一种MiniLED封装测试方法及测试设备

By combining beam irradiation and quantum dot fluorescent labeling with surface plasmon resonance and acoustic stimulation, the problem of performance degradation of micro-optical structures in Mini LED packaging testing was solved, enabling accurate evaluation and performance prediction of functionally sensitive areas and improving the reliability assessment capability of Mini LED packaging.

CN120275357BActive Publication Date: 2026-07-17SHENZHEN TONGXING HIGH TECHINDUTION EQUIP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN TONGXING HIGH TECHINDUTION EQUIP CO LTD
Filing Date
2025-05-29
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing Mini LED packaging testing methods are unable to accurately predict the long-term performance of Mini LED packages with integrated micro-optical structures in real-world application environments, and cannot effectively identify potential early failure signs. Traditional accelerated aging tests cannot reflect the performance degradation mechanism of micro-optical structures.

Method used

Interference patterns are obtained by external light beam illumination, and functionally sensitive regions are determined by comparison with theoretical models. Quantum dot fluorescent markers are injected for monitoring. Surface plasmon resonance spectroscopy scanning and acoustic stimulation are used, combined with nonlinear optical material layers to record performance degradation, to achieve multispectral dynamic monitoring and performance prediction of functionally sensitive regions.

Benefits of technology

It can accurately identify functionally sensitive areas, monitor the working status of micro-optical structures in real time, detect potential defects early, quantify the degree of performance degradation, predict future trends, and improve the accuracy of reliability assessment for Mini LED packaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明公开一种Mini LED封装测试方法及测试设备,包括:利用反向光路追踪技术对Mini LED封装进行光照射获得干涉图样并确定功能敏感区域;向功能敏感区域注入量子点荧光标记物进行多光谱动态监测;对功能敏感区域进行表面等离子体共振光谱扫描获得表面等离子体共振响应数据;根据获得的数据对功能敏感区域进行声波刺激测试获得声学响应数据;利用非线性光学材料层进行补偿测试获得性能衰减预测数据。本发明技术方案实现了对Mini LED封装中微型光学结构的精确检测和性能预测,能够有效识别潜在的早期失效征兆。
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