Silicon wafer cutting penetration judgment method and device, electronic equipment and storage medium

Abstract

The application provides a silicon wafer cutting penetration judgment method and device, electronic equipment and storage medium, the method comprises the following steps: obtaining the feed torque average of the current cutting, the cycle torque average of the last cycle and the process related parameters; according to the feed torque average and the cycle torque average, the current torque ratio of the current cutting is obtained; according to the process related parameters, the target process group corresponding to the process related parameters is determined from the N process groups divided in advance; according to the feed torque average, the target subdivision group corresponding to the current cutting is determined from the target process group; whether the current torque ratio is less than the cutting torque ratio threshold value corresponding to the target subdivision group is judged, wherein the cutting torque ratio threshold value is determined according to the minimum torque ratio of the target subdivision group; if less, it is determined that the silicon rod corresponding to the current cutting is in the cutting penetration state. The application can realize the automatic judgment of whether the silicon rod is cut through, and improve the judgment efficiency.

Description

Technical Field

[0001] This application relates to the field of silicon wafer cutting technology, and more specifically, to a method, apparatus, electronic device, and storage medium for determining whether a silicon wafer has been cut through. Background Technology

[0002] Currently, the slicing machine uses a reverse cutting process. One drawback of the reverse cutting process is that it can create wire bows, meaning that the cutting depth of the steel wires on the right and left sides of the silicon rod is different, resulting in an uneven wire mesh. Therefore, after the machine is stopped normally after cutting according to the process formula, there may be a problem that the silicon rod is not cut through.

[0003] Currently, the method for determining whether a silicon rod has been cut through is to manually open the slicing machine, use a strong flashlight to observe the wire mesh, and visually inspect whether it has been cut through. This method relies on manual labor and is inefficient. Summary of the Invention

[0004] The purpose of this application is to provide a method, apparatus, electronic device, and computer-readable storage medium for determining whether a silicon wafer has been cut through, so as to solve the problem of low efficiency in determining whether a silicon rod has been cut through in the related art.

[0005] This application provides a method for determining silicon wafer cut-through, comprising: obtaining the average feed torque of the current cut, the average cycle torque of the last cycle, and process-related parameters, wherein the process-related parameters include silicon wafer number, process time, and process tension; obtaining the current torque ratio of the current cut based on the average feed torque and the average cycle torque; determining a target process group corresponding to the process-related parameters from N pre-divided process groups based on the process-related parameters, wherein the N process groups are determined based on historical process-related parameters of historical cuts, each process group corresponds to at least two subgroups, and N is an integer greater than 1; determining a target subgroup corresponding to the current cut from the target process groups based on the average feed torque; determining whether the current torque ratio is less than the cutting torque ratio threshold corresponding to the target subgroup, wherein the cutting torque ratio threshold is determined based on the minimum torque ratio of the target subgroup; if it is less, determining that the silicon rod corresponding to the current cut is in a cut-through state.

[0006] In the above implementation process, the cutting torque ratio threshold of the target subgroup corresponding to the current cut is used to determine the current torque ratio of the current cut belonging to that target subgroup. If the current torque ratio of the current cut is less than the cutting torque ratio threshold, it is determined that the silicon ingot corresponding to the current cut is cut through. Since the cutting torque ratio threshold is determined based on the minimum torque ratio of the target subgroup, which reflects the minimum torque ratio historically required for additional cutting, the cutting torque ratio threshold determined based on the minimum torque ratio of the target subgroup can be used more accurately as a basis for determining whether additional cutting is needed for the current cut. That is, it can more accurately determine whether the silicon ingot corresponding to the current cut is cut through. Therefore, compared to related technologies, it can achieve automated determination of whether the silicon ingot is cut through, improving the determination efficiency.

[0007] Furthermore, in the above implementation, N process groups are pre-divided based on N process groups. Then, based on the N process groups of the current cut, a target process group is determined from these N process groups. The cutting torque ratio threshold of the target subgroup within the target process group corresponding to the current cut is then used for judgment. That is, in the above implementation, the cutting situation is matched based on the process-related parameters and average feed torque of the current cut. This allows for the determination of the cutting torque ratio threshold of the target subgroup within the target process group that best matches the cutting situation of the current cut. This improves the reliability of the cutting torque ratio threshold and further enhances the accuracy of determining whether the silicon rod is cut through.

[0008] Further, determining the target subgroup corresponding to the current cut from the target process group based on the average feed torque includes: for each subgroup in the target process group, comparing the average feed torque with the average minimum feed torque and the average maximum feed torque of that subgroup to obtain the comparison result corresponding to that subgroup; and determining whether the subgroup is the target subgroup based on the comparison result corresponding to that subgroup.

[0009] In the above implementation, by comparing the average feed torque with the average minimum and maximum feed torque of the sub-group, it can be determined whether the average feed torque falls within the range of the average feed torque of the sub-group, thereby quickly determining whether the sub-group is the target sub-group.

[0010] Furthermore, if each process group corresponds to two subgroups, the method further includes: for each process group, obtaining the average historical feed torque of multiple historical cuts in that process group; and using a quantile classification method to divide the average historical feed torque of multiple historical cuts into a high-torque subgroup and a low-torque subgroup corresponding to that process group.

[0011] Furthermore, for each process group, the average historical feed torque of multiple historical cuts is divided using a quantile classification method to obtain the high-torque subgroup and low-torque subgroup corresponding to that process group. This includes: for each historical cut in multiple historical cuts within each process group, sorting the average historical feed torque of the historical cuts, and obtaining the torque ranked at a set quantile as the subdivision torque of that process group; and dividing the process group into a high-torque subgroup and a low-torque subgroup based on the subdivision torque of that process group and the historical feed torque of multiple historical cuts.

[0012] In the above implementation, the average historical feed torque of multiple historical cuts is divided by using a quantile classification method, and the process group is divided into a high torque sub-group and a low torque sub-group at a set quantile, so that the high torque sub-group and the low torque sub-group have an equal probability of becoming the target sub-group corresponding to the current cut.

[0013] Further, determining the target subdivision group corresponding to the current cut from the target process group based on the average feed torque includes: if the target process group includes a target high-torque subdivision group and a target low-torque subdivision group, then comparing the average feed torque with the minimum average feed torque and the maximum average feed torque of the target high-torque subdivision group to obtain a comparison result for the target high-torque subdivision group; comparing the average feed torque with the minimum average feed torque and the maximum average feed torque of the target low-torque subdivision group to obtain a comparison result for the target low-torque subdivision group; and determining the target subdivision group from the target high-torque subdivision group and the target low-torque subdivision group based on the comparison results of the target high-torque subdivision group and the target low-torque subdivision group.

[0014] In the above implementation, by comparing the average feed torque with the average minimum and maximum feed torque of the target high-torque subgroup of the target process group, and with the average minimum and maximum feed torque of the target low-torque subgroup of the target process group, it can be determined whether the average feed torque falls within the range of the average feed torque of the target high-torque subgroup or the range of the average feed torque of the target low-torque subgroup, thereby quickly identifying the target subgroup.

[0015] Furthermore, before determining whether the current torque ratio is less than the cutting torque ratio threshold corresponding to the target sub-group, the method further includes: obtaining M historical torque ratios of M historical cutting operations in the target sub-group; selecting the minimum value from the M historical torque ratios as the minimum torque ratio of the target sub-group; and obtaining the cutting torque ratio threshold corresponding to the target sub-group based on the minimum torque ratio of the target sub-group.

[0016] In the above implementation, the minimum value of the M historical torque ratios of the M historical additional cutting operations in the target sub-group is taken as the minimum torque ratio of the target sub-group. This minimum torque ratio can effectively reflect the minimum torque ratio required in history when additional cutting is needed. The additional cutting torque ratio threshold determined based on the minimum torque ratio of the target sub-group can be accurately used as the basis for judging whether additional cutting is needed in the current cutting operation, thereby improving the accuracy of the judgment result.

[0017] Furthermore, after determining whether the current torque ratio is less than the cutting torque ratio threshold corresponding to the target subgroup, the method further includes: if it is not less than, determining that the silicon rod corresponding to the current cut is in a non-through state, and using a cutting process to cut the silicon rod corresponding to the current cut.

[0018] In the above implementation, if the current torque ratio is not less than the cutting torque ratio threshold corresponding to the target subgroup, it can be considered that the current cut has not cut through the silicon rod. Therefore, the cutting process is used to cut the silicon rod corresponding to the current cut, which increases the probability of cutting through the silicon rod.

[0019] Furthermore, the method further includes: determining whether there is an abnormal state in the current cut, wherein the abnormal state includes a disconnection state and a downtime exceeding a preset time threshold; if the abnormal state exists in the current cut, then it is determined that the silicon rod corresponding to the current cut is in the non-through state, and the silicon rod corresponding to the current cut is cut using the additional cutting process.

[0020] In the above implementation, if a break occurs in the current cutting stroke or the downtime exceeds the preset time threshold, it indicates that an abnormality has occurred in the cutting process. At this time, it is determined that the silicon rod corresponding to the current cutting stroke is in a non-cut-through state, and an additional cutting process is used to cut the silicon rod corresponding to the current cutting stroke, which can prevent the silicon rod from being cut through.

[0021] This application embodiment also provides a silicon wafer cut-through determination device, comprising: an acquisition module, configured to acquire the average feed torque of the current cut, the average cycle torque of the last cycle, and process-related parameters, and to acquire the current torque ratio of the current cut based on the average feed torque and the average cycle torque; wherein the process-related parameters include silicon wafer number, process time, and process tension; a determination module, configured to determine a target process group corresponding to the process-related parameters from N pre-divided process groups based on the process-related parameters, and to determine a target subgroup corresponding to the current cut from the target process group based on the average feed torque; wherein the N process groups are determined based on historical process-related parameters of historical cuts, each process group corresponds to at least two subgroups, and N is an integer greater than 1; and a judgment module, configured to determine whether the current torque ratio is less than the cutting torque ratio threshold corresponding to the target subgroup, and if it is less, to determine that the silicon rod corresponding to the current cut is in a cut-through state; wherein the cutting torque ratio threshold is determined based on the minimum torque ratio of the target subgroup.

[0022] This application also provides an electronic device, including a processor and a memory, wherein the memory stores a computer program, and the processor executes the computer program to implement any of the above-described silicon wafer cut-through determination methods.

[0023] This application also provides a computer-readable storage medium storing a computer program, which, when executed by at least one processor, implements any of the above-described silicon wafer cut-through determination methods. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic flowchart illustrating a silicon wafer cut-through determination method provided in an embodiment of this application;

[0026] Figure 2 A flowchart illustrating the process of obtaining the cutting torque ratio threshold of a target subgroup, as provided in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of a silicon wafer cut-through determination device provided in an embodiment of this application;

[0028] Figure 4This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0029] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0030] To address the problem of low efficiency in determining whether a silicon ingot has been cut through in related technologies, this application provides a method for determining whether a silicon wafer has been cut through. See also... Figure 1 As shown, Figure 1 This is a flowchart illustrating the silicon wafer cut-through determination method provided in the embodiments of this application, including:

[0031] S101: Obtain the average feed torque of the current cut, the average cycle torque of the last cycle, and process-related parameters.

[0032] In this embodiment, multiple torques at the feed position during the cutting process of the current cut can be obtained by sampling, and the average value of the feed torque for the current cut can be obtained. Alternatively, only the torque at the feed position when the current cut begins can be obtained and used as the average feed torque for the current cut.

[0033] In this embodiment, multiple torques at the feed position in the last cycle of the current cut can be obtained by sampling, and the average value can be calculated to obtain the average cycle torque of the last cycle of the current cut. Alternatively, only the torque at the feed position at the beginning of the last cycle of the current cut can be obtained and used as the average cycle torque of the last cycle of the current cut.

[0034] It's understandable that a single cut often has a set number of cutting cycles or a set cutting time. For example, if it's set to 120 cycles, each cycle lasting 1 minute, then the current cut will be in its last minute, meaning it's in its last cycle.

[0035] In this embodiment, the torque at the infeed position can be obtained by setting a sensor at the infeed position. Alternatively, the torque at the infeed position can be calculated based on the radius, tension, and cutting speed of the diamond wire used for cutting. This embodiment does not limit the method for obtaining the torque at the infeed position.

[0036] In the embodiments of this application, process-related parameters refer to parameters related to the silicon wafer cutting process, including silicon wafer specifications, process time, and process tension. Furthermore, process-related parameters may also include at least one of the following parameters: machine tool, diameter of the diamond wire used for cutting, and length of the silicon rod being cut.

[0037] In this embodiment of the application, process-related parameters can be input by the user into the electronic device executing the method of this embodiment of the application, so that the electronic device obtains the process-related parameters for the current cut.

[0038] S102: Obtain the current torque ratio for the current cut based on the average feed torque and the average cycle torque.

[0039] In this embodiment, the ratio between the average feed torque of the current cut and the average cycle torque of the last cycle can be calculated, and this ratio can be used as the current torque ratio of the current cut.

[0040] In practical applications, the ratio is usually obtained by dividing the average cycle torque of the last cycle by the average feed torque. Of course, the ratio can also be obtained by dividing the average feed torque by the average cycle torque of the last cycle. The following example uses the ratio obtained by dividing the average cycle torque of the last cycle by the average feed torque.

[0041] S103: Based on the process-related parameters of the current cut, determine the target process group corresponding to the process-related parameters from the pre-divided N process groups.

[0042] In the embodiments of this application, the N process groups are determined based on the historical process-related parameters of the historical cuts. Each process group corresponds to at least two subgroups, and N is an integer greater than 1.

[0043] For example, assuming historical process parameters include m cutting machines, n types of silicon wafers, k types of wire diameter, j types of ingot length, l types of process tension, and p types of process time, and each cutting machine can use these k types of wire diameter, j types of ingot length, l types of process tension, and p types of process time to cut these n types of silicon wafers, then N = m*n*k*j*l*p process groups can be defined. Based on the cutting machine number, silicon wafer number, wire diameter, ingot length, process tension, and process time of the current cut, the target process group with the current cutting machine number, silicon wafer number, wire diameter, ingot length, process tension, and process time can be found from these m*n*k*j*l*p process groups.

[0044] S104: Based on the average feed torque of the current cut, determine the target subgroup corresponding to the current cut from the target process group.

[0045] In this embodiment of the application, for each process group, the average historical feed torque of multiple historical cuts in the process group can be obtained, and then the average historical feed torque of multiple historical cuts can be divided to obtain K subgroups corresponding to the process group.

[0046] In this embodiment, the specific value of K can be configured according to actual needs. The larger K is, the more detailed the division of the historical average feed torque.

[0047] In this embodiment, the average historical feed torque of historical cuts can be obtained by acquiring the historical feed torque of historical cuts and then calculating the average value.

[0048] In the embodiments of this application, the average historical feed torque of multiple historical cuts can be divided using, but is not limited to, a quantile classification method.

[0049] In this embodiment of the application, when performing step S104, the average feed torque of each subgroup in the target process group can be compared with the average minimum feed torque and the average maximum feed torque of that subgroup to obtain the comparison result corresponding to that subgroup. Then, based on the comparison result corresponding to that subgroup, it can be determined whether that subgroup is the target subgroup.

[0050] It is understandable that the average minimum and maximum feed torque of a subdivision group reflects the range of average feed torque for that subdivision group. By comparing the average feed torque with the average minimum and maximum feed torque of that subdivision group, it can be determined whether the average feed torque falls within the range of average feed torque for that subdivision group, thus quickly determining whether that subdivision group is the target subdivision group.

[0051] The following example illustrates the case where K is 2, using the quantile classification method:

[0052] For each historical cut in a process group, the average historical feed torque of each historical cut can be sorted, and the torque at the set quantile can be used as the sub-minimum torque for that process group. Then, based on the sub-minimum torque of the process group and the historical feed torque of multiple historical cuts, the process group is divided into a high-torque sub-minimum group and a low-torque sub-minimum group.

[0053] For example, the quantile can be set to two-thirds, one-half, or three-quarters, etc. The specific value of the quantile can be set by the engineer according to the actual needs.

[0054] For example, suppose the average historical feed torque of each historical cut in a process group is a1, a2, a3, a4, a5, a6, and a1 < a2 < a3 < a4 < a5 < a6. Assume the quantile is set to two-thirds and K is 2. Then, setting the torque corresponding to the quantile to a4, we can obtain the low torque subgroup [a1, a4] and the high torque subgroup (a4, a6) for this process group.

[0055] Accordingly, when executing step S104, the average feed torque of the current cut can be compared with the average minimum and maximum feed torque of the target high-torque subdivision group to obtain the comparison result of the target high-torque subdivision group; and the average feed torque of the current cut can be compared with the average minimum and maximum feed torque of the target low-torque subdivision group to obtain the comparison result of the target low-torque subdivision group. Then, based on the comparison results of the target high-torque subdivision group and the target low-torque subdivision group, the target subdivision group is determined from the target high-torque subdivision group and the target low-torque subdivision group. The target high-torque subdivision group and the target low-torque subdivision group are the high-torque subdivision group and the low-torque subdivision group of the target process group.

[0056] For example, if the average feed torque of the current cut is greater than or equal to the average minimum feed torque of the target high-torque subdivision group and less than or equal to the average maximum feed torque of the target high-torque subdivision group, the target high-torque subdivision group can be identified as the target subdivision group. Similarly, if the average feed torque of the current cut is greater than or equal to the average minimum feed torque of the target low-torque subdivision group and less than or equal to the average maximum feed torque of the target low-torque subdivision group, the target low-torque subdivision group can be identified as the target subdivision group.

[0057] S105: Determine whether the current torque ratio is less than the threshold of the cutting torque ratio corresponding to the target subgroup.

[0058] In this embodiment, the torque ratio threshold is determined based on the minimum torque ratio of the target subgroup.

[0059] In this embodiment of the application, before determining whether the current torque ratio is less than the threshold of the shear torque ratio corresponding to the target sub-group, one can also refer to... Figure 2 As shown, the threshold for the shear torque ratio corresponding to the target subgroup is first obtained in the following manner:

[0060] S201: Obtain the M historical torque ratios of the M historical cutting operations in the target subgroup.

[0061] In this embodiment, the M historical cutting cuts can be all historical cutting cuts in the target subdivision group. For each historical cutting cut in the target subdivision group, the average historical feed torque and the average historical cycle torque of the last cycle can be obtained, and then the ratio between the two can be calculated to obtain the historical torque ratio of the historical cutting cut.

[0062] S202: Select the minimum value from M historical torque ratios as the minimum torque ratio of the target subgroup.

[0063] S203: Based on the minimum torque ratio of the target sub-group, obtain the threshold value of the shear torque ratio corresponding to the target sub-group.

[0064] In some embodiments of this application, the minimum torque ratio of the target subgroup can be used as the threshold of the shear torque ratio corresponding to the target subgroup.

[0065] In some other embodiments of this application, the difference or sum of the minimum torque ratio of the target sub-group and a preset value can also be used as the threshold for the shear torque ratio corresponding to the target sub-group. The preset value can be set by the engineer according to actual needs.

[0066] It is understood that, in the embodiments of this application, the cutting torque ratio threshold for the target sub-group can be determined in the manner described above for each silicon wafer cutting penetration determination. Alternatively, the threshold can be determined after identifying the sub-groups of each process group, i.e., for each sub-group, in the manner described above. Figure 2 The method predetermines the cutting torque ratio threshold corresponding to each subgroup of the process group, and then, when performing silicon wafer cutting through judgment each time, the target subgroup is determined and the cutting torque ratio threshold of the target subgroup is directly called for judgment.

[0067] S106: If the current torque ratio is less than the cutting torque ratio threshold corresponding to the target subgroup, then the silicon rod corresponding to the current cut is determined to be in the cut-through state.

[0068] In this embodiment of the application, if the current torque ratio is greater than or equal to the cutting torque ratio threshold corresponding to the target subgroup, it can be determined that the silicon rod corresponding to the current cut is in a non-through state, and the cutting process is used to cut the silicon rod corresponding to the current cut.

[0069] Optionally, in some embodiments of this application, if the target sub-group corresponding to the current cut cannot be determined from the target process group based on the average feed torque of the current cut, it can be determined that the silicon rod corresponding to the current cut is in a non-through-cut state, and an additional cutting process is used to cut the silicon rod corresponding to the current cut. It can be understood that if there is no matching target sub-group in the target process group for the current cut, it means that the feed situation of the current cut is not within the historical range, and it can be considered that an abnormal feed has occurred, such as an abnormal feed speed. In this case, determining that the silicon rod corresponding to the current cut is in a non-through-cut state and performing additional cutting can prevent the silicon rod from being incompletely cut.

[0070] Optionally, in some embodiments of this application, it can be determined whether there is an abnormal state in the current cutting pass. If there is an abnormal state in the current cutting pass, it is determined that the silicon rod corresponding to the current cutting pass is in the non-through cutting state. The abnormal state includes a broken wire state and a downtime exceeding a preset threshold. An additional cutting process is then used to cut the silicon rod corresponding to the current cutting pass. If a broken wire occurs in the current cutting pass, or if the downtime exceeds the preset threshold, it indicates that an abnormality has occurred in the cutting process that is sufficient to prevent the cutting process from continuing. In this case, it is determined that the silicon rod corresponding to the current cutting pass is in the non-through cutting state, and additional cutting can prevent the silicon rod from being cut incompletely.

[0071] The preset duration threshold can be set by engineers according to the actual situation, for example, it can be set to 30 minutes.

[0072] The silicon wafer cut-through determination method provided in this application utilizes the cutting torque ratio threshold of the target subgroup corresponding to the current cut in the target process group to determine the current torque ratio of the current cut belonging to that target subgroup. If the current torque ratio of the current cut is less than the cutting torque ratio threshold, it is determined that the silicon ingot corresponding to the current cut is cut through. Since the cutting torque ratio threshold is determined based on the minimum torque ratio of the target subgroup, which reflects the minimum torque ratio historically required for additional cutting, the cutting torque ratio threshold determined based on the minimum torque ratio of the target subgroup can be used more accurately as a basis for determining whether additional cutting is needed for the current cut. This allows for a more accurate determination of whether the silicon ingot corresponding to the current cut is cut through, thus achieving automated determination of whether the silicon ingot is cut through compared to related technologies, improving determination efficiency.

[0073] Furthermore, in the silicon wafer cut-through determination method provided in this application embodiment, N process groups are pre-divided based on N process groups. Then, based on the N process groups of the current cut, a target process group is determined from the N process groups. Finally, the cutting torque ratio threshold of the target sub-group corresponding to the current cut is used for determination. That is, in the above implementation, the cutting situation is matched based on the process-related parameters and average feed torque of the current cut, thereby determining the cutting torque ratio threshold of the target sub-group in the target process group that best matches the current cut situation. This improves the reliability of the cutting torque ratio threshold and further enhances the accuracy of determining whether the silicon rod is cut through.

[0074] Based on the same inventive concept, this application also provides a silicon wafer cutting-through determination device 300. Please refer to... Figure 3 As shown, Figure 3 It shows the use of Figure 1The method illustrated uses a silicon wafer cut-through determination device. It should be understood that the specific functions of device 300 are described above; to avoid repetition, detailed descriptions are omitted here. Device 300 includes at least one software function module that can be stored in memory or embedded in the operating system of device 300 in the form of software or firmware. Specifically:

[0075] See Figure 3 As shown, the device 300 includes: an acquisition module 301, a determination module 302, and a decision module 303. Wherein:

[0076] The acquisition module 301 is used to acquire the average feed torque of the current cut, the average cycle torque of the last cycle, and process-related parameters, and to acquire the current torque ratio of the current cut based on the average feed torque and the average cycle torque; wherein, the process-related parameters include silicon wafer number, process time, and process tension;

[0077] The determining module 302 is used to determine the target process group corresponding to the process-related parameters from the pre-divided N process groups according to the process-related parameters, and to determine the target subgroup corresponding to the current cut from the target process group according to the average feed torque; wherein, the N process groups are determined according to the historical process-related parameters of historical cuts, each process group corresponds to at least two subgroups, and N is an integer greater than 1;

[0078] The decision module 303 is used to determine whether the current torque ratio is less than the cutting torque ratio threshold corresponding to the target subgroup. If it is less, it is determined that the silicon rod corresponding to the current cut is in the cut-through state. The cutting torque ratio threshold is determined based on the minimum torque ratio of the target subgroup.

[0079] In one feasible embodiment of this application, the determining module 302 is specifically used to: for each subgroup in the target process group, compare the average feed torque with the average minimum feed torque and the average maximum feed torque of the subgroup, obtain the comparison result corresponding to the subgroup, and determine whether the subgroup is the target subgroup based on the comparison result corresponding to the subgroup.

[0080] In one feasible embodiment of this application, if each process group corresponds to two subgroups, the acquisition module 301 is further configured to acquire the average historical feed torque of multiple historical cuts in each process group; and to divide the average historical feed torque of multiple historical cuts into high torque subgroups and low torque subgroups corresponding to the process group by using a quantile classification method.

[0081] In the above feasible implementation, the acquisition module 301 is specifically used to sort the average historical feed torque of each historical cut in each of the multiple historical cuts in each process group, obtain the torque ranked in a set quantile as the subdivision torque of the process group, and divide the process group into a high torque subdivision group and a low torque subdivision group based on the subdivision torque of the process group and the historical feed torque of the multiple historical cuts.

[0082] In the above feasible implementation, the determining module 302 is specifically used for:

[0083] If the target process group includes a target high torque subdivision group and a target low torque subdivision group, then the average feed torque is compared with the average minimum feed torque and the average maximum feed torque of the target high torque subdivision group to obtain the comparison result of the target high torque subdivision group.

[0084] The average feed torque is compared with the average minimum feed torque and the average maximum feed torque of the target low torque subdivision group to obtain the comparison result of the target low torque subdivision group;

[0085] Based on the comparison results of the target high torque subdivision group and the target low torque subdivision group, the target subdivision group is determined from the target high torque subdivision group and the target low torque subdivision group.

[0086] In one feasible embodiment of this application, the acquisition module 301 is further configured to: before the judgment module 303 determines whether the current torque ratio is less than the cutting torque ratio threshold corresponding to the target sub-group, acquire M historical torque ratios of M historical cutting operations in the target sub-group, select the minimum value from the M historical torque ratios as the minimum torque ratio of the target sub-group, and acquire the cutting torque ratio threshold corresponding to the target sub-group based on the minimum torque ratio of the target sub-group.

[0087] In this embodiment of the application, the decision module 303 is further configured to determine that the silicon rod corresponding to the current cut is in a non-through state if the current torque ratio is not less than the cutting torque ratio threshold corresponding to the target sub-group, and to cut the silicon rod corresponding to the current cut using a cutting process.

[0088] In one feasible embodiment of this application, the decision module 303 is further configured to determine whether there is an abnormal state in the current cut; if the current cut has the abnormal state, then it is determined that the silicon rod corresponding to the current cut is in the non-through-cut state. The abnormal state includes a broken wire state and a downtime exceeding a preset time threshold.

[0089] It should be understood that, for the sake of brevity, some of the content described in the method embodiments will not be repeated in the device embodiment section.

[0090] Based on the same inventive concept, this application also provides an electronic device, see [link to relevant documentation]. Figure 4 As shown, it includes a processor 401 and a memory 402. Wherein:

[0091] The memory 402 stores a computer program, and the processor 401 executes one or more computer programs stored in the memory 402 to implement the above-mentioned silicon wafer cut-through determination method.

[0092] It is understandable that processor 401 can be a processor core or processor chip, or other circuitry capable of program configuration and execution. Memory 402 can be RAM (Random Access Memory), ROM (Read-Only Memory), flash memory, etc., but this is not a limitation.

[0093] It's understandable. Figure 4 The structure shown is for illustrative purposes only; the electronic device may also include components that are more advanced than those shown. Figure 4 The more or fewer components shown, or having the same Figure 4 Different configurations are shown. For example, it may also have an internal communication bus for communication between the processor 401 and the memory 402; or it may have an external communication interface, such as a USB (Universal Serial Bus) interface, a CAN (Controller Area Network) bus interface, etc.; or it may have an information display component such as a display screen, but this is not a limitation.

[0094] Based on the same inventive concept, this embodiment also provides a computer-readable storage medium, such as a floppy disk, optical disk, hard disk, flash memory, USB flash drive, SD (Secure Digital Memory Card), MMC (Multimedia Card), etc., in which one or more computer programs implementing the above steps are stored. These one or more computer programs can be executed by one or more processors to implement the above silicon wafer cut-through determination method. Further details will not be elaborated here.

[0095] The embodiments in this application can be combined with each other without conflict to obtain new embodiments.

[0096] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0097] Furthermore, the units described as separate components may or may not be physically separate.

[0098] Furthermore, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0099] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0100] In this article, "multiple" refers to two or more.

[0101] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for determining whether a silicon wafer has been cut through, characterized in that, include: Obtain the average feed torque of the current cut, the average cycle torque of the last cycle, and process-related parameters, wherein the process-related parameters include silicon wafer number, process time, and process tension; Based on the average feed torque and the average periodic torque, obtain the current torque ratio for the current cut. Based on the process-related parameters, a target process group corresponding to the process-related parameters is determined from N pre-divided process groups. The N process groups are determined based on the historical process-related parameters of historical cuts. Each process group corresponds to at least two subgroups, and N is an integer greater than 1. Based on the average feed torque, determine the target subgroup corresponding to the current cut from the target process group; Determine whether the current torque ratio is less than the cut torque ratio threshold corresponding to the target subgroup, wherein the cut torque ratio threshold is determined based on the minimum torque ratio of the target subgroup; If it is less than, then the silicon rod corresponding to the current cut is determined to be in the cut-through state.

2. The method as described in claim 1, characterized in that, The step of determining the target subgroup corresponding to the current cut from the target process group based on the average feed torque includes: For each subgroup in the target process group, the average feed torque is compared with the average minimum feed torque and the average maximum feed torque of that subgroup to obtain the comparison result corresponding to that subgroup; based on the comparison result corresponding to that subgroup, it is determined whether that subgroup is the target subgroup.

3. The method as described in claim 1, characterized in that, If each process group corresponds to two subgroups, the method further includes: For each process group, the average historical feed torque of multiple historical cuts in that process group is obtained; the average historical feed torque of multiple historical cuts is divided into high torque subgroups and low torque subgroups corresponding to that process group using a quantile classification method.

4. The method as described in claim 3, characterized in that, For each process group, the average historical feed torque of multiple historical cuts is divided using a quantile classification method to obtain the high torque subgroup and low torque subgroup corresponding to that process group, including: For each historical cut in multiple historical cuts within each process group, the average historical feed torque of each historical cut is sorted, and the torque ranked at a set quantile is taken as the subdivision torque of that process group. Based on the subdivision torque of that process group and the historical feed torque of multiple historical cuts, the process group is divided into a high torque subdivision group and a low torque subdivision group.

5. The method as described in claim 3, characterized in that, The step of determining the target subgroup corresponding to the current cut from the target process group based on the average feed torque includes: If the target process group includes a target high torque subdivision group and a target low torque subdivision group, then the average feed torque is compared with the average minimum feed torque and the average maximum feed torque of the target high torque subdivision group to obtain the comparison result of the target high torque subdivision group. The average feed torque is compared with the average minimum feed torque and the average maximum feed torque of the target low torque subdivision group to obtain the comparison result of the target low torque subdivision group; Based on the comparison results of the target high torque subdivision group and the target low torque subdivision group, the target subdivision group is determined from the target high torque subdivision group and the target low torque subdivision group.

6. The method as described in claim 1, characterized in that, Before determining whether the current torque ratio is less than the threshold for the shear torque ratio corresponding to the target subdivision group, the method further includes: Obtain M historical torque ratios for M historical cutting operations in the target subgroup; Select the minimum value from the M historical torque ratios as the minimum torque ratio of the target subgroup; Based on the minimum torque ratio of the target subgroup, obtain the cutting torque ratio threshold corresponding to the target subgroup.

7. The method as described in claim 1, characterized in that, After determining whether the current torque ratio is less than the threshold for the shear torque ratio corresponding to the target subgroup, the method further includes: If it is not less than, then the silicon rod corresponding to the current cut is determined to be in a non-through state, and the silicon rod corresponding to the current cut is cut using an additional cutting process.

8. The method according to any one of claims 1-7, characterized in that, The method further includes: Determine whether there is an abnormal state in the current cut, wherein the abnormal state includes a disconnection state and a downtime exceeding a preset time threshold; If the abnormal state exists in the current cut, it is determined that the silicon rod corresponding to the current cut is in a non-through state, and the silicon rod corresponding to the current cut is cut using an additional cutting process.

9. A silicon wafer cut-through judgment device, characterized in that, include: The acquisition module is used to acquire the average feed torque of the current cut, the average cycle torque of the last cycle, and process-related parameters, and to acquire the current torque ratio of the current cut based on the average feed torque and the average cycle torque; wherein, the process-related parameters include silicon wafer number, process time, and process tension; The determination module is used to determine the target process group corresponding to the process-related parameters from N pre-divided process groups based on the process-related parameters, and to determine the target subgroup corresponding to the current cut from the target process group based on the average feed torque; wherein, the N process groups are determined based on the historical process-related parameters of historical cuts, each process group corresponds to at least two subgroups, and N is an integer greater than 1; The decision module is used to determine whether the current torque ratio is less than the cutting torque ratio threshold corresponding to the target subgroup. If it is less, it is determined that the silicon rod corresponding to the current cut is in the cut-through state. The cutting torque ratio threshold is determined based on the minimum torque ratio of the target subgroup.

10. An electronic device, characterized in that, It includes a processor and a memory, wherein the memory stores a computer program, and the processor executes the computer program to implement the method as described in any one of claims 1-8.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by at least one processor, implements the method as described in any one of claims 1-8.

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