Integrated circuit packaging product and packaging method
By improving the film layer design and laser process to remove some film layers, the carrier plate stress problems and poor convex cracks caused by the film layer are solved, and the quality and reliability of integrated circuit packaging products are improved.
CN120280352APending Publication Date: 2025-07-08SUZHOU ASEN SEMICON CO LTD
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Patent Information
- Application Number
- CN202510229411.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2025-07-08
AI Technical Summary
Technical Problem
In the prior art, the film layer causes the carrier plate stress to be reduced, the bump cracks are poor and the film layer peeling risk is high, which affects the quality and reliability of integrated circuit packaging products.
Method used
By improving the film layer design and packaging process, laser process is used to remove part of the film layer, retain the cavity position and perform plastic sealing, optimize the bonding effect of the carrier plate and other materials, and adapt to the treatment of different film layer thicknesses.
Benefits of technology
It improves the stability of the packaging structure, reduces the defect rate of convex cracks, improves product quality and reliability, and improves production efficiency.
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Smart Images
Figure CN120280352A_ABST
Abstract
The invention discloses an integrated circuit packaging product and a packaging method, and belongs to the technical field of integrated circuit packaging. The packaging method comprises the following steps: preparing a carrier plate; carrying plate surface mounting, wherein elements are welded on the corresponding product units on the carrying plate through protruding blocks; carrying plate film covering: carrying out film covering on the carrying plate and the element, and forming a cavity between the covering film and the bare chip and between the covering film and the carrying plate; laser film removal: removing a film layer covering the support plate outside the cavity through a laser process to ensure that part of the surface of the support plate is exposed; and carrying out plastic packaging on the product, namely carrying out plastic packaging on the carrier plate and the element through a plastic packaging material so as to protect the product. According to the invention, only the necessary cavity position and the reserved protective area are reserved, so that the impact of the plastic package material in the packaging process can be effectively resisted, the stability of the packaging structure is improved, the good performance of the product can be still maintained in a complex working environment, the performance of the product can be improved, the reject ratio is reduced, and the production cost is reduced. The production efficiency and the product quality are improved.
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