Gas-liquid double-cooling three-dimensional heat dissipation device
Through the gas-liquid dual-cooling three-dimensional heat dissipation device, the combination of the temperature uniform plate and the water-cooling head is used to achieve efficient heat dissipation effect, solve the problem of insufficient heat dissipation of electronic components and improve the overall performance of electronic devices.
Patent Information
- Application Number
- CN202411098694.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-11
- Filing Date
- 2024-08-12
- Publication Date
- 2025-07-11
AI Technical Summary
The prior art is difficult to effectively improve the heat dissipation efficiency of electronic components such as central processors and drawing chips in electronic devices, resulting in their working temperature being too high, affecting the overall performance of electronic devices.
The gas-liquid dual-cooled three-dimensional heat dissipation device is adopted, which includes a temperature equalization plate module and a water cooling head. The temperature equalization plate is used to directly contact the heat source, and the heat dissipation liquid circulation is carried out through the fluid-connected heat pipe and the water cooling head. Combined with the fan and the heat dissipation fin module, it can achieve efficient heat dissipation.
The heat dissipation efficiency of the electronic device is significantly improved, the working temperature of the computing chip is reduced, and the overall working efficiency of the electronic device is improved.
Smart Images
Figure CN120295435A_ABST