Electronic component and method for manufacturing the same

Abstract

The invention provides an electronic component capable of improving design freedom. The electronic component includes: a glass substrate including a top surface, a bottom surface, a first side surface, and a second side surface; an outer surface conductor provided on at least the first side surface of the first side surface and the second side surface and being at least a part of the passive element; and a terminal electrode embedded in the glass substrate and exposed from the bottom surface, and electrically connected to the outer surface conductor. The terminal electrode penetrates through the glass substrate from the first side surface to the second side surface, and the distance between the top surface and the bottom surface, namely the height dimension of the glass substrate, is smaller than the distance between the first side surface and the second side surface, namely the width dimension of the glass substrate.

Description

Technical Field

[0001] The present disclosure relates to an electronic component and a method for manufacturing the same. Background Art

[0002] Conventionally, as an electronic component, there is an electronic component described in Japanese Unexamined Patent Application Publication No. 2020-174169 (Patent Document 1). The electronic component includes a glass substrate including a bottom surface, a coil provided on the glass substrate, and a terminal electrode provided on the glass substrate and electrically connected to the coil. The bottom surface conductor of the coil is provided on the bottom surface of the glass substrate, and the terminal electrode is provided on the bottom surface of the glass substrate.

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2020-174169

[0004] However, in the electronic component as described above in the past, since the bottom surface conductor and the terminal electrode are provided on the same bottom surface of the glass substrate, the bottom surface conductor and the terminal electrode interfere with each other, and the design freedom of the electronic component cannot be improved. Summary of the Invention

[0005] Therefore, an object of the present disclosure is to provide an electronic component and a method for manufacturing the same that can improve the design freedom.

[0006] To solve the above problems, an electronic component according to one aspect of the present disclosure includes:

[0007] a glass substrate including a top surface, a bottom surface, a first side surface, and a second side surface;

[0008] an outer surface conductor provided on at least the first side surface of the first side surface and the second side surface, and being at least a part of a passive element; and

[0009] a terminal electrode embedded in the glass substrate and exposed from the bottom surface, and electrically connected to the outer surface conductor,

[0010] the terminal electrode penetrates the glass substrate from the first side surface to the second side surface,

[0011] a height dimension of the glass substrate is smaller than a width dimension of the glass substrate, the height dimension of the glass substrate is a distance between the top surface and the bottom surface, and the width dimension of the glass substrate is a distance between the first side surface and the second side surface.

[0012] According to the above aspect, since the first side surface on which the outer surface conductor of the passive element is provided and the bottom surface on which the terminal electrode is provided are different surfaces, the outer surface conductor and the terminal electrode can be designed without being affected by each other, and the design freedom of the electronic component is improved.

[0013] In addition, the terminal electrode penetrates the glass substrate from the first side surface to the second side surface, so the terminal electrode extends in the width direction from the first side surface toward the second side surface in a state of being embedded in the glass substrate. If the height dimension is smaller than the width dimension in the absence of the terminal electrode, the glass substrate is likely to bend in the height direction from the bottom surface toward the top surface. However, since the terminal electrode extends in the width direction in a state of being embedded in the glass substrate, the bending strength of the glass substrate in the height direction can be improved.

[0014] In addition, a method for manufacturing an electronic component according to an aspect of the present disclosure includes the following steps:

[0015] Prepare a glass mother substrate including a first surface and a second surface;

[0016] On the first surface, set two or more singulation regions defined by a first side, a second side, a third side, and a fourth side in a direction parallel to the first side and two or more in a direction parallel to the third side, where the first side and the second side have a length smaller than the distance between the first surface and the second surface and are parallel to each other, and the third side and the fourth side are orthogonal to the first side and parallel to each other;

[0017] In each of all the singulation regions, form a through hole that penetrates the mother substrate from the first surface to the second surface, and embed a conductor into the through hole to form a terminal electrode;

[0018] In each of all the singulation regions, form an outer surface conductor on the first surface, and the outer surface conductor is at least a part of a passive element; and

[0019] Singulate each of all the singulation regions to manufacture a plurality of electronic components.

[0020] According to the above aspect, an electronic component with improved design freedom can be manufactured. In addition, an electronic component that can improve the bending strength of the glass substrate in the height direction can be manufactured.

[0021] According to an aspect of the present disclosure, an electronic component and a method for manufacturing the same can improve the design freedom of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a side view of a first embodiment of an electronic component as viewed from the first side surface.

[0023] Figure 2 is Figure 1 a cross-sectional view taken along line II-II.

[0024] Figure 3AIt is an explanatory diagram for explaining a method of manufacturing an electronic component.

[0025] Figure 3B It is an explanatory diagram for explaining a method of manufacturing an electronic component.

[0026] Figure 3C It is an explanatory diagram for explaining a method of manufacturing an electronic component.

[0027] Figure 3D It is an explanatory diagram for explaining a method of manufacturing an electronic component.

[0028] Figure 3E It is an explanatory diagram for explaining a method of manufacturing an electronic component.

[0029] Figure 4 It is a side view of a second embodiment of an electronic component as viewed from the first side.

[0030] Figure 5 It is a side view of a third embodiment of an electronic component as viewed from the first side.

[0031] Figure 6 It is Figure 5 a cross-sectional view taken along line VI-VI.

[0032] Figure 7 It is a side view of a fourth embodiment of an electronic component as viewed from the first side.

[0033] Figure 8 It is Figure 7 a cross-sectional view taken along line VIII-VIII.

[0034] Figure 9 It is a side view of a fifth embodiment of an electronic component as viewed from the first side.

[0035] Figure 10 It is a side view of a sixth embodiment of an electronic component as viewed from the first side.

[0036] Figure 11 It is a side view of a seventh embodiment of an electronic component as viewed from the first side.

[0037] Figure 12 It is a side view of an eighth embodiment of an electronic component as viewed from the first side.

[0038] Figure 13 It is a side view of a ninth embodiment of an electronic component as viewed from the first side.

[0039] Figure 14 It is a side view of a tenth embodiment of an electronic component as viewed from the first side.

[0040] Figure 15 is a side view of the eleventh embodiment of an electronic component as viewed from the first side surface side.

[0041] Figure 16 is Figure 15 a cross-sectional view taken along XVI-XVI.

[0042] Figure 17 is a side view of the twelfth embodiment of an electronic component as viewed from the first side surface side.

[0043] Figure 18 is a side view of the thirteenth embodiment of an electronic component as viewed from the first side surface side.

[0044] Figure 19 is a side view of the fourteenth embodiment of an electronic component as viewed from the first side surface side.

[0045] Figure 20 is Figure 19 a cross-sectional view taken along XX-XX. Detailed Embodiments

[0046] Hereinafter, an electronic component according to an aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. In addition, some of the drawings are schematic and there are cases where actual dimensions and ratios are not reflected.

[0047] <First Embodiment>

[0048] [Schematic Configuration]

[0049] Figure 1 is a side view of the electronic component 1 as viewed from the first side surface side. Figure 2 is Figure 1 a cross-sectional view taken along II-II. As Figure 1 and Figure 2 shown, the electronic component 1 includes a glass substrate 10, an inductor element 2, a first terminal electrode 41, and a second terminal electrode 42. The inductor element 2 is an example of the "passive element" described in the claims. The electronic component 1 is, for example, a surface-mount type electronic component used in a high-frequency signal transmission circuit.

[0050] The glass substrate 10 has a top surface 10t and a bottom surface 10b located on opposite sides, and a first side surface 10s1 and a second side surface 10s2 located on opposite sides.

[0051] The inductor component 2 has a first coil conductor 21 provided on the first side surface 10s1 and a second coil conductor 22 provided on the second side surface 10s2. The first coil conductor 21 and the second coil conductor 22 are examples of the "outer surface conductor" described in the claims.

[0052] The first terminal electrode 41 and the second terminal electrode 42 are respectively embedded in the glass substrate 10 and exposed from the bottom surface 10b, and are electrically connected to the first coil conductor 21 and the second coil conductor 22.

[0053] The first terminal electrode 41 and the second terminal electrode 42 respectively penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. The distance between the top surface 10t and the bottom surface 10b, that is, the height dimension H of the glass substrate 10, is smaller than the distance between the first side surface 10s1 and the second side surface 10s2, that is, the width dimension W of the glass substrate 10.

[0054] Here, the relationship of "the height dimension H is smaller than the width dimension W" means a relationship that satisfies at least one of "the maximum distance (height dimension H) between the top surface 10t and the bottom surface 10b is smaller than the minimum distance (width dimension W) between the first side surface 10s1 and the second side surface 10s2" or "the average distance (height dimension H) between the top surface 10t and the bottom surface 10b is smaller than the average distance (width dimension W) between the first side surface 10s1 and the second side surface 10s2".

[0055] According to the above configuration, the first side surface 10s1 where the first coil conductor 21 is provided and the second side surface 10s2 where the second coil conductor 22 is provided are different from the bottom surface 10b where the first terminal electrode 41 and the second terminal electrode 42 are provided. Therefore, the first coil conductor 21, the second coil conductor 22, the first terminal electrode 41, and the second terminal electrode 42 can be designed without affecting each other, and the design freedom of the electronic component 1 is improved.

[0056] In addition, since the first terminal electrode 41 and the second terminal electrode 42 respectively penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2, the first terminal electrode 41 and the second terminal electrode 42 respectively extend in the width direction (Y direction) from the first side surface 10s1 toward the second side surface 10s2 in a state of being embedded in the glass substrate 10. If the height dimension H is smaller than the width dimension W in the absence of the first terminal electrode 41 and the second terminal electrode 42, the glass substrate 10 is likely to bend in the height direction (Z direction) from the bottom surface 10b toward the top surface 10t. However, since the first terminal electrode 41 and the second terminal electrode 42 extend in the width direction in a state of being embedded in the glass substrate 10, the bending strength of the glass substrate 10 in the height direction can be improved.

[0057] In addition, since the height dimension H is smaller than the width dimension W, the height dimension H of the glass substrate 10 can be reduced, and thus, the low-profile of the electronic component 1 can be achieved.

[0058] In addition, as the passive element, it may not be an inductor element but a capacitor element, a resistor, or the like. In addition, it is sufficient to provide an outer surface conductor as at least a part of the passive element on at least the first side surface among the first side surface and the second side surface. In addition, at least one terminal electrode is sufficient.

[0059] [Preferred configurations of respective components]

[0060] (Glass substrate 10)

[0061] The glass substrate 10 is a rectangular parallelepiped having a length, a width, and a height. The glass substrate 10 has a first end surface 10e1 and a second end surface 10e2 located on both end sides in the length direction, a first side surface 10s1 and a second side surface 10s2 located on both end sides in the width direction, and a bottom surface 10b and a top surface 10t located on both end sides in the height direction. In other words, the outer surface 100 of the glass substrate 10 includes the first end surface 10e1 and the second end surface 10e2, the first side surface 10s1 and the second side surface 10s2, and the bottom surface 10b and the top surface 10t. The bottom surface 10b is the surface facing the mounting substrate side when the electronic component 1 is mounted on the mounting substrate.

[0062] In this specification, the outer surface 100 of the glass substrate 10 not only refers to the surface of the glass substrate 10 facing the outer peripheral side but also refers to the surface that forms the boundary between the outer side and the inner side of the glass substrate 10. In addition, "above the outer surface 100 of the glass substrate 10" is not an absolute direction such as vertically upward defined along the direction of gravity but refers to the direction of the outer side among the outer side and the inner side with the outer surface 100 as a reference and the outer surface 100 as a boundary. Therefore, "above the outer surface 100" is a relative direction defined according to the direction of the outer surface 100. In addition, "above" with respect to a certain member not only refers to the upper side separated from the member, that is, the upper position on the member with another object in between, the upper position at an interval, but also includes the directly above position (on) in contact with the member.

[0063] Hereinafter, for the sake of convenience of explanation, the direction from the first end face 10e1 toward the second end face 10e2, which is the length direction (long side direction) of the glass substrate 10, is defined as the X direction. Further, the direction from the first side face 10s1 toward the second side face 10s2, which is the width direction of the glass substrate 10, is defined as the Y direction. Further, the direction from the bottom face 10b toward the top face 10t, which is the height direction of the glass substrate 10, is defined as the Z direction. The X direction, the Y direction, and the Z direction are mutually orthogonal directions and form a right-handed system when arranged in the order of X, Y, and Z.

[0064] The glass substrate 10 has insulation properties. Preferably, the glass substrate 10 is a photosensitive glass substrate represented by, for example, Foturan II (registered trademark of Schott AG). In particular, it is preferable that the glass substrate 10 contains cerium oxide (cerium dioxide: CeO2). In this case, the cerium oxide is a sensitizer, making the processing based on photolithography easier.

[0065] However, since the glass substrate 10 can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching processing using a photoresist / metal mask, laser processing, etc., it may also be a non-photosensitive glass plate. Further, the glass substrate 10 may be formed by sintering a glass paste or may be formed by a known method such as the float process.

[0066] The height dimension H of the glass substrate 10 is smaller than the width dimension W of the glass substrate 10. The distance between the first end face 10e1 and the second end face 10e2, that is, the length dimension L of the glass substrate 10, is larger than the width dimension W of the glass substrate 10.

[0067] Here, the relationship of "the length dimension L is smaller than the width dimension W" means that at least one of the following is satisfied: "the maximum distance (length dimension L) between the first end face 10e1 and the second end face 10e2 is smaller than the minimum distance (width dimension W) between the first side face 10s1 and the second side face 10s2" or "the average distance (length dimension L) between the first end face 10e1 and the second end face 10e2 is smaller than the average distance (width dimension W) between the first side face 10s1 and the second side face 10s2".

[0068] (Inductor element 2)

[0069] The inductor element 2 has a coil 20, a first lead conductor 25 connected to the first end of the coil 20, and a second lead conductor 26 connected to the second end of the coil 20. The coil 20 is wound in a spiral shape along the axis AX. The first lead conductor 25 is connected to the first terminal electrode 41. The second lead conductor 26 is connected to the second terminal electrode 42.

[0070] The axis AX of the coil 20 is arranged parallel to the bottom surface 10b of the glass substrate 10. Thus, when the electronic component 1 is mounted on the mounting substrate and the bottom surface 10b of the glass substrate 10 is opposed to the mounting substrate, the axis AX of the coil 20 is horizontal to the mounting substrate, so that a decrease in the L value and the Q value caused by the flow of eddy current in the mounting substrate is not likely to occur. "Parallel" includes not only that the axis AX is completely parallel to the bottom surface 10b, but also that the axis AX is slightly inclined with respect to the bottom surface 10b, etc., which is substantially parallel.

[0071] The coil 20 includes a plurality of first coil conductors 21, a plurality of second coil conductors 22, a plurality of first through conductors 23, and a plurality of second through conductors 24. They are electrically connected in the order of the first through conductors 23, the second coil conductors 22, the second through conductors 24, and the first coil conductors 21, and the coil 20 forms a helix. The number of turns of the coil 20 is multiple turns. In addition, the number of turns of the coil 20 may also be less than one turn.

[0072] The plurality of first through conductors 23 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the plurality of first through conductors 23 extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. Thus, the bending strength in the height direction (Z direction) of the glass substrate 10 can be further improved.

[0073] The plurality of first through conductors 23 extend from the second coil conductor 22 toward the first coil conductor 21 and are arranged along the axis AX. The first through conductor 23 extends in a direction orthogonal to the first side surface 10s1 and the second side surface 10s2. All the first through conductors 23 are arranged parallel to each other along the X direction. The first through conductor 23 is arranged on the bottom surface 10b side with respect to the axis AX.

[0074] The plurality of second through conductors 24 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the plurality of second through conductors 24 extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. Thus, the bending strength in the height direction (Z direction) of the glass substrate 10 can be further improved.

[0075] The plurality of second through conductors 24 extend from the second coil conductor 22 toward the first coil conductor 21 and are arranged along the axis AX. The second through conductor 24 extends in a direction orthogonal to the first side surface 10s1 and the second side surface 10s2. All the second through conductors 24 are arranged parallel to each other along the X direction. The second through conductor 24 is arranged on the opposite side of the first through conductor 23 with respect to the axis AX. In other words, the second through conductor 24 is arranged on the top surface 10t side with respect to the axis AX.

[0076] A plurality of first coil conductors 21 are provided on the first side surface 10s1. The first coil conductors 21 are shaped to extend in the Z direction. All the first coil conductors 21 are arranged parallel to each other in the X direction. The first end portion (pad portion) of the first coil conductor 21 is connected to the end portion of the first through-conductor 23. The second end portion (pad portion) of the first coil conductor 21 is connected to the end portion of the second through-conductor 24.

[0077] A plurality of second coil conductors 22 are provided on the second side surface 10s2. The second coil conductors 22 are slightly inclined in the X direction and extend in the Z direction. All the second coil conductors 22 are arranged parallel to each other in the X direction. The first end portion (pad portion) of the second coil conductor 22 is connected to the end portion of the first through-conductor 23. The second end portion (pad portion) of the second coil conductor 22 is connected to the end portion of the second through-conductor 24.

[0078] The first lead conductor 25 is provided on the first side surface 10s1. The first lead conductor 25 is shaped to extend in the Z direction. The first end portion (pad portion) of the first lead conductor 25 is connected to the end portion of the first through-conductor 23. The second end portion of the first lead conductor 25 is connected to the side surface of the first terminal electrode 41.

[0079] The second lead conductor 26 is provided on the first side surface 10s1. The second lead conductor 26 is shaped to extend in the Z direction. The first end portion (pad portion) of the second lead conductor 26 is connected to the end portion of the second through-conductor 24. The second end portion of the second lead conductor 26 is connected to the side surface of the second terminal electrode 42.

[0080] The first coil conductors 21 and the second coil conductors 22 are made of a conductive material such as copper, silver, gold, or an alloy thereof. The first coil conductors 21 and the second coil conductors 22 can be either a metal film formed by electroplating, evaporation, sputtering, etc., or a metal sintered body formed by coating and sintering a conductor paste. In addition, the materials of the first through-conductor 23 and the second through-conductor 24 are the same as those of the first coil conductors 21 and the second coil conductors 22.

[0081] Preferably, the first coil conductors 21 and the second coil conductors 22 are formed by a semi-additive process, whereby first coil conductors 21 and second coil conductors 22 with low resistance, high precision, and high aspect ratio can be formed. The first through-conductor 23 and the second through-conductor 24 can be formed in through-holes pre-formed in the glass substrate 10 using the materials and manufacturing methods exemplified for the first coil conductors 21 and the second coil conductors 22.

[0082] The first lead conductor 25 and the second lead conductor 26 can be formed using the same materials and methods as the first coil conductors.

[0083] (The first terminal electrode 41 and the second terminal electrode 42)

[0084] The first terminal electrode 41 is embedded in the glass substrate 10 and exposed from the bottom surface 10b, the first side surface 10s1, and the second side surface 10s2. The first terminal electrode 41 is disposed on the first end surface 10e1 side with respect to the center of the glass substrate 10 in the X direction.

[0085] The second terminal electrode 42 is embedded in the glass substrate 10 and exposed from the bottom surface 10b, the first side surface 10s1, and the second side surface 10s2. The second terminal electrode 42 is disposed on the second end surface 10e2 side with respect to the center of the glass substrate 10 in the X direction.

[0086] The first terminal electrode 41 and the second terminal electrode 42 can be formed by the same material and method as the first coil conductor. In addition, the first terminal electrode 41 and the second terminal electrode 42 may also have a plating layer.

[0087] The first terminal electrode 41 is connected to the first lead conductor 25 which is the first end of the inductor element 2. The second terminal electrode 42 is connected to the second lead conductor 26 which is the second end of the inductor element 2.

[0088] (Manufacturing method of the electronic component 1)

[0089] Next, use Figures 3A to 3E To describe the manufacturing method of the electronic component 1.

[0090] As Figure 3A Shown, prepare a glass mother substrate 1000 including a first surface 1000a and a second surface 1000b. The first surface 1000a includes a first side surface 10s1, and the second surface 1000b includes a second side surface 10s2. As the mother substrate 1000, for example, Foturan II can be used. The mother substrate 1000 generally includes oxides such as silicon, lithium, aluminum, and cerium, thereby enabling high-precision lithography.

[0091] On the first surface 1000a, a plurality of singulation regions 1100 are provided. In Figure 3A Shown, the singulation regions 1100 are shown by hatching. The singulation regions 1100 are defined by a first side 1101, a second side 1102, a third side 1103, and a fourth side 1104. The first side 1101 and the second side 1102 are parallel to each other, and the third side 1103 and the fourth side 1104 are parallel to each other. The third side 1103 and the fourth side 1104 are orthogonal to the first side 1101. In other words, the singulation regions 1100 are quadrilaterals.

[0092] The first side 1101 and the second side 1102 each have a length less than the distance between the first surface 1000a and the second surface 1000b. The distance between the first surface 1000a and the second surface 1000b corresponds to the width dimension W of the glass substrate 10. The length of each of the first side 1101 and the second side 1102 corresponds to the height dimension H of the glass substrate 10. The length of each of the third side 1103 and the fourth side 1104 corresponds to the length dimension L of the glass substrate 10.

[0093] Two or more singulation regions 1100 are provided in a direction (Z direction) parallel to the first side 1101, and two or more are provided in a direction (X direction) parallel to the third side 1103. In this embodiment, two singulation regions 1100 are provided in the Z direction and two in the X direction, for a total of four.

[0094] As Figure 3B shown, in each of all the singulation regions 1100, a first through hole 1001, a second through hole 1002, a third through hole 1003, and a fourth through hole 1004 are formed that penetrate the mother substrate 1000 from the first surface 1000a to the second surface 1000b. In Figure 3B , the singulation regions 1100 are shown by dashed-dotted lines.

[0095] The first through hole 1001 is a part where the first through conductor 23 is formed. The second through hole 1002 is a part where the second through conductor 24 is formed. The third through hole 1003 is a part where the first terminal electrode 41 is formed. The fourth through hole 1004 is a part where the second terminal electrode 42 is formed.

[0096] As a method for forming the first to fourth through holes 1001 to 1004, for example, ultraviolet rays are irradiated onto the part where the through holes are to be formed, and a crystallization part is formed by heat treatment (e.g., firing) to crystallize it, and the through holes are formed by etching away the crystallization part.

[0097] As Figure 3C shown, a conductor is embedded in the first through hole 1001 to form the first through conductor 23. A conductor is embedded in the second through hole 1002 to form the second through conductor 24. A conductor is embedded in the third through hole 1003 to form the first terminal electrode 41. A conductor is embedded in the fourth through hole 1004 to form the second terminal electrode 42. The first through conductor 23, the second through conductor 24, the first terminal electrode 41, and the second terminal electrode 42 are formed, for example, by a semi-additive method.

[0098] Then, in each of all the singulation regions 1100, a first coil conductor 21, a first lead-out conductor 25, and a second lead-out conductor 26 are formed on the first surface 1000a, and in addition, a second coil conductor 22 is formed on the second surface 1000b.

[0099] As shown Figure 3D in FIG. 4, ultraviolet rays are irradiated to the cutting region 1200 between adjacent singulated regions 1100, and crystallization is performed by heat treatment (for example, firing) to form a crystallization portion. The cutting region 1200 coincides with the cutting line when the mother substrate 1000 is singulated. In Figure 3D FIG. 4, for convenience, the crystallization portion of the cutting region 1200 is shown by hatched lines.

[0100] The crystallization portion of the cutting region 1200 is removed by etching, and as shown Figure 3E in FIG. 5, each of all the singulated regions 1100 is singulated to manufacture a plurality of electronic components 1. In addition, the mother substrate 1000 is singulated by etching the crystallization portion, but the mother substrate 1000 may also be singulated by a cutting machine, a laser, or the like.

[0101] According to the above manufacturing method, since the mother substrate 1000 having two singulated regions 1100 in the Z direction and two singulated regions 1100 in the X direction is singulated, it is not easy for the mother substrate 1000 to be broken. In contrast, in the case of singulating a mother substrate having two or more singulated regions only in the X direction, the height dimension H is smaller than the width dimension W in each singulated region. Therefore, if the mother substrate is cut from the Z direction, the cutting is performed along the direction in which the height dimension H is small. In this way, the cutting is performed along the direction in which the strength of the mother substrate is weak, so it is easy for the glass substrate to be broken.

[0102] <Second Embodiment>

[0103] Figure 4 FIG. 6 is a side view of the second embodiment of the electronic component as viewed from the first side. The position of the coil of the inductor element in the second embodiment is different from that in the first embodiment. Hereinafter, the different configurations will be described. Other configurations are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are given and their descriptions are omitted.

[0104] As shown Figure 4 in FIG. 7, in the electronic component 1A of the second embodiment, the axis AX of the coil 20A of the inductor element 2A is perpendicular to the bottom surface 10b of the glass substrate 10. Accordingly, when the electronic component 1A is mounted on the mounting substrate and the bottom surface 10b of the glass substrate 10 faces the mounting substrate, the axis AX of the coil 20A is perpendicular to the mounting substrate, so that magnetic coupling between the electronic component 1A and other adjacent components on the mounting substrate can be reduced. "Perpendicular" not only means that the axis AX is completely perpendicular to the bottom surface 10b, but also includes that the angle formed by the axis AX and the bottom surface 10b is substantially perpendicular, such as 80° to 100°.

[0105] A plurality of first through conductors 23 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. All the first through conductors 23 are arranged in parallel along the Z direction. The first through conductors 23 are arranged on the first end surface 10e1 side with respect to the axis AX.

[0106] A plurality of second through conductors 24 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. All the second through conductors 24 are arranged in parallel along the Z direction. The second through conductors 24 are arranged on the side opposite to the first through conductors 23 with respect to the axis AX. In other words, the second through conductors 24 are arranged on the second end surface 10e2 side with respect to the axis AX.

[0107] A plurality of first coil conductors 21 are provided on the first side surface 10s1. The first coil conductors 21 are slightly inclined in the Z direction and extend in the X direction. All the first coil conductors 21 are arranged in parallel along the Z direction.

[0108] A plurality of second coil conductors 22 are provided on the second side surface 10s2. The second coil conductors 22 extend in the X direction. All the second coil conductors 22 are arranged in parallel along the Z direction.

[0109] In the electronic component 1A of the second embodiment, it has the same effect as the electronic component 1 of the first embodiment. In other words, the first side surface 10s1 where the first coil conductors 21 are provided and the second side surface 10s2 where the second coil conductors 22 are provided are different from the bottom surface 10b where the first terminal electrode 41 and the second terminal electrode 42 are provided, so the first coil conductors 21, the second coil conductors 22, the first terminal electrode 41, and the second terminal electrode 42 can be designed without affecting each other, and the design freedom of the electronic component 1A is improved.

[0110] In addition, the first terminal electrode 41 and the second terminal electrode 42 respectively penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2, so the first terminal electrode 41 and the second terminal electrode 42 respectively extend in the width direction (Y direction) from the first side surface 10s1 toward the second side surface 10s2 in a state of being embedded in the glass substrate 10. Thereby, the bending strength in the height direction (Z direction) of the glass substrate 10 can be improved.

[0111] In addition, the height dimension H is smaller than the width dimension W, so the height dimension H of the glass substrate 10 can be reduced, and thereby, the low height of the electronic component 1A can be achieved.

[0112] In addition, the plurality of first through conductors 23 extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. Therefore, the bending strength in the height direction (Z direction) of the glass substrate 10 can be further improved.

[0113] In addition, a plurality of second through conductors 24 extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. Therefore, the bending strength in the height direction (Z direction) of the glass substrate 10 can be further improved.

[0114] <Third Embodiment>

[0115] Figure 5 It is a side view of the third embodiment of the electronic component as viewed from the first side. Figure 6 is Figure 5 The VI-VI cross-sectional view. The configuration of the passive element in the third embodiment is different from that in the first embodiment. Hereinafter, this different configuration will be described. Other configurations are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are assigned and their descriptions are omitted.

[0116] As Figure 5 and Figure 6 shown, in the electronic component 1B of the third embodiment, the passive element is a capacitor element 3. The capacitor element 3 includes a first flat electrode 31, a second flat electrode 32, a dielectric film 33, a first lead conductor 35, and a second lead conductor 36. The first flat electrode 31, the second flat electrode 32, the first lead conductor 35, and the second lead conductor 36 are an example of the "outer surface conductor" described in the claims.

[0117] The first flat electrode 31 is provided on the first side surface 10s1, and the second flat electrode 32 is provided on the first flat electrode 31. The dielectric film 33 is provided between the first flat electrode 31 and the second flat electrode 32. The first flat electrode 31 and the second flat electrode 32 each extend in the X direction. The dielectric film 33 extends in the X direction and covers both ends of the first flat electrode 31 in the Z direction.

[0118] The first lead conductor 35 is provided on the first side surface 10s1. The first lead conductor 35 has a shape extending in the Z direction. The first end portion of the first lead conductor 35 is connected to the second flat electrode 32. The second end portion of the first lead conductor 35 is connected to the side surface of the first terminal electrode 41.

[0119] The second lead conductor 36 is provided on the first side surface 10s1. The second lead conductor 36 has a shape extending in the Z direction. The first end portion of the second lead conductor 36 is connected to the first flat electrode 31. The second end portion of the second lead conductor 36 is connected to the side surface of the second terminal electrode 42.

[0120] In the electronic component 1B according to the second embodiment, compared with the case where the capacitor element 3 is disposed on the bottom surface 10b, stray capacitance with the ground of the mounting substrate is less likely to occur. Further, compared with the case where the capacitor element 3 is disposed on the top surface 10t, parasitic inductance can be reduced.

[0121] The electronic component 1B in the second embodiment has the same effects as the electronic component 1 in the first embodiment. In other words, since the first side surface 10s1 where the first flat electrode 31 and the second flat electrode 32 are provided is different from the bottom surface 10b where the first terminal electrode 41 and the second terminal electrode 42 are provided, the first flat electrode 31, the second flat electrode 32, the first terminal electrode 41, and the second terminal electrode 42 can be designed without affecting each other, and the design freedom of the electronic component 1B is improved.

[0122] Further, since the first terminal electrode 41 and the second terminal electrode 42 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2, the first terminal electrode 41 and the second terminal electrode 42 extend in the width direction (Y direction) from the first side surface 10s1 toward the second side surface 10s2 in a state of being embedded in the glass substrate 10. Thereby, the bending strength in the height direction (Z direction) of the glass substrate 10 can be improved.

[0123] Further, since the height dimension H is smaller than the width dimension W, the height dimension H of the glass substrate 10 can be reduced, and thereby, low height of the electronic component 1B can be achieved.

[0124] <Fourth Embodiment>

[0125] Figure 7 FIG. is a side view of the fourth embodiment of the electronic component as viewed from the first side surface side. Figure 8 is Figure 7 The VIII-VIII cross-sectional view. The configuration of the capacitor element in the fourth embodiment is different from that in the third embodiment. Hereinafter, the different configuration will be described. Other configurations are the same as those in the third embodiment, and the same reference numerals as those in the third embodiment are given and the description thereof is omitted.

[0126] As Figure 7 and Figure 8 shown, in the electronic component 1C of the fourth embodiment, the capacitor element 3C has a plurality of first flat electrodes 31C, a plurality of second flat electrodes 32C, a first support conductor 37, and a second support conductor 38. The first flat electrode 31C, the second flat electrode 32C, the first support conductor 37, and the second support conductor 38 are an example of "outer surface conductor" in the claims.

[0127] A plurality of first flat electrodes 31C penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the plurality of first flat electrodes 31C extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. The first flat electrode 31C extends in a direction parallel to the YZ plane. All the first flat electrodes 31C are arranged in parallel in the X direction.

[0128] A plurality of second flat electrodes 32C penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the plurality of second flat electrodes 32C extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. The second flat electrode 32C extends in a direction parallel to the YZ plane. All the second flat electrodes 32C are arranged in parallel in the X direction.

[0129] The first support conductor 37 penetrates the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the first support conductor 37 extends in the width direction (Y direction) in a state of being embedded in the glass substrate 10. The first support conductor 37 has a first portion 371 extending in a direction parallel to the XY plane and a second portion 372 connected to the first portion 371 and extending in a direction parallel to the YZ plane. The first portion 371 is disposed on the top surface 10t side, and the second portion 372 is disposed on the second end surface 10e2 side. A plurality of first flat electrodes 31C are connected to the first portion 371. The second portion 372 is connected to the second terminal electrode 42.

[0130] The second support conductor 38 penetrates the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the second support conductor 38 extends in the width direction (Y direction) in a state of being embedded in the glass substrate 10. The second support conductor 38 has a first portion 381 extending in a direction parallel to the XY plane and a second portion 382 connected to the first portion 381 and extending in a direction parallel to the YZ plane. The first portion 381 is disposed on the bottom surface 10b side, and the second portion 382 is disposed on the first end surface 10e1 side. A plurality of second flat electrodes 32C are connected to the first portion 381. The second portion 382 is connected to the first terminal electrode 41.

[0131] The plurality of first flat electrodes 31C and the plurality of second flat electrodes 32C are alternately arranged in the X direction. In other words, the plurality of first flat electrodes 31C and the plurality of second flat electrodes 32C form a comb structure. A part of the glass substrate 10 exists between the first flat electrode 31C and the second flat electrode 32C. In other words, a part of the glass substrate 10 functions as a dielectric of the capacitor element 3C.

[0132] In the electronic component 1C of the fourth embodiment, the same effects as those of the electronic component 1B of the third embodiment are achieved. In other words, the first side surface 10s1 and the second side surface 10s2 where the first flat electrode 31C and the second flat electrode 32C are provided are different from the bottom surface 10b where the first terminal electrode 41 and the second terminal electrode 42 are provided. Therefore, the first flat electrode 31C, the second flat electrode 32C, the first terminal electrode 41, and the second terminal electrode 42 can be designed without affecting each other, and the design freedom of the electronic component 1C is improved.

[0133] In addition, the first terminal electrode 41 and the second terminal electrode 42 respectively penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the first terminal electrode 41 and the second terminal electrode 42 respectively extend in the width direction (Y direction) from the first side surface 10s1 toward the second side surface 10s2 in a state of being embedded in the glass substrate 10. Thereby, the bending strength in the height direction (Z direction) of the glass substrate 10 can be improved.

[0134] In addition, since the height dimension H is smaller than the width dimension W, the height dimension H of the glass substrate 10 can be reduced. Thereby, the low profile of the electronic component 1C can be achieved.

[0135] In addition, the plurality of first flat electrodes 31C extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. Therefore, the bending strength in the height direction (Z direction) of the glass substrate 10 can be further improved.

[0136] In addition, the plurality of second flat electrodes 32C extend in the width direction (Y direction) in a state of being embedded in the glass substrate 10. Therefore, the bending strength in the height direction (Z direction) of the glass substrate 10 can be further improved.

[0137] <Fifth Embodiment>

[0138] Figure 9 FIG. is a side view of the fifth embodiment of the electronic component as viewed from the first side surface side. The configuration of the dielectric in the fifth embodiment is different from that in the fourth embodiment. Hereinafter, the different configurations will be described. Other configurations are the same as those in the fourth embodiment, and the same reference numerals as those in the fourth embodiment are given and their descriptions are omitted.

[0139] As Figure 9 shown, in the electronic component 1D of the fifth embodiment, the capacitor element 3C has a dielectric 34 between the first flat electrode and the second flat electrode. The dielectric 34 is made of a material different from the glass material of the glass substrate 10. The glass material refers to a non-crystalline material in an amorphous state. The dielectric 34 is composed of, for example, crystalline glass, air, a high dielectric material other than glass, and the like.

[0140] In the electronic component 1D of the fifth embodiment, by using a material with a dielectric constant higher than that of the glass substrate 10 for the dielectric 34, a larger capacitance is obtained. In addition, by using a material with a smaller dielectric loss than that of the glass substrate for the dielectric 34, a higher Q value is obtained.

[0141] Moreover, in the electronic component 1D of the fifth embodiment, in other configurations, it has the same effects as the electronic component 1C of the fourth embodiment.

[0142] <Sixth Embodiment>

[0143] Figure 10 FIG. is a side view of the sixth embodiment of the electronic component as viewed from the first side. The configuration of the passive element in the sixth embodiment is different from that in the first embodiment. Hereinafter, the different configuration will be described. Other configurations are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are given and their descriptions are omitted.

[0144] As Figure 10 shown, in the electronic component 1E of the sixth embodiment, the passive element includes an inductor element 2 and a capacitor element 3. The inductor element 2 has the same configuration as the inductor element 2 of the electronic component 1 in the first embodiment. The capacitor element 3 has the same configuration as the capacitor element 3 of the electronic component 1B in the third embodiment. The inductor element 2 is disposed on the second end face 10e2 side (second terminal electrode 42 side), and the capacitor element 3 is disposed on the first end face 10e1 side (first terminal electrode 41 side). The inductor element 2 and the capacitor element 3 are connected in series electrically.

[0145] The inductor element 2 has a coil 20 and a second lead conductor 26. The coil 20 includes a first coil conductor 21, a second coil conductor 22, a first through conductor 23, and a second through conductor 24. The first coil conductor 21 is provided on the first side face 10s1. The second coil conductor 22 is provided on the second side face 10s2. The first through conductor 23 and the second through conductor 24 penetrate the glass substrate 10 from the first side face 10s1 to the second side face 10s2. The second lead conductor 26 is connected to the second terminal electrode 42.

[0146] The capacitor element 3 has a first flat electrode 31, a second flat electrode 32, a dielectric film 33, a first lead conductor 35, and a second lead conductor 36. The first flat electrode 31, the second flat electrode 32, the first lead conductor 35, and the second lead conductor 36 are provided above the first side face 10s1. The first lead conductor 35 is connected to the first terminal electrode 41. The second lead conductor 36 is connected to the first through conductor 23, which is the first end portion of the coil 20.

[0147] In the electronic component 1E of the sixth embodiment, since it includes an inductor element 2 and a capacitor element 3, an LC circuit can be realized. In addition, the number of each of the inductor element 2 and the capacitor element 3 can also be plural.

[0148] Moreover, in the electronic component 1E of the sixth embodiment, in other configurations, it has the same effects as the electronic component 1 of the first embodiment and the electronic component 1B of the third embodiment.

[0149] <Seventh Embodiment>

[0150] Figure 11 FIG. is a side view of the seventh embodiment of the electronic component as viewed from the first side. The configuration of the glass substrate of the seventh embodiment is different from that of the sixth embodiment. Hereinafter, this different configuration will be described. Other configurations are the same as those of the sixth embodiment, and the same reference numerals as those of the sixth embodiment are given and their descriptions are omitted.

[0151] As Figure 11 shown, in the electronic component 1F of the seventh embodiment, the glass substrate 10F has a first portion 101 and a second portion 102. The height dimension H2 of the second portion 102 is smaller than the height dimension H1 of the first portion 101. The height dimension H1 of the first portion 101 and the height dimension H2 of the second portion 102 are smaller than the width dimension W of the glass substrate 10F. A capacitor element 3 is provided in the first portion 101, and an inductor element 2 is provided in the second portion 102.

[0152] In the electronic component 1F of the seventh embodiment, the space in the height direction of the step provided between the first portion 101 and the second portion 102 can be effectively utilized. In addition, three or more portions having different height dimensions may be provided on the glass substrate 10F, and a plurality of steps may be provided on the glass substrate 10F.

[0153] Moreover, in the electronic component 1F of the seventh embodiment, in other configurations, it has the same effects as the electronic component 1E of the sixth embodiment.

[0154] <Eighth Embodiment>

[0155] Figure 12 FIG. is a side view of the eighth embodiment of the electronic component as viewed from the first side. The configuration of the glass substrate of the eighth embodiment is different from that of the sixth embodiment. Hereinafter, this different configuration will be described. Other configurations are the same as those of the sixth embodiment, and the same reference numerals as those of the sixth embodiment are given and their descriptions are omitted.

[0156] As Figure 12As shown, in the electronic component 1G of the eighth embodiment, the length dimension L of the glass substrate 10G is more than twice the width dimension W of the glass substrate 10G. The length in the axial direction of the coil 20 is more than twice the length in the axial direction of the coil 20 of the sixth embodiment.

[0157] In the electronic component 1G of the eighth embodiment, since the length dimension L of the glass substrate 10G can be extended, the inductor element 2 and the capacitor element 3 can be enlarged, and the performance can be improved. In addition, since enlargement can be achieved by extending the length dimension L, it is not necessary to increase the width dimension of the glass substrate 10G. Therefore, it is not necessary to extend the lengths of the terminal electrodes 41 and 42 in the width direction, which makes manufacturing easier. In addition, it is not necessary to extend the lengths of the through conductors 23 and 24 in the width direction, and the diameters of the through conductors 23 and 24 can be reduced.

[0158] Moreover, in the electronic component 1G of the eighth embodiment, in other configurations, it has the same effects as the electronic component 1E of the sixth embodiment.

[0159] <Ninth Embodiment>

[0160] Figure 13 FIG. is a side view of the ninth embodiment of the electronic component as viewed from the first side. The number of terminal electrodes in the ninth embodiment is different from that in the sixth embodiment. Hereinafter, this different configuration will be described. Other configurations are the same as those in the sixth embodiment, and the same reference numerals as those in the sixth embodiment are used and their descriptions are omitted.

[0161] As Figure 13 shown, in the electronic component 1H of the ninth embodiment, it further includes a third terminal electrode 43. The third terminal electrode 43 is embedded in the glass substrate 10 and exposed from the bottom surface 10b. The third terminal electrode 43 penetrates the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2.

[0162] The third terminal electrode 43 is located between the first terminal electrode 41 and the second terminal electrode 42 along the X direction. The third terminal electrode 43 is connected between the inductor element 2 and the capacitor element 3. Specifically, the third terminal electrode 43 is connected to the second lead conductor 36.

[0163] In the electronic component 1H of the ninth embodiment, more terminal electrodes 41, 42, and 43 can be provided, and a more complex circuit can be realized. In addition, since the third terminal electrode 43 extends in the width direction (Y direction) in a state of being embedded in the glass substrate 10, the bending strength in the height direction (Z direction) of the glass substrate 10 can be further improved. In addition, there may be four or more terminal electrodes.

[0164] Further, in the electronic component 1H of the ninth embodiment, among other configurations, it has the same effects as the electronic component 1E of the sixth embodiment.

[0165] <Tenth Embodiment>

[0166] Figure 14 FIG. 7 is a side view of the tenth embodiment of the electronic component as viewed from the first side. The configuration of the terminal electrodes in the tenth embodiment is different from that in the first embodiment. Hereinafter, this different configuration will be described. Other configurations are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are assigned and their descriptions are omitted.

[0167] As Figure 14 shown, in the electronic component 1J of the tenth embodiment, the first terminal electrode 41J also protrudes from the first end face 10e1. Specifically, the first terminal electrode 41J has a first portion 411 and a second portion 412 connected to the first portion 411. The first portion 411 extends along the bottom face 10b, and the second portion 412 extends along the first end face 10e1. In other words, the first terminal electrode 41J is an L-shaped electrode. The first portion 411 protrudes from the bottom face 10b, and the second portion 412 protrudes from the first end face 10e1. The first portion 411 and the second portion 412 respectively penetrate through the glass substrate 10 from the first side face 10s1 to the second side face 10s2.

[0168] The second terminal electrode 42J also protrudes from the second end face 10e2. Specifically, the second terminal electrode 42J has a first portion 421 and a second portion 422 connected to the first portion 421. The first portion 421 extends along the bottom face 10b, and the second portion 422 extends along the second end face 10e2. In other words, the second terminal electrode 42J is an L-shaped electrode. The first portion 421 protrudes from the bottom face 10b, and the second portion 422 protrudes from the second end face 10e2. The first portion 421 and the second portion 422 respectively penetrate through the glass substrate 10 from the first side face 10s1 to the second side face 10s2.

[0169] In the electronic component 1J of the tenth embodiment, when the electronic component 1J is mounted on the mounting substrate and the bottom face 10b of the glass substrate 10 is opposed to the mounting substrate, solder is also attached to the portion of the first terminal electrode 41J that protrudes from the first end face 10e1, which can suppress the inclination of the electronic component 1J and solder balls, and can also improve the mounting strength. Similarly, solder is also attached to the portion of the second terminal electrode 42J that protrudes from the second end face 10e2, which can suppress the inclination of the electronic component 1J and solder balls, and can also improve the mounting strength.

[0170] Also, in the electronic component 1J of the tenth embodiment, among other configurations, it has the same effects as the electronic component 1 of the first embodiment.

[0171] <Eleventh Embodiment>

[0172] Figure 15 FIG. is a side view of the eleventh embodiment of the electronic component as viewed from the first side. Figure 16 is Figure 15 The XVI-XVI cross-sectional view. The difference between the eleventh embodiment and the first embodiment lies in the provision of a protective layer. Hereinafter, this different configuration will be described. Other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are assigned and their descriptions are omitted.

[0173] As Figure 15 and Figure 16 shown, in the electronic component 1K of the eleventh embodiment, it has a first protective layer 15 and a second protective layer 16. In addition, in the electronic component 1K, it may also have either the first protective layer 15 or the second protective layer 16.

[0174] The first protective layer 15 is provided on the first side 10s1 and covers the first coil conductor 21, the first lead conductor 25, and the second lead conductor 26. When viewed from a direction orthogonal to the first side 10s1, the first protective layer 15 is the same size as the first side 10s1 of the glass substrate 10. The first protective layer 15 has insulating properties and is made of, for example, resins such as epoxy and polyimide.

[0175] Preferably, the first protective layer 15 is colored. The first protective layer 15 is, for example, colored such as green or blue, and the transparency of the first protective layer 15 is lower than the transparency of the glass material of the glass substrate 10. The glass material refers to a non-crystalline material in an amorphous state.

[0176] The second protective layer 16 is provided on the second side 10s2 and covers the second coil conductor 22. When viewed from a direction orthogonal to the second side 10s2, the second protective layer 16 is the same size as the second side 10s2 of the glass substrate 10. The second protective layer 16 has insulating properties and is made of, for example, resins such as epoxy and polyimide.

[0177] Preferably, the second protective layer 16 is colored. The second protective layer 16 is, for example, colored such as green or blue, and the transparency of the second protective layer 16 is lower than the transparency of the glass material of the glass substrate 10.

[0178] In the electronic component 1K of the eleventh embodiment, the first protective layer 15 is provided, so the first coil conductor 21, the first lead conductor 25, and the second lead conductor 26 are protected and the reliability is improved. In addition, the exposed area of the glass substrate 10 is reduced, and the strength of the electronic component 1K can be improved. In addition, when the terminal electrodes 41 and 42 are mounted on the mounting substrate using solder, it is possible to prevent the solder from adhering to the first coil conductor 21, the first lead conductor 25, and the second lead conductor 26. In addition, although stress is generated in the glass substrate 10 due to the difference in the linear expansion coefficients of the first protective layer 15 and the glass substrate 10, since the width dimension W of the glass substrate 10 is large, it is possible to reduce the generation of warpage in the width direction (Y direction) of the glass substrate 10. Preferably, the first protective layer 15 is colored, so that it can be detected by a laser sensor or a camera.

[0179] The same applies to the second protective layer 16. In other words, the second coil conductor 22 is protected and the reliability is improved. In addition, the exposed area of the glass substrate 10 is reduced, and the strength of the electronic component 1K can be improved. In addition, it is possible to prevent the solder from adhering to the second coil conductor 22. In addition, even if the second protective layer 16 is provided, since the width dimension W of the glass substrate 10 is large, it is also possible to reduce the generation of warpage in the width direction (Y direction) of the glass substrate 10. Preferably, the second protective layer 16 is colored, so that it can be detected by a laser sensor or a camera.

[0180] Moreover, in the electronic component 1K of the eleventh embodiment, in other configurations, it has the same effects as the electronic component 1 of the first embodiment.

[0181] <Twelfth Embodiment>

[0182] Figure 17 It is a side view of the electronic component of the twelfth embodiment as viewed from the first side. The size of the protective layer in the twelfth embodiment is different from that in the eleventh embodiment. Hereinafter, this different configuration will be described. Other configurations are the same as those in the eleventh embodiment, and the same reference numerals as those in the eleventh embodiment are given and their descriptions are omitted.

[0183] As Figure 17 shown, in the electronic component 1L of the twelfth embodiment, when viewed from a direction orthogonal to the first side 10s1, the first protective layer 15 is located inside the outer periphery of the first side 10s1 of the glass substrate 10. Similarly, when viewed from a direction orthogonal to the second side 10s2, the second protective layer 16 is located inside the outer periphery of the second side 10s2 of the glass substrate 10. In addition, only the first protective layer 15 among the first protective layer 15 and the second protective layer 16 needs to satisfy the above configuration.

[0184] In the electronic component 1L of the twelfth embodiment, the first protective layer 15 is smaller than the outer periphery of the first side surface 10s1, so that the processing of the glass substrate 10 becomes easy. For example, in the case of cutting the glass substrate 10, the portion of the glass substrate 10 to be cut can be crystallized and cut by etching. Further, for example, it is possible to prevent the first protective layer 15 from peeling off from the glass substrate 10 due to the load of the cutting machine when cutting with the cutting machine.

[0185] The same applies to the second protective layer 16. In other words, the second protective layer 16 is smaller than the outer periphery of the second side surface 10s2, so that the processing of the glass substrate 10 becomes easy in the case of cutting the glass substrate 10. Further, it is possible to prevent the second protective layer 16 from peeling off from the glass substrate 10 due to the load of the cutting machine when cutting the glass substrate 10 with the cutting machine.

[0186] Moreover, in the electronic component 1L of the twelfth embodiment, in other configurations, it has the same effects as the electronic component 1K of the eleventh embodiment.

[0187] <Thirteenth Embodiment>

[0188] Figure 18 FIG. is a side view of the electronic component of the thirteenth embodiment as viewed from the first side surface side. The configuration of the end surface of the glass substrate in the thirteenth embodiment is different from that in the twelfth embodiment. Hereinafter, this different configuration will be described. Other configurations are the same as those in the twelfth embodiment, and the same reference numerals as those in the twelfth embodiment are given and the description thereof is omitted.

[0189] As Figure 18 shown, in the electronic component 1M of the thirteenth embodiment, the first end surface 10e1 of the glass substrate 10 is colored. More specifically, the first end surface 10e1 of the glass substrate 10 is composed of a crystallized portion 10a. In Figure 18 , for convenience, the crystallized portion 10a is shown by hatching. The crystallized portion 10a is a portion of the glass substrate 10 that has been crystallized. The transparency of the crystallized portion 10a is lower than the transparency of the non-crystallized glass material of the glass substrate 10. The crystallized portion 10a can be formed by irradiating ultraviolet rays to the portion of the glass substrate 10 to be crystallized and then performing heat treatment (for example, firing).

[0190] Similarly, the second end surface 10e2 of the glass substrate 10 is colored. More specifically, the second end surface 10e2 of the glass substrate 10 is composed of a crystallized portion 10a. In addition, only the first end surface 10e1 among the first end surface 10e1 and the second end surface 10e2 needs to satisfy the above configuration.

[0191] In the electronic component 1M of the thirteenth embodiment, since the first end face 10e1 is colored, it can be detected by a laser sensor or a camera. Similarly, since the second end face 10e2 is colored, it can be detected by a laser sensor or a camera. In addition, other than the crystal part 10a, the end faces can also be colored by other methods such as additional coloring. For example, a colored resin layer can be provided on the end faces.

[0192] Moreover, in the electronic component 1M of the thirteenth embodiment, in other configurations, it has the same effects as the electronic component 1L of the twelfth embodiment.

[0193] <Fourteenth Embodiment>

[0194] Figure 19 It is a side view of the fourteenth embodiment of the electronic component as viewed from the first side. Figure 20 It is Figure 19 The XX-XX cross-sectional view. The difference between the fourteenth embodiment and the third embodiment is that an inductor element is added. Hereinafter, this different configuration will be described. Other configurations are the same as those of the third embodiment, and the same reference numerals as those of the third embodiment are used and their descriptions are omitted.

[0195] As Figure 19 and Figure 20 shown, in the electronic component 1N of the fourteenth embodiment, on the first side 10s1, the first coil conductor 21 of the inductor element 2 is provided on the first flat electrode 31 and the second flat electrode 32 of the capacitor element 3. The first flat electrode 31 and the second flat electrode 32 are an example of the "outer surface conductor" described in the claims. The first coil conductor 21 is an example of the "wiring layer" described in the claims.

[0196] The inductor element 2 has the same configuration as the inductor element 2 of the first embodiment. The capacitor element 3 has the same configuration as the capacitor element 3 of the third embodiment. Therefore, the detailed descriptions of the inductor element 2 and the capacitor element 3 are omitted.

[0197] The electronic component 1N further includes a first protective layer 15, a second protective layer 16, and a third protective layer 17. The first protective layer 15 is provided on the first side 10s1, the second protective layer 16 is provided on the second side 10s2, and the third protective layer 17 is provided on the first protective layer 15. The first protective layer 15, the second protective layer 16, and the third protective layer 17 have the same configurations as the first protective layer 15 and the second protective layer 16 of the twelfth embodiment. Therefore, the detailed descriptions of the first protective layer 15, the second protective layer 16, and the third protective layer 17 are omitted.

[0198] The capacitor element 3 has a first flat electrode 31, a second flat electrode 32, a dielectric film 33, a first lead conductor 35, and a second lead conductor 36. The first flat electrode 31, the second flat electrode 32, the dielectric film 33, the first lead conductor 35, and the second lead conductor 36 are provided on the first side surface 10s1. The capacitor element 3 is covered with a first protective layer 15. The first lead conductor 35 is connected to the first terminal electrode 41, and the second lead conductor 36 is connected to the second terminal electrode 42.

[0199] The inductor element 2 has a coil 20, a first lead conductor 25, and a second lead conductor 26. The first lead conductor 25 and the second lead conductor 26 are provided on the first side surface 10s1 and are covered with the first protective layer 15. The first lead conductor 25 is connected to the first terminal electrode 41, and the second lead conductor 26 is connected to the second terminal electrode 42. In other words, the inductor element 2 is electrically connected in parallel with the capacitor element 3.

[0200] The coil 20 includes a first coil conductor 21, a second coil conductor 22, a first through conductor 23, and a second through conductor 24. The first through conductor 23 and the second through conductor 24 respectively penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. The second coil conductor 22 is provided on the second side surface 10s2. The second coil conductor 22 is covered with a second protective layer 16.

[0201] The first coil conductor 21 is provided on the first protective layer 15 and is covered with a third protective layer 17. The first coil conductor 21 is connected to the first through conductor 23 and the second through conductor 24 via a via conductor 27 that penetrates the first protective layer 15. In other words, the first coil conductor 21 is located on the first flat electrode 31 and the second flat electrode 32.

[0202] In other words, the first flat electrode 31 and the second flat electrode 32 are arranged inside the coil 20. Specifically described, a part of the capacitor element 3 is provided between the first coil conductor 21 and the second coil conductor 22 of the coil 20 and between the first through conductor 23 and the second through conductor 24. "Inside the coil 20" means a region surrounded by two surfaces that are in contact with the inner circumferences of the first through conductor 23 and the second through conductor 24 that face each other, and two surfaces that are in contact with the inner circumferences of the first coil conductor 21 and the second coil conductor 22 that face each other.

[0203] In the electronic component 1N of the fourteenth embodiment, a more complex circuit can be realized without increasing the height dimension of the electronic component 1N.

[0204] Moreover, in the electronic component 1N of the fourteenth embodiment, in other configurations, it has the same effects as the electronic component 1 of the first embodiment and the electronic component 1B of the third embodiment.

[0205] In addition, the present disclosure is not limited to the above-described embodiments, and the design can be changed without departing from the gist of the present disclosure. For example, the characteristic points of the first to fourteenth embodiments can be combined in various ways.

[0206] The present disclosure includes the following aspects.

[0207] <1> An electronic component, comprising:

[0208] A glass substrate including a top surface, a bottom surface, a first side surface, and a second side surface;

[0209] An outer surface conductor provided on at least the first side surface of the first side surface and the second side surface, and being at least a part of a passive element; and

[0210] A terminal electrode embedded in the glass substrate and exposed from the bottom surface, and being electrically connected to the outer surface conductor,

[0211] The terminal electrode penetrates the glass substrate from the first side surface to the second side surface,

[0212] The height dimension of the glass substrate is smaller than the width dimension of the glass substrate. The height dimension of the glass substrate is the distance between the top surface and the bottom surface, and the width dimension of the glass substrate is the distance between the first side surface and the second side surface.

[0213] <2>

[0214] The electronic component according to <1>, wherein

[0215] The passive element is an inductor element,

[0216] The inductor element has a through conductor that is connected to the outer surface conductor and penetrates the glass substrate from the first side surface to the second side surface.

[0217] <3>

[0218] The electronic component according to <2>, wherein

[0219] The inductor element has a coil that is wound in a spiral shape along an axis and includes the outer surface conductor and the through conductor,

[0220] The axis of the coil is parallel to the bottom surface.

[0221] <4>

[0222] The electronic component according to <2>, wherein

[0223] The above inductor element has a coil, the coil is wound in a spiral shape along an axis, and includes the above outer surface conductor and the above through conductor.

[0224] The axis of the above coil is perpendicular to the above bottom surface.

[0225] <5>

[0226] The electronic component according to <1>, wherein

[0227] The above passive element is a capacitor element.

[0228] The above outer surface conductor includes a first flat electrode provided on the above first side surface and a second flat electrode provided on the above first flat electrode.

[0229] The above capacitor element has a dielectric film provided between the above first flat electrode and the above second flat electrode.

[0230] <6>

[0231] The electronic component according to <1>, wherein

[0232] The above passive element is a capacitor element.

[0233] The above outer surface conductor includes a first flat electrode and a second flat electrode. The first flat electrode penetrates the above glass substrate from the above first side surface to the above second side surface, and the second flat electrode is opposed to the first flat electrode and penetrates the above glass substrate from the above first side surface to the above second side surface.

[0234] <7>

[0235] The electronic component according to <6>, wherein

[0236] The above capacitor element has a dielectric made of a material different from the glass material of the above glass substrate between the above first flat electrode and the above second flat electrode.

[0237] <8>

[0238] The electronic component according to <1>, wherein

[0239] The above passive element includes an inductor element and a capacitor element.

[0240] <9>

[0241] The electronic component according to any one of <1> to <8>, wherein

[0242] The above glass substrate has a first part and a second part, and the second part has a height dimension smaller than the height dimension of the first part.

[0243] <10>

[0244] The electronic component according to any one of <1> to <9>, wherein,

[0245] The glass substrate includes a first end face and a second end face,

[0246] The length dimension of the glass substrate is more than twice the width dimension of the glass substrate, and the length dimension of the glass substrate is the distance between the first end face and the second end face.

[0247] <11>

[0248] The electronic component according to any one of <1> to <10>, wherein,

[0249] There are three or more of the terminal electrodes.

[0250] <12>

[0251] The electronic component according to any one of <1> to <11>, wherein,

[0252] The glass substrate includes a first end face and a second end face,

[0253] The terminal electrode also exposes from the first end face.

[0254] <13>

[0255] The electronic component according to any one of <1> to <12>, wherein,

[0256] It further includes a protective layer, and the protective layer is disposed on the first side surface and covers the outer surface conductor.

[0257] <14>

[0258] The electronic component according to <13>, wherein,

[0259] The protective layer is colored.

[0260] <15>

[0261] The electronic component according to <13> or <14>, wherein,

[0262] When observed from a direction orthogonal to the first side surface, the protective layer is located inside the outer periphery of the first side surface of the glass substrate.

[0263] <16>

[0264] The electronic component according to any one of <1> to <15>, wherein,

[0265] The above glass substrate includes a first end face and a second end face.

[0266] The above first end face is colored.

[0267] <17>

[0268] The electronic component according to any one of <1> to <16>, wherein

[0269] A wiring layer is further provided on the above outer surface conductor on the above first side face.

[0270] <18>A method for manufacturing an electronic component, comprising the following steps:

[0271] Prepare a mother substrate of glass including a first face and a second face;

[0272] On the above first face, two or more singulation regions defined by a first side, a second side, a third side, and a fourth side are provided in a direction parallel to the above first side and two or more are provided in a direction parallel to the above third side, wherein the above first side and the above second side have a length smaller than the distance between the above first face and the above second face and are parallel to each other, and the above third side and the above fourth side are orthogonal to the above first side and parallel to each other;

[0273] In each of all the above singulation regions, a through hole is formed that penetrates the mother substrate from the above first face to the above second face, and a conductor is embedded in the through hole to form a terminal electrode;

[0274] In each of all the above singulation regions, an outer surface conductor is formed on the above first face, and the outer surface conductor is at least a part of a passive element; and

[0275] Each of all the above singulation regions is singulated to manufacture a plurality of electronic components.

[0276] Description of reference numerals: 1, 1A to 1H, 1J to 1N... electronic components; 2, 2A... inductor elements (passive components); 3, 3C, 3D... capacitor elements (passive components); 10, 10G, 10F... glass substrates; 10a... crystallization part; 100... outer surface of the glass substrate; 101... first part; 102... second part; 10t... top surface; 10b... bottom surface; 10s1... first side surface; 10s2... second side surface; 10e1... first end surface; 10e2... second end surface; 15 to 17... first to third protective layers; 20, 20A... coils; 21... first coil conductor (outer surface conductor); 22... second coil conductor (outer surface conductor); 23... first through-conductor; 24... second through-conductor; 25... first lead-out conductor (outer surface conductor); 26... second lead-out conductor (outer surface conductor); 27... via-hole conductor; 31, 31C... first flat electrode (outer surface conductor); 32, 32C... second flat electrode (outer surface conductor); 33... dielectric film; 34... dielectric; 35... first lead-out conductor (outer surface conductor); 36... second lead-out conductor (outer surface conductor); 37... first support conductor; 38... second support conductor; 41, 41J... first terminal electrode; 42, 42J... second terminal electrode; 43... third terminal electrode; 1000... mother substrate; 1000a... first surface; 1000b... second surface; 1001 to 1004... first to fourth through-holes; 1100... singulation area; 1101 to 1104... first to fourth sides; 1200... cutting area; AX... axis; H... height dimension of the glass substrate; H1... height dimension of the first part; H2... height dimension of the second part; W... width dimension of the glass substrate; L... length dimension of the glass substrate.

Claims

1. An electronic component, comprising: A glass substrate, including a top surface, a bottom surface, a first side surface, and a second side surface; An outer surface conductor, provided on at least the first side surface of the first side surface and the second side surface, and being at least a part of a passive component; And A terminal electrode, embedded in the glass substrate and exposed from the bottom surface, and electrically connected to the outer surface conductor, The terminal electrode penetrates the glass substrate from the first side surface to the second side surface, The height dimension of the glass substrate is smaller than the width dimension of the glass substrate. The height dimension of the glass substrate is the distance between the top surface and the bottom surface, and the width dimension of the glass substrate is the distance between the first side surface and the second side surface.

2. The electronic component according to claim 1, wherein, The passive component is an inductor component, The inductor component has a through conductor, the through conductor is connected to the outer surface conductor, and penetrates the glass substrate from the first side surface to the second side surface.

3. The electronic component according to claim 2, wherein, The inductor component has a coil, the coil is wound in a spiral shape along an axis, and includes the outer surface conductor and the through conductor, The axis of the coil is parallel to the bottom surface.

4. The electronic component according to claim 2, wherein, The inductor component has a coil, the coil is wound in a spiral shape along an axis, and includes the outer surface conductor and the through conductor, The axis of the coil is perpendicular to the bottom surface.

5. The electronic component according to claim 1, wherein, The passive component is a capacitor component, The outer surface conductor includes a first flat electrode provided on the first side surface and a second flat electrode provided on the first flat electrode, The capacitor component has a dielectric film provided between the first flat electrode and the second flat electrode.

6. The electronic component according to claim 1, wherein, The passive component is a capacitor component, The outer surface conductor includes a first flat electrode and a second flat electrode. The first flat electrode penetrates the glass substrate from the first side surface to the second side surface, and the second flat electrode is opposed to the first flat electrode and penetrates the glass substrate from the first side surface to the second side surface.

7. The electronic component according to claim 6, wherein, The capacitor component has a dielectric made of a material different from the glass material of the glass substrate between the first flat electrode and the second flat electrode.

8. The electronic component according to claim 1, wherein, The passive component includes an inductor component and a capacitor component.

9. The electronic component according to any one of claims 1 to 8, wherein, The glass substrate has a first part and a second part, and the second part has a height dimension smaller than the height dimension of the first part.

10. The electronic component according to any one of claims 1 to 9, wherein, The glass substrate includes a first end face and a second end face, The length dimension of the glass substrate is more than twice the width dimension of the glass substrate, and the length dimension of the glass substrate is the distance between the first end face and the second end face.

11. The electronic component according to any one of claims 1 to 10, wherein there are three or more of the terminal electrodes.

12. The electronic component according to any one of claims 1 to 11, wherein the glass substrate includes a first end face and a second end face, and the terminal electrode also exposes from the first end face.

13. The electronic component according to any one of claims 1 to 12, wherein a protective layer is further provided, and the protective layer is provided on the first side face and covers the outer surface conductor.

14. The electronic component according to claim 13, wherein the protective layer is colored.

15. The electronic component according to claim 13 or 14, wherein when observed from a direction orthogonal to the first side face, the protective layer is located inside the outer periphery of the first side face of the glass substrate.

16. The electronic component according to any one of claims 1 to 15, wherein the glass substrate includes a first end face and a second end face, and the first end face is colored.

17. The electronic component according to any one of claims 1 to 16, wherein a wiring layer is further provided on the outer surface conductor on the first side face.

18. A method for manufacturing an electronic component, comprising the following steps: preparing a mother substrate of glass including a first face and a second face; On the first surface, two or more singulation regions defined by a first side, a second side, a third side, and a fourth side are provided in a direction parallel to the first side and two or more are provided in a direction parallel to the third side, wherein, the first side and the second side have lengths smaller than the distance between the first face and the second face and are parallel to each other, and the third side and the fourth side are orthogonal to the first side and parallel to each other; in each of all the singulation regions, forming a through hole that penetrates the mother substrate from the first face to the second face, and embedding a conductor into the through hole to form a terminal electrode; in each of all the singulation regions, forming an outer surface conductor on the first face, and the outer surface conductor is at least a part of a passive element; and singulating each of all the singulation regions to manufacture a plurality of electronic components.

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