Circuit board and electronic equipment
Patent Information
- Application Number
- CN202311820711.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2025-07-04
AI Technical Summary
The existing through-axis circuit board solution weakens the strength of electronic devices, causing electronic devices to be easily deformed.
The circuit board connection section adopts a bifurcated design, and the first sub-segment and the second sub-segment are respectively arranged on the opposite sides of the center of the electronic device along the first direction. The shaft mechanism arranges the connection components in the central position to provide a fulcrum, enhance the support strength of the central position, and reasonably allocate the trace path to optimize signal transmission.
It improves the overall deformation resistance and signal transmission effect of electronic equipment, reduces the deformation amount of equipment, and improves the strength and signal quality of equipment.
Smart Images

Figure CN120264569A_ABST