Method for producing cooling device

Abstract

The invention relates to a method for producing a cooling device (1), comprising a base element (10) and a cover element (11) connected thereto, between which a cooling structure is arranged, said cooling structure having a cooling element (6), the invention relates to a method for producing a cooling structure in the form of a cooling element (6), comprising the steps of providing a material and forming the cooling structure from the material, using a sintering powder as the material, producing at least one green body from the sintering powder by pressing, sintering the green body into a shaped blank (19), and producing the cooling structure in the form of the cooling element (6) from the shaped blank (19) by shaping, for this purpose, a part of the parison (19) is pressed by means of a forming tool (20), and the base element (10) is integrally bonded to the cover element (11) after the cooling structure is arranged between the base element (10) and the cover element (11).

Description

Field of the Invention

[0001] The present invention relates to a method for manufacturing a cooling device, which includes a bottom element and a cover element connected to the bottom element. A cooling structure is provided between the bottom element and the cover element, and the cooling structure has cooling elements. The method has steps of providing a material and constructing the cooling structure from the material.

[0002] Furthermore, the present invention relates to a cooling device, which includes a bottom element and a cover element connected to the bottom element. A cooling structure is provided between the bottom element and the cover element, and the cooling structure has cooling elements. Background Art

[0003] So-called power electronic components, such as power semiconductors, are well known from the prior art. Such components are often used, for example, also in motor vehicles. It is also known that these components generate a large amount of heat during operation, which usually has to be dissipated by means of a cooling medium. For this purpose, very different coolers are known in the prior art. Additionally, so-called pin-fin cooling bodies are also known, which are surrounded and flushed by a cooling medium and thus transfer heat from the pins to the cooling medium. For example, DE102019108106A1 describes a cooler for power semiconductors in an inverter. The cooler is designed in two parts and includes: a bottom plate as the first part, which is thermally conductively attached to the power semiconductor; a cooling body as the second part, which is arranged on the bottom plate and has at least one corrugated void portion that is continuously constructed from the side of the cooling body facing away from the bottom plate to the side facing the cooling body; the first part and the second part are connected to each other and are coated with a layer that protects the two parts from electrochemical reduction.

[0004] DE102018216859A1 discloses a device for cooling a component, which has: a first substrate and a second substrate; columnar and / or conical first cooling ribs constructed in the first substrate, which can be circulated by a coolant; and columnar and / or conical second cooling ribs constructed in the second substrate, which can be circulated by a coolant. The second substrate is joined to the first substrate such that the second cooling ribs are located between the first cooling ribs without contacting the first substrate. Summary of the Invention

[0005] The object of the present invention is to simplify the manufacture of the cooling device and provide a corresponding cooling device for components with improved cooling power.

[0006] The object of the present invention is solved by the method mentioned at the beginning, according to which it is provided that a sintered powder is used as the material, at least one green body is manufactured from the sintered powder by pressing, the green body is sintered to form a shaped body, and a cooling structure in the form of a cooling element is manufactured from the shaped body by shaping. For this purpose, a part of the shaped body is pressed by a shaping die, and the bottom element and the cover element are joined in a material-locking manner after the cooling structure is arranged between the bottom element and the cover element.

[0007] Furthermore, the object of the present invention is solved by the cooling device mentioned at the beginning, the cooling structure is manufactured from shaped sintered material, and the bottom element and the cover element are joined in a material-locking manner.

[0008] It is advantageous here that no waste is produced for the cooling element manufactured by shaping, as is the case, for example, in machining. Furthermore, several or all of the cooling elements of the cooling device can be manufactured simultaneously, whereby a corresponding increase in productivity can be achieved. Here, it is advantageous for the shaping that although the green body already has a corresponding strength due to sintering, the green body can still be shaped more simply due to the pores compared to solid material. When the green body is shaped into a cooling element, stresses can be generated in the cooling element, which have a positive effect on the mechanical properties of the cooling element during the use of the cooling device. By joining the bottom element and the cover element in a material-locking manner, a fluid-tight cooling device can be provided for the cooling structure (apart from the possibility of entry and exit of the cooling fluid), so that this cooling device can be used without problems in very different applications without having to involve other special preparations for this (apart from connecting the cooling device to the cooling circuit). Due to the installed configuration of the cooling structure, this cooling mechanism can be used particularly simply in electronic applications.

[0009] According to an implementation variant of the present invention, it can be provided that the bottom element is manufactured from at least one green body and / or the cover element is manufactured from at least one green body. By manufacturing the bottom element and / or the cover element by sintering technology, the bottom element and / or the cover element can be more simply adapted to the cooling structure.

[0010] Here, according to another implementation variant of the present invention, it is advantageous that the cooling element of the cooling structure is constructed integrally with the bottom element and / or the cooling element of the cooling structure is constructed integrally with the cover element. Thus, it is possible to manufacture not only the cooling element but also the bottom element or the cover element in a single method step, whereby its manufacture can be formed more economically. By the integral construction, furthermore, no other measures for fixing the position of the cooling structure are required.

[0011] According to another embodiment variant of the present invention, it can be provided that the material-locking connection is constructed outside the region of the cooling structure. Thus, it is possible to avoid the influence on the cooling structure due to the construction of the material-locking connection, such as a thermal influence. Furthermore, it is therefore possible to construct the cooling structure as required regardless of the requirements for constructing the material-locking connection.

[0012] For constructing the material-locking connection, according to another embodiment variant of the present invention, it can be provided that a joining gap is constructed in or is present in the bottom element or the cover element. Thus, a region can be defined in which the material-locking connection is constructed, so that subsequently the interaction between the cooling structure and the material-locking connection during the manufacture of the connection can be more simply avoided. Thus, the automation of the method step "material-locking connection" can also be more simply achieved, especially if additional material is used for the material-locking connection, because the joining gap can avoid or prevent the extension of the additional material during the construction of the material-locking connection.

[0013] According to another embodiment variant of the present invention, it can be provided that the material-locking connection is constructed as a brazed connection or the material-locking connection is a brazed connection, so as to keep the temperature load on the cooling structure small during the construction of the material-locking connection and keep the stress reduction in the cooling element as small as possible or avoid the stress reduction.

[0014] According to an embodiment variant thereof, the brazed connection can be manufactured by induction brazing or sintering brazing. By means of the induction brazing, the heat input into the bottom element and the cover element during the construction of the material-locking connection can be limited to a very narrow region. On the other hand, by means of the sintering brazing, a method simplification can be achieved in such a way that the material-locking connection is produced when passing through a sintering furnace. Here, it is also possible to construct a more uniform characteristic profile over the entire cooling device.

[0015] For greater stability of the cooling device, according to an embodiment variant of the present invention, it can be provided that at least some of the individual cooling elements in the cooling element are connected not only to the bottom element but also to the cover element. Thus, it is subsequently also possible to reduce the thickness of the bottom element or the cover element, whereby the thermal resistance can be reduced and thus the cooling power of the cooling device can be increased.

[0016] To be able to simplify the joining of the cooling element to the cover element or the bottom element here, according to an embodiment variant of the present invention, in order to accommodate additional material, a joining void can be constructed in the head of the cooling element that is connected not only to the bottom element but also to the cover element.

[0017] In order to improve the corrosion resistance, according to another embodiment variant of the present invention, a coating can be applied to the cooling structure.

[0018] Here, according to another embodiment variant of the present invention, the coating can be applied before or after the material-locking connection between the bottom element and the lid element. By applying the coating before manufacturing the material-locking connection, the coating itself can be simplified, especially in hard-to-reach areas. By applying the coating after manufacturing the material-locking connection, the placement of the material-locking connection on the bottom element and the lid element can be simplified, especially by constructing this material-locking connection closer to the cooling structure, because covering for avoiding coating deposition in these areas can be avoided. Description of the Drawings

[0019] For a better understanding of the present invention, the present invention will be explained in detail with the aid of the following drawings.

[0020] Respectively in simplified schematic views:

[0021] Figure 1 A side view of a cooling device with a component to be cooled shown in section;

[0022] Figure 2 An oblique view showing a part in the cooling device;

[0023] Figure 3 An oblique view showing an embodiment variant of the cooling device;

[0024] Figure 4 Shown by a longitudinal sectional view of a cooling device according to Figure 3 ;

[0025] Figure 5 A partial longitudinal sectional view showing another embodiment variant of the cooling device;

[0026] Figure 6 An embodiment variant of a preform is shown;

[0027] Figure 7 An embodiment variant of a mold for manufacturing the cooling device is shown. Detailed Description of the Invention

[0028] It should be noted first: In the differently described embodiments, the same components are provided with the same reference numerals or the same component names, and the disclosure contained in the entire specification can be meaningfully transferred to the same components with the same reference numerals or the same component names. The positional descriptions selected in the specification, such as above, below, lateral, etc., also refer to the directly described and shown drawings, and these positional descriptions are meaningfully transferred to the new positions when the positions change.

[0029] In Figure 1 Figure 1, a side view of the cooling device 1 is shown.

[0030] The cooling device 1 is used to cool one component 2 or multiple components 2 or an assembly. For this purpose, the cooling device 1 is arranged with its back side 3, in particular directly against at least one component 2, and thus is preferably in direct contact with the component 2 for heat exchange.

[0031] The component 2 is preferably an electronic component, in particular a so-called power electronic component or a high-power electronic component or a power semiconductor or a high-power semiconductor, but it can also be implemented differently. Such a component 2 or an assembly composed of these components 2 or having these components can in particular be designed for powers in the range from several kilowatts to megawatts. Such a component 2 is used, for example, to convert electrical energy using switching electronic components. Typical applications are converters or frequency converters in the field of electric drive technology, solar inverters for regenerating energy grids or switching power supplies (usually converting alternating voltage to direct voltage through a rectifier and converting direct voltage to alternating voltage through an inverter), and converters for wind turbines, such as control systems, battery management systems, etc. in the drive technology of the electric drive system of an electric vehicle or a hybrid vehicle. The power electronic component can, for example, be a semiconductor, in particular a so-called power semiconductor, such as an IGBT.

[0032] Since such a component 2 is itself known from the relevant prior art, in order to avoid repetition in terms of details, reference is made to these prior arts in this regard.

[0033] The cooling device 1 includes a base element 4, which has a cooling structure on a first surface 5. The cooling structure is formed by cooling elements 6, which are arranged on the base element 4 protruding from the first surface 5 and are integrally connected to the base element, as can also be seen from Figure 2 Figure 1.

[0034] Within the scope of the present invention, there is the possibility that for each component 2 or an assembly composed of at least one such component 2 or having at least one such component 2, multiple cooling devices 1 according to the present invention can be combined with each other to form a cooling device group. Therefore, the cooling device 1 can in particular also be modularly assembled into a cooling device group.

[0035] The base element 4 and the cooling elements 6 are made of or composed of sintered material. Additionally, the cooling elements 6 are manufactured by shaping the base element 4 or a blank therefor.

[0036] In a preferred embodiment variant, the density of the base element 4 and the cooling elements 6 is at least 98%, in particular at least 98.5%, preferably at least 99% of the solid density of the material used.

[0037] Here, the solid density refers to the density of a cooling device made by melting and metallurgy from the same material, i.e., a component composed of solid material. The solid material here refers to a metallic material without pores except for defects, as it typically exists in sintered components.

[0038] The cooling element 6 is arranged for circulation of a cooling fluid, such as water, so that the heat received by the cooling device 1 is transferred away via this cooling fluid. Preferably, the cooling device 1 is a so-called pin-fin cooling device.

[0039] The cooling element 6 of the shown embodiment variant is configured cylindrically. However, the cooling element can also have different shapes, such as a frustoconical shape, a mushroom shape, or generally a shape with a cross-section that widens or tapers in the direction of the cooling element head 7, such as a truncated pyramid shape.

[0040] The cross-section of the cooling element 6 can be circular, elliptical, rhombic, square, etc.

[0041] In addition, all the cooling elements 6 can be configured identically. However, cooling elements 6 of different shapes can also be provided or combined on the base element 4.

[0042] The height 8 of the cooling element 6 above the first surface 5 of the base element 4 can preferably be between 2 mm and 20 mm.

[0043] In the simplest design of the cooling device 1, all the cooling elements 6 of the cooling device 1 have the same height 8 within the tolerance range. However, within the scope of the present invention, there is the possibility that the height of some of the cooling elements 6 can be less than the height of the remaining cooling elements 6. The edge cooling elements 6 can, for example, be higher than the remaining cooling elements, or the cooling elements 6 can have a trend from a height 8 that is lower or higher in the center of the cooling device 1 to a height 8 that is higher or lower at the edge of the cooling device 1. Other embodiments with different heights 8 are possible within the scope of the present invention.

[0044] It can also be provided that between 300 and 1300, in particular between 300 and 1000, for example between 300 and 750, cooling elements 6 are provided or configured per dm² of the first surface 5. In particular, this quantity has proven to be advantageous in the manufacture of the cooling device 1, i.e., in shaping the base element 4 into the cooling elements 6, because damage to the cooling elements 6 or incompletely configured cooling elements 6 can thus be avoided or reduced.

[0045] As can be seen in particular from Figure 1As can be seen, according to an implementation variant of the cooling device 1, the back side 3 is configured with a flat surface. However, there is also the possibility that the back side 3 is configured with one or more recesses 9 in which the component 2 is at least partially received. Thus, a better engagement of the component 2 to the cooling device 1 can be achieved. Generally, the component 2 can be adhesively bonded or screwed or brazed or sintered etc. to the cooling device 1.

[0046] Within the scope of manufacturing the cooling element 6, the at least one recess 9 can be manufactured simultaneously with the cooling element. Via the at least one recess 9, it is also possible to manufacture a cooling element 6 with a height 8 greater than the height of the remaining cooling elements 6.

[0047] The cooling device 1 has a bottom element 10 and a cover element 11 connected to the bottom element 10. In the implementation variant shown in Figure 1 the basic element 4 with the cooling element 6 is arranged on the bottom element 10 which also forms the back side 3, in particular connected to this bottom element. However, the basic element 4 with the cooling element 6 can also be arranged on the cover element 11, in particular connected to this cover element.

[0048] However, according to an implementation variant of the present invention, the basic element 4 can also form the bottom element 10 and / or the cover element 11. In the implementation variant "and", there are two basic elements 4, one basic element forms the bottom element 10 and the other basic element forms the cover element 11. Depending on the size of the cooling device 1, more than two basic elements 4 with cooling elements 6 can also be provided.

[0049] The implementation variant "the basic element 4 forms the bottom element 10" is shown in Figure 3 and Figure 4 The implementation variant "one basic element 4 forms the bottom element 10 and the other basic element 4 forms the cover element 11" is partially shown in Figure 5

[0050] Thus, in a preferred implementation variant, the bottom element 10 or the cover element 11 is made of sintered material or is formed therefrom, or both the bottom element 10 and the cover element 11 are made of sintered material or are formed therefrom, as will be explained in detail subsequently by means of the manufacturing of the basic element 4 with the cooling element 6. For the case of combining the bottom element 10 or the cover element 11 with a structural element made of non-sintered material, this structural element can be, for example, a punched structural element or a cut-out, in particular laser-cut or cast etc. structural element.

[0051] ​After the basic element 4 can form the bottom element 10 and / or the cover element 11, in a preferred embodiment variant, (all) the cooling elements 6 are integrally constructed with the bottom element 10 or the cover element 11, or a part of the cooling elements 6 is integrally constructed with the bottom element 10 and the remaining part of the cooling elements 6 is integrally constructed with the cover element 11.

[0052] It should be noted that in a plurality of basic elements 4 having cooling elements 6, all the basic elements 4 can also be constructed identically (except for the embodiment variant shown in Figure 5 ).

[0053] In addition, the cooling device 1 has an inlet element 12 or a plurality of inlet elements 12 for introducing a liquid or gaseous cooling fluid into the cooling device 1 and an outlet element 12 or a plurality of outlet elements 12 for discharging the cooling fluid from the cooling device 1. In the Figure 3 embodiment variant shown, the at least one inlet element 12 and the at least one outlet element 13 are arranged on the cover element 11. However, the at least one inlet element 12 and the at least one outlet element 13 can also be arranged in the bottom element 10. In addition, the at least one inlet element 12 can be arranged on the bottom element 10 and the at least one outlet element 13 can be arranged on the cover element 11 (or vice versa).

[0054] The inlet element 10 is in fluid connection with the gap 14 located between the bottom element 10 and the cover element 11 via a penetration in the cover element 11 (or the bottom element 10). The same applies to the outlet element 13. Cooling elements 6 are arranged in the gap 14. The inlet element 12 and the outlet element 13 are particularly also used to connect the cooling device 1 to a cooling circuit.

[0055] The bottom element 10 and the cover element 11 are materially locked together. In principle, the material locking connection can be an adhesive connection or a welding connection. However, in a preferred embodiment variant, the material locking connection is a brazing connection, for which a corresponding solder (as additional material) is preferably used. Constructing as a brazing connection has the following advantages: The cooling device 1 can also withstand higher temperatures (compared to an adhesive connection), and the temperature load on the cooling elements 6 manufactured by shaping technology is smaller than in a welding connection.

[0056] Due to the porosity of the bottom element 10 and / or the cover element 11 caused by sintering technology, a "grip" can be achieved if necessary by infiltrating additional material into these pores and at least partially filling these pores. Thereby, the connection strength and fluid tightness of the material locking connection can be improved.

[0057] In order to construct a fluid-tight gap 14 (apart from the inlet element 12 and the outlet element 13), the material-locking connection is preferably constructed circumferentially around the cooling structure (seen in plan view) between the bottom element 10 and the cover element 11. However, there is also the possibility that a sealing element is provided between the bottom element 10 and the cover element 11, and in this embodiment variant, the material-locking connection is constructed only in discrete regions between the bottom element 10 and the cover element 11.

[0058] In principle, the brazing connection can be manufactured according to any suitable method. However, the brazing is preferably carried out by induction brazing or sintered brazing (each preferably with solder as an additional material).

[0059] In the induction brazing, only the regions where the brazing connection is to be constructed are heated respectively. Conversely, in the sintered brazing, the additional material is introduced between the bottom element 10 and the cover element 11 and the bottom element and the cover element together with the already manufactured cooling structure are introduced into a sintering furnace again.

[0060] The brazing connection can be implemented, for example, in the form of a fillet weld. For this purpose, a butt joint or a T-joint or a corner joint can be constructed between the bottom element 10 and the cover element 11, as is known per se for brazing connections. According to another embodiment variant of the cooling device 1, in order to construct the material-locking connection between the bottom element 10 and the cover element 11, a joining gap 15 for receiving the additional material is constructed. In Figure 3 and Figure 4 the embodiment variant shown, this is achieved in that the bottom element 10 has a flange 16 on which the cover element 11 is arranged at a distance from the side wall 17 of the flange 16 with the (circumferential) joining gap 15 constructed. Other configurations of the joining gap are possible within the scope of the present invention.

[0061] The joining gap 15 can have, for example, a width between 0.05 mm and 3 mm and a depth between 0.1 mm and 5 mm.

[0062] As can be seen from Figure 3 and Figure 4 the joining gap 15 is preferably constructed only outside the cooling structure and at a distance from the cooling structure. Therefore, the material-locking connection is also preferably constructed outside the region of the cooling structure and at a distance from the cooling structure. The distance between the joining gap 15 and the nearest cooling element 6 can be between at least 3 mm and at least 15 mm.

[0063] The cooling elements 6 can be arranged at a distance between 0.3 and 5 mm relative to each other. Here, the distance is measured between two directly adjacent cooling elements 6 respectively. InFigure 5 In the embodiment variant shown in , the distances between the cooling elements 6 on the bottom element 10 and the cooling elements 6 on the cover element 11 are set larger, so that gaps are formed between the respective cooling elements 6, into which the cooling elements 6 of the bottom element 10 or the cover element 11 engage. In the finished cooling device 1, the distances between the cooling elements 6 can again be selected from the ranges mentioned above for this purpose.

[0064] The base element 4 (and therefore also the bottom element 10 and / or the cover element 11 ) can have, for example, an element height 18 of between 3 mm and 5 mm (see Figure 2 ). However, the base element 4 can also have an element height 18 of a maximum of 3 mm. In particular, the base element 4 can also have an element height 18 of between 1 mm and 2.5 mm. The element height 18 of the (plate-shaped) base element 4 is measured between its back side 3 and the first surface 5. If a recess 9 is provided in the back side 4, the element height 18 is measured next to the recess 9.

[0065] Sintered powders or (in particular metal) powders used in powder metallurgy are used to produce the cooling device 1. Sintered powders with correspondingly good thermal conductivity are preferably used. In particular, sintered powders based on aluminum or aluminum alloys or based on copper or copper alloys or MMC powders (metal matrix composites) are used.

[0066] The cooling device is produced by powder metallurgy according to the powder metallurgy method, and is therefore preferably a sintered component. For this purpose, a green body is produced in a corresponding die (die) from a sintering powder that can be produced from individual (metal) powders by mixing, and the powders can be used in prealloyed form if necessary. The density of the green body is preferably at least 80%, in particular between 80% and 96%, of the solid density of the material.

[0067] The green body is then dewaxed at room temperature and subjected to one-stage, two-stage or multi-stage sintering and then preferably cooled to room temperature. The sintering can be carried out at a temperature between 500° C. and 1300° C., for example.

[0068] Since these method sequences and the method parameters used therein are likewise known from the prior art, in order to avoid repetitions, reference is made to the relevant prior art in this regard.

[0069] By sintering, a preform 19 is formed from the green body, as is exemplified in Figure 6shown in. The preform 19 can be configured as a flat plate, so that the back side 3 and the first surface 5 can thus extend parallel to each other. Additionally, the preform 19, in particular the preform for manufacturing the bottom element 10, may already have a support surface, such as a flange 16, for supporting the lid element 11, in order to form a gap 14 between the bottom element 10 and the lid element 11. Similarly, the preform 19, in particular the preform for manufacturing the lid element 11, may have an inlet element 12 and / or an outlet element 13.

[0070] Due to the improved formability of the preform 19, other shapes of the first surface 5 of the preform 19 are possible. Thus, it is already possible to preform a first pin-fin addition or a cooling element addition (circular, oval, elliptical, etc.) with a height between 0.1 mm and 2.0 mm. Additionally, structures (waves, ribs, etc.) can be intentionally introduced into the first surface 5 of the preform 19 in order to facilitate the eddy current of the cooling fluid if necessary.

[0071] Subsequently, the preform 19 can be recompressed. The recompression can be carried out simultaneously with the forming of the preform 19 into the cooling element 6.

[0072] The forming of the preform 19 is carried out in a forming die 20. For this purpose, the preform 19 is placed into the forming die 20 or the preform is placed against the forming die. In the simplest case, the forming die 20 for manufacturing the cooling element 6 consists of a perforated plate 21. The perforated plate 21 has voids 22, in particular through-holes, into which or through which a part of the material of the preform 19 is pressed, thereby forming the cooling element 6. In order to form the flange 16, corresponding voids 23 can be provided according to its shape in the perforated plate 21.

[0073] The remaining part of the material of the preform 19 that is not pressed into the forming die 20 or pressed through the forming die 20 forms the base element 4, i.e., preferably the bottom element 10 or the lid element 11. Here, the subsequent desired element height 18 of the base element 4 has already been taken into account on the preform 19 according to the forming to be carried out for forming the cooling element 6.

[0074] The voids 22, 23, i.e., their cross-sections, are correspondingly adapted to the cross-section of the cooling element 6 to be manufactured.

[0075] The forming die 20 can also have a different appearance, i.e., it does not necessarily have to be a perforated plate 21. The forming die 20 can in particular be configured as a concave die "in the shape of a pot".

[0076] For shaping, the punch 24, or generally the stamping die, is placed against the back side 3 of the preform 19 and pressed onto the preform 19 with a predeterminable pressure, said back side also constituting the back side 3 of the base element 4. The shaping can be carried out, for example, at a pressure between 700 MPa and 1600 MPa. Additionally, the shaping can be carried out during a time period of at most 10 s, in particular between 0.1 s and 10 s. Additionally, the shaping can preferably be carried out at room temperature (20 °C), i.e., cold shaping, or the shaping can also be carried out after preheating the preform 19 to a temperature between 50 °C and 300 °C, for example between 50 °C and 150 °C, and / or in or with a shaping die 18 heated to a temperature between 50 °C and 300 °C, for example between 50 °C and 150 °C.

[0077] After shaping the preform 19, i.e., forming, the cooling device 1 can be reprocessed. For example, the cooling element 6 can be height-calibrated or generally recompressed, for example at the free end, and for this purpose, the punch can also be used. Additionally, the first surface 5 and the cooling element 6 can be provided with a coating 25 (see Figure 5 ). For example, a corrosion-resistant coating, such as an electroplated Ni-P coating 25. The coating 25 can be applied or deposited before or after the material-locking connection of the bottom element 10 and the cover element 11. Applying the coating before the material-locking connection of the bottom element 10 and the cover element 11 has the advantage that the surface to be coated can be more easily accessed. If it is not desired to subsequently remove the coating 25 in the connection area between the bottom element 10 and the cover element 11 before the material-locking connection is constructed, the area with the material-locking connection can be covered, for example masked, before depositing or applying the coating 25. This can be avoided by depositing the coating 25 after the material-locking connection is constructed. For example, arranging the flange 16 at a distance from the cooling structure can also contribute to the fact that the coating 25 in the connection area does not have to be removed because the flange 16 can be arranged outside the area to be coated of the cooling structure.

[0078] The coating 25 can have a layer thickness between 1 µm and 500 µm, for example.

[0079] The shaping of the preform 19 can be carried out in one or multiple stages, so that the cooling element 6 and the base element 4 or the bottom element 10 or the cover element 11 can thus be formed in one or multiple steps.

[0080] Furthermore, according to an implementation variant, there is a possibility that at least some of the cooling elements 6 are connected or have been connected not only to the bottom element 10 but also to the cover element 11. For this purpose, for example, the bottom element 10 or the cover element 11 can be heated from the outside in the abutment area of the cooling element 6 to be connected, for example, by means of a laser. Here, the area to be heated can be maximally as large as the cross-section of the cooling element 6 in the cooling element head 7. For example, a circular or annular area of a material-locking connection can be constructed between the cooling element 6 and the bottom element 10 or the cover element 11.

[0081] In order to also be able to provide additional material for such a material-locking joining of the cooling element 6 to the bottom element 10 or the cover element 11, according to an implementation variant, it can be provided that a joining gap 26 (joining recess) is constructed in the cooling element head 7 of the cooling element 6 that is connected not only to the bottom element 10 but also to the cover element 11, as shown in dashed lines in Figure 1 . The joining gap 26 can be formed, for example, during the shaping of the preform 19 into the cooling element 6 in such a way that, for example, the shaping die 20 for constructing the cooling element 6 with the joining gap 26 does not have a penetration part but only a recess, and the recess has a corresponding contour of the bottom of the recess for forming the joining gap 26. Additional material, such as solder, can be provided in the joining gap 26. This additional material can be liquefied, for example, by means of a laser or inductively. Similarly, sintered brazing of the cooling element 6 is thus possible.

[0082] In addition to constructing a material-locking connection between the bottom element 10 and the cover element 11, a form-fitting connection can additionally be provided by constructing corresponding form-fitting elements (for example, in the form of a groove / key connection) in the bottom element 10 and / or in the cover element 11.

[0083] Furthermore, it can be provided that the inlet element 12 and / or the outlet element 13 are arranged in the side wall of the cooling device 1.

[0084] As can be seen from Figure 3 , the bottom element 10 can be manufactured with a penetration part 27 through which the cooling device can be connected to the component 2 to be cooled, for example, by means of a thread.

[0085] The specifically shown shape of the cooling device 1 in the figure is only used to explain the present invention. The cooling device 1 can also have other shapes.

[0086] The various embodiments show possible implementation variants. It should be noted here that combinations of the various implementation variants with each other are also possible.

[0087] It should finally be noted that, for a better understanding of the structure of the cooling device 1, it is not necessarily shown to scale.

[0088] List of reference numerals

[0089] 1 Cooling device

[0090] 2 Component

[0091] 3 Dorsal side

[0092] 4 Base element

[0093] 5 Surface

[0094] 6 Cooling element

[0095] 7 Cooling element head

[0096] 8 Height

[0097] 9 Recess

[0098] 10 Bottom element

[0099] 11 Cover element

[0100] 12 Inlet element

[0101] 13 Outlet element

[0102] 14 Gap

[0103] 15 Joint gap

[0104] 16 Flange

[0105] 17 Side wall

[0106] 18 Element height

[0107] 19 Parison

[0108] 20 Molding die

[0109] 21 Orifice plate

[0110] 22 Void portion

[0111] 23 Void portion

[0112] 24 Punch

[0113] 25 Coating

[0114] 26 Joint void portion

[0115] 27 Penetration portion.

Claims

1. A method for manufacturing a cooling device (1), the cooling device comprising a bottom element (10) and a cover element (11) connected to the bottom element, a cooling structure being provided between the bottom element (10) and the cover element (11), the cooling structure having a cooling element (6), the method comprising the steps of providing a material and constructing the cooling structure from the material, characterized in that, Use the sintered powder as the material, manufacture at least one green compact from the sintered powder by pressing, sinter the green compact into a shaped blank (19), and manufacture a cooling structure in the form of a cooling element (6) from the shaped blank (19). To this end, press a part of the shaped blank (19) through a forming die (20), and after arranging the cooling structure between the bottom element (10) and the cover element (11), connect the bottom element (10) and the cover element (11) by material locking.

2. The method according to claim 1, characterized in that, Manufacture the bottom element (10) from at least one shaped blank (19) and / or manufacture the cover element (11) from at least one shaped blank (19).

3. The method according to claim 2, wherein Construct the cooling element (6) of the cooling structure integrally with the bottom element (10) and / or construct the cooling element (6) of the cooling structure integrally with the cover element (11).

4. The method according to any one of claims 1 to 3, characterized in that, Construct the material locking connection outside the area of the cooling structure.

5. The method according to claim 4, characterized in that, Construct a joining gap (15) in the bottom element (10) or the cover element (11).

6. The method according to any one of claims 1 to 5, characterized in that Construct the material locking connection as a soldering connection.

7. The method according to claim 6, wherein Manufacture the soldering connection by induction soldering or sintering soldering.

8. The method according to any one of claims 1 to 7, characterized in that, Connect at least some of the individual cooling elements in the cooling element (6) not only to the bottom element (10) but also to the cover element (11).

9. The method according to claim 8, wherein Construct a joining void (26) in the cooling element head (7) of the cooling element (6) that is connected not only to the bottom element (10) but also to the cover element (11).

10. The method according to any one of claims 1 to 9, characterized in that, Apply a coating (25) to the cooling structure.

11. The method according to claim 10, characterized in that, Carry out the coating (25) before or after the material locking connection between the bottom element (10) and the cover element (11).

12. Cooling device (1), said cooling device comprising a bottom element (10) and a cover element (11) connected to said bottom element, a cooling structure being provided between said bottom element (10) and said cover element (11), said cooling structure having a cooling element (6), characterized in that, The cooling structure is manufactured from shaped sintered material, and the bottom element (10) and the cover element (11) are connected by material locking.

13. The cooling device (1) according to claim 12, characterized in that, The cooling element (6) of the cooling structure is constructed integrally with the bottom element (10) and / or the cooling element (6) of the cooling structure is constructed integrally with the cover element (11).

14. The cooling device (1) according to claim 12 or 13, characterized in that, The material locking connection between the bottom element (10) and the cover element (11) is a soldering connection.

15. The cooling device (1) according to claim 14, characterized in that, The soldering connection is constructed in a joining gap (15) that is constructed outside the cooling structure.

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