Five-axis wafer robot
By designing a five-axis wafer robot, using technologies such as couplings, symmetric bearing seats, drag chain protection, sensor monitoring and negative pressure solenoid valves, the accuracy and reliability problems of existing equipment in diversified chip picking requirements are solved, and efficient and intelligent wafer processing and handling are achieved.
Patent Information
- Application Number
- CN202510194254.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2025-07-04
AI Technical Summary
Existing wafer equipment is difficult to meet the diverse chip picking needs, especially in complex wafer manufacturing processes, it is impossible to provide multi-axis dedicated robots to meet the wafer position requirements, resulting in insufficient operating accuracy and reliability.
A five-axis wafer robot is designed, including X-axis, Z-axis, T-axis, and RW-axis components. It uses couplings and symmetrical bearing seats to enhance power transmission stability and support capabilities, uses drag chain protection cables, installs R-axis and W-axis sensors for real-time monitoring, negative pressure solenoid valves control clamping, and IO boards and cards realize equipment coordination, improving intelligence and reliability.
It significantly improves the automation level of wafer handling and processing, reduces manual dependence, enhances the reliability and adaptability of equipment, meets diverse process needs, and improves production efficiency and economic benefits.
Smart Images

Figure CN120244936A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of wafer robots, and more specifically, to a five-axis wafer robot. Background Art
[0002] With the development of the semiconductor industry, more and more diverse wafer picking requirements are put forward to meet the complex situations in the wafer manufacturing process.
[0003] According to the different requirements of wafers in the manufacturing process segments and the differences in wafer manufacturing process schemes, wafer equipment emerges in an endless stream. At the same time, due to the special requirements for the wafer's equipment position, a multi-axis dedicated robot is needed to meet the wafer picking positions.
[0004] For this reason, this application proposes a five-axis wafer robot to solve the above existing problems.
[0005] Application Content
[0006] To solve the above problems, this application provides a five-axis wafer robot.
[0007] The five-axis wafer robot provided by this application adopts the following technical solutions:
[0008] A five-axis wafer robot, comprising:
[0009] An X-axis assembly, on which a Z-axis assembly is installed;
[0010] The Z-axis assembly is installed with a T-axis assembly, and the T-axis assembly moves in the Z-axis direction;
[0011] The T-axis assembly is installed with an RW-axis assembly, and the RW-axis assembly is composed of an R-axis and a W-axis;
[0012] The X-axis assembly includes a robot backplane, a mover fixed seat, a sliding module, a reader head fixed block, a Z-axis mounting plate, an upper side cover plate, and a right side cover plate;
[0013] A linear motor stator and an X-axis grating are installed on the robot backplane;
[0014] A linear motor mover is installed on the mover fixed seat; the linear motor stator and the linear motor mover cooperate to provide the power source for the X-axis assembly;
[0015] The sliding module includes an X-axis guide rail and an X-axis slider; the X-axis guide rail is installed on the robot backplane, the X-axis slider is installed on the mover fixed seat, and the X-axis guide rail and the X-axis slider are slidably connected;
[0016] The reader fixing block is installed on the mover fixing seat, and an X-axis reader is provided on the reader fixing block; the X-axis reader is used in cooperation with the X-axis grating to provide position feedback for the movement;
[0017] The Z-axis mounting plate is installed on the mover fixing seat and is used to install the Z-axis components;
[0018] The upper side cover plate and the right side cover plate are installed on the manipulator back plate to protect the linear motor stator;
[0019] The Z-axis components include a Z-axis back plate, a Z-axis servo motor, a bearing block, a Z-axis guide rail, and a Z-axis sensor;
[0020] The Z-axis back plate is installed on the Z-axis mounting plate and is used to integrate and install all components of the Z-axis;
[0021] The Z-axis servo motor is installed on the Z-axis back plate. The output rod of the Z-axis servo motor is drivingly connected to a lead screw. A sliding seat is threadedly connected to the lead screw, and a nut is provided at one end of the lead screw opposite to the Z-axis servo motor; the bearing block is installed on the Z-axis back plate and cooperates with the lead screw;
[0022] The sliding seat is further provided with a Z-axis slider, a Z-axis sensor, and a sensor stop piece;
[0023] The Z-axis guide rail is fixed on the Z-axis back plate and is used in cooperation with the Z-axis slider to provide a guiding function for the Z-axis components;
[0024] The Z-axis sensor is fixed on the Z-axis back plate and is used in cooperation with the sensor stop piece to provide position feedback for the movement of the Z-axis;
[0025] The T-axis components include a T-axis connecting plate, a T-axis mounting plate, a T-axis servo motor, a T-axis reducer, a hollow rotary table, a driver, and a negative pressure solenoid valve; the T-axis mounting plate is installed on the connecting plate, and the T-axis servo motor is installed on the T-axis reducer;
[0026] The T-axis components further include that the T-axis reducer is installed on the hollow rotary table and is used to increase the torque and reduce the speed of the T-axis components;
[0027] The hollow rotary table is installed on the T-axis mounting plate and is used to transmit the power provided by the T-axis servo motor;
[0028] The driver controls the movement of the T-axis servo motor;
[0029] The RW axis assembly includes a base plate, a W axis motor, a W axis reducer, a W axis arm, a W axis cylinder, a W axis tooth fork, a W axis clamping block, an R axis reducer, an R axis motor, an R axis arm, an R axis cylinder, an R axis clamping block, an R axis sensor, an R axis tooth fork, a symmetrically arranged R axis synchronous wheel, an R axis synchronous belt body, an R axis synchronous belt mounting plate, an R axis slider, an R axis guide rail, a W axis synchronous belt body, a symmetrically arranged W axis synchronous wheel, a W axis synchronous belt mounting plate, a W axis slider, a W axis slide rail, and a reducer fixing plate;
[0030] The bottom plate is fixed on the hollow rotating table; the W-axis motor is installed on the W-axis reducer, and the W-axis reducer is installed on the reducer fixing plate; the W-axis arm is installed on the W-axis slider;
[0031] The W-axis cylinder is fixed to the W-axis arm and serves as a power component for clamping the wafer;
[0032] The W-axis tooth fork is installed on the W-axis arm; the W-axis clamping block is installed on the W-axis cylinder;
[0033] The R-axis reducer is mounted on the reducer fixing plate, and the R-axis motor is connected to the R-axis reducer in a transmission manner; the R-axis arm is mounted on the R-axis slider, the R-axis cylinder is fixed on the W-axis arm, the R-axis clamping block is mounted on the R-axis cylinder, and the R-axis tooth fork is mounted on the R-axis arm for carrying the wafer; the R-axis synchronous wheel is mounted on the R-axis reducer and transmits power through the R-axis synchronous belt body; the R-axis slider is mounted under the R-axis synchronous belt mounting plate and cooperates with the R-axis guide rail to provide guidance for the R-axis assembly and ensure motion accuracy, and the R-axis guide rail is mounted on the bottom plate;
[0034] The W-axis synchronous belt body is sleeved on the adjacent W-axis synchronous wheel and is used to transmit power. The W-axis synchronous wheel is installed on the W-axis reducer. The W-axis synchronous belt mounting plate is installed on the W-axis slider to clamp the synchronous belt and transmit power to the W-axis slider. The W-axis slider cooperates with the W-axis slide rail to provide guidance for the W-axis assembly. The W-axis guide rail is installed on the bottom plate.
[0035] The reducer fixing plate is mounted on the bottom plate, and the reducer fixing plate is used to fix the R-axis reducer and the W-axis reducer.
[0036] Furthermore, a coupling is included, and the coupling is connected to the divisor shaft of the Z-axis servo motor.
[0037] Through the above technical solution, the presence of the coupling enhances the transmission stability of the output power of the Z-axis servo motor. The Z-axis undertakes the precise lifting task during the wafer handling operation. If only a simple fixation is adopted at the connection part between the motor output shaft and the lead screw, problems such as loosening and misalignment are likely to occur, affecting the power transmission accuracy, and further increasing the position deviation of the slide during lifting; at the same time, the coupling can compensate for certain radial and angular deviations, tightly connecting the motor output shaft and the lead screw, ensuring that the power is transmitted from the motor to the lead screw smoothly and accurately, ensuring that the Z-axis slide moves precisely according to the command, improving the accuracy of wafer operation in the vertical direction, and ensuring the consistency of the processing technology.
[0038] Further, the bearing seats are symmetrically arranged, and the lead screw penetrates and cooperates with the two bearing seats.
[0039] Through the above technical solution, the stability and load-bearing capacity of the Z-axis lead screw drive system are significantly improved. During the wafer handling process, the Z-axis slide not only bears the weight of its own components but also the load of the wafer and the clamping device. It is difficult for a single-sided bearing seat to provide uniform and stable support, which is likely to cause the lead screw to bend and deform, affecting the motion accuracy and service life; the symmetric double bearing seats support the lead screw evenly from both sides, dispersing the force, effectively preventing the lead screw from being eccentrically loaded, ensuring that the slide moves smoothly and precisely along the Z-axis guide rail, meeting the requirements of high-precision wafer processing technology, extending the service life of the key components of the equipment, and reducing the equipment maintenance frequency.
[0040] Further, it also includes an X-axis cable carrier and a Z-axis cable carrier. One end of the X-axis cable carrier is fixed on the manipulator backplane, and the other end is installed on the mover fixed seat; one end of the Z-axis cable carrier is fixed on the Z-axis backplane, and the other end is fixed on the cable carrier fixing plate; the X-axis cable carrier is used to protect the cable.
[0041] Through the above technical solution, the two respectively address the cable risks brought by frequent movements in their respective axial directions. In a complex wafer production environment, whether it is the rapid translation of the X-axis or the fine lifting of the Z-axis, the cable can be protected by the cable carrier from being pulled, worn, and entangled, greatly reducing the probability of equipment downtime caused by cable failures, improving the overall operation reliability of the equipment, ensuring the efficient and stable operation of the production line, and reducing the production interruption losses caused by equipment maintenance.
[0042] Further, it also includes an R-axis sensor and a W-axis sensor. The W-axis sensor is installed on the W-axis arm, and the R-axis sensor is installed on the R-axis arm. The W-axis sensor and the R-axis sensor are used for the in-position detection of the wafer.
[0043] Through the above technical solution, during the process of the RW axis assembly clamping and handling wafers, if it is impossible to know in real time whether the wafer is in place and whether the clamping state is stable, accidents such as wafer dropping and misoperation are very likely to occur, damaging valuable wafers. These two sensors are respectively installed at the key parts of the R-axis and W-axis arms, and they can monitor the wafer position information in real time and feedback the signals to the control system. Once any abnormality is detected, the system can timely adjust the clamping action or pause the handling process to ensure the safety and reliability of the entire wafer handling process, improve the intelligent control level of the production process, and guarantee the product quality and production efficiency.
[0044] Further, it also includes a negative pressure solenoid valve; the negative pressure solenoid valve is used for the switching of the negative pressure of the R-axis and W-axis.
[0045] Through the above technical solution, in some special wafer processing technologies, such as wafer surface micro-nano structure processing, coating and other processes, it is necessary to use negative pressure to stably adsorb the wafer to prevent its displacement during fine operations. The negative pressure solenoid valve precisely controls the on-off of the negative pressure of the R-axis and W-axis, and opens or closes the negative pressure channel in a timely manner according to the process requirements, ensuring that the wafer closely adheres to the dental fork and clamping block during clamping and handling, maintaining the high-precision processing positioning requirements, improving the process stability and product quality consistency, expanding the applicable process range of the robot, and meeting the diverse semiconductor manufacturing requirements.
[0046] Further, it also includes an IO board card, and the IO board card is installed in the T-axis assembly.
[0047] Through the above technical solution, on the semiconductor wafer production line, the robot needs to cooperate with many surrounding devices, such as interacting signals and data with wafer detection devices, processing machine tools, etc.; the IO board card, as an electrical signal transfer hub, can efficiently process various input and output signals, realizing the precise linkage between the robot and external devices; it can flexibly configure communication interfaces and protocols, quickly respond to external control instructions, and accurately feedback its own status information, optimizing the automation process of the entire production line, improving the production cooperation efficiency, and reducing the risk of production delays caused by poor equipment communication.
[0048] In summary, the present application includes at least the following beneficial technical effects:
[0049] (1) The five-axis wafer robot of the present application has multi-axis linkage and fine control, greatly improving the automation and intelligent level of wafer handling and processing, reducing the dependence on manual labor, reducing human errors, and ensuring the stability of product quality;
[0050] (2) A series of optimized designs from structure to function, such as precise fitting of each axis component, drag chain protection, sensor monitoring, and the addition of special functional components (such as negative pressure solenoid valves and IO boards), comprehensively enhance the reliability, adaptability, and expandability of the equipment, enabling it to operate stably for a long time in a complex and changeable semiconductor production environment, meet diverse process requirements, and effectively improve the production efficiency and economic benefits of the entire production line. Brief Description of the Drawings
[0051] Figure 1 is the general assembly drawing of this application;
[0052] Figure 2 is the isometric view of the X-axis of this application;
[0053] Figure 3 is the partial cross-sectional view of the X-axis of this application;
[0054] Figure 4 is the isometric view of the Z-axis of this application;
[0055] Figure 5 is the isometric view of the T-axis of this application;
[0056] Figure 6 is the isometric view of the RW-axis of this application;
[0057] Figure 7 is the top cross-sectional view of the RW-axis of this application;
[0058] Figure 8 is the internal structure diagram of the top cross-sectional view of the RW-axis of this application.
[0059] Explanation of the reference numerals in the drawings:
[0060] 1. X-axis component; 101. Manipulator backplane; 102. Linear motor stator; 103. Linear motor mover; 104. X-axis guide rail; 105. X-axis slider; 106. X-axis grating; 107. X-axis read head; 108. Read head fixing block; 109. Z-axis mounting plate; 110. Upper side sealing plate; 111. Right side sealing plate; 112. X-axis drag chain; 113. Mover fixing seat;
[0061] 2. Z-axis component; 201. Z-axis backplane; 202. Z-axis servo motor; 203. Coupling; 204. Bearing seat; 205. Lead screw; 206. Nut; 207. Slide seat; 208. Z-axis guide rail; 209. Z-axis slider; 210. Z-axis sensor; 211. Sensor baffle; 212. Z-axis drag chain;
[0062] 3. T-axis assembly; 301. T-axis connection plate; 302. T-axis mounting plate; 303. T-axis servo motor; 304. T-axis reducer; 305. Hollow rotary table; 306. IO board; 307. Driver; 308. Negative pressure solenoid valve; 309. Drag chain fixing plate;
[0063] 4. RW-axis assembly; 401. Bottom plate; 402. W-axis motor; 403. W-axis reducer; 404. W-axis arm; 405. W-axis cylinder; 406. W-axis tooth fork; 407. W-axis clamping block; 408. W-axis sensor; 409. R-axis reducer; 410. R-axis motor; 411. R-axis arm; 412. R-axis cylinder; 413. R-axis clamping block; 414. R-axis sensor; 415. R-axis tooth fork; 416. R-axis synchronous pulley; 417. R-axis synchronous belt body; 418. R-axis synchronous belt mounting plate; 419. R-axis slider; 420. R-axis guide rail; 421. W-axis synchronous belt; 422. W-axis synchronous pulley; 423. W-axis synchronous belt mounting plate; 424. W-axis slider; 425. W-axis slide rail; 426. Reducer fixing plate; 427. Wafer. Detailed implementation manners
[0064] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application; obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0065] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0066] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "provided with", "sheathed / connected", "connection", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0067] Embodiment:
[0068] The following further elaborates on this application in conjunction with the attached Figure 1 -7.
[0069] The embodiment of this application discloses a five-axis wafer 427 robot, which is characterized by including:
[0070] An X-axis component 1, on which a Z-axis component 2 is installed;
[0071] The Z-axis component 2 is installed with a T-axis component 3, and the T-axis component 3 moves in the Z-axis direction;
[0072] The T-axis component 3 is installed with an RW-axis component 4, and the RW-axis component 4 is composed of an R-axis and a W-axis;
[0073] The X-axis component 1 includes a robot backplane 101, a mover fixed seat 113, a sliding module, a head fixing block 108, a Z-axis mounting plate 109, an upper side sealing plate 110, and a right side sealing plate 111;
[0074] A linear motor stator 102 and an X-axis grating 106 are installed on the robot backplane 101;
[0075] A linear motor mover 103 is installed on the mover fixed seat 113; the linear motor stator 102 and the linear motor mover 103 cooperate to provide a power source for the X-axis component;
[0076] The sliding module includes an X-axis guide rail 104 and an X-axis slider 105; the X-axis guide rail 104 is installed on the robot backplane 101, the X-axis slider 105 is installed on the mover fixed seat 113, and they are slidably connected between the X-axis guide rail 104 and the X-axis slider 105;
[0077] The head fixing block 108 is installed on the mover fixed seat 113, and an X-axis head 107 is provided on the head fixing block 108; the X-axis head 107 is used in cooperation with the X-axis grating 106 to provide position feedback for the movement;
[0078] The Z-axis mounting plate 109 is installed on the mover fixed seat 113 and is used to install the Z-axis component 2;
[0079] The upper side sealing plate 110 and the right side sealing plate 111 are installed on the robot backplane 101 and are used to protect the linear motor stator 102;
[0080] The Z-axis component 2 includes a Z-axis backplane 201, a Z-axis servo motor 202, a bearing seat 204, a Z-axis guide rail 208, and a Z-axis sensor 210;
[0081] The Z-axis backplane 201 is installed on the Z-axis mounting plate 109 and is used to integrate and install all components of the Z-axis;
[0082] The Z-axis servo motor 202 is installed on the Z-axis backplane 201. The output rod of the Z-axis servo motor 202 is drivingly connected to a lead screw 205. A slide block 207 is threadedly connected to the lead screw 205, and a nut 206 is provided at one end of the lead screw 205 opposite to the Z-axis servo motor 202; a bearing block 204 is installed on the Z-axis backplane 201 and cooperates with the lead screw 205;
[0083] The slide block 207 is further provided with a Z-axis slider 209, a Z-axis sensor 210 and a sensor baffle 211;
[0084] The Z-axis guide rail 208 is fixed on the Z-axis backplane 201 and is used in conjunction with the Z-axis slider 209 to provide guidance for the Z-axis assembly;
[0085] The Z-axis sensor 210 is fixed on the Z-axis backplane 201 and is used in conjunction with the sensor baffle 211 to provide position feedback for the movement of the Z-axis;
[0086] The T-axis assembly 3 includes a T-axis connecting plate 301, a T-axis mounting plate 302, a T-axis servo motor 303, a T-axis reducer 304, a hollow rotary table 305, a driver 307, and a negative pressure solenoid valve 308; the T-axis mounting plate 302 is installed on the connecting plate 301, and the T-axis servo motor 303 is installed on the T-axis reducer 304;
[0087] The T-axis assembly 3 further includes that the T-axis reducer 304 is installed on the hollow rotary table 305 and is used to increase the torque and reduce the speed of the T-axis assembly 3;
[0088] The hollow rotary table 305 is installed on the T-axis mounting plate 302 and is used to transmit the power provided by the T-axis servo motor 303;
[0089] The driver 307 controls the movement of the T-axis servo motor 303;
[0090] The RW-axis assembly 4 includes a bottom plate 401, a W-axis motor 402, a W-axis reducer 403, a W-axis arm 404, a W-axis cylinder 405, a W-axis tooth fork 406, a W-axis clamping block 407, an R-axis reducer 409, an R-axis motor 410, an R-axis arm 411, an R-axis cylinder 412, an R-axis clamping block 413, an R-axis sensor 414, an R-axis tooth fork 415, symmetrically arranged R-axis synchronous pulleys 416, an R-axis synchronous belt body 417, an R-axis synchronous belt mounting plate 418, an R-axis slider 419, an R-axis guide rail 420, a W-axis synchronous belt body 421, symmetrically arranged W-axis synchronous pulleys 422, a W-axis synchronous belt mounting plate 423, a W-axis slider 424, a W-axis slide rail 425, and a reducer fixing plate 426;
[0091] The base plate 401 is fixed on the hollow rotating table; the W-axis motor 402 is mounted on the W-axis reducer 403, and the W-axis reducer 403 is mounted on the reducer fixing plate 426; the W-axis arm 404 is mounted on the W-axis slider 424;
[0092] The W-axis cylinder 405 is fixed to the W-axis arm 404 and serves as a power component for clamping the wafer 427;
[0093] The W-axis tooth fork 406 is installed on the W-axis arm 404; the W-axis clamping block 407 is installed on the W-axis cylinder 405;
[0094] The R-axis reducer 409 is mounted on the reducer fixing plate 426, and the R-axis motor 410 is connected to the R-axis reducer 409 in transmission; the R-axis arm 411 is mounted on the R-axis slider 419, the R-axis cylinder 412 is fixed on the W-axis arm 404, the R-axis clamping block 413 is mounted on the R-axis cylinder 412, and the R-axis tooth fork 415 is mounted on the R-axis arm 411 for carrying the wafer 427; the R-axis synchronous wheel 416 is mounted on the R-axis reducer 409 and transmits power through the R-axis synchronous belt body 417; the R-axis slider 419 is mounted under the R-axis synchronous belt mounting plate 418 and cooperates with the R-axis guide rail 420 to provide guidance for the R-axis assembly and ensure motion accuracy, and the R-axis guide rail 420 is mounted on the base plate 401;
[0095] The W-axis synchronous belt body 421 is sleeved on the adjacent W-axis synchronous wheel 422 and is used to transmit power. The W-axis synchronous wheel 422 is installed on the W-axis reducer 403; the W-axis synchronous belt mounting plate 423 is installed on the W-axis slider 424 to clamp the synchronous belt and transmit power to the W-axis slider 424. The W-axis slider 424 cooperates with the W-axis slide rail 425 to provide guidance for the W-axis assembly. The W-axis guide rail is installed on the bottom plate 401;
[0096] The reducer fixing plate 426 is installed on the base plate 401 , and the reducer fixing plate 426 is used to fix the R-axis reducer 409 and the W-axis reducer 403 .
[0097] It also includes a coupling 203, which is connected to the divisor shaft of the Z-axis servo motor 202; the existence of the coupling enhances the transmission stability of the output power of the Z-axis servo motor. The Z-axis is responsible for the precise lifting task in the wafer handling operation. If the connection between the motor output shaft and the lead screw is simply fixed, it is easy to loosen and misalign, affecting the power transmission accuracy, thereby increasing the position deviation of the slide lifting; at the same time, the coupling can compensate for certain radial and angular deviations, tightly connect the motor divisor shaft and the lead screw, ensure that the power is smoothly and accurately transmitted from the motor to the lead screw, ensure that the Z-axis slide moves accurately according to the command, improve the accuracy of the wafer operation in the vertical direction, and ensure the consistency of the processing technology.
[0098] See also Figure 4, the bearing housing 204 is symmetrically arranged, and the lead screw 205 passes through and mates with the two bearing housings 204; significantly improving the stability and load-bearing capacity of the Z-axis lead screw drive system. During the wafer handling process, the Z-axis slide not only bears the weight of its own components but also the load of the wafer and the clamping device. A single-sided bearing housing is difficult to provide uniform and stable support, easily causing the lead screw to bend and deform, affecting the motion accuracy and service life. The symmetric double bearing housings support the lead screw evenly from both sides, dispersing the force, effectively preventing the lead screw from being eccentrically loaded, ensuring the smooth and precise lifting and lowering of the slide along the Z-axis guide rail, meeting the requirements of high-precision wafer processing technology, extending the service life of the key components of the equipment, and reducing the equipment maintenance frequency.
[0099] See Figure 2 , it also includes an X-axis cable carrier 112 and a Z-axis cable carrier 212. One end of the X-axis cable carrier 112 is fixed to the manipulator backplane 101 and the other end is installed on the mover fixed seat 113; one end of the Z-axis cable carrier 212 is fixed to the Z-axis backplane 201 and the other end is fixed to the cable carrier fixing plate 309; used to protect the cables. The X-axis cable carrier 112 is used to protect the cables; both can cope with the cable risks brought by frequent movement in their respective axial directions. In a complex wafer production environment, whether it is the rapid translation of the X-axis or the fine lifting of the Z-axis, the cables can be protected by the cable carriers from being pulled, worn, and entangled, greatly reducing the probability of equipment downtime caused by cable failures, improving the overall operation reliability of the equipment, ensuring the efficient and stable operation of the production line, and reducing the production interruption losses caused by equipment maintenance.
[0100] See Figure 6 , Figure 7 and Figure 8 , it also includes an R-axis sensor 414 and a W-axis sensor 408. The W-axis sensor 408 is installed on the W-axis arm 404, and the R-axis sensor 414 is installed on the R-axis arm 411. The W-axis sensor 408 and the R-axis sensor 414 are used for the in-position detection of the wafer 427; during the process of the RW-axis assembly clamping and handling the wafer, if it is impossible to know in real time whether the wafer is in position and whether the clamping state is stable, it is very easy to have accidents such as wafer dropping and misoperation, damaging the precious wafer. These two sensors are respectively installed at the key parts of the R-axis and W-axis arms, real-time monitoring the wafer position information, and feeding back the signals to the control system. Once an abnormality is detected, the system can adjust the clamping action in time or pause the handling process to ensure the safety and reliability of the entire wafer handling process, improve the intelligent control level of the production process, and ensure the product quality and production efficiency.
[0101] See Figure 5, it also includes a negative pressure solenoid valve 308; the negative pressure solenoid valve 308 is used for the on / off of the negative pressure of the R axis and the W axis; in some special wafer processing processes, such as wafer surface micro-nano structure processing, coating and other links, it is necessary to use negative pressure to stably adsorb the wafer to prevent its displacement during fine operations. The negative pressure solenoid valve precisely controls the on / off of the negative pressure of the R axis and the W axis, opens or closes the negative pressure channel in a timely manner according to the process requirements, ensures that the wafer closely fits the dental fork and the clamping block during clamping and handling, maintains the high-precision processing positioning requirements, improves the process stability and product quality consistency, expands the applicable process range of the robot, and meets the diverse semiconductor manufacturing needs.
[0102] See Figure 5 , it also includes an IO board 306, and the IO board 306 is installed in the T-axis assembly 3; in the semiconductor wafer production line, the robot needs to cooperate with many peripheral devices, such as interacting signals and data with wafer detection devices, processing machine tools, etc.; the IO board, as an electrical signal transfer hub, can efficiently process various input and output signals, realizing the precise linkage between the robot and external devices; it can flexibly configure communication interfaces and protocols, quickly respond to external control instructions, and accurately feedback its own status information, optimizing the automation process of the entire production line, improving the production cooperation efficiency, and reducing the risk of production delays caused by poor equipment communication.
[0103] The implementation principle of a five-axis wafer robot in an embodiment of this application is as follows:
[0104] When the upper computer issues an instruction to pick up the wafer, the five-axis wafer robot starts a series of coordinated actions.
[0105] First of all, the X-axis assembly 1 and the Z-axis assembly 2 operate synchronously to form a robotic arm, and quickly transport the T-axis assembly 3 and the RW-axis assembly 4 to the target position precisely.
[0106] When the X-axis assembly 1 moves, the linear motor stator 102 cooperates with the linear motor mover 103, and the electromagnetic force generated after power-on is converted into power to drive the mover fixing seat 113 to smoothly move along the X-axis guide rail 104. The X-axis slider 105 ensures a stable movement process and steadily drives all kinds of parts installed on it to the designated point; at the same time, the X-axis grating 106 and the X-axis read head 107 real-time monitor the movement trajectory of the X-axis assembly 1 and accurately feedback the position information.
[0107] After the Z-axis assembly 2 is started, the Z-axis servo motor 202 runs quickly, and the power is transmitted to the lead screw 205 through the coupling 203, and the lead screw 205 drives the nut 206 to move; with the cooperation of the Z-axis guide rail 208 and the Z-axis slider 209, the slide seat 207 accurately lifts and lowers along the established route, and the sensor stop piece 211 and the sensor 201 real-time sense the position of the slide seat 207 and feedback the information in time to ensure that the Z-axis assembly 2 moves accurately.
[0108] After the X-axis component 1 and the Z-axis component 2 are successfully in place, the T-axis component 3 is driven by the T-axis servo motor 303. The power first passes through the T-axis reducer 304 for reasonable speed increase and torque increase, and then the relevant components of the RW-axis component 4 are rotated and adjusted to the required orientation by means of the hollow rotary table 305.
[0109] Then the R-axis motor 410 is turned on. After the power passes through the R-axis reducer 409, it causes the R-axis synchronous pulley 416 to rotate, and then drives the R-axis synchronous belt 417, the R-axis synchronous belt mounting plate 418, and the R-axis slider 419 to move together. Under the guidance of the R-axis guide rail 420, it reaches the key transmission node. At this time, the R-axis sensor 414 confirms that the wafer 427 is accurately in place. Under the fine control of the negative pressure solenoid valve 308, the R-axis cylinder 412 is ventilated, and the R-axis clamping block 413 is pushed to firmly clamp the wafer 427. After the clamping is completed, the R-axis motor 410 reverses, and the R-axis arm 411 is pulled back to its original position.
[0110] Similarly, the operation process of the W-axis is similar. After the power of the W-axis motor 402 is optimized by the W-axis reducer 403, it drives the W-axis synchronous pulley 422 to rotate, and drives the W-axis synchronous belt 421, the W-axis synchronous belt mounting plate 423, and the W-axis slider 424 to be in place under the guidance of the W-axis guide rail 425.
[0111] After the W-axis sensor 408 confirms that the wafer 427 is in place, the W-axis cylinder 405 is ventilated under the control of the negative pressure solenoid valve 308, and the W-axis clamping block 407 is pushed to firmly clamp the wafer 427. Then the W-axis motor 402 reverses, and the W-axis arm 404 smoothly returns to the origin.
[0112] At this point, the entire wafer picking action is successfully completed. Each component of the robot cooperates perfectly, and the wafer picking process is completed efficiently and accurately.
[0113] The above are all preferred embodiments of this application, and do not limit the protection scope of this application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.
Claims
1. A five-axis wafer (427) robot, characterized in that, Including: An X-axis component (1) with a Z-axis component (2) mounted thereon; The Z-axis component (2) is equipped with a T-axis component (3), and the T-axis component (3) moves in the Z-axis direction; The T-axis component (3) has an RW-axis component (4) mounted thereon, and the RW-axis component (4) consists of an R-axis and a W-axis; The X-axis component (1) includes a robot backplane (101), a mover fixed seat (113), a sliding module, a head fixing block (108), a Z-axis mounting plate (109), an upper side cover plate (110), and a right side cover plate (111); A linear motor stator (102) and an X-axis grating (106) are mounted on the robot backplane (101); A linear motor mover (103) is mounted on the mover fixed seat (113); the linear motor stator (102) and the linear motor mover (103) cooperate to provide a power source for the X-axis component; The sliding module includes an X-axis guide rail (104) and an X-axis slider (105); the X-axis guide rail (104) is mounted on the robot backplane (101), the X-axis slider (105) is mounted on the mover fixed seat (113), and they are slidably connected between the X-axis guide rail (104) and the X-axis slider (105); The head fixing block (108) is mounted on the mover fixed seat (113), and an X-axis head (107) is provided on the head fixing block (108); the X-axis head (107) is used in cooperation with the X-axis grating (106) to provide position feedback for the movement; The Z-axis mounting plate (109) is mounted on the mover fixed seat (113) for mounting the Z-axis component (2); The upper side cover plate (110) and the right side cover plate (111) are mounted on the robot backplane (101) to protect the linear motor stator (102); The Z-axis component (2) includes a Z-axis backplane (201), a Z-axis servo motor (202), a bearing block (204), a Z-axis guide rail (208), and a Z-axis sensor (210); The Z-axis backplane (201) is mounted on the Z-axis mounting plate (109) for integrating and mounting all components of the Z-axis; The Z-axis servo motor (202) is mounted on the Z-axis backplane (201), the output rod of the Z-axis servo motor (202) is drivingly connected to a lead screw (205), a slide block (207) is threadedly connected to the lead screw (205), and a nut (206) is provided at one end of the lead screw (205) opposite to the Z-axis servo motor (202); the bearing block (204) is mounted on the Z-axis backplane (201) and cooperates with the lead screw (205); The slide block (207) is further provided with a Z-axis slider (209), a Z-axis sensor (210), and a sensor stop piece (211); The Z-axis guide rail (208) is fixed on the Z-axis backplane (201) and is used in conjunction with the Z-axis slider (209) to provide a guiding function for the Z-axis component; The Z-axis sensor (210) is fixed on the Z-axis backplane (201) and used in conjunction with the sensor baffle (211) to provide position feedback for the movement of the Z-axis. The T-axis assembly (3) includes a T-axis connecting plate (301), a T-axis mounting plate (302), a T-axis servo motor (303), a T-axis reducer (304), a hollow rotary table (305), a driver (307), and a negative pressure solenoid valve (308); the T-axis mounting plate (302) is mounted on the connecting plate (301), and the T-axis servo motor (303) is mounted on the T-axis reducer (304). The T-axis assembly (3) further includes that the T-axis reducer (304) is mounted on the hollow rotary table (305) to increase the torque and reduce the speed of the T-axis assembly (3). The hollow rotary table (305) is mounted on the T-axis mounting plate (302) to transmit the power provided by the T-axis servo motor (303). The driver (307) controls the movement of the T-axis servo motor (303). The RW-axis assembly (4) includes a bottom plate (401), a W-axis motor (402), a W-axis reducer (403), a W-axis arm (404), a W-axis cylinder (405), a W-axis tooth fork (406), a W-axis clamping block (407), an R-axis reducer (409), an R-axis motor (410), an R-axis arm (411), an R-axis cylinder (412), an R-axis clamping block (413), an R-axis sensor (414), an R-axis tooth fork (415), symmetrically arranged R-axis synchronous pulleys (416), an R-axis synchronous belt body (417), an R-axis synchronous belt mounting plate (418), an R-axis slider (419), an R-axis guide rail (420), a W-axis synchronous belt body (421), symmetrically arranged W-axis synchronous pulleys (422), a W-axis synchronous belt mounting plate (423), a W-axis slider (424), a W-axis slide rail (425), and a reducer fixing plate (426). The bottom plate (401) is fixed on the hollow rotary table; the W-axis motor (402) is mounted on the W-axis reducer (403), and the W-axis reducer (403) is mounted on the reducer fixing plate (426); the W-axis arm (404) is mounted on the W-axis slider (424). The W-axis cylinder (405) is fixed on the W-axis arm (404) and serves as a power component for clamping the wafer (427). The W-axis tooth fork (406) is mounted on the W-axis arm (404); the W-axis clamping block (407) is mounted on the W-axis cylinder (405). The R-axis reducer (409) is mounted on the reducer fixing plate (426), and the R-axis motor (410) is connected to the R-axis reducer (409) in a transmission manner; the R-axis arm (411) is mounted on the R-axis slider (419), the R-axis cylinder (412) is fixed on the W-axis arm (404), the R-axis clamping block (413) is mounted on the R-axis cylinder (412), and the R-axis tooth fork (415) is mounted on the R-axis arm (411) for carrying the wafer (427); the R-axis synchronous wheel (416) is mounted on the R-axis reducer (409) and transmits power through the R-axis synchronous belt body (417); the R-axis slider (419) is mounted under the R-axis synchronous belt mounting plate (418) and cooperates with the R-axis guide rail (420) to provide guidance for the R-axis assembly and ensure movement accuracy, and the R-axis guide rail (420) is mounted on the base plate (401); The W-axis synchronous belt body (421) is sleeved on the adjacent W-axis synchronous wheel (422) and is used to transmit power. The W-axis synchronous wheel (422) is installed on the W-axis reducer (403); the W-axis synchronous belt mounting plate (423) is installed on the W-axis slider (424) and is used to clamp the synchronous belt to transmit power to the W-axis slider (424). The W-axis slider (424) cooperates with the W-axis slide rail (425) to provide guidance for the W-axis assembly. The W-axis guide rail is installed on the base plate (401); The reducer fixing plate (426) is installed on the base plate (401), and the reducer fixing plate (426) is used to fix the R-axis reducer (409) and the W-axis reducer (403).
2. The five-axis wafer (427) robot according to claim 1, characterized in that: It also includes a coupling (203), wherein the coupling (203) is connected to the divisor shaft of the Z-axis servo motor (202).
3. A five-axis wafer (427) robot according to claim 1, characterized in that: The bearing seats (204) are symmetrically arranged, and the screw rod (205) passes through and cooperates with the two bearing seats (204).
4. A five-axis wafer (427) robot according to claim 1, characterized in that: It also includes an X-axis drag chain (112) and a Z-axis drag chain (212), wherein one end of the X-axis drag chain (112) is fixed on the manipulator back plate (101) and the other end is mounted on the mover fixing seat (113); one end of the Z-axis drag chain (212) is fixed on the Z-axis back plate (201) and the other end is fixed on the drag chain fixing plate (309); the X-axis drag chain (112) is used to protect cables.
5. A five-axis wafer (427) robot according to claim 1, characterized in that: It also includes an R-axis sensor (414) and a W-axis sensor (408), wherein the W-axis sensor (408) is mounted on the W-axis arm (404), and the R-axis sensor (414) is mounted on the R-axis arm (411), and the W-axis sensor (408) and the R-axis sensor (414) are used for in-situ detection of the wafer (427).
6. A five-axis wafer (427) robot according to claim 1, characterized in that: It also includes a negative pressure solenoid valve (308); the negative pressure solenoid valve (308) is used to switch the negative pressure of the R axis and the W axis.
7. A five-axis wafer (427) robot according to claim 1, characterized in that: It also includes an IO board (306), wherein the IO board (306) is installed in the T-axis assembly (3).
Citation Information
Patent Citations
Mechanical arm
CN110039530A
Semiconductor mechanical arm
CN110223948A
Multi-station manipulator for wafer interactive transmission
CN119993886A
Display apparatus and method of manufacturing the display apparatus
KR1020260082623A