to claim 4, characterized in that, The fixing mechanism (2) also includes: The pressure sensor is provided on the wall of the fixed track (21). One pressure sensor is located on the fixed track (21) where the light source module (4a) and the shooting module (4b) are located. Three pressure sensors are located on the fixed track (21) where the three working positions are located. The number of pressure sensors in one set is two. The two pressure sensors are symmetrically arranged on the two side walls of the fixed track (21). The height of the pressure sensor is equal to the port height of the first exhaust hole (731).

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