Submerged liquid cooling heat exchange device and method

Abstract

The application relates to the technical field of computer electronic products, and discloses an immersed liquid cooling heat exchange device and method, which comprise a whole machine component, a chip radiator is immersed in fluorinated liquid, and the fluorinated liquid does not fill the cavity; preset software is used to determine the running state and resource occupation of the chip, and the target working temperature and system pressure of the chip are calculated; a gas pressure adjusting and controlling component is used to adjust the pressure according to the target system pressure parameter, the gas pressure adjusting and controlling component comprises a vacuum pump and an air compressor, and the vacuum pump and the air compressor are connected with the whole machine component through pipelines; and a temperature and pressure detecting component is used to detect the temperature at the associated position and monitor the system pressure. The boiling point of the immersed liquid cooling fluorinated liquid is controlled by controlling the pressure in the system, so that efficient heat dissipation is realized, and a set of software preset and a set of temperature and pressure detecting feedback adjusting mechanism are matched to meet the overclocking or turbo frequency working requirements of the chip.

Description

Technical Field

[0001] This application relates to the field of computer electronic product technology, such as an immersion liquid cooling heat exchange device and method. Background Technology

[0002] With the urgent need to improve the performance of electronic products, the heat generated by chips such as CPUs and GPUs is soaring, and conventional air cooling or liquid cooling methods are no longer sufficient to meet the heat dissipation requirements brought about by the rapid increase in power consumption. Even using boiling and condensation heat transfer technologies with high heat transfer coefficients is difficult to quickly cope with the rapid increase in power consumption. Therefore, how to effectively dissipate the heat from the ultra-high power consumption of a single chip has become an urgent technical problem to be solved.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0005] This disclosure provides an immersion liquid cooling heat exchange device and method, which controls the boiling point of the immersion liquid cooling fluoride by controlling the pressure in the system to achieve efficient heat dissipation, and matches a set of software presets and a set of temperature and pressure detection feedback adjustment mechanisms to meet the overclocking or turbo boost operation requirements of the chip.

[0006] In some embodiments, the immersion liquid-cooled heat exchanger includes:

[0007] The complete machine components include a chip heat sink, which is a boiling heat sink, and the chip heat sink is immersed in a fluorinated liquid, but the fluorinated liquid does not fill the cavity in which it is located;

[0008] The pre-set software is used to determine the chip's operating status and resource usage, and to calculate the chip's target operating temperature and system pressure.

[0009] A pressure regulation and control unit is used to adjust the pressure according to the target system pressure parameters. The pressure regulation and control unit includes a vacuum pump and an air compressor. The vacuum pump and the air compressor are respectively connected to the whole machine components through pipelines. The vacuum pump is used to extract gas from the cavity to reduce the pressure, and the air compressor is used to inject gas into the cavity to increase the pressure.

[0010] Temperature and pressure sensing components are used to detect temperature at associated locations and monitor system pressure.

[0011] Optionally, the complete set of components includes: a housing, a sealing element, a transparent structural plate, a pressure plate, a circuit board, and a chip heat sink. These components together constitute a sealed immersion liquid cooling environment, wherein the chip is mounted on the circuit board and dissipates heat through the chip heat sink.

[0012] Optionally, the temperature and pressure detection component includes a temperature sensor and a pressure gauge. The temperature sensor is placed inside the chip heat sink, integrated into the chip, and immersed in the liquid, respectively, to monitor the temperature of the chip, the chip heat sink, and the fluorinated liquid in real time. The pressure gauge is installed on the top of the chamber to monitor the pressure inside the chamber in real time.

[0013] Optionally, the immersion liquid-cooled heat exchanger also includes an external heat dissipation system, including a heat exchanger, condenser coil, fan module and pump, wherein the external heat dissipation system dissipates the heat inside the chamber to the external environment through liquid cooling and air cooling.

[0014] Optionally, the external heat dissipation system includes a condenser plate, an air-cooled heat dissipation module, and a fan module with an air guide shroud, wherein the external heat dissipation system is a pure air-cooled heat dissipation system.

[0015] Optionally, the immersion liquid-cooled heat exchanger also includes a control system. The control system receives signals from temperature sensors and pressure gauges, and calculates and adjusts the working status of the vacuum pump, air compressor, and external heat dissipation system according to preset software algorithms and temperature and pressure detection feedback mechanisms.

[0016] In some embodiments, the immersion liquid cooling heat exchange method is used in the aforementioned immersion liquid cooling heat exchange device, and the method includes:

[0017] The boiling point of the fluorinated liquid is adjusted by controlling the system pressure within the overall component, causing the chip heat sink to boil rapidly for heat dissipation.

[0018] Based on the chip's operating status and resource usage, the target's operating temperature and system pressure are calculated, and the system status is adjusted in real time through a temperature and pressure detection feedback adjustment mechanism to ensure that the chip operates at the preset temperature.

[0019] Optionally, the software can preset the chip's operating percentage and temperature control point, and generate a database containing a mapping table of operating percentage, temperature control point, and predetermined pressure.

[0020] Optionally, calculating the target's operating temperature and system pressure based on the chip's operating status and resource usage includes:

[0021] Calculate the target operating temperature of the chip based on its operating status and resource usage.

[0022] The temperature of the chip heat sink and the boiling point of the immersion liquid are calculated based on the superheat, and the target system pressure is further calculated.

[0023] In some embodiments, the immersion liquid cooling heat exchange method is used in the aforementioned immersion liquid cooling heat exchange device, and the method includes:

[0024] Confirm the chip's operating status and resource usage;

[0025] The target operating temperature of the chip is calculated, the target temperature of the chip heat sink and the boiling point of the immersion liquid are calculated based on the superheat, and the target system pressure is further calculated.

[0026] The pressure regulation control component is used to adjust the pressure within the entire component to the target system pressure, while simultaneously controlling the temperature of each module to ensure that the chip operates at the preset temperature.

[0027] The immersion liquid-cooled heat exchange device and method provided in this disclosure can achieve the following technical effects:

[0028] Pressure-controlled heat dissipation mechanism: By controlling the pressure within the system, the boiling point of the immersion liquid-cooled fluoride is adjusted to achieve efficient heat dissipation. This innovation solves the problem of heat dissipation difficulties for high-power chips, especially when the chip is overclocked or turbo boosted, it can quickly remove heat and keep the chip operating at a low temperature.

[0029] Software preset and temperature and pressure detection feedback adjustment mechanism: Combining the software preset function, the target operating temperature and system pressure are calculated based on the chip's operating status and resource usage. The system status is then adjusted in real time through the temperature and pressure detection feedback adjustment mechanism to ensure that the chip operates at the preset temperature.

[0030] This disclosure controls the boiling point of the immersion liquid-cooled fluoride by controlling the pressure within the system to achieve efficient heat dissipation, and matches it with a set of software presets and a set of temperature and pressure detection feedback adjustment mechanisms to meet the overclocking or turbo boost requirements of the chip.

[0031] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0032] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0033] Appendix Figure 1 This is a schematic flowchart illustrating the operation of the present invention.

[0034] Appendix Figure 2This is the general assembly drawing of Example 1 of the present invention.

[0035] Appendix Figure 3 This is an exploded structural diagram of Example 1 of the present invention.

[0036] Appendix Figure 4 This is the general assembly drawing of Example 2 of the present invention.

[0037] Appendix Figure 5 This is an exploded structural diagram of Example 2 of the present invention.

[0038] Appendix Figure 6 This is a structural diagram of the condenser plate in Example 2 of the present invention.

[0039] Figure label:

[0040] 1. Vacuum pump; 2. Overall structure; 3. Temperature and pressure detection components; 4. Air compressor.

[0041] 2-1. Housing; 2-2. Seals; 2-3. Transparent structural panel; 2-4. Pressure plate; 2-5. Circuit board; 2-5-1. Chip heat sink; 3-1. Frame; 3-2. Pump; 3-3. Heat exchanger; 3-4. Fan module; 3-5. Pressure gauge; 3-6. Safety valve; 3-7. Condensate coil; 3-8. Heat dissipation module; 3-9. Condensate plate; 3-10. Air guide shroud. Detailed Implementation

[0042] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0043] The terms "first," "second," etc., used in the embodiments of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0044] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better describing the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this disclosure according to the specific circumstances.

[0045] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0046] Unless otherwise stated, the term "multiple" means two or more.

[0047] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0048] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0049] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0050] This invention aims to provide an immersion liquid-cooled heat exchange device and method. By completely immersing heat-generating components such as chips in a low-boiling-point fluorinated liquid, efficient heat dissipation is achieved by utilizing the high thermal conductivity and phase change characteristics of the fluorinated liquid. Simultaneously, the boiling point of the fluorinated liquid is controlled by regulating the pressure within the system to adapt to different power consumption and heat dissipation requirements, thereby enabling overclocking or turbo boost operation of the chip.

[0051] Its complete components include a chip heat sink, which is a boiling heat sink, and the chip heat sink is immersed in a fluorinated liquid, but the fluorinated liquid does not fill the cavity in which it is located;

[0052] The pre-set software is used to determine the chip's operating status and resource usage, and to calculate the chip's target operating temperature and system pressure;

[0053] The pressure regulation and control unit is used to adjust the pressure according to the target system pressure parameters. The pressure regulation and control unit includes a vacuum pump and an air compressor. The vacuum pump and the air compressor are respectively connected to the whole machine components through pipelines. The vacuum pump is used to extract gas from the cavity to reduce the pressure, and the air compressor is used to inject gas into the cavity to increase the pressure.

[0054] Temperature and pressure sensing components are used to detect temperature at associated locations and monitor system pressure.

[0055] The following is combined Figure 1-6 As shown, an explanation will be provided.

[0056] This disclosure provides an immersion liquid-cooled heat exchange device, including a complete system, a pressure regulation and control component, a temperature and pressure detection feedback regulation mechanism, and a preset software component.

[0057] The complete system includes a conventional electronic control unit, server, or main control unit; a sealed metal casing; fluorinated liquid; a boiling heat exchanger 3-3; and a condenser (or an air-cooled heat dissipation module 3-8). The sealed metal casing houses the fluorinated liquid and heating elements, with the fluorinated liquid serving as the heat transfer medium. The boiling heat exchanger 3-3 and the condenser (or air-cooled heat dissipation module 3-8) dissipate heat to the external environment.

[0058] The pressure regulation and control components include a vacuum pump 3-21, an air compressor 4, and a safety relief valve. The vacuum pump 3-21 extracts gas from the sealed metal casing, reducing pressure and thus lowering the boiling point of the fluorinated liquid. The air compressor 4 injects gas into the sealed metal casing, increasing pressure and raising the boiling point. The safety relief valve automatically releases pressure when it becomes too high, ensuring system safety.

[0059] Temperature and pressure detection feedback regulation mechanism: This includes a control feedback mechanism for the temperature sensor, pressure gauge 3-5, vacuum pump 3-21, air compressor 4, and condenser (or air-cooled heat dissipation module 3-8). The temperature sensor is used to monitor the temperature of the heating element, radiator, and fluorinated liquid in real time; the pressure gauge 3-5 is used to monitor the pressure inside the sealed metal casing in real time. Based on the temperature and pressure signals, the control system adjusts the operating status of the vacuum pump 3-21, air compressor 4, and condenser (or air-cooled heat dissipation module 3-8) through a preset software algorithm to achieve efficient heat dissipation and temperature control.

[0060] The preset software section is used to preset the operating state percentages of large-scale software and critical application software, and to set temperature and pressure thresholds based on chip power consumption and heat dissipation requirements. The control system automatically adjusts the operating state of the air pressure regulation control components and the temperature and pressure detection feedback regulation mechanism according to the parameters set in the preset software section.

[0061] In summary, the inventive points of this technical solution are mainly reflected in the following aspects:

[0062] Pressure-controlled heat dissipation mechanism: By controlling the pressure within the system, the boiling point of the immersion liquid-cooled fluoride is adjusted to achieve efficient heat dissipation. This innovation solves the problem of heat dissipation difficulties for high-power chips, especially when the chip is overclocked or turbo boosted, it can quickly remove heat and keep the chip operating at a low temperature.

[0063] Software preset and temperature and pressure detection feedback adjustment mechanism: Combining the software preset function, the target operating temperature and system pressure are calculated based on the chip's operating status and resource usage. The system status is then adjusted in real time through the temperature and pressure detection feedback adjustment mechanism to ensure that the chip operates at the preset temperature.

[0064] Based on this, this disclosure provides two implementation schemes for external heat dissipation systems: one is an external heat dissipation system combining air cooling and liquid cooling, and the other is a pure air cooling system. Both schemes can achieve efficient heat exchange and meet the needs of different application scenarios.

[0065] Example 1: As Figures 2 to 3 As shown, an immersion liquid-cooled heat exchange device is provided, and the external heat dissipation system adopts an external heat dissipation system that combines air cooling and liquid cooling.

[0066] Overall Structure 2: Includes a housing 2-1, a sealing element 2-2, a transparent structural plate 2-3, a pressure plate 2-4, a circuit board 2-5, and a chip heat sink 2-5-1. These components together form a sealed, immersion-type liquid-cooled environment. The housing 2-1 is a sealed metal shell filled with a low-boiling-point fluorinated liquid. The circuit board 2-5 is installed inside the housing 2-1, on which the chip and chip heat sink 2-5-1 are mounted. The transparent structural plate 2-3 is used to observe the state of the fluorinated liquid inside the housing 2-1, and the pressure plate 2-4 is used to fix the circuit board 2-5 and the chip heat sink 2-5-1.

[0067] Pressure regulation and control components: Vacuum pump 1 and air compressor 4 are connected to housing 2-1 via pipelines and are used to regulate the pressure inside housing 2-1. Vacuum pump 1 is used to extract gas from housing 2-1 to reduce pressure, thereby lowering the boiling point of the submerged liquid-cooled fluorinated liquid; air compressor 4 is used to inject gas into housing 2-1 to increase pressure and raise the boiling point.

[0068] Temperature and pressure detection feedback regulation mechanism: This includes temperature sensors, pressure gauges 3-5, etc. The temperature sensors are respectively placed inside the chip heat sink 2-5-1, integrated into the chip, and immersed in the liquid. These sensors monitor the temperature of the chip, heat sink, and immersed liquid in real time. Pressure gauge 3-5 is installed on the top of the housing 2-1 to monitor the pressure inside the housing 2-1 in real time.

[0069] Temperature and pressure signals are transmitted to the control system via lines. The control system adjusts the working status of vacuum pump 1 and air compressor 4, as well as the working mode of the external heat dissipation system, according to the preset software algorithm and temperature and pressure detection feedback mechanism.

[0070] External heat dissipation system: including heat exchanger 3-3, condenser coil 3-7, fan module 3-4, and pump 3-2, etc. These components work together to dissipate the heat inside the enclosure 2-1 to the external environment through liquid cooling and air cooling.

[0071] Control system: Receives signals from temperature sensor and pressure gauge 3-5, and calculates and adjusts the working status of vacuum pump 3-21, air compressor 4 and external heat dissipation system according to preset software algorithm and temperature and pressure detection feedback mechanism to achieve efficient heat dissipation and chip temperature control.

[0072] In summary, in Example 1, the overall component and the temperature and pressure detection component 3 are connected and work together through pipelines, lines and control systems to form an efficient and reliable immersion liquid-cooled heat exchange device.

[0073] Example 2: As Figures 4 to 6 As shown, an immersion liquid-cooled heat exchange device is provided, and the external heat dissipation system adopts a pure air-cooled heat dissipation system.

[0074] Overall Structure 2: Same as Embodiment 1, including housing 2-1, sealing element 2-2, transparent structural plate 2-3, pressure plate 2-4, circuit board 2-5, and chip heat sink 2-5-1. These components together constitute a sealed immersion liquid cooling environment for containing immersion liquid cooling fluoride and for chip heat dissipation.

[0075] Pressure regulation and control components: Same as in Example 1, including a vacuum pump 1 and an air compressor 4. The vacuum pump 1 and air compressor 4 are connected to the housing 2-1 via pipelines. These components are used to regulate the pressure inside the housing 2-1, thereby controlling the boiling point of the submerged liquid-cooled fluorinated liquid and achieving efficient heat dissipation.

[0076] External heat dissipation system: A wind-cooled heat dissipation module 3-8 replaces the heat exchanger 3-3, condenser coil 3-7, and pump 3-2 in Example 1. The wind-cooled heat dissipation module 3-8 includes a condenser plate 3-9, the wind-cooled heat dissipation module 3-8 itself, and a fan module 3-4 with an air guide shroud 3-10. After absorbing heat from the chip within the housing 2-1, the fluorinated liquid circulates between the housing 2-1 and the condenser plate 3-9 via natural convection or, optionally, pump 3-2. The wind-cooled heat dissipation module 3-8 cools the condenser plate 3-9, and the fan module 3-4 with an air guide shroud 3-10 accelerates airflow around the wind-cooled heat dissipation module 3-8, improving heat dissipation efficiency.

[0077] Temperature and pressure monitoring feedback regulation mechanism: Same as in Example 1, including temperature sensor and pressure gauge 3-5

[0078] Temperature sensors are located within the chip heatsink 2-5-1, integrated into the chip, and submerged in the liquid. These sensors monitor the temperature of the chip, heatsink, and submerged liquid in real time, ensuring the chip operates at a preset temperature and transmitting the temperature signal to the control system.

[0079] Pressure gauge 3-5 is connected to the air pressure regulation system inside chamber 2-1 to monitor the pressure inside chamber 2-1 in real time. Pressure gauge 3-5 transmits the pressure signal to the control system, which compares the real-time pressure with the preset pressure and adjusts the working status of vacuum pump 1 and air compressor 4 to maintain the pressure inside chamber 2-1.

[0080] The control system receives signals from temperature sensors and pressure gauges 3-5, and calculates and adjusts the operating states of vacuum pump 1, air compressor 4, and air-cooling system based on preset software algorithms and temperature and pressure detection feedback mechanisms. Through the control system, efficient heat dissipation, chip temperature control, and stable system operation are achieved.

[0081] In Example 2, the overall component and the temperature and pressure detection component 3 are connected and work together through pipelines, lines and control systems to form an efficient and reliable immersion liquid-cooled heat exchange device. The pure air-cooled heat dissipation system is used to adapt to different application scenarios and needs.

[0082] In summary, both embodiments achieve efficient heat dissipation and chip temperature control by controlling the pressure and temperature within the system, combined with software presets and temperature and pressure detection feedback adjustment mechanisms. Meanwhile, the two embodiments differ in their external heat dissipation systems, adapting to different application scenarios and requirements.

[0083] Furthermore, this disclosure also provides an immersion liquid-cooled heat exchange method for the aforementioned immersion liquid-cooled heat exchange device, the method comprising:

[0084] The boiling point of the fluorinated liquid is adjusted by controlling the system pressure within the overall component, causing the chip heat sink 2-5-1 to boil rapidly for heat dissipation.

[0085] Based on the chip's operating status and resource usage, the target's operating temperature and system pressure are calculated, and the system status is adjusted in real time through a temperature and pressure detection feedback adjustment mechanism to ensure that the chip operates at the preset temperature.

[0086] The target operating temperature and system pressure can be calculated in real time or retrieved from a database. Preferably, the software presets the chip's operating percentage and temperature control point, and generates a database containing a mapping table of operating percentage, temperature control point, and predetermined pressure.

[0087] Optionally, calculating the target's operating temperature and system pressure based on the chip's operating status and resource usage includes:

[0088] Calculate the target operating temperature of the chip based on its operating status and resource usage.

[0089] The temperature of the chip heat sink 2-5-1 and the boiling point of the immersion liquid are calculated based on the superheat, and the target system pressure is further calculated.

[0090] In some embodiments, the immersion liquid cooling heat exchange method is used in the aforementioned immersion liquid cooling heat exchange device, and the method includes:

[0091] Confirm the chip's operating status and resource usage;

[0092] Calculate the target operating temperature of the chip, calculate the target temperature of the chip heat sink 2-5-1 and the boiling point of the immersion liquid based on the superheat, and further calculate the target system pressure;

[0093] The pressure regulation control component is used to adjust the pressure within the entire component to the target system pressure, while simultaneously controlling the temperature of each module to ensure that the chip operates at the preset temperature.

[0094] As an example, when processing large files, large software programs, or critical applications, the software pre-determines the chip's workload (e.g., 95% CPU or GPU resource allocation) and temperature control points. The software analyzes this data and generates a corresponding pressure database within the immersion liquid-cooled chassis. When using such software, a temperature detection feedback mechanism monitors the chip's real-time operating temperature. When the predetermined operating point is reached, such as 40°C, vacuum pump 3-21 quickly activates, creating a vacuum within the liquid-cooled chassis to reach the system's predetermined pressure. This rapidly causes the chip's heatsink 2-5-1 to boil. Through boiling and condensation heat exchange, the system reaches thermal equilibrium, quickly removing heat while the chip performs overclocking and turbo boost. After overclocking and turbo boost are complete, or when the pre-determined software is closed, the temperature and pressure detection feedback mechanism adjusts based on the existing temperature. If normal pressure operation is required, pressure pump 3-2 activates to restore the chassis pressure to normal, ensuring equipment lifespan and reliability.

[0095] This disclosure has the following beneficial effects:

[0096] High-efficiency heat dissipation: By using immersion liquid cooling, the heat-generating components such as chips are completely immersed in a low-boiling-point fluorinated liquid, utilizing the high thermal conductivity and phase change characteristics of the fluorinated liquid to achieve high-efficiency heat dissipation.

[0097] Flexible Adjustment: The boiling point of the fluorinated liquid is controlled by regulating the pressure within the system to adapt to varying power consumption and heat dissipation requirements. When chip power consumption increases, the boiling point of the fluorinated liquid is lowered by reducing the pressure within the system, thus improving heat dissipation efficiency; conversely, the pressure is increased to raise the boiling point. This innovation solves the problem of heat dissipation difficulties for high-power chips, especially during chip overclocking or turbo boost operations, rapidly removing heat and maintaining low chip operating temperatures.

[0098] Stable and reliable: Combining software preset functions, the system calculates the target operating temperature and system pressure based on the chip's operating status and resource usage. It then automatically adjusts the operating status of the air pressure regulation control component and the external heat dissipation system through temperature and pressure detection feedback to ensure stable and reliable system operation.

[0099] Wide range of applications: This invention can be widely used in thermal management of main unit chassis, servers, self-service electronic products and other fields to meet the overclocking or turbo boost requirements of high-performance chips.

[0100] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An immersion liquid-cooled heat exchanger, characterized in that, include: The complete machine components include a chip heat sink, which is a boiling heat sink, and the chip heat sink is immersed in a fluorinated liquid, but the fluorinated liquid does not fill the cavity in which it is located; The pre-set software is used to determine the chip's operating status and resource usage, and to calculate the chip's target operating temperature and system pressure. A pressure regulation and control unit is used to adjust the pressure according to the target system pressure parameters. The pressure regulation and control unit includes a vacuum pump and an air compressor. The vacuum pump and the air compressor are respectively connected to the whole machine components through pipelines. The vacuum pump is used to extract gas from the cavity to reduce the pressure, and the air compressor is used to inject gas into the cavity to increase the pressure. A temperature and pressure detection component is used to detect the temperature at a related location and monitor the system pressure. The temperature and pressure detection component includes a pressure gauge, which monitors the pressure inside the chamber in real time. The control system is used to receive the pressure signal from the pressure gauge, obtain the real-time pressure, and adjust the working state of the vacuum pump and air compressor based on the comparison between the real-time pressure and the predetermined pressure, wherein the predetermined pressure is the system pressure of the chip target calculated by the preset software.

2. The immersion liquid-cooled heat exchanger according to claim 1, characterized in that, The complete machine components include: a housing, a sealing element, a transparent structural plate, a pressure plate, a circuit board, and a chip heat sink. These components together form a sealed immersion liquid cooling environment, in which chips are mounted on the circuit board and dissipated through the chip heat sink.

3. The immersion liquid-cooled heat exchanger according to claim 2, characterized in that, The temperature and pressure detection component also includes a temperature sensor. Temperature sensors are placed inside the chip heat sink, integrated into the chip, and immersed in liquid to monitor the temperature of the chip, the chip heat sink, and the fluorinated liquid in real time. The pressure gauge is installed on the top of the housing.

4. The immersion liquid-cooled heat exchanger according to claim 3, characterized in that, It also includes an external heat dissipation system comprising a heat exchanger, condenser coil, fan module and pump, which dissipates heat from inside the enclosure to the external environment through liquid cooling and air cooling.

5. The immersion liquid-cooled heat exchanger according to claim 4, characterized in that, The external heat dissipation system includes a condenser plate, an air-cooled heat dissipation module, and a fan module with an air guide shroud. The external heat dissipation system is a pure air-cooled heat dissipation system.

6. The immersion liquid-cooled heat exchanger according to claim 4 or 5, characterized in that, Also includes: The control system receives signals from temperature sensors and pressure gauges, and calculates and adjusts the working status of the vacuum pump, air compressor, and external heat dissipation system according to preset software algorithms and temperature and pressure detection feedback mechanisms.

7. A method for immersion liquid cooling heat exchange, characterized in that, The method for the immersion liquid-cooled heat exchanger as described in any one of claims 1 to 6 comprises: The boiling point of the fluorinated liquid is adjusted by controlling the system pressure within the overall component, causing the chip heat sink to boil rapidly for heat dissipation. Based on the chip's operating status and resource usage, the target's operating temperature and system pressure are calculated, and the system status is adjusted in real time through a temperature and pressure detection feedback adjustment mechanism to ensure that the chip operates at the preset temperature.

8. The immersion liquid cooling heat exchange method according to claim 7, characterized in that, The software presets the chip's operating percentage and temperature control point, and generates a database containing a mapping table of operating percentage, temperature control point, and predetermined pressure.

9. The immersion liquid-cooled heat exchange method according to claim 7, characterized in that, The calculation of the target's operating temperature and system pressure based on the chip's operating status and resource usage includes: Calculate the target operating temperature of the chip based on its operating status and resource usage. The temperature of the chip heat sink and the boiling point of the immersion liquid are calculated based on the superheat, and the target system pressure is further calculated.

10. A method for immersion liquid cooling heat exchange, characterized in that, The method for the immersion liquid-cooled heat exchanger as described in any one of claims 1 to 6 comprises: Confirm the chip's operating status and resource usage; The target operating temperature of the chip is calculated, the target temperature of the chip heat sink and the boiling point of the immersion liquid are calculated based on the superheat, and the target system pressure is further calculated. The pressure regulation control component is used to adjust the pressure within the entire component to the target system pressure, while simultaneously controlling the temperature of each module to ensure that the chip operates at the preset temperature.

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