A gauge pressure sensor weld joint detection system, method, and medium

Abstract

The application discloses a kind of gauge pressure sensor weld point detection system, method and medium, it is related to weld point detection technical field, solve the technical problem that cannot be checked to real-time operating environment when completing processing in prior art, cannot exclude the abnormal risk of electric parameter and mechanical parameter, specifically for non-destructive inspection, material detection and material surface detection are carried out to sensor weld point position, mark sensor weld point, obtain welding mode according to material analysis, complete welding mode determination, surface detection is carried out to sensor weld point;Operating environment inspection, operating environment inspection is carried out to the sensor weld point completed welding, obtain high-intensity sub-period and low-intensity sub-period, resistance influence detection is carried out according to period comparison, after sensor weld point resistance inspection is normal, each weld point is inputted specific electrical signal and specific electrical signal is synchronously collected and detected;Stress detection unit, stress detection is carried out to sensor weld point.

Description

Technical Field

[0001] This invention relates to the field of weld joint detection technology, specifically to a gauge pressure sensor weld joint detection system, method, and medium. Background Technology

[0002] A gauge pressure sensor is a sensor that can sense pressure relative to ambient pressure and convert it into a usable output signal; it uses ambient pressure as a reference and measures the difference between the measured pressure and the ambient pressure; the sensor solder joint is an important part that connects the internal circuit components of the sensor or the sensor to the external circuit, and plays a key role in the performance and reliability of the sensor.

[0003] However, in the existing technology, the welding method cannot be reasonably controlled according to the material and surface inspection during the processing of sensor solder joints, which cannot guarantee the processing quality of the solder joints. At the same time, it is not possible to check the real-time operating environment when the processing is completed, and it is not possible to eliminate the risk of abnormal electrical and mechanical parameters. In addition, stress detection cannot be performed during use, so additional impacts cannot be effectively managed.

[0004] To address the aforementioned technical shortcomings, a solution is proposed. Summary of the Invention

[0005] The purpose of this invention is to solve the problems mentioned above by providing a gauge pressure sensor solder joint detection system, method, and medium.

[0006] The objective of this invention can be achieved through the following technical solutions: A gauge pressure sensor weld joint detection system includes a weld joint detection center, which is communicatively connected to a non-destructive inspection unit, an operating environment inspection unit, and a stress detection unit. The non-destructive testing unit performs material testing and surface testing on the sensor solder joints, marks the sensor solder joints, and determines the welding method based on material analysis. After the welding method is determined, the surface of the sensor solder joints is tested. The operating environment inspection unit performs an operating environment inspection on the completed sensor weld joints, obtains high-intensity sub-time periods and low-intensity sub-time periods, performs resistance influence detection based on time period comparison, and after the sensor weld joint resistance check is normal, it inputs a specific electrical signal to each weld joint and outputs a specific electrical signal for synchronous acquisition and detection. The stress detection unit performs stress detection on the sensor solder joints.

[0007] As a preferred embodiment of the present invention, the process of the non-destructive inspection unit is as follows: The appropriate welding temperature range for the welding method corresponding to the sensor solder joint is collected to obtain the sensor surface deformation area. If the deformation of the sensor surface deformation area exceeds the set deformation threshold, the appropriate welding temperature range is adjusted and analyzed. If the deformation of the sensor surface deformation area does not exceed the set deformation threshold, it is inferred that the sensor material in the sensor solder joint area is suitable for the current welding method, and the current welding method is performed at the optimal temperature of the appropriate welding temperature range.

[0008] In a preferred embodiment of the present invention, under the current welding method, an image of the solder corresponding to the sensor solder joint is acquired, and the solder outline is obtained based on the acquired image. The image detection is used to determine whether the solder outline is meniscus and whether the solder currently forming a meniscus has deformation. If it is meniscus and there is no obvious deformation, it is inferred that the welding method is qualified; otherwise, if it is not meniscus or there is obvious deformation, it is inferred that the welding method is unqualified. The welding method execution judgment result is sent to the solder joint detection center in the form of a signal.

[0009] In a preferred embodiment of the present invention, the process of the operating environment checking unit is as follows: The sensor's operating time is collected and divided into several sub-time periods. Based on the workload of each sub-time period, the sub-time periods are further divided into high-intensity sub-time periods and low-intensity sub-time periods. The solder joint resistance at the corresponding progress time is obtained based on the high-intensity sub-period and the low-intensity sub-period. If the solder joint resistance at the corresponding progress point exceeds the solder joint resistance threshold, it is inferred that there is an anomaly at the current solder joint. Furthermore, if the current solder joint resistance shows an increasing trend during the increase of the sensor's running time, it is inferred that the solder joint has experienced solder displacement. At this point, the operation is stopped and a resistance risk signal is sent to the solder joint detection center, while the current solder joint is repaired.

[0010] In a preferred embodiment of the present invention, after the resistance of the sensor solder joint is checked to be normal, a specific electrical signal is input to each solder joint and a specific electrical signal is output synchronously acquired and detected. First, the input and output of a specific electrical signal are compared in time. If there is a time deviation, the surface signal is delayed. At the same time, the instructions of the input and output signals are identified. If there is a deviation in the measurement task within the instruction, the surface signal is attenuated. When the aforementioned delay and attenuation signals occur at the same time but not simultaneously, they are treated as occasional signal faults and continuously monitored. If the frequency of occasional signal faults continues to increase at adjacent times, a transmission-affecting signal will be generated. If the aforementioned delay and attenuation signals occur simultaneously at the same time, it is considered a signal transmission fault and the solder joint inspection center will conduct solder joint inspection. If the frequency of intermittent signal faults does not increase or there is no signal transmission fault, the electrical parameter test for the current period will be deemed qualified, and mechanical parameter test will be conducted.

[0011] In a preferred embodiment of the present invention, mechanical parameters of the sensor solder joints are detected during the current time period. The frequency and amplitude of external vibration experienced by the sensor during the current time period are collected and marked as mechanical parameters. Under the current mechanical parameter values, deformation of the solder surface of the sensor solder joints is collected. According to the alternation of high-intensity sub-time periods and low-intensity sub-time periods during the current time period, the growth rate of deformation of the solder surface and the duration of no change are collected. If the growth rate of deformation collected on the solder surface is within the set growth rate range, and the cumulative value of the duration of no change continues to increase, a mechanical parameter qualified signal is generated; if the growth rate of deformation collected on the solder surface is not within the set growth rate range, or the cumulative value of the duration of no change does not continue to increase, a mechanical parameter qualified signal is generated.

[0012] In a preferred embodiment of the present invention, the stress detection unit operates as follows: The set value of the solder joint spacing in the distribution sequence of the sensor solder joints is collected. The corresponding solder joint spacing position is collected according to the current set value. The position of the additional adjustment operation is obtained during the sensor use period. The minimum spacing value between the position of the additional adjustment operation and the endpoint position of the solder joint spacing is inferred by position comparison. When the minimum spacing value is lower than the set spacing threshold, the real-time surface deformation rate fluctuation span of the corresponding solder joint at the endpoint of the solder joint spacing is collected and marked as the assembly stress parameter; the highest temperature deviation of the sensor solder joint surface at the location of internal components with different operating temperature peaks is collected and marked as the thermal stress parameter.

[0013] In a preferred embodiment of the present invention, the assembly stress parameters and thermal stress parameters are compared with the speed fluctuation span threshold and the maximum temperature deviation threshold, respectively: If the assembly stress parameter exceeds the speed fluctuation span threshold, or the thermal stress parameter exceeds the maximum temperature deviation threshold, a stress influence signal is generated; if the assembly stress parameter does not exceed the speed fluctuation span threshold and the thermal stress parameter does not exceed the maximum temperature deviation threshold, a normal stress signal is generated.

[0014] As a preferred embodiment of the present invention, a method for detecting solder joints in a gauge pressure sensor is provided, and the specific method for detecting solder joints is as follows: Non-destructive testing, material testing and surface testing of sensor solder joints, marking of sensor solder joints and welding methods based on material analysis, and surface testing of sensor solder joints after determining the welding method; Operating environment check: The operating environment of the completed sensor weld joints is checked to obtain high-intensity sub-time periods and low-intensity sub-time periods. Resistance influence detection is performed based on the time period comparison. After the resistance of the sensor weld joints is normal, specific electrical signals are input to each weld joint and specific electrical signals are output synchronously collected and detected. The stress detection unit performs stress detection on the sensor solder joints.

[0015] As a preferred embodiment of the present invention, a storage medium is characterized in that it stores a computer program, which, when executed by a processor, implements the above-described method for detecting weld joints of a gauge pressure sensor.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, material detection and surface detection are performed on the sensor solder joint positions. By detecting the appearance of the solder joint positions, it is inferred whether there is a welding effect on the current sensor solder joints. This avoids poor solder joint setting effect caused by welding site selection deviation, which would prevent the welding function from being achieved. Surface detection allows for more intuitive sensor quality detection, improves operating efficiency, and enables more accurate measurement and monitoring of relative environmental pressure.

[0017] 2. In this invention, the operating environment of the completed sensor solder joints is checked, namely, the electrical and mechanical parameters of the sensor solder joints are detected. Based on the electrical and mechanical parameter detection, it is inferred whether the solder of the current solder joint meets the operating requirements of the current sensor position, so as to avoid the operating environment of the current position affecting the quality of the solder joint, which may lead to a decrease in the welding effect of the current area of ​​the solder joint and affect the qualification of the sensor. The solder joint inspection can also perform operational testing on each solder joint of the sensor to control the probability of the occurrence of the fault type related to the corresponding solder joint of the current sensor.

[0018] 3. In this invention, stress detection is performed on the sensor solder joints. By detecting the stress, it is inferred whether there are solder joints affecting the operation during the current operation, thereby reducing the external influence on the sensor solder joints, avoiding the solder joints from being subjected to additional stress, which increases the risk of deformation or cracking of the solder joints and reduces the reliability of the solder joints. Attached Figure Description

[0019] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the principle of the present invention; Figure 2 This is a schematic diagram of the implementation steps of the present invention. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] Please see Figure 1 As shown, a gauge pressure sensor weld joint detection system includes a weld joint detection center, which serves as the data aggregation center for the weld joint detection system. It is connected via communication to a non-destructive testing unit, an operating environment testing unit, and a stress detection unit. As the data aggregation center, it receives signals transmitted from each communication unit and provides weld joint detection warnings based on signal type, thereby enabling quality control of the gauge pressure sensor. This system is adapted to gauge pressure sensors, hereinafter referred to as sensors. It should be further explained that the flowchart of the entire implementation process of this system is as follows: Figure 2 As shown; in accordance with Figure 2 Corresponding execution order; The solder joint inspection center generates a non-destructive inspection signal and sends it to the non-destructive inspection unit. The non-destructive testing unit is used to receive non-destructive testing signals and, upon receiving such signals, to perform material and surface testing on the sensor solder joints. By examining the appearance of the solder joints, it infers whether there is any welding interference, thus avoiding poor solder joint setting due to welding location deviations and preventing welding from taking effect. Surface testing allows for more intuitive sensor quality inspection, improving operational efficiency and enabling more accurate measurement and identification of relative environmental pressure. The sensor solder joints are labeled and sorted by their location. The appropriate welding temperature range for each welding method is collected, and the sensor surface deformation area is obtained based on the location of the solder joints for sensor material detection. If the deformation of the sensor surface deformation area exceeds a set deformation threshold, the appropriate welding temperature range is adjusted and analyzed. For example, if the lowest temperature in the welding temperature range is used as the red line value and the welding temperature is lowered, and there is still a deviation between the peak value of the deformation temperature of the sensor surface material and the lowered red line value, it indicates that the welding method is suitable. Otherwise, the surface welding method is suitable, and the temperature corresponding to the welding method is adjusted within the appropriate welding temperature range. It should be noted that the area deformation is represented by the concave area or concave depth of the sensor surface region. If the deformation of the sensor surface deformation area does not exceed the set deformation threshold, it is inferred that the sensor material in the sensor solder joint area is compatible with the current welding method, and the current welding method is performed at the optimal temperature that is compatible with the welding temperature range. After determining the welding method, surface inspection is performed on the sensor solder joints. Under the current welding method, images of the solder corresponding to the sensor solder joints are acquired. The solder outline is obtained from the acquired images, and image inspection is used to determine whether the solder outline forms a meniscus and whether the solder currently forming a meniscus has any deformation. If it forms a meniscus and has no obvious deformation, the welding method is considered to be qualified; otherwise, if it does not form a meniscus or has obvious deformation, the welding method is considered to be unqualified. The welding method execution judgment result is sent to the solder joint inspection center in the form of a signal. The solder joint inspection center processes the solder joints according to the welding method execution judgment result. That is, if the welding method execution is unqualified, the area where the current solder is located is re-welded; otherwise, if the welding method execution is qualified, the welding work of the next solder joint is carried out. After completing the non-destructive inspection, the weld joints are inspected for effectiveness, which involves generating an operating environment inspection signal and sending the signal to the operating environment inspection unit. The operating environment inspection unit is used to inspect the operating environment of the completed sensor solder joints, namely, to detect the electrical and mechanical parameters of the sensor solder joints. Based on the detection of electrical and mechanical parameters, it infers whether the solder of the current solder joint meets the operating requirements of the current sensor position, so as to avoid the operating environment of the current position affecting the quality of the solder joint, which may lead to a decrease in the welding effect of the current area of ​​the solder joint and affect the qualification of the sensor. The solder joint inspection can also perform operational testing on each solder joint of the sensor to control the probability of the occurrence of the fault type related to the corresponding solder joint of the current sensor. The sensor's operating time is collected and divided into several sub-time periods, with the time interval between the two ends of each sub-time period being consistent. Based on the workload of each sub-time period, it is divided into high-intensity sub-time periods and low-intensity sub-time periods. The workload is represented by the span and frequency of the fluctuation of the environmental pressure value measured by the sensor. The larger the span or frequency of the fluctuation of the current value, the greater the workload. The solder joint resistance at the corresponding progress time is obtained based on the high-intensity sub-period and the low-intensity sub-period. The progress time at the same time is represented as the ratio of the current time of the sub-period to the total number of times of the sub-period. It should also be noted that the acquisition of high-intensity sub-period and low-intensity sub-period needs to overcome the impact of operation. That is, the total operation time of the acquisition period is close to that of the corresponding high-intensity sub-period and low-intensity sub-period. If the solder joint resistance exceeds the solder joint resistance threshold at the corresponding progress time, it is inferred that there is an anomaly at the current solder joint; and if the current solder joint resistance shows an increasing trend during the increase of the sensor's running time, it is inferred that the solder joint has experienced solder displacement. At this time, the operation is stopped and a resistance risk signal is sent to the solder joint detection center, and the current solder joint is repaired. After the resistance of the sensor solder joints is checked and found to be normal, specific electrical signals are input to each solder joint and specific electrical signals are output synchronously acquired and detected. It should be explained that the specific electrical signals are sensor operating signals, such as parameter acquisition, comparison of ambient pressure and the pressure of the measuring body, etc. First, the input and output of a specific electrical signal are compared in time. If there is a time deviation, the signal is delayed. At the same time, the instructions of the input and output signals are identified. If there is a deviation in the measurement task within the instruction, the signal is attenuated. Specifically, the pressure value of the current hour is collected by the external terminal and transmitted as a signal wave. Then the sensor collects the data according to the signal wave and executes the task. If the waveform changes and the corresponding collection time deviates, the signal is attenuated. When the aforementioned delay and attenuation signals occur at the same time but not simultaneously, they are treated as occasional signal faults and continuously monitored. If the frequency of occasional signal faults at adjacent times continues to increase, a transmission impact signal is generated and sent to the solder joint inspection center. After receiving the transmission impact signal, the solder joint inspection center inspects the solder joints at each location and performs resoldering or solder adjustment after inspection. When the aforementioned delay and attenuation signals occur simultaneously at the same time, it is considered a signal transmission fault and the solder joint inspection center will conduct solder joint inspection. If the frequency of intermittent signal faults does not increase or there are no signal transmission faults, the electrical parameter test for the current period is deemed qualified; and mechanical parameter testing is then performed. Mechanical parameters of the sensor solder joints are detected during the current time period. The frequency and amplitude of external vibrations experienced by the sensor during the current time period are collected and marked as mechanical parameters. Under the current mechanical parameter values, the deformation of the solder surface of the sensor solder joints is collected. It should be explained that the deformation of the solder surface can be obtained through image acquisition. The deformation is represented as the length or depth of the crack on the solder surface. Based on the alternation of high-intensity and low-intensity sub-periods within the current time period, the growth rate of deformation on the solder surface and the duration of no change are collected. The growth rate represents the rate of increase in the length or depth of the deformation crack on the solder surface within the current time period; the duration of no change represents the duration of no cracks or the duration of no change when cracks are present. If the growth rate of deformation collected on the solder surface is within the set growth rate range, and the cumulative value of the duration of no change continues to increase, it is inferred that the mechanical parameters of the current solder joint are qualified by the sensor, and a mechanical parameter qualified signal is generated and sent to the solder joint detection center. If the growth rate of deformation on the solder surface is not within the set growth rate range, or the cumulative value of the duration of no change does not continue to increase, it is inferred that the mechanical parameters of the current sensor solder joint are unqualified. A mechanical parameter qualified signal is generated and sent to the solder joint inspection center. The solder joint inspection center repairs the sensor solder joint for the current period to enhance mechanical performance and prevent solder joint deformation during operation, which would reduce the sensor's operating efficiency. After the current operating environment check is passed, a stress detection signal is generated and sent to the stress detection unit; The stress detection unit is used to detect stress on the sensor solder joints after receiving the stress detection signal. By detecting the stress, it can infer whether the solder joints affect the operation during the current process, thereby reducing the external influence on the sensor solder joints, avoiding the solder joints from being subjected to additional stress, increasing the risk of deformation or cracking of the solder joints, and reducing the reliability of the solder joints. The system collects the set value of the solder joint spacing in the distribution sequence of the sensor solder joints, collects the corresponding solder joint spacing position according to the current set value, and obtains the position of additional adjustment operation during the sensor use period. By comparing the positions, it infers the minimum spacing value between the position of additional adjustment operation and the endpoint position of the solder joint spacing. Additional adjustment operations include over-tightening screws, forcibly plugging and unplugging connecting wires, etc. When the minimum spacing value is lower than the set spacing threshold, the real-time surface deformation rate floating span of the endpoint weld of the corresponding weld point spacing is collected, and the real-time surface deformation rate floating span of the endpoint weld of the corresponding weld point spacing is marked as the assembly stress parameter. The peak operating temperature of the internal components at the sensor solder joint location is collected, and the highest temperature deviation of the sensor solder joint surface at the location of the internal components with different operating temperature peaks is collected. The highest temperature deviation of the sensor solder joint surface at the location of the internal components with different operating temperature peaks is marked as a thermal stress parameter. It should be explained that the highest temperature deviation is expressed as the numerical difference between the highest temperatures at two locations. The assembly stress parameters and thermal stress parameters are compared with the speed fluctuation span threshold and the maximum temperature deviation threshold, respectively: If the assembly stress parameter exceeds the speed fluctuation span threshold, or the thermal stress parameter exceeds the maximum temperature deviation threshold, it is inferred that the stress detection of the sensor solder joint is abnormal, a stress influence signal is generated and sent to the solder joint detection center. After receiving the stress influence signal, the solder joint detection center monitors each stress influence. If the assembly stress parameter does not exceed the speed fluctuation span threshold and the thermal stress parameter does not exceed the maximum temperature deviation threshold, it is inferred that the stress detection of the sensor solder joint is normal, a normal stress signal is generated, and the normal stress signal is sent to the solder joint detection center.

[0024] A method for detecting solder joints in a gauge pressure sensor, the specific method being as follows: Non-destructive testing, material testing and surface testing of sensor solder joints, marking of sensor solder joints and welding methods based on material analysis, and surface testing of sensor solder joints after determining the welding method; Operating environment check: The operating environment of the completed sensor weld joints is checked to obtain high-intensity sub-time periods and low-intensity sub-time periods. Resistance influence detection is performed based on the time period comparison. After the resistance of the sensor weld joints is normal, specific electrical signals are input to each weld joint and specific electrical signals are output synchronously collected and detected. The stress detection unit performs stress detection on the sensor solder joints.

[0025] Additionally, a storage medium stores a computer program that, when executed by a processor, implements the aforementioned method for detecting weld joints of a gauge pressure sensor.

[0026] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods.

[0027] Any references to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory.

[0028] By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0029] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0030] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A system for detecting weld joints of a gauge pressure sensor, characterized in that, This includes a weld joint inspection center, which has communication connections with a non-destructive testing unit, an operating environment inspection unit, and a stress testing unit. The non-destructive testing unit performs material testing and surface testing on the sensor solder joints, marks the sensor solder joints, and determines the welding method based on material analysis. After the welding method is determined, the surface of the sensor solder joints is tested. The operating environment check unit performs an operating environment check on the completed sensor weld joints, obtaining high-intensity and low-intensity sub-time periods. Based on the time period comparison, it performs resistance influence detection. After the sensor weld joint resistance check is normal, it synchronously acquires and detects specific electrical signals input and output to each weld joint. The process of the operating environment check unit is as follows: The sensor's operating time is collected and divided into several sub-time periods. Based on the workload of each sub-time period, the sub-time periods are further divided into high-intensity sub-time periods and low-intensity sub-time periods. The solder joint resistance at the corresponding progress time is obtained based on the high-intensity sub-period and the low-intensity sub-period. If the solder joint resistance exceeds the solder joint resistance threshold at the corresponding progress time, it is inferred that there is an anomaly at the current solder joint; and if the current solder joint resistance shows an increasing trend during the increase of the sensor's running time, it is inferred that the solder joint has experienced solder displacement. At this time, the operation is stopped and a resistance risk signal is sent to the solder joint detection center, and the current solder joint is repaired. After the resistance of the sensor solder joints is checked and found to be normal, specific electrical signals are input to each solder joint and specific electrical signals are output synchronously for acquisition and detection. First, the input and output of a specific electrical signal are compared in time. If there is a time deviation, the surface signal is delayed. At the same time, the instructions of the input and output signals are identified. If there is a deviation in the measurement task within the instruction, the surface signal is attenuated. When the delay and attenuation of the surface signal occur at the same time but not simultaneously, they are treated as occasional signal faults and continuously monitored. If the frequency of occasional signal faults continues to increase at adjacent times, a transmission-affecting signal will be generated. If the surface signal delay and attenuation occur simultaneously at the same time, it is considered a signal transmission fault and the solder joint inspection center will conduct solder joint inspection; if the frequency of intermittent signal faults does not increase or there is no signal transmission fault, the electrical parameter test for the current period is judged as qualified; and mechanical parameter test is performed. Mechanical parameters of the sensor solder joints are detected during the current time period. The frequency and amplitude of external vibration experienced by the sensor during the current time period are collected and marked as mechanical parameters. Under the current mechanical parameter values, the deformation of the solder surface of the sensor solder joints is collected. Based on the alternation of high-intensity and low-intensity sub-periods within the current time period, the growth rate of deformation on the solder surface and the duration of no change are collected. If the growth rate of deformation collected on the solder surface is within the set growth rate range, and the cumulative value of the duration of no change continues to increase, a mechanical parameter qualified signal is generated. If the growth rate of deformation collected on the solder surface is not within the set growth rate range, or the cumulative value of the duration of no change does not continue to increase, a mechanical parameter qualified signal will be generated. The stress detection unit performs stress detection on the sensor solder joints.

2. The gauge pressure sensor weld joint detection system according to claim 1, characterized in that, The process for non-destructive testing of the unit is as follows: The appropriate welding temperature range for the welding method corresponding to the sensor solder joint is collected to obtain the sensor surface deformation area. If the deformation of the sensor surface deformation area exceeds the set deformation threshold, the appropriate welding temperature range is adjusted and analyzed. If the deformation of the sensor surface deformation area does not exceed the set deformation threshold, it is inferred that the sensor material in the sensor solder joint area is suitable for the current welding method, and the current welding method is performed at the optimal temperature of the appropriate welding temperature range.

3. The gauge pressure sensor weld joint detection system according to claim 2, characterized in that, Under the current welding method, images of the solder corresponding to the sensor solder joint are acquired. The solder outline is obtained from the acquired images. The image detection determines whether the solder outline is meniscus and whether the solder that is currently meniscus has deformation. If it is meniscus and there is no obvious deformation, the welding method is considered to be qualified; otherwise, if it is not meniscus or there is obvious deformation, the welding method is considered to be unqualified. The welding method execution judgment result is sent to the solder joint detection center in the form of a signal.

4. The gauge pressure sensor weld joint detection system according to claim 1, characterized in that, The process of the stress detection unit is as follows: The set value of the solder joint spacing in the distribution sequence of the sensor solder joints is collected. The corresponding solder joint spacing position is collected according to the current set value. The position of the additional adjustment operation is obtained during the sensor use period. The minimum spacing value between the position of the additional adjustment operation and the endpoint position of the solder joint spacing is inferred by position comparison. When the minimum spacing value is lower than the set spacing threshold, the real-time surface deformation rate fluctuation span of the corresponding solder joint at the endpoint of the solder joint spacing is collected and marked as the assembly stress parameter; the highest temperature deviation of the sensor solder joint surface at the location of internal components with different operating temperature peaks is collected and marked as the thermal stress parameter.

5. The gauge pressure sensor weld joint detection system according to claim 4, characterized in that, The assembly stress parameters and thermal stress parameters are compared with the speed fluctuation span threshold and the maximum temperature deviation threshold, respectively: If the assembly stress parameter exceeds the speed fluctuation span threshold, or the thermal stress parameter exceeds the maximum temperature deviation threshold, a stress influence signal is generated; if the assembly stress parameter does not exceed the speed fluctuation span threshold and the thermal stress parameter does not exceed the maximum temperature deviation threshold, a normal stress signal is generated.

6. A method for detecting solder joints of a gauge pressure sensor, characterized in that, The application is a gauge pressure sensor weld joint detection system as described in any one of claims 1-5 above.

7. A storage medium, characterized in that, It stores a computer program, which, when executed by a processor, implements a method for detecting weld joints of a gauge pressure sensor as described in claim 6.

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