An embedded microchannel heat spreader for an electronic chip

Abstract

This invention discloses an embedded shunt microchannel heat sink for electronic chips, specifically relating to the field of heat dissipation device technology. It includes two symmetrically distributed protective shells (shell 1), with a second protective shell (shell 2) located below each of the two shells. A circulation assembly is fixedly installed on the inner surface of each of the two shells (shell 1). Three heat exchange components are linearly arrayed and fixedly installed at the ends of the two shells (shell 1 and shell 2) that are close to each other. This embedded shunt microchannel heat sink for electronic chips, through its circulation assembly, enables sufficient heat exchange between the coolant and the chip, thereby improving the heat dissipation efficiency. The heat exchange components dissipate heat from the coolant inside the heat exchange channels. Furthermore, their special shape enhances heat exchange efficiency with external air during the heat exchange process, thus improving the heat dissipation efficiency for both the coolant and the chip.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation device technology, and in particular to an embedded shunt microchannel heat sink for electronic chips. Background Technology

[0002] Embedded shunt microchannel heat sinks are a high-efficiency technology for heat dissipation of electronic chips. They create efficient heat conduction channels between the chip surface and the heat sink by embedding microchannels inside the heat sink. The channels contain liquid, such as water or other coolant, which flows through these channels to carry away the heat generated by the electronic components.

[0003] Compared to traditional heat sinks, shunt microchannel heat sinks offer higher thermal management efficiency. Due to the high surface area and small size of the microchannels, heat conduction speed can be significantly improved and thermal resistance reduced. In addition, the embedded design allows the heat sink to be tightly integrated with the electronic chip, effectively avoiding heat concentration, thereby improving the stability and performance of the chip. This technology is particularly suitable for electronic products with high power density or requiring precise heat dissipation, such as high-performance processors, power amplifiers, and high-efficiency power modules.

[0004] Chinese patent document CN118263209A discloses an embedded shunt microchannel heat sink for electronic chips, belonging to the field of heat sinks. It features multiple shunt micro-units within the flow channel, each containing recesses and flow-disrupting elements. These flow-disrupting elements gradually widen from the inlet to the outlet and are staggered from left to right. This staggered, gradually changing periodic arrangement effectively avoids excessively long, unstructured regions between two sets of microstructures. The gradually widening flow-disrupting elements along the flow direction allow for more efficient utilization of the coolant, significantly reducing high-temperature and low-temperature regions on the heat exchange surface of the microchannel heat sink. This patent document helps reduce the temperature gradient along the flow direction, resulting in a more uniform temperature distribution on the heat dissipation surface, thereby reducing thermal stress. Furthermore, this embedded structure is small in size and lightweight, with the chip heat source and heat sink in close contact, resulting in a large temperature difference and high heat dissipation efficiency.

[0005] While the device described in the aforementioned patent document can dissipate heat from the chip during use, it lacks the ability to circulate and cool the cooled liquid after heat dissipation. This may cause the coolant to remain at a high temperature, leading to excessive chip temperature and overload. Summary of the Invention

[0006] The main objective of this invention is to provide an embedded shunt microchannel heat sink for electronic chips, which can effectively solve the problem of insufficient circulation cooling of the cooled liquid in actual processes, which may cause the coolant to remain at a high temperature, resulting in excessive chip temperature and overload.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] An embedded shunt microchannel heat sink for an electronic chip includes two protective shells symmetrically distributed on the left and right sides. A second protective shell is provided on the lower side of each of the two protective shells. A one-way valve is fixedly connected to the adjacent ends of the left protective shell and the left protective shell. A support platform is fixedly connected to the adjacent right ends of the right protective shell and the right protective shell. A micro booster pump is fixedly connected to the adjacent ends of the two support platforms. A circulation assembly is fixedly installed on the inner surface of each of the two protective shells. Three heat exchange components are linearly arrayed and fixedly installed at the adjacent ends of the two protective shells and the adjacent ends of the two protective shells. Three mounting holes are linearly arrayed at the adjacent ends of the two protective shells and the adjacent ends of the two protective shells.

[0009] Preferably, the circulation assembly includes two L-shaped rods fixedly connected to the bottom walls of the two protective shells, the two L-shaped rods being symmetrically distributed from left to right. Two L-shaped rods are fixedly connected to the top walls of the two protective shells. Three connecting pipes are linearly arrayed and fixedly connected to the outer surfaces of the two L-shaped rods and the outer surfaces of the two L-shaped rods that are close to each other. A heat exchange tube is fixedly connected to the ends of the connecting pipes located on the left and right sides that are close to each other. A liquid inlet pipe is fixedly connected to the upper part of the outer surface of the left L-shaped rod, extending through the protective shell on the same side to the outside. A threaded cap is threaded to the upper end of the liquid inlet pipe. A turbulence-inducing assembly is fixedly installed on the inner surface of the right L-shaped rod, and a connecting assembly is fixedly installed on the lower part of the inner surface of the right L-shaped rod. The connecting pipes on the same side are respectively located on the inner surface of the mounting holes on the same side.

[0010] Preferably, the lower end of the L-shaped rod one on the left is fixedly connected to the output end of the one-way valve, the upper end of the L-shaped rod two on the left is fixedly connected to the input end of the one-way valve, and the upper end of the L-shaped rod two on the right is fixedly connected to the output end of the micro booster pump.

[0011] Preferably, the turbulence assembly includes a mounting rod fixedly connected to the upper part of an inner surface of the L-shaped rod on the right side, and two hollow cylinders are rotatably connected to the outer surface of the mounting rod in a linear array. A rotating column is fixedly connected to the outer surface of each of the two hollow cylinders, and a plurality of stirring blades are fixedly connected to the outer surface of each of the two rotating columns in a ring array.

[0012] Preferably, several interference flow blocks are linearly arrayed and fixedly connected to the inner surface of the L-shaped rod on the right side.

[0013] Preferably, both rotating columns are conical and the stirring blades are arc-shaped.

[0014] Preferably, the connecting assembly includes a main tube, the outer surface of which is fixedly connected to the lower part of the inner surface of the L-shaped rod, and a secondary tube is fixedly connected to the lower part of the inner surface of the main tube, the secondary tube being fixedly connected to the input end of the micro booster pump.

[0015] Preferably, the heat exchange assembly includes six irregularly shaped heat exchange fins. The left and right ends of the three irregularly shaped heat exchange fins located on the upper side are respectively fixedly connected to the right end of the first protective shell on the left side and the right end of the first protective shell on the right side. The left and right ends of the three irregularly shaped heat exchange fins located on the lower side are respectively fixedly connected to the right end of the second protective shell on the left side and the right end of the first protective shell on the right side. Each of the six irregularly shaped heat exchange fins has a placement hole extending through to the right side of the inner surface on the left side.

[0016] Preferably, the six heat exchange tubes are located inside the six placement holes, and the six irregular heat exchange fins are arranged in several X shapes.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention, through the set circulation component, can achieve sufficient heat exchange of the coolant when the coolant exchanges heat with the chip, thereby improving the heat dissipation efficiency of the chip. In addition, during the heat dissipation process, it can be used with a one-way valve and a micro booster pump to achieve the effect of circulating heat exchange.

[0019] 2. The present invention can dissipate heat from the coolant inside the heat exchange pipe by setting the heat exchange component. In addition, the special shape of the component can improve the heat exchange efficiency with the outside air during the heat exchange process, thereby improving the heat dissipation efficiency of the coolant and the chip. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention from another perspective;

[0022] Figure 3 This is a schematic diagram showing the complete location of the loop component structure of the present invention;

[0023] Figure 4 This is a partial cross-sectional view of the present invention;

[0024] Figure 5 This is a schematic diagram of the heat exchange component structure of the present invention;

[0025] Figure 6 This is a partial structural diagram of the circulation component of the present invention;

[0026] Figure 7 This is a schematic diagram of a half-section of the turbulence component of the present invention;

[0027] Figure 8 This is a schematic diagram of the turbulence component structure of the present invention;

[0028] Figure 9 This is a partial cross-sectional view of the present invention;

[0029] Figure 10 For the present invention Figure 4 Enlarged schematic diagram of the structure at point A in the middle.

[0030] In the diagram: 1. Protective shell one; 2. Protective shell two; 3. One-way valve; 4. Support platform; 5. Miniature booster pump; 6. Circulation assembly; 61. L-shaped rod one; 60. L-shaped rod two; 62. Connecting pipe; 63. Heat exchange tube; 64. Liquid filling pipe; 65. Threaded cap; 66. Turbulence assembly; 661. Mounting rod; 662. Hollow cylinder; 663. Rotating column; 664. Stirring blade; 665. Turbulence block; 67. Connecting assembly; 671. Main pipe; 672. Secondary pipe; 7. Heat exchange assembly; 71. Irregular heat exchange fins; 72. Placement hole; 8. Mounting hole. Detailed Implementation

[0031] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0032] Example 1, as Figure 1 and Figure 2 As shown, an embedded shunt microchannel heat sink for an electronic chip includes two protective shells 1 arranged symmetrically on the left and right sides. Each of the two protective shells 1 has a second protective shell 2 on its lower side. A one-way valve 3 is fixedly connected to the end of the left protective shell 1 and the end of the left protective shell 2 that are close to each other. A support platform 4 is fixedly connected to the right end of the right protective shell 1 and the right protective shell 2 that are close to each other. A micro booster pump 5 is fixedly connected to the end of the two support platforms 4 that are close to each other. A circulation assembly 6 is fixedly installed on the inner surface of each of the two protective shells 1. Through the circulation assembly 6, sufficient heat exchange can be achieved when the coolant exchanges heat with the chip, thereby improving the heat dissipation efficiency of the chip. Furthermore, during the heat dissipation process, the one-way valve 3 and the micro booster pump 5 can work together to achieve a circulating heat exchange effect.

[0033] Three heat exchange components 7 are linearly arrayed and fixedly installed at the ends of the two protective shells 1 and the two protective shells 2 that are close to each other. Through the heat exchange components 7, the coolant inside the heat exchange pipe can be cooled. In addition, through its special shape, the heat exchange efficiency with the outside air can be improved during the heat exchange process, thereby improving the subsequent heat dissipation efficiency of the coolant and the chip.

[0034] Three mounting holes 8 are linearly arranged at the ends of the two protective shells 1 and 2 that are close to each other.

[0035] Example 2: Based on Example 1, this example aims to achieve effective heat exchange for the chip.

[0036] For details, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 9 The circulation component 6 includes two L-shaped rods 61 fixedly connected to the bottom walls of two protective shells 1. The two L-shaped rods 61 are symmetrically distributed from left to right. The top walls of the two protective shells 2 are fixedly connected to L-shaped rods 60. Three connecting pipes 62 are linearly arrayed and fixedly connected to the sides of the outer surfaces of the two L-shaped rods 61 and the sides of the outer surfaces of the two L-shaped rods 60 that are close to each other. Heat exchange pipes 63 are fixedly connected to the ends of the connecting pipes 62 on the left and right sides that are close to each other. A liquid adding pipe 64 is fixedly connected to the upper part of the outer surface of the left L-shaped rod 61. The upper part of the outer surface of the liquid adding pipe 64 extends through the protective shell 1 on the same side to the outside. A threaded cap 65 is threadedly connected to the upper end of the liquid adding pipe 64. A turbulence emulator 66 is fixedly installed on the inner surface of the right L-shaped rod 61. A connecting assembly 67 is fixedly installed on the lower part of the inner surface of the right L-shaped rod 61. The connecting pipes 62 on the same side are respectively located on the inner surface of the mounting holes 8 on the same side.

[0037] Furthermore, the lower end of the left-side L-shaped rod 61 is fixedly connected to the output end of the one-way valve 3, the upper end of the left-side L-shaped rod 60 is fixedly connected to the input end of the one-way valve 3, and the upper end of the right-side L-shaped rod 60 is fixedly connected to the output end of the micro booster pump 5.

[0038] Furthermore, the connecting assembly 67 includes a main pipe 671, the outer surface of which is fixedly connected to the lower part of the inner surface of the L-shaped rod 61, and a secondary pipe 672 is fixedly connected to the lower part of the inner surface of the main pipe 671. The secondary pipe 672 is fixedly connected to the input end of the micro booster pump 5.

[0039] Furthermore, the heat exchange assembly 7 includes six irregularly shaped heat exchange fins 71. The left and right ends of the three irregularly shaped heat exchange fins 71 located on the upper side are fixedly connected to the right ends of the left protective shell 1 and the right protective shell 1, respectively. The left and right ends of the three irregularly shaped heat exchange fins 71 located on the lower side are fixedly connected to the right ends of the left protective shell 2 and the right protective shell 1, respectively. Each of the six irregularly shaped heat exchange fins 71 has a placement hole 72 extending through to the right side of the inner surface on the left side.

[0040] Furthermore, the six heat exchange tubes 63 are located inside the six placement holes 72, and the six irregular heat exchange fins 71 are arranged in several X shapes.

[0041] Before using the device, the rear ends of the two protective shells 1 and 2 can be installed on both sides of the chip using snap-fit ​​or any snap-fit ​​method in the prior art. Usually, bolts, clamps and other common installation methods in the prior art are used to install the device on both sides of the chip to ensure stable contact.

[0042] Therefore, the installation methods described above are all conventional designs in the existing technology. In this solution, it is only necessary to install the protective shell 1 and the protective shell 2 on both sides of the chip. This solution will not be elaborated in detail.

[0043] After the protective shell 1 and the protective shell 2 are installed on both sides of the chip, the rear ends of the six heat exchange components 7 are attached to the chip surface. As mentioned above, the six irregular heat exchange fins 71 are arranged in several X shapes. By setting the irregular heat exchange fins 71 in an X shape, compared with the traditional straight irregular heat exchange fins 71, the heat dissipation surface area can be effectively increased, and more surface is exposed to the air, thereby improving the heat conduction and dissipation efficiency. The X-shaped design helps to optimize the airflow path, so that the airflow passes through the heat dissipation fins more evenly, reducing dead corners and local airflow too fast, thereby improving heat dissipation efficiency. By increasing the surface area and improving airflow, the X-shaped irregular heat exchange fins 71 can effectively improve heat dissipation performance, especially under high heat load, it can remove heat more quickly and reduce temperature.

[0044] When the micro booster pump 5 is started, as mentioned above, the lower end of the left L-shaped rod 61 is fixedly connected to the output end of the one-way valve 3, the upper end of the left L-shaped rod 60 is fixedly connected to the input end of the one-way valve 3, and the upper end of the right L-shaped rod 60 is fixedly connected to the output end of the micro booster pump 5. The secondary pipe 672 is fixedly connected to the input end of the micro booster pump 5. Therefore, the output end of the micro booster pump 5 can transfer the coolant inside the right L-shaped rod 61 from the main pipe 671 and the secondary pipe 672 to the L-shaped rod 60 fixedly connected to its input end. The thrust generated during the transfer can transfer the coolant from the three heat exchange tubes 63 on the lower side into the L-shaped rod 60 on the right side. The six heat exchange tubes 63 are located inside the six placement holes 72. Therefore, during the process of the coolant flowing from the three heat exchange tubes 63 on the lower side into the left L-shaped rod 60, the coolant undergoes a heat exchange process. Under the heat exchange effect of the fins 71, the heat inside the heat exchange tube 63 can be transferred into the air, thereby reducing the temperature of the coolant. Then, the coolant is pushed upward by the output end of the micro booster pump 5 through the second L-shaped rod 60 on the left and transferred into the input end of the one-way valve 3. Then, it is transferred again from the output end of the one-way valve 3 into the first L-shaped rod 61 on the left, and then drawn into the three heat exchange tubes 63 on the upper side. The heat exchange process between the three heat exchange tubes 63 on the upper side and the irregular heat exchange fins 71 is the same as the heat exchange process described above. Please refer to the above operation steps for details, so they will not be described in detail. The coolant after heat exchange in the three heat exchange tubes 63 on the upper side will be drawn back into the first L-shaped rod 61 on the right side by the input end of the micro booster pump 5 for reciprocating operation. The one-way valve 3 can prevent the coolant from flowing back into the second L-shaped rod 60 fixedly connected to its output end.

[0045] When coolant needs to be added after prolonged use, simply rotate the threaded cap 65 to open it and add coolant from the filling tube 64 into the L-shaped rod 61 on the left side. Then rotate the threaded cap 65 back on.

[0046] Therefore, the circulation component 6 can work in conjunction with the heat exchange component 7 to perform heat exchange and heat dissipation on the coolant after heat exchange on the chip surface, thereby improving the efficiency of subsequent chip heat dissipation.

[0047] The one-way valve 3 and the miniature booster pump 5 mentioned above are both conventional designs in the prior art. Their specific working principles are as follows:

[0048] One-way valve 3:

[0049] When the fluid flows in the designed direction, the fluid pressure pushes the valve disc or valve plate to open, and the fluid can pass freely through the check valve 3. When the fluid flows, the valve disc in the check valve 3 is pushed open by the pressure, allowing the fluid to flow through the valve seat.

[0050] When the fluid attempts to flow in the opposite direction, the fluid pressure acts on the valve disc in the opposite direction, causing the valve disc to close or come into tight contact with the valve seat, preventing the fluid from passing through the check valve 3. At this time, the check valve 3 acts as a check valve to prevent the fluid from flowing back.

[0051] Miniature booster pump 5:

[0052] When the micro booster pump 5 is started, the air inlet or liquid inlet of the micro booster pump 5 begins to draw in liquid or gas from the outside. Depending on the type of pump, the working elements inside the micro booster pump 5, such as piston, diaphragm, gear, screw, etc., begin to move and draw the fluid into the pump chamber.

[0053] Through the mechanical structure inside the micro booster pump 5, such as pistons, diaphragms, gears, etc., the fluid is compressed or pushed into a smaller space. During this process, the fluid inside the micro booster pump 5 is compressed by mechanical movement, resulting in an increase in fluid pressure.

[0054] Therefore, the one-way valve 3 and the micro booster pump 5 mentioned above are conventional settings in the prior art. Their specific installation methods, circuit connection methods and control methods are all conventional designs, and this solution will not elaborate on them in detail.

[0055] Example 3 is based on Example 2, and aims to achieve the purpose of turbulent heat dissipation of the coolant after heat exchange.

[0056] For details, please refer to Figure 4 , Figure 7 , Figure 8 and Figure 10 The turbulence assembly 66 includes a mounting rod 661 fixedly connected to the upper part of the inner surface of the right-side L-shaped rod 61. Two hollow cylinders 662 are rotatably connected to the outer surface of the mounting rod 661 in a linear array. Rotating columns 663 are fixedly connected to the outer surfaces of the two hollow cylinders 662. Several stirring blades 664 are fixedly connected to the outer surfaces of the two rotating columns 663 in a ring array.

[0057] Furthermore, several interference flow blocks 665 are fixedly connected to the inner surface of the L-shaped rod 61 on the right side in a linear array.

[0058] Furthermore, both rotating columns 663 are conical in shape, and the various stirring blades 664 are arc-shaped.

[0059] When the three heat exchange tubes 63 on the upper side exchange heat with the coolant and then draw it into the L-shaped rod 61 on the right side through the input end of the micro booster pump 5, the two rotating columns 663 are located below the uppermost heat exchange tube 63 and the upper middle heat exchange tube 63, respectively. Both rotating columns 663 are conical, and the stirring blades 664 are arc-shaped. Therefore, when the coolant impacts the surface of the rotating columns 663, the water flow flows along the surface of the rotating columns 663 and impacts the surface of the stirring blades 664. The kinetic energy and pressure of the water flow act on the surface of the stirring blades 664. Since the stirring blades 664 are arc-shaped, the water flow can drive the stirring blades 664 to drive the rotating columns 663 and the hollow cylinder 662 to rotate on the surface of the mounting rod 661, generating mechanical energy. This achieves the effect of stirring the coolant after heat exchange. After the coolant is stirred, its internal temperature can be kept consistent, avoiding the situation where the temperature at the beginning and end is inconsistent, which would reduce the subsequent heat exchange effect.

[0060] Furthermore, this solution uses a linear array of interference flow blocks 665 fixedly connected to the inner surface of the L-shaped rod 61 on the right side. When the coolant enters the L-shaped rod 61 on the right side, the coolant will impact the surface of the interference flow blocks 665, thereby generating a turbulence effect. The turbulence can change the flow path of the coolant and reduce the stagnant zone of the coolant near the heat exchange surface, thereby improving the convective heat transfer capacity between the coolant and the heat exchange surface. Through turbulence, the coolant flow becomes more irregular and generates more turbulence, which helps to improve the heat exchange efficiency of the fluid because turbulence can effectively enhance the heat transfer between the fluid and the hot surface.

[0061] Turbulence increases the instability of fluid flow, causing the coolant to flow in turbulent flow. Turbulence can disrupt the boundary layer of the coolant, allowing heat to be carried away from the heat source surface more quickly, reducing thermal resistance. Increased fluid turbulence makes the heat distribution in the coolant more uniform, thereby improving the overall cooling efficiency. Compared with laminar flow, turbulence can effectively promote heat transfer.

[0062] Turbulence also helps the coolant flow more evenly, preventing localized overheating or undercooling when the coolant flows over the heat exchange surface. Without turbulence, the coolant flow may cause some areas to be hotter, resulting in uneven heat exchange and affecting the overall cooling effect. Turbulence balances the coolant flow rate and temperature distribution, avoiding these problems and ensuring stable operation of the heat exchange process.

[0063] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. An embedded shunt microchannel heat sink for an electronic chip, comprising two protective shells symmetrically distributed on the left and right sides (1), characterized in that: Both of the protective shells (1) are provided with a protective shell (2) on their lower sides. A one-way valve (3) is fixedly connected to the end of the protective shell (1) on the left side and the protective shell (2) on the left side that are close to each other. A support platform (4) is fixedly connected to the right end of the protective shell (1) on the right side and the protective shell (2) on the right side that are close to each other. A micro booster pump (5) is fixedly connected to the end of the two support platforms (4) that are close to each other. A circulation component (6) is fixedly installed on the inner surface of both of the protective shells (1). Three heat exchange components (7) are fixedly installed in a linear array at the end of the two protective shells (1) and the end of the two protective shells (2) that are close to each other. Three mounting holes (8) are opened in a linear array at the end of the two protective shells (1) and the end of the two protective shells (2) that are close to each other. The circulation component (6) includes two L-shaped rods (61) fixedly connected to the bottom walls of the two protective shells (1). The two L-shaped rods (61) are symmetrically distributed from left to right. The top walls of the two protective shells (2) are fixedly connected to L-shaped rods (60). The outer surfaces of the two L-shaped rods (61) and the outer surfaces of the two L-shaped rods (60) are linearly arrayed and fixedly connected to three connecting pipes (62). The ends of the connecting pipes (62) on the left and the connecting pipes (62) on the right are fixed together. A heat exchange tube (63) is connected to the upper part of the outer surface of the L-shaped rod (61) on the left side, and a liquid filling tube (64) is fixedly connected to the upper part of the outer surface of the liquid filling tube (64) through the protective shell (1) on the same side to the outside. A threaded cap (65) is threadedly connected to the upper end of the liquid filling tube (64). A turbulence emulator (66) is fixedly installed on the inner surface of the L-shaped rod (61) on the right side, and a connecting assembly (67) is fixedly installed on the lower part of the inner surface of the L-shaped rod (61) on the right side. The connecting tubes (62) on the same side are respectively located on the inner surface of the mounting holes (8) on the same side.

2. The embedded shunt microchannel heat sink for an electronic chip according to claim 1, characterized in that: The lower end of the L-shaped rod (61) on the left is fixedly connected to the output end of the one-way valve (3), the upper end of the L-shaped rod (60) on the left is fixedly connected to the input end of the one-way valve (3), and the upper end of the L-shaped rod (60) on the right is fixedly connected to the output end of the micro booster pump (5).

3. The embedded shunt microchannel heat sink for an electronic chip according to claim 2, characterized in that: The turbulence assembly (66) includes a mounting rod (661) fixedly connected to the upper part of the inner surface of the L-shaped rod (61) on the right side. Two hollow cylinders (662) are rotatably connected to the outer surface of the mounting rod (661) in a linear array. Rotating columns (663) are fixedly connected to the outer surfaces of the two hollow cylinders (662). Several stirring blades (664) are fixedly connected to the outer surfaces of the two rotating columns (663) in a ring array.

4. The embedded shunt microchannel heat sink for an electronic chip according to claim 3, characterized in that: Several interference flow blocks (665) are fixedly connected to the inner surface of the L-shaped rod (61) on the right side in a linear array.

5. An embedded shunt microchannel heat sink for an electronic chip according to claim 3, characterized in that: Both of the rotating columns (663) are conical, and the stirring blades (664) are arc-shaped.

6. The embedded shunt microchannel heat sink for an electronic chip according to claim 1, characterized in that: The connecting assembly (67) includes a main tube (671), the outer surface of which is fixedly connected to the lower part of the inner surface of the L-shaped rod (61), and a secondary tube (672) is fixedly connected to the lower part of the inner surface of the main tube (671). The secondary tube (672) is fixedly connected to the input end of the micro booster pump (5).

7. An embedded shunt microchannel heat sink for an electronic chip according to claim 1, characterized in that: The heat exchange assembly (7) includes six irregular heat exchange fins (71). The left and right ends of the three irregular heat exchange fins (71) located on the upper side are fixedly connected to the right end of the protective shell 1 (1) located on the left side and the right end of the protective shell 1 (1) located on the right side, respectively. The left and right ends of the three irregular heat exchange fins (71) located on the lower side are fixedly connected to the right end of the protective shell 2 (2) located on the left side and the right end of the protective shell 1 (1) located on the right side, respectively. Each of the six irregular heat exchange fins (71) has a placement hole (72) that extends through to the right side of the inner surface on the left side.

8. An embedded shunt microchannel heat sink for an electronic chip according to claim 7, characterized in that: The six heat exchange tubes (63) are located inside the six placement holes (72), and the six irregular heat exchange fins (71) are arranged in several X shapes.

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