Circuit board structure and electronic equipment
By designing the first cut-out hole group on the circuit board to prevent heat diffusion, the failure of electronic components due to high temperature and abnormal signal flow problems are solved, the stability and reliability of the circuit board are improved, and the propagation of noise is reduced.
Patent Information
- Application Number
- CN202510406168.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2025-06-24
Smart Images
Figure CN120201643A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of circuit boards, and in particular, relates to a circuit board structure and an electronic device. Background Art
[0002] Circuit boards play a vital role in electronic devices. With the continuous development of electronic devices, the refresh rate of electronic devices is getting higher and higher, and the power consumption is also getting higher and higher, which leads to higher and higher temperatures of electronic components on circuit boards, more serious heat conduction of electronic components, and increased risk of failure of electronic components due to overheating, resulting in reduced reliability of circuit boards. Summary of the invention
[0003] In order to address the shortcomings of the prior art, the present application provides a circuit board structure that can reduce the efficiency of heat dissipation from electronic components to the surrounding areas, reduce the occurrence of abnormal temperatures of surrounding electronic components or modules caused by heat generated by electronic components, and is beneficial to improving the stability and reliability of the circuit board structure.
[0004] On the one hand, the present application provides a circuit board structure, including a first circuit board, the first circuit board including a first board body and a first electronic component; the first board body includes a first layer and a second layer arranged in a stacked manner, and the first electronic component is installed on the first layer; the second layer includes an insulating layer and a copper clad layer arranged in a stacked manner, the copper clad layer of the second layer is arranged on a side of the second layer close to the first layer, the copper clad layer of the second layer is provided with a first cut-out hole group, and the orthographic projection of the first cut-out hole group on the first layer is arranged around the first electronic component.
[0005] In a possible implementation manner, the first cut-out hole group includes a first cut-out hole and a second cut-out hole, and the orthographic projections of the first cut-out hole and the second cut-out hole on the first layer are arranged around the circumference of the first electronic component.
[0006] In a possible embodiment, the first board body further includes a third layer located on the side of the second layer away from the first layer, the third layer includes an insulating layer and a copper clad layer stacked together, the copper clad layer of the third layer is arranged on the side of the third layer close to the second layer, the copper clad layer of the third layer is provided with a second cut-out hole group, and the second cut-out hole group is arranged around the first electronic component in the orthographic projection of the first board body.
[0007] In a possible implementation, the second cutting hole group includes a third cutting hole and a fourth cutting hole, and the orthographic projections of the third cutting hole and the fourth cutting hole on the first layer are arranged at intervals around the circumference of the first electronic component; the first cutting hole and the second cutting hole are opposite and spaced apart along a first direction, and the third cutting hole and the fourth cutting hole are opposite and spaced apart along a second direction; wherein, the first direction is perpendicular to the stacking direction of the first plate body, the second direction is perpendicular to the stacking direction of the first plate body, and the first direction is different from the second direction.
[0008] In a possible implementation, the first circuit board further includes a second electronic component disposed on the first layer, and at least a part of the orthographic projection of the second cutting hole group on the first layer overlaps at least a part of the orthographic projection of the first cutting hole group on the first layer; the overlapping area of the orthographic projection of the first cutting hole group on the first layer and the orthographic projection of the second cutting hole group on the first layer is located between the orthographic projection of the second electronic component on the first layer and the orthographic projection of the first electronic component on the first layer.
[0009] In a possible implementation, the circuit board structure further includes a second circuit board, the second circuit board includes a second plate body and a third electronic component, and the second plate body is connected to the first plate body; the second plate body includes a first setting layer, the first setting layer includes an insulating layer and a copper-clad layer, and the third electronic component is mounted on the copper-clad layer of the third setting layer; the copper-clad layer of the third setting layer is provided with a third cutting hole group, and the third cutting hole group is arranged around the third electronic component.
[0010] In a possible implementation, the second plate body further includes a second setting layer stacked with the first setting layer, the second setting layer includes an insulating layer and a copper-clad layer, and a fourth cutting hole group is provided on the copper-clad layer of the second setting layer, and the orthographic projection of the fourth cutting hole group on the first setting layer is arranged around the third electronic component.
[0011] In a possible implementation, the third cutting hole group includes a fifth cutting hole and a sixth cutting hole, and the fifth cutting hole and the sixth cutting hole are opposite and spaced apart along the second direction; the fourth cutting hole group includes a seventh cutting hole and an eighth cutting hole, and the seventh cutting hole and the eighth cutting hole are opposite and spaced apart along the second direction; wherein, the second direction is perpendicular to the stacking direction of the second plate body.
[0012] In a possible implementation, the circuit board structure further includes a first signal line and a second signal line. The first signal line and the second signal line are disposed on the first circuit board or the second circuit board. The signal flow rate of the first signal line is greater than that of the second signal line. A fifth cut-out hole group is disposed between the first signal line and the second signal line.
[0013] On the other hand, the present application further provides an electronic device, including the above-mentioned circuit board structure and a display screen, and the display screen is electrically connected to the circuit board structure.
[0014] For the circuit board structure provided by the present application, the first electronic component is disposed on the first layer of the first board body, the first cut-out hole group is disposed on the copper-clad layer of the second layer of the first board body, and the orthographic projection of the first cut-out hole group on the first layer is arranged around the first electronic component. Thus, when the first electronic component is powered on and working, the heat generated by the first electronic component is conducted to the second layer, and due to the blocking effect of the first cut-out hole group, it will not spread around on the second layer, which can reduce the heat dissipation efficiency of the first electronic component to the surrounding on the second layer, and further reduce the phenomenon that the temperature of the electronic components or modules around the first electronic component is abnormal due to heat, which is beneficial to improving the stability and reliability of the circuit board structure during operation. Moreover, for the electronic components that generate noise during operation, through the setting of the first cut-out hole group, the propagation of the noise generated by the first electronic component can be weakened, and thus the noise during the operation of the circuit board structure is relatively small. Description of the Drawings
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some implementations provided by the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.
[0016] Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;
[0017] Figure 2 is a schematic heat dissipation diagram of an electronic device provided by an embodiment of the present application;
[0018] Figure 3 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application;
[0019] Figure 4 is an exploded structural diagram of a first board body provided by an embodiment of the present application;
[0020] Figure 5Schematic diagram of a first cutting hole group, a second cutting hole group, and a first electronic component provided by an embodiment of the present application;
[0021] Figure 6 Schematic diagram of a first cutting hole group, a second cutting hole group, and a first electronic component provided by another embodiment of the present application;
[0022] Figure 7 Schematic diagram of a first cutting hole group, a second cutting hole group, and a first electronic component provided by still another embodiment of the present application;
[0023] Figure 8 Schematic diagram of a first cutting hole group, a second cutting hole group, and a first electronic component provided by yet another embodiment of the present application;
[0024] Figure 9 Schematic diagram of a first cutting hole group, a second cutting hole group, a first electronic component, and a second electronic component provided by an embodiment of the present application;
[0025] Figure 10 Exploded view of a second plate body provided by an embodiment of the present application;
[0026] Figure 11 Schematic diagram of a third cutting hole group, a fourth cutting hole group, and a third electronic component provided by an embodiment of the present application;
[0027] Figure 12 Schematic diagram of the wiring design of a first circuit board provided by an embodiment of the present application. Detailed implementation manners
[0028] Next, the technical solutions of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0029] The following descriptions of the embodiments refer to the attached drawings for illustrating specific embodiments in which the present application can be implemented. The directional terms mentioned in the description of the present application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "top surface", "side surface", "bottom surface", "top wall", "side wall", "bottom wall", "inner side wall", "outer side wall", "length direction", "width direction", "height direction", etc., are only the directions with reference to the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation on the present application. In the description of the present application, for example, "first", "second", "third", "fourth", etc. are only used to distinguish the described objects and do not have any sequential or technical meanings. In the description of the present application, the "connection" and "coupling" involved, unless otherwise specified, both include direct connection (coupling) and indirect connection (coupling).
[0030] In the circuit board structures of some existing electronic devices, since the electronic components or modules on the circuit board structure generate heat during operation, the heat generated by the electronic components or modules will be conducted to other electronic components or modules, resulting in the phenomenon that other electronic components or modules fail due to overheating or the signal flow is abnormal.
[0031] Please refer to Figure 1 and Figure 2 , Figure 1 FIG. is a schematic structural diagram of an electronic device provided by an embodiment of the present application, Figure 2 FIG. is a schematic diagram of heat dissipation of an electronic device provided by an embodiment of the present application.
[0032] In one embodiment, the present application provides an electronic device 1000, which can effectively improve the phenomenon that electronic components or modules fail or the signal flow is abnormal due to overheating. The electronic device 1000 provided by this embodiment includes a circuit board structure 100 and a display screen 300, and the circuit board structure 100 is electrically connected to the display screen 300 to drive the display screen 300 to achieve a display effect. Among them, the electronic device 1000 includes, but is not limited to, mobile phones, tablet computers, laptop computers, desktop computers, vehicle-mounted devices, televisions, wearable devices, etc., and the present application does not limit this.
[0033] The following takes the electronic device 1000 as a liquid crystal display device as an example to describe the present application in detail. The liquid crystal display device includes the above-mentioned circuit board structure 100 and the above-mentioned display screen 300 that are electrically connected, and the above-mentioned display screen 300 is a liquid crystal display panel.
[0034] Please refer to Figure 3 andFigure 4 , Figure 3 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application. Figure 4 is an exploded view of a first board body provided by an embodiment of the present application.
[0035] In one embodiment, the present application provides a circuit board structure 100. The circuit board structure 100 includes a first circuit board 20. The first circuit board 20 includes a first board body 21 and first electronic components 22. The first electronic components 22 are disposed on the first board body 21. The first electronic components 22 are electrically connected to a display screen 300 through the first board body 21. Specifically, the first board body 21 includes a first layer 211 and a second layer 212 stacked on each other. The first electronic components 22 are mounted on the first layer 211. The second layer 212 includes an insulating layer and a copper-clad layer stacked on each other. The insulating layer of the second layer 212 is disposed on a side of the second layer 212 facing away from the first layer 211, and the copper-clad layer of the second layer 212 is disposed on a side of the second layer 212 close to the first layer 211. The copper-clad layer of the second layer 212 is provided with a first cut-out hole group 23. The orthographic projection of the first cut-out hole group 23 on the first layer 211 is arranged around the first electronic components 22.
[0036] For the circuit board structure 100 provided in this embodiment, the first electronic components 22 are disposed on the first layer 211 of the first board body 21, the first cut-out hole group 23 is disposed on the copper-clad layer of the second layer 212 of the first board body 21, and the orthographic projection of the first cut-out hole group 23 on the first layer 211 is arranged around the first electronic components 22. Thus, when the first electronic components 22 are powered on and working, the heat generated by the first electronic components 22 during heating is conducted to the second layer 212, and due to the blocking effect of the first cut-out hole group 23, it will not spread around in the second layer 212. The heat dissipation efficiency of the first electronic components 22 to the surrounding in the second layer 212 can be reduced, and further the phenomenon that the temperature of the electronic components or modules around the first electronic components 22 is abnormal due to heating can be reduced, which is beneficial to improving the working stability and reliability of the circuit board structure 100. Moreover, for electronic components that generate noise during operation, through the setting of the first cut-out hole group 23, the propagation of the noise generated by the first electronic components 22 can be weakened, and thus the noise during the operation of the circuit board structure 100 is relatively small.
[0037] The first cut-out hole group 23 provided in this embodiment is a through-hole group. It can be understood that in some other embodiments, the first cut-out hole group 23 may be a groove group, and the present application does not limit this.
[0038] The first electronic component 22 provided in this embodiment is an electronic component that generates heat during operation. It can be understood that in some other embodiments, the first electronic component 22 can be an electronic component module, that is, a unit formed by combining multiple electronic components, and this application does not limit this.
[0039] In this embodiment, the first circuit board 20 is a PCBA board, and the first board body 21 is a PCB board. It can be understood that in some other embodiments, the first circuit board 20 can be an FPCA board, and the first board body 21 can be an FPC board, and this application does not limit this.
[0040] Please refer to Figure 3 and Figure 4 , in one embodiment, the first cutting hole group 23 of the circuit board structure 100 includes a first cutting hole 231 and a second cutting hole 232, and the orthographic projections of the first cutting hole 231 and the second cutting hole 232 on the first layer 211 are arranged circumferentially around the first electronic component 22.
[0041] For the circuit board structure 100 provided in this embodiment, by arranging the orthographic projections of the first cutting hole 231 and the second cutting hole 232 of the first cutting hole group 23 circumferentially around the first electronic component 22 on the first layer 211, so that the first electronic component 22 can be surrounded by the first cutting hole group 23 at a larger angle in the circumferential direction of the projection on the second layer 212, the heat dissipation efficiency of the first electronic component 22 to the surrounding in the second layer 212 can be further reduced, which is beneficial to reducing the thermal influence of the first electronic component 22 on the surrounding components or modules.
[0042] Please refer to Figure 3 and Figure 4 , in a specific embodiment, the first cutting hole 231 and the second cutting hole 232 are arranged opposite to each other and spaced apart along the first direction, and the orthographic projections of the first cutting hole 231 and the second cutting hole 232 on the first layer 211 are arranged circumferentially around the first electronic component 22, that is, the orthographic projection of the first electronic component 22 on the second layer 212 is located between the first cutting hole 231 and the second cutting hole 232. Among them, the first direction is perpendicular to the stacking direction of the first board body 21, that is, the Y direction as shown in Figure 1 shown.
[0043] The circuit board structure 100 provided in this embodiment has a first cutting hole 231 and a second cutting hole 232 that are opposite and spaced apart in the first direction. The orthographic projection of the first electronic component 22 on the second layer 212 is located between the first cutting hole 231 and the second cutting hole 232, so that the traces in the second layer 212 can be arranged at the interval between the first cutting hole 231 and the second cutting hole 232, which is beneficial to improving the convenience of the trace design in the second layer 212. At the same time, the copper-clad layer of the second layer 212 is a large-area copper pour. By arranging the first cutting hole 231 and the second cutting hole 232 at intervals, on the premise of ensuring the electromagnetic shielding and protection effects, it is beneficial for the first electronic component 22 to achieve the effect of electromagnetic compatibility.
[0044] It should be understood that in some other embodiments, if there is no need to arrange traces in the area surrounded by the first cutting hole 231 and the second cutting hole 232, the first cutting hole 231 and the second cutting hole 232 can form an annular cutting hole. The orthographic projection of the first electronic component 22 on the second layer 212 is located within the annular cutting hole. The present application does not limit this.
[0045] Please refer to Figure 3 、 Figure 4 and Figure 5 , Figure 5 which are schematic structural diagrams of a first cutting hole group, a second cutting hole group, and a first electronic component provided in an embodiment of the present application.
[0046] In one embodiment, the first board body 21 further includes a first layer 211, a second layer 212, and a third layer 213 that are stacked. The second layer 212 is located between the first layer 211 and the third layer 213, and the third layer 213 is located on the side of the second layer 212 away from the first layer 211. Both the second layer 212 and the third layer 213 include an insulating layer and a copper-clad layer that are stacked. The insulating layer of the second layer 212 is arranged on the side of the second layer 212 away from the first layer 211, the copper-clad layer of the second layer 212 is arranged on the side of the second layer 212 close to the first layer 211, the insulating layer of the third layer 213 is arranged on the first side of the third layer 213 away from the second layer 212, and the copper-clad layer of the third layer 213 is arranged on the side of the third layer 213 close to the second layer 212. The copper-clad layer of the second layer 212 is provided with a first cutting hole group 23, and the orthographic projection of the first cutting hole group 23 on the first layer 211 is arranged around the first electronic component 22. The copper-clad layer of the third layer 213 is provided with a second cutting hole group 24, and the orthographic projection of the second cutting hole group 24 on the first board body 21 is arranged around the first electronic component 22.
[0047] The circuit board structure 100 provided in this embodiment has the first electronic component 22 disposed on the first layer 211 of the first board body 21, the first cutting hole group 23 disposed on the copper-clad layer of the second layer 212 of the first board body 21, and the orthographic projection of the first cutting hole group 23 on the first layer 211 is arranged around the first electronic component 22. The second cutting hole group 24 is disposed on the copper-clad layer of the third layer 213 of the first board body 21, and the orthographic projection of the second cutting hole group 24 on the first layer 211 is arranged around the first electronic component 22. Thus, when the first electronic component 22 is powered on and operates, the heat generated by the first electronic component 22 is conducted to the second layer 212, and due to the blocking effect of the first cutting hole group 23, it will not spread around on the second layer 212. This can reduce the heat dissipation efficiency of the first electronic component 22 to the surroundings on the second layer 212, and further reduce the occurrence of the phenomenon that the temperature of the electronic components or modules around the first electronic component 22 becomes abnormal due to heating, which is beneficial to improving the working stability and reliability of the circuit board structure 100. At the same time, when the first electronic component 22 is powered on and operates, the heat generated by the first electronic component 22 is conducted to the third layer 213, and due to the blocking effect of the second cutting hole group 24, it will not spread around on the third layer 213. This can reduce the heat dissipation efficiency of the first electronic component 22 to the surroundings on the third layer 213, so as to further reduce the occurrence of the phenomenon that the temperature of the electronic components or modules around the first electronic component 22 becomes abnormal due to heating, which is beneficial to further improving the working stability and reliability of the circuit board structure 100. Moreover, for the electronic components that generate noise during operation, through the settings of the first cutting hole group 23 and the second cutting hole group 24, the propagation of the noise generated by the first electronic component 22 can be weakened, and thus the noise during the operation of the circuit board structure 100 is relatively small.
[0048] Please refer to Figure 3 、 Figure 4 、 Figure 6 and Figure 7 , Figure 6 FIGS. are schematic structural diagrams of a first cutting hole group, a second cutting hole group, and a first electronic component provided in another embodiment of the present application. Figure 7 FIGS. are schematic structural diagrams of a first cutting hole group, a second cutting hole group, and a first electronic component provided in yet another embodiment of the present application.
[0049] In one embodiment, the first cutting hole group 23 includes only one cutting hole, the second cutting hole group 24 includes only one cutting hole, the orthographic projection of the first cutting hole group 23 on the first layer 211 and the orthographic projection of the second cutting hole 232 on the first layer 211 enclose an annular region, and the first electronic component 22 is located within the annular region enclosed by the orthographic projection of the first cutting hole group 23 on the first layer 211 and the orthographic projection of the second cutting hole 232 on the first layer 211.
[0050] It is understandable that the first cutting hole group 23 includes but is not limited to a "U" shape, an "L" shape, etc., and the second cutting hole group 24 includes but is not limited to a "U" shape, an "L" shape, etc. It only needs to ensure that the orthographic projection of the first cutting hole group 23 on the first layer 211 and the orthographic projection of the second cutting hole 232 on the first layer 211 enclose an annular area. The present application does not limit this.
[0051] Please refer to Figure 3 、 Figure 4 and Figure 5 , in an embodiment, the second cutting hole group 24 includes a third cutting hole 241 and a fourth cutting hole 242. The orthographic projections of the third cutting hole 241 and the fourth cutting hole 242 on the first layer 211 are arranged at intervals around the circumference of the first electronic component 22.
[0052] For the circuit board structure 100 provided in this embodiment, by arranging the orthographic projections of the third cutting hole 241 and the fourth cutting hole 242 of the second cutting hole group 24 around the circumference of the first electronic component 22, the first electronic component 22 can be surrounded by the second cutting hole group 24 at a larger angle in the circumferential direction of the projection on the third layer 213, which can further reduce the heat dissipation efficiency of the first electronic component 22 to the surroundings on the third layer 213 and is beneficial to reducing the thermal influence of the first electronic component 22 on the surrounding components or modules.
[0053] Please refer to Figure 3 、 Figure 4 and Figure 5 , in a specific embodiment, the first cutting hole 231 and the second cutting hole 232 of the first cutting hole group 23 are opposite and spaced apart along a first direction on the second layer 212. The orthographic projections of the first cutting hole 231 and the second cutting hole 232 on the first layer 211 are arranged around the circumference of the first electronic component 22, that is, the orthographic projection of the first electronic component 22 on the second layer 212 is located between the first cutting hole 231 and the second cutting hole 232. The third cutting hole 241 and the fourth cutting hole 242 of the second cutting hole group 24 are opposite and spaced apart along a second direction on the second layer 212. The orthographic projections of the third cutting hole 241 and the fourth cutting hole 242 on the first layer 211 are arranged around the circumference of the first electronic component 22, that is, the orthographic projection of the first electronic component 22 on the third layer 213 is located between the third cutting hole 241 and the fourth cutting hole 242. Among them, the first direction is different from the second direction. The first direction is perpendicular to the stacking direction of the first plate body 21, that is, the Y direction as shown in Figure 1 . The second direction is perpendicular to the stacking direction of the first plate body 21, that is, the X direction as shown in Figure 1 .
[0054] The circuit board structure 100 provided in this embodiment has the first cutting hole 231 and the second cutting hole 232 arranged opposite to and spaced apart from each other along the first direction. The orthographic projection of the first electronic component 22 on the second layer 212 is located between the first cutting hole 231 and the second cutting hole 232, so that the traces in the second layer 212 can be arranged at the interval between the first cutting hole 231 and the second cutting hole 232, which is beneficial to improving the convenience of the trace design in the second layer 212. The third cutting hole 241 and the fourth cutting hole 242 are arranged opposite to and spaced apart from each other along the second direction. The orthographic projection of the first electronic component 22 on the third layer 213 is located between the third cutting hole 241 and the fourth cutting hole 242, so that the traces in the third layer 213 can be arranged at the interval between the third cutting hole 241 and the fourth cutting hole 242, which is beneficial to improving the convenience of the trace design in the third layer 213. Thus, by designing the first cutting hole group 23 and the second cutting hole group 24, it is beneficial to improve the convenience of the overall trace layout design of the circuit board structure 100. At the same time, the copper-clad layer of the third layer 213 is a large-area copper pour. By arranging the third cutting hole 241 and the fourth cutting hole 242 at intervals, on the premise of ensuring the electromagnetic shielding and protection effects, it is beneficial for the first electronic component 22 to achieve the effect of electromagnetic compatibility.
[0055] It should be understood that in some other embodiments, if there is no need to arrange traces in the area surrounded by the first cutting hole 231 and the second cutting hole 232, the first cutting hole 231 and the second cutting hole 232 can form an annular cutting hole. The orthographic projection of the first electronic component 22 on the second layer 212 is located within the annular cutting hole formed by the first cutting hole 231 and the second cutting hole 232, and / or, if there is no need to arrange traces in the area surrounded by the third cutting hole 241 and the fourth cutting hole 242, the third cutting hole 241 and the fourth cutting hole 242 can form an annular cutting hole. The orthographic projection of the first electronic component 22 on the third layer 213 is located within the annular cutting hole formed by the third cutting hole 241 and the fourth cutting hole 242. The present application does not limit this.
[0056] Please refer to Figure 3 、 Figure 4 and Figure 5, more specifically, for the circuit board structure 100 provided in this embodiment, both the first cutting holes 231 and the second cutting holes 232 of the first cutting hole group 23 located on the copper-clad layer of the second layer 212 are "C"-shaped cutting holes, and the first cutting hole 231 and the second cutting hole 232 are located on the same regular circular ring. Both the third cutting holes 241 and the fourth cutting holes 242 of the second cutting hole group 24 located on the copper-clad layer of the third layer 213 are "C"-shaped cutting holes, and the third cutting hole 241 and the fourth cutting hole 242 are located on the same regular circular ring. Moreover, the outer diameter of the circular ring where the first cutting hole 231 and the second cutting hole 232 are located is smaller than the inner diameter of the circular ring where the third cutting hole 241 and the fourth cutting hole 242 are located, and the third cutting hole 241 and the fourth cutting hole 242 respectively cover the positions of the two openings formed by the intervals between the first cutting hole 231 and the second cutting hole 232.
[0057] When the first electronic component 22 operates and generates heat, the heat generated by the first electronic component 22 diffuses around in the direction of the arrow as Figure 6 shown. The first cutting hole 231 and the second cutting hole 232 of the first cutting hole group 23 on the second layer 212 will weaken the conduction of part of the heat, and the third cutting hole 241 and the fourth cutting hole 242 of the second cutting hole group 24 on the third layer 213 will weaken the conduction of another part of the heat. Thus, the heat generated when the entire first electronic component 22 operates can be reduced from diffusing and conducting to the surroundings.
[0058] Please refer to Figure 8 , Figure 8 which is a schematic structural diagram of a first cutting hole group, a second cutting hole group, and a first electronic component provided in another embodiment of the present application.
[0059] In some other embodiments, for the convenience of wire routing layout design of the second layer 212 and the third layer 213 of the first plate body 21, the first cutting hole 231 and the second cutting hole 232 can be "one"-shaped strip holes, the third cutting hole 241 and the fourth cutting hole 242 can be "one"-shaped strip holes, and the orthographic projections of the first cutting hole 231, the second cutting hole 232, the third cutting hole 241, and the fourth cutting hole 242 on the first layer 211 enclose a closed "mouth"-shaped area, and the first electronic component 22 is arranged within the closed "mouth"-shaped area enclosed by the orthographic projections of the first cutting hole 231, the second cutting hole 232, the third cutting hole 241, and the fourth cutting hole 242 on the first layer 211.
[0060] Among them, the first cutting holes 231 and the second cutting holes 232 of the first cutting hole group 23 are opposite and spaced along the first direction, and the third cutting holes 241 and the fourth cutting holes 242 of the second cutting hole group 24 are opposite and spaced along the second direction; or, the first cutting holes 231 and the second cutting holes 232 of the first cutting hole group 23 are opposite and spaced along the second direction, and the third cutting holes 241 and the fourth cutting holes 242 of the second cutting hole group 24 are opposite and spaced along the first direction; or, the first cutting holes 231 and the second cutting holes 232 of the first cutting hole group 23 are opposite and spaced along one direction, and the third cutting holes 241 and the fourth cutting holes 242 of the second cutting hole group 24 are opposite and spaced along the other direction.
[0061] It can be understood that for the convenience of wiring design, the orthographic projections of the first cutting hole 231, the second cutting hole 232, the third cutting hole 241, and the fourth cutting hole 242 on the first layer 211 can enclose an open "mouth" - shaped area, and this application places no restrictions on this. It can be understood that the first cutting hole 231 and the second cutting hole 232 can be cutting holes of other shapes, and the third cutting hole 241 and the fourth cutting hole 242 can be cutting holes of other shapes, and this application places no restrictions on this.
[0062] Please refer to Figure 3 、 Figure 4 and Figure 9 , Figure 9 which is a schematic structural diagram of a first cutting hole group, a second cutting hole group, a first electronic component, and a second electronic component provided by an embodiment of the present application.
[0063] In one embodiment, the first circuit board 20 of the circuit board structure 100 includes a first electronic component 22 and a second electronic component 25 disposed on the first layer 211, and the first electronic component 22 and the second electronic component 25 are spaced apart. The first board body 21 includes a first layer 211, a second layer 212, and a third layer 213. The first cutting hole group 23 is located on the second layer 212, and the second cutting hole group 24 is located on the third layer 213. At least a part of the orthographic projection of the second cutting hole group 24 on the first layer 211 overlaps at least a part of the orthographic projection of the first cutting hole group 23 on the first layer 211. The overlapping area of the orthographic projection of the first cutting hole group 23 on the first layer 211 and the orthographic projection of the second cutting hole group 24 on the first layer 211 is located between the orthographic projection of the second electronic component 25 on the first layer 211 and the orthographic projection of the first electronic component 22 on the first layer 211.
[0064] For the circuit board structure 100 provided in this embodiment, a first electronic component 22 and a second electronic component 25 are disposed at intervals on the first layer 211 of the first circuit board 20. At least a part of the orthographic projection of the second cutting hole group 24 on the first layer 211 overlaps at least a part of the orthographic projection of the first cutting hole group 23 on the first layer 211. Moreover, the overlapping region of the orthographic projection of the first cutting hole group 23 on the first layer 211 and the orthographic projection of the second cutting hole group 24 on the first layer 211 is located between the orthographic projection of the second electronic component 25 on the first layer 211 and the orthographic projection of the first electronic component 22 on the first layer 211. Thus, the heat generated by the operation of the first electronic component 22 can be blocked by the first cutting hole group 23 and the second cutting hole group 24 in the overlapping region of the orthographic projection on the first layer 211, and the heat generated by the operation of the second electronic component 25 can be blocked by the first cutting hole group 23 and the second cutting hole group 24 in the overlapping region of the orthographic projection on the first layer 211. The influence of the heat generated by the first electronic component 22 on the second electronic component 25 can be reduced, and the influence of the heat generated by the second electronic component 25 on the first electronic component 22 can also be reduced.
[0065] Please refer to Figure 3 , Figure 4 and Figure 9 , in a specific embodiment, the first cutting hole group 23 includes a first section 233, a second section 234, and a third section 235 that are connected in sequence. The orthographic projection of the second section 234 on the first layer 211 is disposed between the first electronic component 22 and the third electronic component 42. The first section 233 is connected to one end of the second section 234 and extends toward the first electronic component 22. The third section 235 is connected to the other end of the second section 234 and extends toward the second electronic component 25. The second cutting hole group 24 includes a fourth section 243, a fifth section 244, and a sixth section 245 that are connected in sequence. The orthographic projection of the fifth section 244 on the first layer 211 is disposed between the first electronic component 22 and the third electronic component 42. The fourth section 243 is connected to one end of the fifth section 244 and extends toward the first electronic component 22. The sixth section 245 is connected to the other end of the fifth section 244 and extends toward the second electronic component 25. Among them, the orthographic projection of the second section 234 on the first layer 211 overlaps the orthographic projection of the fifth section 244 on the first layer 211. The first electronic component 22 is disposed within the region surrounded by the orthographic projections of the first section 233, the second section 234, the fourth section 243, and the fifth section 244 on the first layer 211, and the second electronic component 25 is disposed within the region surrounded by the orthographic projections of the third section 235, the fourth section 243, the fifth section 244, and the sixth section 245 on the first layer 211. Thus, both the first electronic component 22 and the second electronic component 25 on the first board 21 can be connected to the copper-clad layer.
[0066] The circuit board structure 100 provided in this embodiment has the orthographic projection of the second section 234 on the first layer 211 overlapping with the orthographic projection of the fifth section 244 on the first layer 211. After the orthographic projection of the second section 234 on the first layer 211 overlaps with the orthographic projection of the fifth section 244 on the first layer 211, it is located between the first electronic component 22 and the second electronic component 25, so that the heat generated by the operation of the first electronic component 22 can be blocked by the second section 234 and the fifth section 244, and the heat generated by the operation of the second electronic component 25 can be blocked by the second section 234 and the fifth section 244. Moreover, the first section 233 and the fifth section 244 can block the heat generated by the operation of the first electronic component 22, and the third section 235 and the sixth section 245 can block the heat generated by the operation of the second electronic component 25. Thus, the influence of the heat generated by the first electronic component 22 on the second electronic component 25 and other electronic components can be further reduced, and the influence of the heat generated by the second electronic component 25 on the first electronic component 22 and other electronic components can also be further reduced.
[0067] In this embodiment, the first section 233, the second section 234, and the third section 235 of the first cutout hole group 23 are all linear, and the first section 233, the second section 234, and the third section 235 of the first cutout hole group 23 form a "Z" - shaped structure. The fourth section 243, the fifth section 244, and the sixth section 245 of the second cutout hole group 24 are all linear, and the fourth section 243, the fifth section 244, and the sixth section 245 of the second cutout hole group 24 form a "Z" - shaped structure. It can be understood that in some other embodiments, the first section 233, the second section 234, and the third section 235 of the first cutout hole group 23 can be arc - shaped, and the fourth section 243, the fifth section 244, and the sixth section 245 of the second cutout hole group 24 can be arc - shaped, as long as it is ensured that the orthographic projection of the second section 234 on the first layer 211 coincides with the orthographic projection of the fifth section 244 on the first layer 211. This application does not limit this.
[0068] Please refer to Figure 3 、 Figure 4 、 Figure 5 and Figure 10 , Figure 10 which is an exploded view of a second board body provided in an embodiment of the present application.
[0069] In one embodiment, the circuit board structure 100 includes a first circuit board 20 and a second circuit board 40. The first circuit board 20 includes a first board body 21, a first electronic component 22, and a second electronic component 25. The first electronic component 22 and the second electronic component 25 are opposite to each other in the second direction and are spaced apart on the first board body 21. The first board body 21 includes a first layer 211, a second layer 212, a third layer 213, and a fourth layer 214 that are stacked. The second layer 212 includes an insulating layer and a copper-clad layer that are stacked. The insulating layer of the second layer 212 faces away from the first layer 211, and the copper-clad layer of the second layer 212 is close to the first layer 211. The third layer 213 includes an insulating layer and a copper-clad layer. The insulating layer of the third layer 213 faces away from the second layer 212, and the copper-clad layer of the third layer 213 is close to the second layer 212. The copper-clad layer of the second layer 212 is provided with a first cut-out hole group 23, and the orthographic projection of the first cut-out hole group 23 on the first layer 211 is arranged around the first electronic component 22. The copper-clad layer of the third layer 213 is provided with a second cut-out hole group 24, and the orthographic projection of the second cut-out hole group 24 on the first layer 211 is arranged around the first electronic component 22. The first cut-out hole group 23 of the circuit board structure 100 includes a first cut-out hole 231 and a second cut-out hole 232. The orthographic projections of the first cut-out hole 231 and the second cut-out hole 232 on the first layer 211 are arranged circumferentially around the first electronic component 22. The first cut-out hole 231 and the second cut-out hole 232 are opposite to each other and spaced apart in the first direction. The orthographic projections of the first cut-out hole 231 and the second cut-out hole 232 on the first layer 211 are arranged circumferentially around the first electronic component 22. The second cut-out hole group 24 of the circuit board structure 100 includes a third cut-out hole 241 and a fourth cut-out hole 242. The orthographic projections of the third cut-out hole 241 and the fourth cut-out hole 242 on the first layer 211 are arranged circumferentially around the first electronic component 22. The third cut-out hole 241 and the fourth cut-out hole 242 are opposite to each other and spaced apart in the second direction. The orthographic projections of the third cut-out hole 241 and the fourth cut-out hole 242 on the first layer 211 are arranged circumferentially around the first electronic component 22. The cut-out hole design of the second electronic component 25 in the stacking direction is the same as that of the first electronic component 22, which will not be elaborated here.
[0070] The second circuit board 40 includes a second board body 41 and a third electronic component 42. The second board body 41 is connected to the first board body 21 so that the first circuit board 20 and the second circuit board 40 form a structure on the board and the first circuit board 20 and the second circuit board 40 are electrically connected. The second board body 41 includes a first setting layer 411. The first setting layer 411 includes an insulating layer and a copper-clad layer. The third electronic component 42 is installed on the copper-clad layer of the third setting layer. The copper-clad layer of the third setting layer is provided with a third cut-out hole group 43, and the third cut-out hole group 43 is arranged around the third electronic component 42.
[0071] The circuit board structure 100 provided in this embodiment, on the one hand, has the first electronic component 22 disposed on the first layer 211 of the first board body 21, the first cutting hole group 23 disposed on the copper clad layer of the second layer 212 of the first board body 21, and the orthographic projection of the first cutting hole group 23 on the first layer 211 is arranged around the first electronic component 22. The second cutting hole group 24 is disposed on the copper clad layer of the third layer 213 of the first board body 21, and the orthographic projection of the second cutting hole group 24 on the first layer 211 is arranged around the first electronic component 22. Thus, when the first electronic component 22 is powered on and operates, the heat generated by the first electronic component 22 is conducted to the second layer 212. Due to the blocking effect of the first cutting hole group 23, it will not spread around on the second layer 212, which can reduce the heat dissipation efficiency of the first electronic component 22 around on the second layer 212. Furthermore, it can reduce the occurrence of the phenomenon that the temperature of the electronic components or modules around the first electronic component 22 is abnormal due to heating, which is beneficial to improving the working stability and reliability of the circuit board structure 100. At the same time, when the first electronic component 22 is powered on and operates, the heat generated by the first electronic component 22 is conducted to the third layer 213. Due to the blocking effect of the second cutting hole group 24, it will not spread around on the third layer 213, which can reduce the heat dissipation efficiency of the first electronic component 22 around on the third layer 213, so as to further reduce the occurrence of the phenomenon that the temperature of the electronic components or modules around the first electronic component 22 is abnormal due to heating, which is beneficial to further improving the working stability and reliability of the circuit board structure 100. On the other hand, the third cutting hole 241 is disposed on the copper clad layer of the first setting layer 411, and the third cutting hole group 43 is arranged around the third electronic component 42. When the third electronic component 42 is powered on and operates, the heat generated by the third electronic component 42 will not spread around on the first setting layer 411 due to the blocking effect of the third cutting hole group 43, which can reduce the heat dissipation efficiency of the third electronic component 42 around on the first setting layer 411. Furthermore, it can reduce the occurrence of the phenomenon that the temperature of the electronic components or modules around the third electronic component 42 is abnormal due to heating, which is beneficial to improving the working stability and reliability of the circuit board structure 100. At the same time, it can reduce the heat dissipation efficiency of the third electronic component 42 around on the first setting layer 411, and further reduce the occurrence of the phenomenon that the temperature of the first electronic component 22 and the second electronic component 25 is abnormal due to heating of the third electronic component 42, which is beneficial to improving the working stability and reliability of the circuit board structure 100. On yet another hand, for the electronic components that generate noise during operation, through the settings of the first cutting hole group 23, the second cutting hole group 24, and the third cutting hole group 43, the propagation of the noise generated by the first electronic component 22, the second electronic component 25, and the third electronic component 42 can be weakened, so that the noise during the operation of the circuit board structure 100 is relatively small.
[0072] In this embodiment, the first circuit board 20 is a PCBA board, and the first board body 21 is a PCB board. The second circuit board 40 is an FPCA board, and the second board body 41 is an FPC board. It can be understood that in some other embodiments, the first circuit board 20 includes but is not limited to an FPCA board, the first board body 21 includes but is not limited to an FPC board, the second circuit board 40 includes but is not limited to a PCBA board, and the second board body 41 includes but is not limited to a PCB board. The present application does not limit this.
[0073] In this embodiment, the first circuit board 20 is electrically connected to the display screen 300 through the second circuit board 40. The first circuit board 20 can also be electrically connected to the display screen 300 through an FPC board. Thus, the display screen 300 can be bent relative to the first circuit board 20, so that the electronic device 1000 has foldable performance.
[0074] In this embodiment, the first board body 21 has a four-layer structure. It can be understood that in some other embodiments, the first board body 21 can be three-layer, five-layer, or six-layer. For the setting of the cutting holes on the first board body 21, flexible design can be carried out according to different layers. The present application does not limit this.
[0075] Please refer to Figure 3 、 Figure 4 、 Figure 5 and Figure 10 , in one embodiment, the second board body 41 includes a first setting layer 411 and a second setting layer 412 which are stacked. The first setting layer 411 includes an insulating layer and a copper-clad layer. The third electronic component 42 is installed on the copper-clad layer of the third setting layer. The copper-clad layer of the third setting layer is provided with a third cutting hole group 43, and the third cutting hole group 43 is arranged around the third electronic component 42. The second setting layer 412 includes an insulating layer and a copper-clad layer. The insulating layer of the second setting layer faces away from the first setting layer 411, and the copper-clad layer of the second setting layer 412 is close to the first setting layer 411. The copper-clad layer of the second setting layer 412 is provided with a fourth cutting hole group 44, and the orthographic projection of the fourth cutting hole group 44 on the first setting layer 411 is arranged around the third electronic component 42.
[0076] The circuit board structure 100 provided in this embodiment has the third electronic component 42 disposed on the first setting layer 411 of the second board body 41. The third cutting hole group 43 is disposed on the copper coating of the first setting layer 411 of the second board body 41, and the third cutting hole group 43 is arranged around the third electronic component 42. The fourth cutting hole group 44 is disposed on the copper coating of the second setting layer 412 of the second board body 41, and the orthographic projection of the fourth cutting hole group 44 on the first layer 211 is arranged around the third electronic component 42. Thus, when the third electronic component 42 is powered on and working, the heat generated by the heat of the third electronic component 42 will not spread around on the first setting layer 411 due to the blocking effect of the third cutting hole group 43, which can reduce the heat dissipation efficiency of the third electronic component 42 around on the first setting layer 411, and further reduce the occurrence of the phenomenon that the temperature of the electronic components or modules around the third electronic component 42 is abnormal due to heating, which is beneficial to improving the working stability and reliability of the circuit board structure 100. At the same time, when the third electronic component 42 is powered on and working, after the heat generated by the heat of the third electronic component 42 is conducted to the second setting layer 412, it will not spread around on the second setting layer 412 due to the blocking effect of the fourth cutting hole group 44, which can reduce the heat dissipation efficiency of the third electronic component 42 around on the second setting layer 412, so as to further reduce the occurrence of the phenomenon that the temperature of the electronic components or modules around the third electronic component 42 is abnormal due to heating, which is beneficial to further improving the working stability and reliability of the circuit board structure 100. Moreover, for the electronic components that generate noise during operation, through the settings of the third cutting hole group 43 and the fourth cutting hole group 44, the propagation of the noise generated by the third electronic component 42 can be weakened, and thus the noise during the operation of the circuit board structure 100 is relatively small.
[0077] In this embodiment, the second board body 41 has a two-layer structure. It can be understood that in some other embodiments, the first board body 21 can be three-layer, four-layer, five-layer, six-layer. For the setting of the cutting holes on the second board body 41, it can be flexibly designed according to different layers, and this application does not limit this.
[0078] Please refer to Figure 3 、 Figure 4 、 Figure 5 、 Figure 10 and Figure 11 , Figure 11 which are schematic structural diagrams of a third cutting hole group, a fourth cutting hole group, and a third electronic component provided in an embodiment of the present application.
[0079] In a specific embodiment, the first electronic component 22 and the third electronic component 42 of the circuit board structure 100 are arranged at intervals substantially along the second direction. The first cutout hole group 23 of the circuit board structure 100 includes a first cutout hole 231 and a second cutout hole 232. The first cutout hole 231 and the second cutout hole 232 of the first cutout hole group 23 are opposite and spaced apart along the first direction in the second layer 212. The orthographic projections of the first cutout hole 231 and the second cutout hole 232 in the first layer 211 are arranged circumferentially around the first electronic component 22, that is, the orthographic projection of the first electronic component 22 in the second layer 212 is located between the first cutout hole 231 and the second cutout hole 232. The second cutout hole group 24 of the circuit board structure 100 includes a third cutout hole 241 and a fourth cutout hole 242. The third cutout hole 241 and the fourth cutout hole 242 of the second cutout hole group 24 are opposite and spaced apart along the second direction in the second layer 212. The orthographic projections of the third cutout hole 241 and the fourth cutout hole 242 in the first layer 211 are arranged circumferentially around the first electronic component 22, that is, the orthographic projection of the first electronic component 22 in the third layer 213 is located between the third cutout hole 241 and the fourth cutout hole 242. The third cutout hole group 43 of the circuit board structure 100 includes a fifth cutout hole 431 and a sixth cutout hole 432. The fifth cutout hole 431 and the sixth cutout hole 432 are opposite and spaced apart along the second direction. The fourth cutout hole group 44 of the circuit board structure 100 includes a seventh cutout hole 441 and an eighth cutout hole 442. The seventh cutout hole 441 and the eighth cutout hole 442 are opposite and spaced apart along the second direction. Among them, the first direction is different from the second direction. The first direction is perpendicular to the stacking direction of the first plate body 21, that is, the Y direction as shown in Figure 1 shown. The second direction is perpendicular to the stacking direction of the first plate body 21, that is, the X direction as shown in Figure 1 shown.
[0080] For the circuit board structure 100 provided in this embodiment, on the one hand, the fifth cutout hole 431 and the sixth cutout hole 432 are arranged opposite to each other and spaced apart along the second direction, and the third electronic component 42 is located between the fifth cutout hole 431 and the sixth cutout hole 432, so that the traces in the first setting layer 411 can be arranged at the interval between the fifth cutout hole 431 and the sixth cutout hole 432, which is beneficial to improving the convenience of the trace design in the first setting layer 411. The seventh cutout hole 441 and the eighth cutout hole 442 are arranged opposite to each other and spaced apart along the second direction, and the orthographic projection of the third electronic component 42 on the second setting layer 412 is located between the seventh cutout hole 441 and the eighth cutout hole 442, so that the traces in the second setting layer 412 can be arranged at the interval between the seventh cutout hole 441 and the eighth cutout hole 442, which is beneficial to improving the convenience of the trace design in the second setting layer 412. Thus, by designing the third cutout hole group 43 and the fourth cutout hole group 44, it is beneficial to improve the convenience of the overall trace layout design of the circuit board structure 100. On the other hand, the third cutout hole 241 and the fourth cutout hole 242 of the second cutout hole group 24 are arranged opposite to each other and spaced apart along the second direction in the second layer 212, the fifth cutout hole 431 and the sixth cutout hole 432 of the third cutout hole group 43 are arranged opposite to each other and spaced apart along the second direction in the first setting layer 411, and the seventh cutout hole 441 and the eighth cutout hole 442 of the fourth cutout hole group 44 are arranged opposite to each other and spaced apart along the second direction in the second setting layer 412. When the first electronic component 22 and / or the third electronic component 42 are working, the fourth cutout hole 242, the fifth cutout hole 431, and the seventh cutout hole 441 are arranged between the first electronic component 22 and the third electronic component 42. Due to the blocking effect of the fourth cutout hole 242, the fifth cutout hole 431, and the seventh cutout hole 441, the mutual influence of the heat between the first electronic component 22 and the third electronic component 42 can be reduced, so as to reduce the occurrence of the phenomenon that the first electronic component 22 and the third electronic component 42 have abnormal temperatures due to heat generation, which is beneficial to improving the stability and reliability of the operation of the first electronic component 22, the third electronic component 42, and the circuit board structure 100. On the further hand, at the same time, the copper-clad layers of the first setting layer 411 and the second setting layer 412 are large-area copper-clad. By arranging the fifth cutout hole 431 and the sixth cutout hole 432 at intervals, and the seventh cutout hole 441 and the eighth cutout hole 442 at intervals, on the premise of ensuring the electromagnetic shielding and protection effects, it is beneficial for the third electronic component 42 to achieve the effect of electromagnetic compatibility.
[0081] In the circuit board structure 100 provided in this embodiment, both the fifth cutout hole 431 and the sixth cutout hole 432 of the third cutout hole group 43 located on the copper-clad layer of the first setting layer 411 are "C"-shaped cutout holes, and the fifth cutout hole 431 and the sixth cutout hole 432 are located on the same regular circular ring. Both the seventh cutout hole 441 and the eighth cutout hole 442 of the fourth cutout hole group 44 located on the copper-clad layer of the second setting layer 412 are "C"-shaped cutout holes, and the seventh cutout hole 441 and the eighth cutout hole 442 are located on the same regular circular ring. Moreover, the outer diameter of the circular ring where the fifth cutout hole 431 and the sixth cutout hole 432 are located is greater than the inner diameter of the circular ring where the seventh cutout hole 441 and the eighth cutout hole 442 are located.
[0082] When the third electronic component 42 operates and generates heat, the heat generated by the third electronic component 42 diffuses in all directions in the direction of the arrow shown as Figure 1 The fifth cutout hole 431 and the sixth cutout hole 432 of the third cutout hole group 43 on the first setting layer 411 will weaken the conduction of part of the heat, and the seventh cutout hole 441 and the eighth cutout hole 442 of the fourth cutout hole group 44 on the second setting layer 412 will weaken the conduction of another part of the heat. Thus, the heat generated when the entire third electronic component 42 operates can be reduced from diffusing and conducting to the surroundings.
[0083] It can be understood that in some other embodiments, the fifth cutout hole 431 and the sixth cutout hole 432 of the third cutout hole group 43 can be "U"-shaped, linear, or broken-line cutout holes, and the seventh cutout hole 441 and the eighth cutout hole 442 of the fourth cutout hole group 44 can be "U"-shaped, linear, or broken-line cutout holes. This application does not limit this.
[0084] Please refer to Figure 3 and Figure 12 , Figure 12 which is a schematic diagram of the wiring design of a first circuit board provided in an embodiment of this application.
[0085] In one embodiment, the circuit board structure 100 includes a first circuit board 20 and a second circuit board 40. The circuit board structure 100 further includes a first signal line 61 and a second signal line 62. The first signal line 61 and the second signal line 62 are disposed on the first circuit board 20 and / or the second circuit board 40. The signal flow rate of the first signal line 61 is greater than the signal flow rate of the second signal line 62. A fifth cutout hole group 63 is disposed between the first signal line 61 and the second signal line 62.
[0086] For the circuit board structure 100 provided in this embodiment, the signal flow rate of the first signal line 61 is greater than that of the second signal line 62. That is, the first signal line 61 is a high-speed signal line, and the second signal line 62 is a low-speed signal line. By providing a fifth cutout hole group 63 between the first signal line 61 and the second signal line 62, the occurrence of signal crosstalk, reflection, radiation, electromagnetic interference, etc. between the first signal line 61 and the second signal line 62 can be reduced, thereby facilitating the guarantee of the accuracy of the signals on the first signal line 61 and the second signal line 62.
[0087] In some embodiments, the first signal line 61 and the second signal line 62 are arranged on different layers of the first circuit board 20 and / or the second circuit board 40. At this time, the position of the fifth cutout hole group 63 corresponding to the first signal line 61 is set in the corresponding layer of the first circuit board 20 and / or the second circuit board 40. By setting the position of the fifth cutout hole group 63 corresponding to the first signal line 61 in the corresponding layer of the first circuit board 20 and / or the second circuit board 40, the occurrence of signal crosstalk, reflection, radiation, electromagnetic interference, etc. between the first signal line 61 and the second signal line 62 can be further reduced.
[0088] The above are some implementation manners of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present application.
Claims
1. A circuit board structure, characterized in that: It includes a first circuit board, which includes a first board body and a first electronic component; the first board body includes a first layer and a second layer which are stacked, and the first electronic component is installed on the first layer; the second layer includes an insulating layer and a copper clad layer which are stacked, and the copper clad layer of the second layer is arranged on a side of the second layer close to the first layer, and the copper clad layer of the second layer is provided with a first cut-out hole group, and the orthographic projection of the first cut-out hole group on the first layer is arranged around the first electronic component.
2. The circuit board structure according to claim 1, characterized in that: The first cut-out hole group includes a first cut-out hole and a second cut-out hole, and the orthographic projections of the first cut-out hole and the second cut-out hole on the first layer are arranged around the circumference of the first electronic component.
3. The circuit board structure according to claim 2, characterized in that: The first board body also includes a third layer located on the side of the second layer away from the first layer, the third layer includes an insulating layer and a copper clad layer stacked together, the copper clad layer of the third layer is arranged on the side of the third layer close to the second layer, the copper clad layer of the third layer is provided with a second cut-out hole group, and the second cut-out hole group is arranged around the first electronic component in the orthographic projection of the first board body.
4. The circuit board structure according to claim 3, characterized in that: The second cut-out hole group includes a third cut-out hole and a fourth cut-out hole, and the orthographic projections of the third cut-out hole and the fourth cut-out hole on the first layer are arranged at intervals around the circumference of the first electronic component; the first cut-out hole and the second cut-out hole are arranged opposite to each other and at intervals along a first direction, and the third cut-out hole and the fourth cut-out hole are arranged opposite to each other and at intervals along a second direction; wherein, the first direction is perpendicular to the stacking direction of the first plate body, the second direction is perpendicular to the stacking direction of the first plate body, and the first direction is different from the second direction.
5. The circuit board structure according to claim 3, characterized in that: The first circuit board further includes a second electronic component disposed on the first layer, and at least a portion of an orthographic projection of the second cut-out hole group on the first layer overlaps with at least a portion of an orthographic projection of the first cut-out hole group on the first layer; An overlapping area of the orthographic projection of the first cut-out hole group on the first layer and the orthographic projection of the second cut-out hole group on the first layer is located between the orthographic projection of the second electronic component on the first layer and the orthographic projection of the first electronic component on the first layer.
6. The circuit board structure according to claim 1, characterized in that: The circuit board structure also includes a second circuit board, the second circuit board includes a second board body and a third electronic component, the second board body is connected to the first board body; the second board body includes a first setting layer, the first setting layer includes an insulating layer and a copper clad layer, and the third electronic component is installed on the copper clad layer of the third setting layer; the copper clad layer of the third setting layer is provided with a third cut-out hole group, and the third cut-out hole group is arranged around the third electronic component.
7. The circuit board structure according to claim 6, characterized in that: The second board body also includes a second setting layer stacked with the first setting layer, the second setting layer includes an insulating layer and a copper cladding layer, the copper cladding layer of the second setting layer is provided with a fourth cut-out hole group, and the orthographic projection of the fourth cut-out hole group on the first setting layer is arranged around the third electronic component.
8. The circuit board structure according to claim 7, characterized in that: The third cut-off hole group includes a fifth cut-off hole and a sixth cut-off hole, and the fifth cut-off hole and the sixth cut-off hole are arranged opposite to each other and spaced apart along a second direction; the fourth cut-off hole group includes a seventh cut-off hole and an eighth cut-off hole, and the seventh cut-off hole and the eighth cut-off hole are arranged opposite to each other and spaced apart along the second direction; wherein the second direction is perpendicular to the stacking direction of the second plate body.
9. The circuit board structure according to claim 6, characterized in that: The circuit board structure also includes a first signal line and a second signal line, the first signal line and the second signal line are arranged on the first circuit board or the second circuit board, the signal flow rate of the first signal line is greater than the signal flow rate of the second signal line, and a fifth cut-off hole group is arranged between the first signal line and the second signal line.
10. An electronic device, characterized in that: It comprises a circuit board structure and a display screen as described in any one of claims 1 to 9, wherein the display screen is electrically connected to the circuit board structure.