Computer heat exchange plate and processing method thereof

Abstract

The application relates to the technical field of computer heat dissipation, in particular to a computer heat exchange plate and a processing method thereof. The computer heat exchange plate comprises a body in a plate structure, the front surface of the body is provided with a positioning support part matched with an external component, the back surface is provided with a positioning groove, a heat dissipation groove and a heat conduction groove; the positioning groove is used for fixing a computer operation module, and a heat conduction block is fixed in the positioning groove; the heat conduction block is provided with an installation groove matched with the computer operation module; the heat dissipation groove is arranged around the circumferential direction of the positioning groove, and a cooling pipeline for circulating heat exchange liquid medium is embedded in the groove; a plurality of heat conduction grooves are located between the positioning groove and the heat dissipation groove, and a sintered heat pipe for connecting the cooling pipeline and the heat conduction block is fixed in the heat conduction groove. The application provides the computer heat exchange plate and the processing method thereof, can effectively protect and position support the computer operation module in intelligent driving, and can also meet the requirements of the intelligent driving system on high integration and high-efficiency heat dissipation.

Description

Technical Field

[0001] This application relates to the field of computer heat dissipation technology, and in particular to a computer heat exchange plate and its processing method. Background Technology

[0002] Computer heat exchangers play a crucial role in modern electronic devices, especially in the fields of intelligent driving and automotive chips, where their efficient heat dissipation capabilities directly impact system stability and safety. With the rapid development of intelligent driving technology, the computing performance of automotive chips is constantly improving, placing higher demands on thermal management. Efficient heat conduction and dissipation not only extend chip lifespan but also significantly improve system response speed and stability, providing reliable support for autonomous driving decision-making, data processing, and real-time communication. Therefore, developing heat exchangers with high thermal conductivity, good structural stability, and compact design has become an important research direction in the industry.

[0003] In existing technologies, various methods are typically employed to achieve efficient heat dissipation for automotive infotainment chips. On one hand, heat dissipation fins are installed on heat exchange plates to increase the heat dissipation area, utilizing natural convection or forced air cooling to remove heat. On the other hand, cooling pipes are arranged inside the heat exchange plate to allow the flow of liquid media for rapid heat conduction and dissipation. Furthermore, some solutions further improve heat transfer efficiency by filling the space between the chip and the heat exchange plate with thermally conductive materials. Simultaneously, some designs adopt an integrated structure, combining positioning devices with heat dissipation functions to optimize space utilization. While these methods address the heat dissipation problem to some extent, they do not fully meet the dual requirements of high-performance automotive infotainment chips for both compactness and efficient heat dissipation.

[0004] However, existing heat exchange plates generally suffer from poor heat conduction paths, particularly low heat exchange efficiency between the chip and cooling pipes, resulting in limited overall heat dissipation performance. Furthermore, under the harsh operating conditions encountered by vehicles in motion, conventional heat exchange plates cannot effectively protect and position the chip, and their lack of integrated design makes it difficult to meet the stringent requirements of intelligent driving systems for high integration and efficient heat dissipation. These issues limit the long-term stable operation of automotive chips and urgently require improvement. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, this application provides a computer heat exchange plate and its processing method, which can effectively protect and position the computer operating module in intelligent driving, and also meet the requirements of intelligent driving system for high integration and efficient heat dissipation.

[0006] This application is achieved through the following technical solution:

[0007] A computer heat exchange plate includes a plate-shaped body. The front of the body has a positioning support portion adapted to an external component, and the back has a positioning groove, a heat dissipation groove, and a heat conduction groove. The positioning groove is used to fix the positioning of a computer operating module, and a heat conduction block is fixed in the positioning groove. The heat conduction block has an installation slot adapted to the computer operating module. The heat dissipation groove is arranged circumferentially around the positioning groove, and a cooling pipe for the flow of heat exchange liquid medium is embedded in the groove. A plurality of the heat conduction grooves are located between the positioning groove and the heat dissipation groove, and a sintered heat pipe connecting the cooling pipe and the heat conduction block is fixed in the heat conduction groove.

[0008] By adopting the above technical solution, the computer heat exchange plate can effectively dissipate heat from the computer's operating modules. Specifically, the plate-like structure combined with the positioning support on the front ensures a stable connection between the heat exchange plate and external components, improving the overall structural reliability. The positioning support also supports the main body, creating a gap when connected to external components to ensure good ventilation and increase the heat dissipation area. The positioning groove on the back is used to fix the computer operating module, ensuring the accuracy of the module's position and improving heat dissipation efficiency. The positioning groove also provides comprehensive protection for the computer operating module, especially the intelligent chip. The heat-conducting block and its internal mounting groove in the positioning groove can fit tightly against the computer operating module, promoting rapid heat conduction. The heat dissipation groove is arranged around the positioning groove and has embedded cooling pipes. Through the flow of the heat exchange liquid medium, efficient heat exchange is achieved. The sintered heat pipes fixed in the heat-conducting groove connect the cooling pipes and the heat-conducting block, further enhancing the efficiency of heat transfer from the heat-conducting block to the cooling pipes, reducing thermal resistance, and improving overall heat dissipation performance.

[0009] Optionally, the ends of the evaporation section and cooling section of the sintered heat pipe are provided with connecting parts for engaging with the heat-conducting block and cooling pipe and increasing the heat conduction contact area.

[0010] By adopting the above technical solution, the ends of the evaporation section and cooling section of the sintered heat pipe are provided with connecting parts, which can be snapped and fixed with the heat-conducting block and cooling pipe, and can also increase the heat conduction contact area, improve the heat conduction efficiency, reduce thermal resistance, and improve heat exchange performance.

[0011] Optionally, the connecting part is a tongue and groove joint, the side wall of the cooling pipe is provided with a recessed part adapted to the tongue and groove joint, and the heat-conducting block is provided with a tongue and groove joint adapted to the tongue and groove joint.

[0012] By adopting the above technical solution, the connection between the sintered heat pipes, heat-conducting blocks, and cooling pipes of the computer heat exchange plate is more stable. Specifically, the tongue-and-groove design of the protrusions, recesses, and grooves significantly increases the heat conduction contact area, thereby improving heat transfer efficiency. In addition, this structural design effectively reduces thermal resistance, ensuring that the heat generated by the computer operating modules can be quickly conducted to the heat exchange liquid medium in the cooling pipes, thus improving the overall heat dissipation performance.

[0013] Alternatively, the recess may be filled with graphite.

[0014] By adopting the above technical solution, the connection between the sintered heat pipes and cooling pipes of the computer heat exchange plate adopts a tongue-and-groove structure. The sidewall of the cooling pipe has a recess that matches the tongue-and-groove, and the heat-conducting block has a tongue-and-groove that matches the tongue-and-groove. This structural design effectively increases the heat conduction contact area and improves the heat transfer efficiency. Furthermore, the recess is filled with graphite. Utilizing the excellent thermal conductivity and stability of graphite, the heat conduction performance can be significantly improved, the thermal resistance can be reduced, thereby enhancing the heat dissipation effect of the entire heat exchange plate.

[0015] Optionally, the bottom outer surface of the positioning groove is provided with heat dissipation fins.

[0016] By adopting the above technical solution, heat dissipation fins are set on the outer surface of the bottom of the positioning groove of the computer heat exchange plate, which can significantly increase the heat exchange area and improve the heat transfer efficiency from the computer operating module to the external environment, thereby effectively reducing the operating temperature of the operating module and improving the stability and service life of the equipment.

[0017] Alternatively, the sidewalls of the heat dissipation fins may have a wavy structure.

[0018] By adopting the above technical solution, the wave-shaped heat dissipation fins can significantly increase the heat dissipation area and improve heat exchange efficiency. At the same time, the wave-shaped structure helps optimize airflow distribution, allowing cooling air to fully contact the heat dissipation fins during flow, further enhancing the heat dissipation effect. In addition, this design can reduce material usage and lower manufacturing costs while ensuring heat dissipation performance.

[0019] Further optionally, the bottom of the positioning groove is provided with heat dissipation holes, which are located between the heat dissipation fins; the bottom of the heat-conducting block is provided with heat-conducting fins that are adapted to the heat dissipation holes.

[0020] By adopting the above technical solution, the design of heat dissipation holes and heat-conducting fins significantly improves the heat dissipation performance of the heat exchange plate. Specifically, the heat dissipation holes promote airflow at the bottom of the positioning groove, accelerating heat dissipation; the heat-conducting fins are adapted to the heat dissipation holes, further improving the heat conduction efficiency at the bottom of the heat-conducting block, allowing heat to be transferred to the external environment more quickly. This structural design effectively reduces the operating temperature of the computer's operating modules, improving the stability and lifespan of the equipment.

[0021] Further optionally, the height of the heat dissipation fins is greater than the height of the heat conduction fins; the end face of the heat conduction fins has a wavy structure.

[0022] By adopting the above technical solution, the height of the heat dissipation fins is greater than that of the heat conduction fins, which effectively increases the heat dissipation area, allowing heat to be dissipated into the surrounding environment more quickly, thereby improving the overall heat dissipation efficiency. At the same time, the end face of the heat conduction fins has a wavy structure, which further increases the effective contact area for heat conduction, improves the heat conduction efficiency, and helps to optimize heat flow distribution, reduce thermal resistance, and ensure that the computer operating modules can still maintain stable operation under high load conditions.

[0023] Optionally, the main body is provided with at least two positioning grooves, the cooling pipe includes a main pipe and branch pipes, the main pipe is provided with a plurality of water outlets connected to the branch pipes, and a temperature sensing valve plate is provided at the water outlet; the temperature sensing valve plate is composed of two layers of metal sheets with different coefficients of thermal expansion, the metal sheet with the lower coefficient of thermal expansion is arranged on the side close to the sintering heat pipe, and the free end of the temperature sensing valve plate has an arc structure that can reduce the flow cross-sectional area of ​​the water outlet; the branch pipes are arranged circumferentially around the positioning grooves.

[0024] By adopting the above technical solution, the computer heat exchange plate can achieve precise temperature control of different positioning groove areas. Specifically, the temperature sensing valve plate on the main pipe deforms according to the temperature change at its location, and automatically adjusts the flow area of ​​the outlet by utilizing the characteristics of the bimetallic strip, thereby dynamically controlling the flow rate of the cooling liquid medium flowing to each branch pipe. This design not only improves cooling efficiency, but also enables self-regulation of the flow rate of the medium flowing from the main pipe into each branch pipe, ensuring that the heat in each positioning groove area can be uniformly and effectively dissipated, further enhancing the stability and reliability of the computer operating module.

[0025] Further optionally, the body is provided with an anodized layer; the positioning support is provided with a fastening threaded hole for connecting with an external component.

[0026] By adopting the above technical solution, the anodized layer on the body significantly improves the corrosion resistance and wear resistance of the heat exchange plate, thereby extending its service life. The threaded holes on the positioning support ensure a stable connection between the heat exchange plate and external components, improving the overall structural stability and reliability.

[0027] A processing method based on any of the above-described computer heat exchange plates specifically includes the following steps:

[0028] A positioning fixture is manufactured, wherein the positioning fixture is provided with a positioning protrusion, and the positioning protrusion is adapted to the gap space formed between the adjacent positioning support part;

[0029] Machining the front of the workpiece: According to the design drawings, a positioning support part is machined on the front of the blank, and a fastening threaded hole is machined at the bottom of the support part.

[0030] For machining the back of the workpiece, first, the blank with the pre-machined positioning support part is matched with the positioning fixture so that the positioning protrusion of the positioning fixture engages with the positioning support part, and the existing fastening threaded hole on the blank is used to fasten the connection with the positioning fixture; then, the positioning groove, heat dissipation groove and heat conduction groove are machined on the back of the workpiece.

[0031] Surface oxidation involves anodizing the surfaces of workpieces that have undergone front and back machining.

[0032] By adopting the above technical solution, the processing method can efficiently and accurately manufacture computer heat exchange plates. Specifically, by creating positioning fixtures and utilizing the cooperation between positioning protrusions and positioning supports, precise positioning of the workpiece during processing is achieved, effectively avoiding processing errors and improving product yield. In the front processing step, positioning supports and fastening threaded holes are machined on the blank, providing a reliable connection foundation for subsequent back processing and simplifying the assembly process. In the back processing step, the engagement and fastening connection of the positioning fixtures ensures the processing accuracy of positioning grooves, heat dissipation grooves, and heat conduction grooves, while ensuring the consistency of installation space for components such as cooling pipes and sintered heat pipes. Surface oxidation treatment enhances the corrosion resistance and wear resistance of the body, extending the service life of the computer heat exchange plate.

[0033] In summary, this application includes at least one of the following beneficial technical effects:

[0034] This application achieves rapid heat conduction and dissipation of the chip by setting a heat-conducting block in the positioning groove and using a sintered heat pipe to connect the heat-conducting block and the cooling pipe, which significantly improves the heat exchange efficiency and solves the problem of poor heat conduction path in the prior art.

[0035] 1. The heat dissipation trenches of this application are arranged around the positioning grooves, and combined with the flow of heat exchange liquid medium in the cooling pipes, they form an efficient heat dissipation circulation system, which effectively meets the requirements of high-performance automotive chips for compactness and efficient heat dissipation.

[0036] 2. The heat dissipation trenches of this application are arranged around the positioning grooves, and combined with the flow of heat exchange liquid medium in the cooling pipes, they form a highly efficient heat dissipation circulation system, which effectively meets the requirements of high-performance automotive chips for compactness and efficient heat dissipation.

[0037] 3. The design of the positioning support and positioning groove in this application is integrated, which not only enhances the structural stability but also optimizes the spatial layout, providing reliable protection and positioning for the chip and adapting to the harsh working conditions during vehicle operation. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the overall structure of the computer heat exchange plate described in Embodiment 1;

[0039] Figure 2 This is a schematic diagram of the front structure of the main body as described in Embodiment 1;

[0040] Figure 3 This is a schematic diagram of the structure on the back of the main body as described in Embodiment 1;

[0041] Figure 4 This is a schematic diagram of the heat-conducting block described in Embodiment 1;

[0042] Figure 5 This is a schematic diagram of the cooling pipe structure described in Embodiment 1;

[0043] Figure 6 This is a schematic diagram of the arrangement structure of the sintered heat pipes described in Embodiment 1;

[0044] Figure 7 This is a schematic diagram of the arrangement structure of the sintering heat pipes described in Example 2;

[0045] Figure 8 This is a schematic diagram of the graphite arrangement structure described in Example 2;

[0046] Figure 9 This is a schematic diagram of the cooling pipe structure described in Embodiment 2;

[0047] Figure 10 This is a schematic diagram of the front structure of the main body as described in Embodiment 3;

[0048] Figure 11 This is a schematic diagram of the structure on the back of the body as described in Embodiment 3;

[0049] Figure 12 This is a schematic diagram of the bottom structure of the heat-conducting block described in Embodiment 3;

[0050] Figure 13 This is a schematic diagram of the arrangement structure of the positioning groove and heat dissipation trench described in Embodiment 4;

[0051] Figure 14 This is a schematic diagram of the main pipe described in Embodiment 4;

[0052] Figure 15 This is a schematic diagram of the arrangement structure of the temperature sensing valve plate described in Embodiment 4;

[0053] Figure 16 This is a schematic diagram of the temperature sensing valve plate described in Embodiment 4.

[0054] In the diagram: 1. Body; 2. Positioning support; 21. Fastening threaded hole; 3. Positioning groove; 31. Heat dissipation fins; 32. Heat dissipation hole; 4. Heat dissipation trench; 5. Heat conduction groove; 6. Cooling pipe; 61. Main pipe; 62. Branch pipe; 63. Temperature sensing valve plate; 631. Active layer; 632. Passive layer; 633. Deformation free end; 64. Recessed part; 7. Heat conduction block; 71. Mounting groove; 72. Heat conduction fins; 73. Tongue and groove; 74. Wire groove; 8. Sintered heat pipe; 81. Connecting part; 9. Graphite; 10. Cover plate. Detailed Implementation

[0055] The technical solutions of various embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] Example 1

[0057] Reference Figures 1-3This application discloses a computer heat exchange plate, including a plate-shaped body 1. The front of the body 1 is provided with a positioning support 2 adapted to external components, and the back is provided with a positioning groove 3, a heat dissipation groove 4, and a heat conduction groove 5. The positioning groove 3 is used to fix the positioning of the computer running module, and a heat conduction block 7 is fixed in the positioning groove 3. The heat conduction block 7 is provided with an installation groove 71 adapted to the computer running module. The heat dissipation groove 4 is arranged circumferentially around the positioning groove 3, and a cooling pipe 6 for the flow of heat exchange liquid medium is embedded in the groove. Several heat conduction grooves 5 are located between the positioning groove 3 and the heat dissipation groove 4, and a sintered heat pipe 8 connecting the cooling pipe 6 and the heat conduction block 7 is fixed in the heat conduction groove 5, which achieves the effects of improving heat conduction efficiency, enhancing structural stability, and optimizing spatial layout. In order to protect the computer running module, the front of the body 1 can be fixed with a cover plate 10 by thread fastening, including the cooling pipe 6 and the computer running module inside. Positioning grooves for installing other computer running modules can also be provided on the cover plate 10 to realize a three-dimensional computer heat exchange plate.

[0058] Specifically, refer to Figures 2-3 The main body 1 can be made of aluminum alloy or copper alloy, which has good thermal conductivity and structural strength; the positioning support part 2 includes multiple protruding structures, such as cylindrical or square bosses, with fastening threaded holes 21 on the top for connection with external components; the diameter of the fastening threaded holes 21 can be selected according to actual needs, such as M4, M6, etc., to adapt to different installation scenarios.

[0059] Reference Figures 2-3 To improve the corrosion resistance and wear resistance of the body 1 and extend its service life, the body 1 is provided with an anodized layer; the positioning support part 2 is provided with a fastening threaded hole 21 for connecting with external components; specifically, the thickness of the anodized layer is 10μm to 25μm, and its surface presents a uniform oxide film with good wear resistance and corrosion resistance.

[0060] Reference Figures 2-3 The positioning groove 3 has a rectangular or circular cross-section, and its depth and width are customized according to the size of the computer operating module; the heat-conducting block 7 is made of a high thermal conductivity material, such as graphite 9, which can be die-cast and its surface is polished to reduce thermal resistance.

[0061] Reference Figure 4 The shape of the heat-conducting block 7 is adapted to the positioning groove 3, and it can also be flat or arc-shaped to adapt to different types of computer operating modules. The heat-conducting block 7 can be die-cast from graphite 9, and the mounting groove 71 provided in the heat-conducting block 7 is a rectangular groove to adapt to different types of computer operating modules. The port side of the mounting groove 71 is provided with a wire groove 74 for wires to pass through.

[0062] Reference Figure 5 The heat dissipation groove 4 is an annular groove, and its cross-sectional shape can be rectangular or semi-circular, depending on the shape of the cooling pipe 6. The cooling pipe 6 is a metal pipe, such as a copper pipe or a stainless steel pipe, and its outer wall is nickel-plated to improve corrosion resistance. The cross-sectional shape of the cooling pipe 6 is circular or elliptical, depending on the design based on fluid dynamics. The cooling pipe 6 is fixed in the heat dissipation groove 4 by welding or bonding to ensure its position is stable.

[0063] Reference Figure 6 The sintered heat pipe 8 can be made of copper and filled with a working medium, such as water and ammonia. The surface of the sintered heat pipe 8 is coated to improve the heat transfer efficiency. The two ends of the sintered heat pipe 8 are connected to the heat-conducting block 7 and the cooling pipe 6, respectively, to achieve rapid heat transfer.

[0064] The implementation principle of this embodiment is as follows: The plate-shaped body 1, combined with the positioning support 2 on the front, ensures a stable connection between the heat exchange plate and the external components, improving the reliability of the overall structure. The positioning support 2 can support the body 1 to form a gap space when connected with the external components, ensuring good ventilation and increasing the heat dissipation area. The positioning groove 3 on the back is used to fix the computer operating module, ensuring the accuracy of the module position and improving the heat dissipation efficiency. The positioning groove 3 can also provide all-round protection for the computer operating module, especially the smart chip. The heat-conducting block 7 and its internal mounting groove 71 in the positioning groove 3 can fit tightly against the computer operating module, promoting rapid heat conduction. The heat dissipation groove 4 is arranged around the positioning groove 3 and has an embedded cooling pipe 6. Through the flow of the heat exchange liquid medium, efficient heat exchange is achieved. The sintered heat pipe 8 fixed in the heat-conducting groove 5 connects the cooling pipe 6 and the heat-conducting block 7, further enhancing the heat transfer efficiency from the heat-conducting block 7 to the cooling pipe 6, reducing thermal resistance, and improving the overall heat dissipation performance.

[0065] Example 2

[0066] Reference Figures 7-9 The difference between this embodiment and Embodiment 1 is that the ends of the evaporation and cooling sections of the sintered heat pipe 8 are provided with connecting parts 81 for engaging with the heat-conducting block 7 and the cooling pipe 6 to increase the heat conduction contact area. Specifically, the connecting part 81 is a mortise block, the side wall of the cooling pipe 6 is provided with a recessed part 64 adapted to the mortise block, and the heat-conducting block 7 is provided with a tongue and groove 73 adapted to the mortise block. In order to further improve the heat conduction efficiency, the recessed part 64 can be filled with graphite 9. The mortise block is a rectangular or trapezoidal block, and its material is the same as that of the sintered heat pipe 8. The recessed part 64 is a groove that matches the shape of the mortise block, and its depth and width are designed according to the size of the mortise block. The graphite 9 is filled in the recessed part 64 and abuts against the heat dissipation groove 4 or the side wall of the sintered heat pipe 8, which can increase the heat conduction area between the circulating medium in the cooling pipe 6 and the outside, and improve the heat conduction efficiency.

[0067] The implementation principle of this embodiment is as follows: the sintered heat pipe 8 is stably connected with the heat-conducting block 7 and the cooling pipe 6 by utilizing its own structural features. The joint design of the block, the recessed part 64, and the tongue and groove 73 significantly increases the heat conduction contact area, thereby improving the heat transfer efficiency. In addition, this structural design effectively reduces thermal resistance, ensuring that the heat generated by the computer operating module can be quickly conducted to the heat exchange liquid medium in the cooling pipe 6, thereby improving the overall heat dissipation performance.

[0068] Example 3

[0069] Reference Figures 10-11 The difference between this embodiment and Embodiment 1 is that the bottom outer surface of the positioning groove 3 is provided with heat dissipation fins 31; the sidewalls of the heat dissipation fins 31 have a wavy structure, increasing the heat dissipation area; and the bottom of the positioning groove 3 is provided with heat dissipation holes 32, which are located between the heat dissipation fins 31; specifically, the heat dissipation fins 31 are thin sheet structures, and their material is the same as that of the body 1; the height difference between the peaks and troughs of the wavy structure is 1mm to 3mm, which can be adjusted according to the heat dissipation requirements. The heat dissipation holes 32 are circular or square holes, with a diameter or side length of 2mm to 5mm. The heat-conducting fins 72 are rectangular sheets with a thickness of 0.5mm to 1mm.

[0070] Refer to Figures 11-12 The bottom of the heat-conducting block 7 is provided with heat-conducting fins 72 that are adapted to the heat dissipation holes 32; the height of the heat dissipation fins 31 is greater than the height of the heat-conducting fins 72; the end face of the heat-conducting fins 72 has a wave-shaped structure, thereby forming a double wave-shaped ventilation channel on the side and bottom surfaces between the heat dissipation fins 31.

[0071] The implementation principle of this embodiment is as follows: the wave-shaped structure can increase the actual surface area of ​​the fins under the same projected area by bending or folding, thereby providing more heat dissipation area in contact with the air. Compared with flat fins, the heat dissipation efficiency can be improved by 10% to 30%. Moreover, the wave-shaped fins will disrupt the laminar flow state of the airflow, forcing the air to generate more turbulence when flowing through the fins, thereby breaking the thermal boundary layer. Turbulence can significantly improve the convective heat transfer coefficient and accelerate the transfer of heat from the fin surface to the air.

[0072] Example 4

[0073] Reference Figures 13-15 The difference between this embodiment and the first embodiment is that two positioning grooves 3 are provided on the main body 1, and the cooling pipe 6 includes a main pipe 61 and a branch pipe 62. The main pipe 61 is provided with a water outlet connected to the branch pipe 62, and a temperature sensing valve plate 63 is provided on the side wall of the water outlet near the sintering heat pipe 8. The temperature sensing valve plate 63 is composed of two layers of metal sheets with different coefficients of thermal expansion.

[0074] Specifically, refer to Figures 15-16 The temperature-sensing valve plate 63 includes an active layer 631 and a passive layer 632. The active layer 631 is made of a material with a high coefficient of thermal expansion, such as a manganese-nickel alloy; the passive layer 632 is made of a material with a low coefficient of thermal expansion, such as an Invar alloy; if cost is to be saved, a combination of brass and steel can also be used; the active layer 631 with a high coefficient of thermal expansion is located on the side away from the sintered heat pipe 8, and the free end of the temperature-sensing valve plate 63 has an arc structure that can reduce the cross-sectional area of ​​the outlet flow. When the temperature of the temperature-sensing valve plate 63 rises, the active layer 631 changes greatly, driving the arc structure to extend and move towards the fixed pipe wall, thereby increasing the cross-sectional area of ​​the flow to achieve autonomous flow regulation.

[0075] The implementation principle of this embodiment is as follows: the computer heat exchange plate can achieve precise temperature control of different positioning groove 3 areas. Specifically, the temperature sensing valve plate 63 on the main pipe 61 deforms according to the temperature change at its location, and automatically adjusts the flow area of ​​the outlet using the characteristics of the bimetallic strip, thereby dynamically controlling the flow rate of the cooling liquid medium to each branch pipe 62. This design not only improves cooling efficiency, but also ensures that the heat in each positioning groove 3 area can be uniformly and effectively dissipated, further enhancing the stability and reliability of the computer operating module.

[0076] Example 5

[0077] This application also discloses a processing method based on the above-mentioned computer heat exchange plate, specifically including the following steps: Manufacturing a positioning fixture, the positioning fixture having positioning protrusions that are adapted to the gap space formed between the positioning protrusions and adjacent positioning support parts 2; Processing the front side of the workpiece, according to the design drawings, machining the positioning support parts 2 on the front side of the blank, and machining fastening threaded holes 21 at the bottom of the support parts; Processing the back side of the workpiece, first fitting the blank with the pre-machined positioning support parts 2 with the positioning fixture, so that the positioning protrusions of the positioning fixture engage with the positioning support parts 2, and using the existing fastening threaded holes 21 on the blank to fasten the connection with the positioning fixture; then processing the positioning grooves 3, heat dissipation grooves 4, and heat conduction grooves 5 on the back side of the workpiece; Surface oxidation, performing anodizing treatment on the surface of the workpiece after completing the front and back side machining.

[0078] The implementation principle of this application embodiment is as follows: through precise processing technology, the structural accuracy and functionality of the computer heat exchange plate are ensured, thereby improving production efficiency and product quality.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the technical solutions of the embodiments of this application.

Claims

1. A computer heat exchange plate, characterized in that, The system includes a plate-shaped body (1), with a positioning support (2) on the front for use with external components, and a positioning groove (3), a heat dissipation groove (4), and a heat conduction groove (5) on the back. The positioning groove (3) is used to fix the computer operating module, and a heat conduction block (7) is fixed in the positioning groove (3). The heat conduction block (7) has an installation slot (71) for the computer operating module. The heat dissipation groove (4) is arranged circumferentially around the positioning groove (3), and a cooling pipe (6) for the flow of heat exchange liquid medium is embedded in the groove. Several heat conduction grooves (5) are located between the positioning groove (3) and the heat dissipation groove (4), and a sintered heat pipe (8) connecting the cooling pipe (6) and the heat conduction block (7) is fixed in the heat conduction groove (5). The ends of the evaporation section and the cooling section of the sintered heat pipe (8) are provided with a connecting part (81) for engaging with the heat conduction block (7) and the cooling pipe (6) and increasing the heat conduction contact area. The connecting part (81) is a mortise block, and the side wall of the cooling pipe (6) is provided with a recess (64) adapted to the mortise block. The heat-conducting block (7) is provided with a tongue and groove (73) adapted to the mortise block. The recess (64) is filled with graphite (9). The heat-conducting block (7), the sintered heat pipe (8) and the cooling pipe (6) are connected as a stable heat-conducting module whole by the snap-fit ​​of the mortise block, the recess and the tongue and groove. The cooling pipe (6) includes a main pipe (61) and branch pipes (6). 2) The main pipe (61) is provided with several outlets connected to the branch pipes (62), and a temperature sensing valve plate (63) is provided at the outlet. The temperature sensing valve plate (63) is composed of two metal sheets with different coefficients of thermal expansion. The metal sheet with the lower coefficient of thermal expansion is arranged on the side close to the sintering heat pipe (8), and the free end of the temperature sensing valve plate (63) has an arc structure that can reduce the cross-sectional area of ​​the outlet flow. The branch pipe (62) is arranged circumferentially around the positioning groove (3).

2. The computer heat exchange plate according to claim 1, characterized in that, The bottom outer surface of the positioning groove (3) is provided with heat dissipation fins (31).

3. The computer heat exchange plate according to claim 2, characterized in that, The sidewalls of the heat dissipation fins (31) have a wavy structure.

4. The computer heat exchange plate according to claim 2, characterized in that, The bottom of the positioning groove (3) is provided with heat dissipation holes (32), which are located between the heat dissipation fins (31); the bottom of the heat-conducting block (7) is provided with heat-conducting fins (72) that are compatible with the heat dissipation holes (32).

5. The computer heat exchange plate according to claim 4, characterized in that, The height of the heat dissipation fin (31) is greater than the height of the heat conduction fin (72); the end face of the heat conduction fin (72) has a wavy structure.

6. A processing method based on the computer heat exchange plate according to any one of claims 1 to 5, characterized in that, Specifically, the following steps are included: A positioning fixture is made, wherein a positioning protrusion is provided on the positioning fixture, and the positioning protrusion is adapted to the gap space formed between the adjacent positioning support (2); The workpiece is machined from the front. According to the design drawings, a positioning support part (2) is machined on the front of the blank, and a fastening thread hole (21) is machined at the bottom of the support part. For the back side of the workpiece, first, the blank with the pre-machined positioning support part (2) is matched with the positioning fixture so that the positioning protrusion of the positioning fixture is engaged with the positioning support part (2), and the existing fastening threaded hole (21) on the blank is fastened to the positioning fixture; then, the positioning groove (3), heat dissipation groove (4) and heat conduction groove (5) are machined on the back side of the workpiece. Surface oxidation involves anodizing the surfaces of workpieces that have undergone front and back machining.

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