Substrate processing apparatus and substrate processing method

Abstract

The present invention provides a substrate processing apparatus and a substrate processing method, in a substrate processing apparatus in which a nozzle guard is disposed on a front side of a slit nozzle that relatively moves with respect to a substrate, capable of removing foreign matter adhering to the nozzle guard without leaving a liquid component and efficiently, achieving stable and high-quality production. In the present invention, while a processing liquid is ejected from a nozzle outlet of a slit nozzle in a state in which the nozzle outlet approaches a surface of a substrate, the slit nozzle and a nozzle guard in a plate shape are relatively moved with respect to the substrate, whereby, while the nozzle guard disposed on the front side with respect to the slit nozzle in a relative movement direction in which the slit nozzle relatively moves is used to prevent foreign matter from adhering to the slit nozzle, the processing liquid is applied to the surface of the substrate. Before the processing liquid is thus applied, foreign matter is removed from the nozzle guard by a dry guard cleaner.

Description

Technical Field

[0001] This invention relates to a substrate processing technology that supplies and coats a processing solution from a slit nozzle onto glass substrates for FPD (Flat Panel Display) devices such as liquid crystal display devices or organic EL display devices, semiconductor wafers, glass substrates for photomasks, substrates for filters, substrates for recording discs, substrates for solar cells, substrates for electronic paper, and substrates for semiconductor packaging (hereinafter referred to as "substrates"). Background Technology

[0002] A substrate processing apparatus is known to coat a substrate with a processing liquid by moving a slit nozzle having a slit-shaped nozzle relative to the substrate and spraying the processing liquid from the slit nozzle. For example, in the apparatus described in Japanese Patent Application Publication No. 2006-102609, the substrate is held by the stage surface of a stage, and the slit nozzle is moved above the stage surface to apply the processing liquid. On the other hand, in the apparatus described in Japanese Patent Application Publication No. 2011-212544, the substrate is moved in a so-called floating manner while the slit nozzle is positioned above the stage surface at a predetermined coating position. More specifically, the substrate is floated by a pressurized gas layer formed on the stage surface by airflow through gas holes provided on the stage surface, and the substrate is moved to pass through a coating area sandwiched between the slit nozzle and the stage surface to apply the processing liquid. Thus, although the substrate handling methods differ, a nozzle guard is provided in both apparatuses. This is because foreign objects or protrusions (hereinafter referred to as "foreign objects") may protrude upwards from the surface of the substrate. That is, if the processing liquid is applied in the presence of these foreign objects, the slit nozzle will collide with the foreign objects, hindering the application of the processing liquid. In other words, such collisions can sometimes adversely affect the already applied processing liquid or the slit nozzle. Therefore, in the aforementioned conventional apparatus, a nozzle guard is provided in front of the slit nozzle in the relative movement direction of the slit nozzle relative to the substrate. Summary of the Invention

[0003] However, when using a nozzle guard to remove foreign matter, sometimes the foreign matter adheres to the nozzle guard. When using a slit nozzle with this nozzle guard for coating, depending on the size of the foreign matter, it may sometimes come into contact with the substrate, causing defects. Furthermore, if the slit nozzle is used repeatedly with foreign matter attached, multiple coatings will produce defects in the same location consecutively.

[0004] Therefore, a scheme has been proposed to assemble, for example, the nozzle protection cleaning apparatus described in Japanese Patent Application Publication No. 2022-134204 within a substrate processing apparatus. This nozzle protection cleaning apparatus supplies rinsing fluid to the nozzle protection to remove foreign matter.

[0005] The apparatus described in Japanese Patent Application Publication No. 2022-134204 removes foreign matter adhering to the nozzle guard NG using a so-called wet cleaning method. Therefore, after cleaning the nozzle guard, liquid components such as rinsing fluid may sometimes remain. Consequently, if the nozzle guard moves upwards onto the substrate in this state, integrally with the slit nozzle, this liquid component may sometimes fall onto the surface of the substrate before coating. Thus, if the surface of the substrate is wetted by rinsing fluid or other liquid components, not only will the coating process be unsuccessful, but it may also subsequently cause process defects.

[0006] The present invention was made in view of the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate processing method, which can effectively remove foreign matter adhering to the nozzle protection member without leaving liquid components in a substrate processing apparatus in which a nozzle protection member is disposed in front of a slit nozzle that moves relative to the substrate, thereby enabling stable high-quality production.

[0007] One aspect of the present invention is a substrate processing apparatus for applying a processing liquid to the surface of a substrate. The apparatus is characterized by comprising: a slit nozzle having a slit-shaped outlet for ejecting the processing liquid; a nozzle moving part that moves the slit nozzle, with its outlet facing downwards, above the substrate and relative to the substrate in a direction along the surface of the substrate; a plate-shaped nozzle guard that is positioned in front of the slit nozzle in the relative moving direction of the nozzle moving part relative to the substrate during the application of the processing liquid, and moves integrally with the slit nozzle; and a foreign matter removal part that draws ambient gas from the nozzle guard and removes foreign matter adhering to the nozzle guard.

[0008] In another aspect, the present invention is a substrate processing method, characterized by comprising: a coating step in which a processing liquid is sprayed from the nozzle outlet while the nozzle outlet of the slit nozzle is brought close to the surface of the substrate, and the slit nozzle and a plate-shaped nozzle guard are moved relative to the substrate, thereby preventing foreign matter from adhering to the slit nozzle by the nozzle guard which is disposed in front of the slit nozzle in the relative movement direction of the relative movement of the slit nozzle; and a removal step in which ambient gas surrounding the nozzle guard is drawn in before the coating step to remove foreign matter adhering to the nozzle guard.

[0009] In this invention, coating is performed while removing foreign matter using a nozzle guard disposed in front of a slit nozzle that moves in the relative moving direction. Therefore, foreign matter may sometimes adhere to the nozzle guard. Thus, in this invention, the foreign matter removal unit draws in ambient gas from the nozzle guard. This allows foreign matter to be removed from the nozzle guard.

[0010] As described above, according to the present invention, since a so-called dry foreign matter removal method is adopted to remove foreign matter without the use of liquid components, it is possible to effectively remove foreign matter adhering to the nozzle guard without leaving any liquid components, thereby achieving stable and high-quality production. Attached Figure Description

[0011] Figure 1 This is a schematic diagram showing the overall structure of the coating apparatus of the first embodiment of the substrate processing apparatus of the present invention.

[0012] Figure 2 It is a schematic representation Figure 1 Side view of the coating apparatus shown.

[0013] Figure 3 It is a three-dimensional diagram showing the overall structure and operation of the foreign object detection unit.

[0014] Figure 4 This is a diagram schematically illustrating the operation of the foreign object detection unit.

[0015] Figure 5 This is a perspective view showing the overall structure and operation of a dry protective cleaner, which serves as an example of a foreign object removal unit.

[0016] Figure 6 It is a schematic representation Figure 5 The diagram shows the operation of a dry protective cleaner.

[0017] Figure 7 It means by Figure 1 The flowchart shows the coating action performed by the coating device.

[0018] Figure 8 This is a side view schematically showing the overall structure of the coating apparatus of the second embodiment of the substrate processing apparatus of the present invention.

[0019] Figure 9 It means by Figure 8 The flowchart shows the coating action performed by the coating device.

[0020] Figure 10 This is a side view schematically showing the overall structure of the coating apparatus of the third embodiment of the substrate processing apparatus of the present invention.

[0021] Figure 11This diagram schematically illustrates the structure and operation of the foreign matter removal unit of the coating apparatus in the fourth embodiment of the substrate processing apparatus of the present invention.

[0022] Figure 12A This diagram schematically illustrates the structure and operation of the foreign matter removal unit of the coating apparatus in the fifth embodiment of the substrate processing apparatus of the present invention.

[0023] Figure 12B This diagram schematically illustrates the structure and operation of the foreign matter removal unit of the coating apparatus in the fifth embodiment of the substrate processing apparatus of the present invention.

[0024] Figure 13 This is a diagram schematically illustrating the overall structure of the coating apparatus according to the sixth embodiment of the substrate processing apparatus of the present invention.

[0025] Explanation of reference numerals in the attached figures

[0026] 1A and 1B Coating Apparatus (Substrate Processing Apparatus)

[0027] 2 slit nozzles

[0028] 3 substrate

[0029] 7. Nozzle cleaning standby section (prepared ejection section)

[0030] 9. Nozzle Cleaning Section (Nozzle Sweeping Section)

[0031] 10 Control Department

[0032] 12 Dry Protective Parts Cleaner (Foreign Object Removal Section)

[0033] 21 (slit nozzle) outlet

[0034] 31 (substrate) surface

[0035] 53 Nozzle Moving Part

[0036] 120 suction head

[0037] 120a suction section

[0038] 120b is roughly V-shaped (relative to the ambient gas).

[0039] 120c brush components

[0040] 552 Adsorption and Travel Control Mechanism (Nozzle Moving Part)

[0041] D1 (distance from the slit nozzle to the nozzle guard)

[0042] D3 (distance from the nozzle cleaning section to the foreign object removal section)

[0043] D4 (distance from the pre-ejection section to the foreign object removal section)

[0044] F Foreign object

[0045] NG nozzle protection

[0046] SA (Suffix of nozzle protection) surrounding gas Detailed Implementation

[0047] Figure 1 This is a schematic diagram showing the overall structure of the coating apparatus according to the first embodiment of the substrate processing apparatus of the present invention. Additionally, Figure 2 It is a schematic representation Figure 1 A side view of the coating apparatus shown. Furthermore, in Figure 1 , Figure 2 In the figures below, to clarify these directional relationships, an orthogonal XYZ coordinate system is appropriately added, with the Z direction as the vertical direction and the XY plane as the horizontal plane. Furthermore, the dimensions and quantities of each part are exaggerated or simplified as needed. Figure 2 In the original text, some structures such as the nozzle support body were omitted.

[0048] The coating apparatus 1A is a coating apparatus called a slit coater, which uses a slit nozzle 2 to coat a treatment liquid onto the surface 31 of a substrate 3, which is an example of the object to be coated. The treatment liquid is, for example, a photoresist. Alternatively, the treatment liquid can be various paste-like or slurry-like treatment liquids, such as pigments for light filters, polyimide precursors, silicone agents, nano-metal inks, or containing conductive materials. The substrate 3 is a rectangular glass substrate when viewed from above. Furthermore, the substrate 3, as the object to be coated, can also be used with various substrates such as rectangular glass substrates, semiconductor substrates, flexible substrates for thin-film liquid crystals, photomask substrates, filter substrates, solar cell substrates, organic EL (electroluminescent) substrates, and semiconductor packaging substrates. It should be noted that, in this specification, "surface 31 of substrate 3" refers to the main surface of substrate 3 on the side where the treatment liquid is applied.

[0049] The coating apparatus 1A includes: a stage 4, which can hold a substrate 3 in a horizontal position; a coating processing unit 5, which performs coating processing on the substrate 3 held by the stage 4 using a slit nozzle 2; a nozzle maintenance unit 6, which performs maintenance processing on the slit nozzle 2 and the nozzle guard NG; and a control unit 10, which controls these parts.

[0050] The stage 4 is made of granite or other stone in a generally rectangular shape, and has a holding surface 41 on its upper surface (+Z side) in the (-Y) direction. The holding surface 41 is machined into a generally horizontal flat surface and holds the substrate 3. A plurality of vacuum suction ports (not shown) are dispersedly formed on the holding surface 41. By adsorbing the substrate 3 with these vacuum suction ports, the substrate can be held horizontally in a predetermined position during the coating process. Furthermore, the method of holding the substrate 3 is not limited to this; for example, the substrate 3 can also be configured to be held mechanically. In addition, a nozzle adjustment area RA is provided in the stage 4 further in the (+Y) direction than the area occupied by the holding surface 41, and a nozzle maintenance unit 6 is arranged in the nozzle adjustment area RA.

[0051] like Figure 1 and Figure 2 As shown, the lower end 2a (spray lip portion) of the slit nozzle 2 tapers towards the bottom. Furthermore, a slit-shaped spray outlet 21 extends along the X direction from the lower surface of the lower end 2a of the slit nozzle 2, and processing liquid, pressurized from a processing liquid supply unit (not shown), is sprayed from the spray outlet 21 onto the surface 31 of the substrate 3. Thus, processing liquid is applied to the surface 31 of the substrate 3.

[0052] The coating treatment unit 5 has a nozzle support 51 that supports the slit nozzle 2. This nozzle support 51 includes: a support member 51a extending parallel to the X direction above the stage 4; and two lifting mechanisms 51b that support the support member 51a from both sides in the X direction and raise or lower it. The support member 51a is made of carbon fiber reinforced resin or the like and is a rod member with a rectangular cross-section. The lower surface of the support member 51a becomes the mounting portion 510 of the slit nozzle 2, where the support member 51a supports the slit nozzle 2 for loading and unloading. Furthermore, various fastening mechanisms such as latches or screws can be appropriately used as mechanisms for loading and unloading the slit nozzle 2 at the mounting portion 510 of the support member 51a.

[0053] Two lifting mechanisms 51b are connected to the two ends of the support member 51a along its length, and each has an AC servo motor and a ball screw, etc. Through these lifting mechanisms 51b, the support member 51a and the slit nozzle 2 fixed to the support member 51a can be raised and lowered in the vertical direction (Z direction), and the distance between the nozzle outlet 21 (opening at the lower end of the slit nozzle 2) and the substrate 3, i.e., the relative height of the nozzle outlet 21 relative to the substrate 3, can be adjusted. Furthermore, the vertical position of the support member 51a can be detected, for example, using a linear encoder (not shown), which consists of a scale and a detection sensor. The scale is located on the side of the lifting mechanism 51b, and the detection sensor is located on the side of the nozzle 2 opposite to the scale.

[0054] like Figure 1 As shown, the nozzle support 51 configured in this way has a bridging structure that is mounted on both ends of the stage 4 along the X direction and spans the holding surface 41. The coating processing unit 5 has a nozzle moving part 53 that moves the nozzle support 51 along the Y direction. The nozzle moving part 53 functions as a relative moving mechanism that moves the nozzle support 51 (which is the bridging structure) and the nozzle 2 supported by the nozzle support 51 relative to the substrate 3 held on the stage 4 along the Y direction. Specifically, the nozzle moving part 53 has the following on the ±X side: a guide rail 52 that guides the movement of the nozzle 2 along the Y direction; a linear motor 54 that serves as a drive source; and a linear encoder 55 that detects the position of the nozzle outlet 21 of the slit nozzle 2.

[0055] Two guide rails 52 are respectively disposed at both ends of the stage 4 in the X direction, extending in the Y direction to include the area where the nozzle adjustment region RA and the holding surface 41 are disposed. The two guide rails 52 guide the movement of the two lifting mechanisms 51b in the Y direction. Additionally, two linear motors 54 are disposed on both sides of the stage 4, and are AC coreless linear motors with fixing members 54a and moving members 54b. The fixing members 54a are disposed on the side of the stage 4 in the X direction along the Y direction. On the other hand, the moving members 54b are fixedly disposed on the outside of the lifting mechanisms 51b. The two linear motors 54 drive the two lifting mechanisms 51b in the Y direction using the magnetic force generated between these fixing members 54a and moving members 54b.

[0056] Furthermore, each linear encoder 55 has a scale section 55a and a detection section 55b. The scale section 55a is disposed along the Y direction at the lower part of the fixing member 54a of the linear motor 54, which is fixedly disposed on the stage 4. On the other hand, the detection section 55b is fixedly disposed at a position on the outer side of the moving member 54b of the linear motor 54, which is fixedly disposed on the lifting mechanism 51b, and is arranged opposite to the scale section 55a. The linear encoder 55 detects the position of the nozzle outlet 21 of the slit nozzle 2 in the Y direction based on the relative positional relationship between the scale section 55a and the detection section 55b.

[0057] The slit nozzle moving part 53 configured in this way drives the nozzle support 51 along the Y direction, thereby enabling the nozzle 2 to move between above the nozzle adjustment area RA and above the substrate S held on the stage 4. Then, the coating apparatus 1A forms a layer of treatment liquid on the surface 31 of the substrate 3 by spraying treatment liquid from the nozzle outlet 21 of the slit nozzle 2 in the (+Y) direction to the coating end position Pen. Thus, in this embodiment, the (+Y) direction corresponds to an example of the "relative movement direction" of the present invention.

[0058] Thus, the application of the processing liquid is performed while the slit nozzle 2 moves relative to the substrate 3 in the (+Y) direction. However, if there are foreign objects on the surface 31 of the substrate 3, the nozzle outlet 21 of the slit nozzle 2 may sometimes come into contact with the foreign objects and be damaged. Therefore, as Figure 1 and Figure 2 As shown, in the relative movement direction (+Y), on the front side of the slit nozzle 2 ( Figure 1 The lower right side and Figure 2 A plate-shaped nozzle guard NG is provided on the right-hand side. This nozzle guard NG has the same width in the X direction as the slit nozzle 2. (As shown...) Figure 2 As shown, the nozzle protector NG is located at a distance D1 from the outlet 21 of the slit nozzle 2 in the (+Y) direction, and is mounted on the side of the slit nozzle 2 in the (+Y) direction with its lower end protruding downwards from the outlet 21 of the slit nozzle 2. Therefore, during the coating process of the treatment liquid, the lower end of the nozzle protector NG approaches the surface 31 of the substrate 3 from above, protecting the outlet 21 of the slit nozzle 2 from damage by foreign objects on the surface 31 of the substrate 3.

[0059] After the coating of the processing liquid is completed, the slit nozzle 2 moves further towards the (+Y) direction and stands idle in the nozzle adjustment area RA. This nozzle adjustment area RA is positioned offset from the holding surface 41 of the substrate 3 towards the (+Y) direction. The nozzle adjustment area RA serves as a standby space for the slit nozzle 2 during periods when coating processing is not performed on the worktable 4, such as during the transfer of the substrate 3 between the coating apparatus 1A and the external transport mechanism (during the loading and unloading of the substrate 3). Furthermore, the nozzle maintenance unit 6 performs various maintenance procedures on the slit nozzle 2 located in the nozzle adjustment area RA.

[0060] The nozzle maintenance unit 6 includes: a nozzle cleaning standby section 7 for performing so-called pre-dispensing (preparatory spraying); a foreign object detection section 8 for detecting the adhesion of foreign objects to the nozzle guard NG; a nozzle cleaning section 9 for cleaning the slit nozzle 2; and a dry guard cleaner 12, which is an example of the "foreign object removal section" of the present invention. These components are arranged in this order along the (+Y) direction. Furthermore, for the purpose of explaining the positional relationship of these components later, the positions of the nozzle cleaning standby section 7, the foreign object detection section 8, the nozzle cleaning section 9, and the dry guard cleaner 12 in the Y direction are defined as position Ppd, position Pdt, position Pnc, and position Pgc, respectively.

[0061] The nozzle cleaning section 9 is an example of the "nozzle cleaning section" of the present invention, and for example, components described in Japanese Patent Application Publication No. 2018-149468 can be used. The nozzle cleaning section 9 has a scraper (abutment member) 91. The scraper 91 abuts against the outer surface (specifically, the inclined surface of the lip) of the lower end of the slit nozzle 2, and moves along the outer surface and in the X direction by a drive mechanism (not shown) (scraping action). As a result, the scraper 91 scrapes and removes the deposits attached to the lower end 2a of the slit nozzle 2.

[0062] The nozzle cleaning standby unit 7 is disposed on the (-Y) direction side of the nozzle cleaning unit 9, separated by the foreign matter detection unit 8. The nozzle cleaning standby unit 7 has a pre-dispensing roller 72, a portion of which is immersed in cleaning fluid stored in a storage tank 71. This pre-dispensing roller 72 has a length equal to or longer than the slit nozzle 2 in the X direction. This pre-dispensing roller 72 is rotated by a motor (not shown). In this embodiment, before performing the coating process, a small amount of resist liquid (processing liquid) is sprayed from the slit nozzle 2, which has moved above the pre-dispensing roller 72, thereby removing the resist liquid containing the cleaning fluid used in the nozzle cleaning unit 9 (preparatory spraying process) from the slit nozzle 2. Through this preparatory spraying process, a resist liquid free of impurities suitable for the coating process can be sprayed. Furthermore, in the nozzle cleaning standby unit 7, the slit nozzle 2 is prepared for the next coating process and is ready for standby.

[0063] Figure 3 This is a three-dimensional diagram showing the overall structure and operation of the foreign object detection unit. For example... Figure 2 As shown, the foreign object detection unit 8 is disposed between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9. More specifically, the foreign object detection unit 8 is disposed at a foreign object detection position Pdt, a distance D2 away from the pre-dispensing roller 72 in the (+Y) direction. In this embodiment, as... Figure 2 As shown, this distance D2 is the same as the distance D1 from the outlet 21 of the slit nozzle 2 in the Y direction to the nozzle guard NG. Therefore, in order to perform the pre-ejection process, when the slit nozzle 2 is positioned at the pre-distribution position Ppd corresponding to the pre-distribution roller 72 (which is an example of the "pre-ejection position" of the present invention), the top end of the nozzle guard NG is positioned at the foreign object detection unit 8 configured as follows, and the foreign object detection process can be performed in parallel with the pre-ejection process.

[0064] The foreign object detection unit 8 includes a light emitter 81, a light receiver 82, and an amplifier unit 83. The amplifier unit 83 houses a light-emitting unit and a light intensity detection unit. The light emitter 81 and the light receiver 82 each have a light-emitting window and a light-receiving window of the same shape. With the light-emitting window and the light-receiving window facing each other and spaced apart by a predetermined interval in the Y direction, the light emitter 81 and the light receiver 82 are erected upwards from the amplifier unit 83. Here, the predetermined interval is set to be slightly wider than the thickness of the top portion of the nozzle guard NG, such as... Figure 3 As shown, the top end of the nozzle guard NG can be clamped by the projector 81 and the receiver 82. The projector 81 uses a built-in lens to make the light emitted from the light-emitting unit into a parallel beam, and then uses a built-in reflector to refract it back in the (+Y) direction, thereby projecting a parallel beam onto the receiver 82. On the other hand, the receiver 82 receives the parallel beam from the projector 81, refracts the light back using the built-in reflector, and guides it to the light intensity detection unit via the built-in lens. Then, the light intensity detection unit outputs a value proportional to the received light intensity (hereinafter referred to as "received light intensity information") to the control unit 10. Furthermore, in this embodiment, a foreign object detection unit 8 that integrates the projector 81, the receiver 82, and the amplifier unit 83 is used. However, it is also possible to separate the amplifier unit 83 from the projector 81 and the receiver 82, connect the light-emitting unit and the projector 81 with a first optical fiber, and connect the receiver 82 and the light intensity detection unit with a second optical fiber.

[0065] like Figure 3 As shown, the foreign object detection unit 8 configured in this way is set to move freely back and forth in the X direction. Furthermore, the foreign object detection unit 8 is connected to the moving mechanism 84. Therefore, if the moving mechanism 84 operates according to the moving command from the control unit 10, the foreign object detection unit 8 moves between the near position P (X1) and the deep position P (Xmax) while clamping the top end of the nozzle guard NG. During this movement, the light-emitting unit continuously or intermittently emits light according to the illumination command from the control unit 10. On the other hand, the light intensity detection unit outputs light intensity information.

[0066] Figure 4This diagram schematically illustrates the operation of the foreign object detection unit. In this diagram, "sensor position" indicates the position of the foreign object detection unit 8 in the X direction, "shielding condition" indicates the condition where the parallel beam traveling from the projector 81 to the receiver 82 is blocked by the top of the nozzle guard NG, and "light received amount" indicates the amount of light received by the light quantity detection unit. Here, the light received amount when the nozzle guard NG is not between the projector 81 and the receiver 82 is set to 100. Specifically, when the foreign object detection unit 8 moves to a position on the top of the nozzle guard NG where no foreign object is attached (a position other than position P(Xn) in this diagram), the light received amount decreases to 60. When the foreign object detection unit 8 moves to a position where foreign object F is attached (position P(Xn) in this diagram), the light received amount further decreases by an amount equivalent to that of foreign object F, decreasing to 50. Therefore, the control unit 10 can determine the presence or absence of foreign object F and the attachment position of foreign object F based on the change in light received amount.

[0067] Figure 5 This is a perspective view showing the overall structure and operation of a dry protective cleaner, which serves as an example of a foreign object removal unit. Additionally, Figure 6 It is a schematic representation Figure 5 The diagram shows the operation of a dry protective cleaner. (See diagram for example.) Figure 2 As shown, the dry protective component cleaner 12 is positioned at a protective component cleaning position Pgc, a distance D3 away from the nozzle cleaning section 9 in the (+Y) direction. In this embodiment, this distance D3 coincides with the distance D1 in the Y direction from the nozzle outlet 21 of the slit nozzle 2 to the nozzle protective component NG. Therefore, if the slit nozzle 2 is positioned at the nozzle cleaning position Pnc corresponding to the scraper (abutment member) 91 in order to clean the tip of the slit nozzle 2 with the nozzle cleaning section 9, the tip of the nozzle protective component NG is positioned in the dry protective component cleaner 12 configured as described below, and the dry protective component cleaning process can be performed in parallel with the nozzle cleaning process.

[0068] The dry protective component cleaner 12 has a suction head 120. For example... Figure 6 As shown, the upper portion of the suction head 120 is machined into a roughly V-shaped YZ cross section to cover the ambient gas SA surrounding the tip (lower end) of the nozzle guard NG, which is positioned at the guard cleaning position Pgc, from below. This roughly V-shaped portion 120b corresponds to an example of the "ambient gas relative portion" of the present invention. Furthermore, in Figure 6 In the middle, dots were added to visually clearly indicate the surrounding ambient gas SA.

[0069] The suction head 120 is configured to freely move along the nozzle protector NG in the longitudinal direction X while facing the ambient gas SA from below. A groove extending in the X direction is formed in the center of the upper portion of the suction head 120. A plurality of suction ports are provided in this groove. The suction head 120 is connected to a head moving part 120h. The suction part 120a is also connected to the suction head 120. Therefore, the head moving part 120h and the suction part 120a operate according to commands from the control unit 10, thereby causing the suction head 120 to draw in the ambient gas SA from the nozzle protector NG while moving in the longitudinal direction X of the nozzle protector NG. In other words, the suction head 120 applies negative pressure to the tip of the nozzle protector NG while moving along the tip of the nozzle protector NG in the X direction. For example, as... Figure 6 As shown, the foreign object F is removed from the nozzle guard NG by suction head 120 passing through the location where the foreign object F is attached (foreign object removal process).

[0070] Such foreign object removal processing is performed at various times, including when the coating apparatus 1A is started, at the end of each coating process, after only a predetermined number of coating processes, and when a nozzle cleaning request is received from the user (hereinafter referred to as "foreign object removal timing"). Furthermore, in this embodiment, the control unit 10 controls each part of the device to move the slit nozzle 2 toward the nozzle cleaning unit 9 for nozzle cleaning processing, but through this movement, the nozzle guard NG is positioned in the dry guard cleaner 12. Therefore, foreign object removal processing can be performed in parallel with nozzle cleaning processing. In addition, in this embodiment, the timing when the foreign object detection unit 8 detects the foreign object F is also included in the aforementioned foreign object removal timing.

[0071] The control unit 10 is configured as described above to control the various parts of the coating apparatus 1A as described. This control unit 10 is configured as a typical computer system with an arithmetic unit (e.g., a CPU (Central Processing Unit)) performing various calculations, a storage unit (e.g., ROM (Read-Only Memory) or RAM (Random Access Memory)) storing the basic program and various information connected to a bus. The bus also connects to a disk (e.g., a hard disk drive) storing the coating program, a display unit (e.g., a monitor) displaying various information, and an input unit (e.g., a keyboard and mouse) receiving input from the operator. Alternatively, a touch panel display integrating the functions of the display and input units can be used. Furthermore, by receiving signals from sensors installed in various parts of the apparatus via interfaces (not shown), the arithmetic unit of the control unit 10 controls each part of the apparatus according to the basic program to perform the coating process described below.

[0072] Figure 7 It means by Figure 1 The flowchart illustrates the coating operation performed by the coating apparatus shown. In this coating apparatus 1A, after the slit nozzle 2 used for coating is moved to the pre-assigned position Ppd, a pre-ejection process is performed (step S11). Additionally, a foreign object detection process is performed in parallel with the pre-ejection process. That is, the tip of the nozzle guard NG enters between the projector 81 and the receiver 82, blocking a portion of the parallel light beam traveling from the projector 81 to the receiver 82. Information on the amount of light received corresponding to this blocking condition is provided to the control unit 10. This operation is performed in accordance with the movement of the foreign object detection unit 8 in the X direction, as follows: Figure 4 As shown, the light intensity information at sensor positions P(X1), ..., P(Xn), ..., P(Xmax) is sequentially acquired and temporarily stored in the storage unit of the control unit 10.

[0073] Based on the light reception information obtained in this way, the calculation unit of the control unit 10 determines whether there is a foreign object attached to the nozzle guard NG. Figure 4 (Step S12). Then, if a foreign object is detected adhering to the nozzle protector NG (No in step S12), the arithmetic unit of the control unit 10 determines that the foreign object removal time has been reached and performs the foreign object removal operation (steps S13 to S15). That is, in step S13, the coating process is interrupted. After such restriction of the coating operation, the arithmetic unit of the control unit 10 controls each part of the dry protective part cleaner 12 to perform dry protective part cleaning of the nozzle protector NG in the state of restricted coating operation (step S14). More specifically, as Figure 5 and Figure 6 As shown, the suction head 120 draws in the ambient gas SA surrounding the nozzle protector NG while moving along the top of the nozzle protector NG in the X direction. This draws in and removes foreign matter F. Then, if the calculation unit of the control unit 10 confirms that the cleaning process of the protector is complete ("Yes" in step S15), the foreign matter removal operation ends, and the control unit 10 returns to step S11, repeatedly performing the pre-ejection operation and the foreign matter detection operation.

[0074] On the other hand, if it is detected that no foreign matter F is attached to the nozzle guard NG (yes in step S12), the following coating process is performed (steps S16 to S24). The substrate 3 is moved into the coating apparatus 1A (step S16). More specifically, the substrate 3 is held in place after being placed on the holding surface 41 of the stage 4.

[0075] In parallel with this, while the clean resist solution is adhering to the vicinity of the nozzle 21 through the pre-ejection process, the slit nozzle 2 moves from the pre-dispensing position Ppd to a position above the coating start position Pst (step S17). Then, the slit nozzle 2 begins to descend. At the coating start position Pst, the resist solution adhering to the vicinity of the nozzle 2's nozzle 2 contacts the surface 31 of the substrate 3. Thus, at the coating start position Pst, a meniscus of the resist solution is formed on the surface 31 of the substrate 3. Corresponding to the formation of the meniscus of the resist solution, the slit nozzle 2 continues to descend. Then, the slit nozzle 2 rises a distance corresponding to the thickness of the resist solution, adjusting the gap between the nozzle 21 and the surface 31 of the substrate 3, i.e., the so-called coating gap (step S18).

[0076] After adjusting the coating gap as described above, the coating operation begins (step S19). That is, the slit nozzle 2 moves in the (+Y) direction while spraying resist liquid from the spray outlet 21. This performs the coating operation of applying resist liquid to the surface 31 of the substrate 3 using the slit nozzle 2, forming a coating film of a certain thickness on the surface 31 of the substrate 3 using the resist liquid. Thus, in this embodiment, the (+Y) direction corresponds to the "relative movement direction" of the present invention.

[0077] The coating process continues until the slit nozzle 2 is moved to the coating end position Pen, where coating should be terminated (step S20). When the slit nozzle 2 reaches the coating end position Pen (yes in step S20), the ejection of resist liquid from the slit nozzle 2 stops. Thus, the coating process ends (step S21). The slit nozzle 2 then leaves the coating end position Pen and returns to the pre-distribution position Ppd (step S22). In parallel with the movement of the slit nozzle 2 to the pre-distribution position, the substrate 3 is released from its hold and removed (step S23). Then, if there is another substrate 3 to be processed (yes in step S24), the process returns to step S11 and repeats the same procedure. On the other hand, if there is no next substrate 3 (no in step S24), the process ends.

[0078] As described above, according to the first embodiment, since a so-called dry foreign matter removal method is used to remove foreign matter without liquid components, it is possible to effectively remove foreign matter F adhering to the nozzle guard NG without leaving any liquid components, thereby achieving stable and high-quality production.

[0079] Furthermore, if foreign matter is detected adhering to the nozzle protector NG, a dry protective cleaning process (removal step) is immediately performed on the nozzle protector NG using the dry protective cleaner 12 (step S14). Therefore, the interruption of the coating process caused by foreign matter adhering to the nozzle protector NG can be eliminated in a short time, and the coating process unaffected by foreign matter F can be restarted. As a result, the operating rate of the coating apparatus 1A can be improved.

[0080] Furthermore, during the dry cleaning (removal process) of the nozzle protector NG, the nozzle protector NG is positioned at the protector cleaning position Pgc, and the slit nozzle 2 is positioned at the nozzle cleaning position Pnc corresponding to the scraper (abutment member) 91. Therefore, the cleaning of the slit nozzle 2 can be performed in parallel with the dry cleaning of the nozzle protector NG using the nozzle cleaning unit 9. As a result, the cycle time can be shortened compared to performing the dry cleaning of the nozzle protector NG and the cleaning of the slit nozzle 2 separately.

[0081] Furthermore, since foreign matter is detected adhering to the nozzle guard NG before coating, it is possible to prevent coating from being performed while foreign matter F is still attached to the nozzle guard NG. Therefore, defects caused by contact between the substrate 3 and foreign matter F can be reliably prevented, and high-quality coating can be achieved.

[0082] Furthermore, the timing of foreign object detection processing is essentially arbitrary as long as it occurs before the coating process on the next substrate. However, in this embodiment, in the Y direction, by aligning the distance D1 between the nozzle outlet 21 of the slit nozzle 2 and the nozzle guard NG with the distance D2 between the pre-dispensing roller 72 and the foreign object detection unit 8, foreign object detection processing and pre-ejection processing are performed in parallel. Thus, compared to conventionally known coating apparatuses that perform pre-ejection processing, this embodiment employs a novel structure that combines foreign object detection processing, preventing the cycle time from increasing with the addition of foreign object detection processing. As described in the above embodiment, by performing foreign object detection processing during pre-ejection processing, the aforementioned effects can be achieved without changing the cycle time. Furthermore, even if foreign object detection processing is performed before or after pre-ejection processing, by performing foreign object detection processing partially in parallel with pre-ejection processing, the increase in cycle time can be suppressed, and the aforementioned effects can be achieved.

[0083] In addition, in this embodiment, such as Figure 2 As shown, the foreign object detection unit 8 is configured in the space between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9. Therefore, by effectively utilizing the space, it is possible to both suppress the increase in device size and install additional foreign object detection units 8.

[0084] Furthermore, in this embodiment, foreign objects are detected based on the light-blocking condition of the parallel beam. In other words, since foreign object detection is performed using a non-contact method, it is possible to detect foreign objects without damaging the nozzle guard. This non-contact method of foreign object detection can be employed using, for example, the Keyence TM-X5000 series online projection image measuring instrument or a line scan camera.

[0085] However, in the first embodiment, a foreign object detection unit 8 is provided, and the foreign object removal process is triggered by the detection of a foreign object F by the foreign object detection unit 8. However, the provision of the foreign object detection unit 8 is not a necessary structural element, but an arbitrary structural element. Therefore, for example, as... Figure 8 As shown, a dry protective component cleaner 12 can be installed at the position of the foreign object detection unit 8 (second embodiment).

[0086] Figure 8 This is a side view schematically showing the overall structure of the coating apparatus according to a second embodiment of the substrate processing apparatus of the present invention. The significant difference between this second embodiment and the first embodiment is that the foreign matter detection unit 8 is not provided, and the dry protective component cleaner 12 is arranged in the space between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9. Furthermore, since other structures are the same as in the first embodiment, the same reference numerals are used to label identical structures, and structural descriptions are omitted.

[0087] In the second embodiment, the dry protective component cleaner 12 is positioned at a protective component cleaning position Pgc, a distance D4 away from the pre-dispensing roller 72 in the (+Y) direction. More specifically, as... Figure 8 As shown, this distance D4 coincides with the distance D1 in the Y direction from the outlet 21 of the slit nozzle 2 to the nozzle guard NG. Therefore, if the slit nozzle 2 is positioned at the pre-distribution position Ppd corresponding to the pre-distribution roller 72 for pre-ejection processing, the top end of the nozzle guard NG is positioned at the dry guard cleaner 12, and the dry guard cleaning process can be performed in parallel with the pre-ejection process. However, since the frequency of performing the dry guard cleaning process is lower than that of the pre-ejection process, in this embodiment, the calculation unit of the control unit 10 controls the execution of both processes based on whether the foreign matter removal timing has been reached, as described below.

[0088] Figure 9 It means by Figure 8The flowchart illustrates the coating operation performed by the coating apparatus shown. In this coating apparatus 1A, after the slit nozzle 2 for coating treatment moves to the pre-assigned position Ppd, the calculation unit determines whether it is an opportune time for foreign object removal (step S31). Then, if the calculation unit determines that it is an opportune time for foreign object removal ("Yes" in step S31), the coating treatment begins after performing the pre-spraying treatment and the protective part cleaning treatment in parallel (step S32). On the other hand, if it is determined that it is not an opportune time for foreign object removal ("No" in step S31), the coating treatment begins after performing only the pre-spraying treatment (step S33).

[0089] The coating process is performed in the same manner as in the first embodiment (steps S16 to S23). Then, if there is another substrate 3 to be processed ("Yes" in step S24), the process returns to step S31 and repeats the same process as described above. On the other hand, if there is no next substrate 3 ("No" in step S24), the process ends.

[0090] As described above, according to the second embodiment, a dry cleaning process for the protective component is performed when it is deemed necessary to remove foreign matter, that is, when foreign matter removal is required. Therefore, the same effect as in the first embodiment can be obtained.

[0091] Furthermore, the timing of the protective component cleaning process is essentially arbitrary, as long as it occurs before the coating process of the next substrate. However, in this embodiment, the protective component cleaning process and the pre-ejection process are performed in parallel by aligning the distance D1 between the nozzle outlet 21 of the slit nozzle 2 and the nozzle protective component NG in the Y direction with the distance D4 between the pre-distribution roller 72 and the dry protective component cleaner 12. Here, if the two processes are performed sequentially in step S32, the cycle time is longer than when only the pre-ejection process is performed. In contrast, in this embodiment, the protective component cleaning process is completed during the pre-ejection process, thereby achieving the aforementioned effect without changing the cycle time. In addition, even if the protective component cleaning process is performed before or after the pre-ejection process in step S32, by performing the protective component cleaning process partially in parallel with the pre-ejection process, the increase in cycle time can be suppressed, and the aforementioned effect can be achieved.

[0092] Figure 10This is a side view schematically showing the overall structure of the coating apparatus according to a third embodiment of the substrate processing apparatus of the present invention. The significant difference between this third embodiment and the first embodiment is that the foreign object detection unit 8 is omitted, and correspondingly, the nozzle cleaning unit 9 and the dry protective component cleaner 12 are offset in the (-Y) direction at a distance D3, thereby achieving a smaller device size. Furthermore, since other structures are the same as in the first embodiment, the same reference numerals are used for identical structures, and structural descriptions are omitted.

[0093] In this third embodiment, the dry protective component cleaner 12 performs protective component cleaning during the removal of foreign objects. At this time, the nozzle protective component NG is located at the protective component cleaning position Pgc, and simultaneously, the slit nozzle 2 is positioned at the nozzle cleaning position Pnc. Therefore, the nozzle cleaning process can be performed in parallel with the protective component cleaning process of the nozzle protective component NG.

[0094] As described above, according to the third embodiment, since a dry cleaning process for the protective component is performed when the foreign object is removed, the same effect as that of the first embodiment can be obtained.

[0095] Figure 11 This diagram schematically illustrates the structure and operation of the foreign matter removal unit of the coating apparatus according to the fourth embodiment of the substrate processing apparatus of the present invention. The significant difference between this fourth embodiment and the first embodiment lies in the structure of the dry protective member cleaner 12. In the first embodiment, the suction head 120 is processed to be shorter than the nozzle protective member NG in the X direction, allowing the suction head 120 to move in the X direction, thereby suctioning and removing foreign matter F from the nozzle protective member NG as a whole. In contrast, in the fourth embodiment, the length of the suction head 120 in the X direction is the same as or longer than the nozzle protective member NG, and a generally V-shaped portion 120b extends along the X direction and is provided throughout the suction head 120. The generally V-shaped portion 120b corresponds to an example of the "ambient gas relative portion" of the present invention, capable of completely covering the peripheral ambient gas SA (SA) of the top part (lower end) of the nozzle protective member NG from below. Figure 6 The suction head 120 is fixedly disposed at the cleaning position Pgc of the protective component. Furthermore, since other structures are the same as in the first embodiment, the same reference numerals are used to label the same structures and structural descriptions are omitted.

[0096] In the fourth embodiment, as shown by the dashed line in the figure, the slit nozzle 2 and the nozzle guard NG move integrally in the (+Y) direction. When the nozzle guard NG is positioned at the guard cleaning position Pgc, the surrounding ambient gas at the top of the nozzle guard NG is entirely covered from below by the approximately V-shaped portion 120b. In this state, if the suction unit 120a operates according to the command from the control unit 10, the surrounding ambient gas becomes negative pressure, and the foreign matter F adhering to the top of the nozzle guard NG is sucked away by the suction unit 120a.

[0097] Figure 12A and Figure 12B This diagram schematically illustrates the structure and operation of the foreign matter removal unit in the coating apparatus of the fifth embodiment of the substrate processing apparatus of the present invention. The significant difference between this fifth embodiment and the fourth embodiment is that a brush member 120c is added to the upper surface of the suction head 120, and cleaning is performed using a brush employing the brush member 120c. Furthermore, since other structures are the same as in the fourth embodiment, the same reference numerals are used to label identical structures, and structural descriptions are omitted.

[0098] In this embodiment, brush members 120c, 120c are erected towards the nozzle guard NG at the (+Y) direction side end and the (-Y) direction side end of the approximately V-shaped portion 120b on the upper surface of the suction head 120. Furthermore, as... Figure 12A As shown by the dashed line, the slit nozzle 2 and the nozzle guard NG move integrally in the (+Y) direction. If the nozzle guard NG is positioned at the guard cleaning position Pgc, the surrounding ambient gas at the top of the nozzle guard NG is entirely covered from below by the approximately V-shaped portion 120b. Simultaneously, in the Z direction, the tops of the brush members 120c are positioned to overlap with the top of the nozzle guard NG. In this state, according to the swing command from the control unit 10, the slit nozzle 2 and the nozzle guard NG swing integrally in the Y direction (see reference). Figure 12B (Ref. AR in the attached drawings). At this time, the top ends of the brush members 120c are rubbed by the top end of the nozzle protector NG, performing brush cleaning. As a result, foreign matter F is removed from the nozzle protector NG. In addition, in parallel with this brush cleaning, the suction unit 120a operates according to the command from the control unit 10, and the foreign matter F is also sucked away by the suction unit 120a. Therefore, it is possible to reliably suck away and remove the foreign matter F that has been removed from the nozzle protector NG by brush cleaning, and it is possible to reliably prevent the foreign matter F from flying around the cleaning position Pgc of the protector.

[0099] As described above, similarly to the first embodiment, the fifth embodiment achieves the same effect as the first embodiment by using a so-called dry removal method to remove foreign matter F adhering to the nozzle protector NG. Furthermore, the brush members 120c, 120c contact the foreign matter F adhering to the nozzle protector NG and peel it off. In other words, by using both brush cleaning and suction cleaning, the foreign matter removal effect can be improved.

[0100] Furthermore, in the fifth embodiment, the brush member 120c is disposed on both the front and rear sides of the generally V-shaped portion 120b in the relative movement direction Y, but it may also be disposed on only one side.

[0101] However, in the first to fifth embodiments described above, the present invention is applicable to a coating apparatus 1A in which the slit nozzle 2 moves relative to the substrate 3 to apply a resist liquid (processing liquid). However, the present invention is also applicable to a coating apparatus, as described in Japanese Patent Application Publication No. 2011-212544, in which the substrate moves relative to a fixedly arranged slit nozzle to apply a resist liquid (processing liquid). Hereinafter, refer to... Figure 13 The sixth embodiment of the present invention will be described.

[0102] Figure 13 This is a schematic diagram showing the overall structure of a coating apparatus according to a sixth embodiment of the substrate processing apparatus of the present invention. The coating apparatus 1B is used to apply coatings to substrates that are horizontally positioned from... Figure 13 A slit applicator is used to apply resist liquid (processing liquid) to the surface 31 of substrate 3, which is transported from the left-hand side to the right-hand side. Furthermore, in Figure 13 In order to clarify the configuration relationship of each part of the device, as shown in the figure, a right-handed XYZ rectangular coordinate system is set. The transport direction of substrate 3 is set as the "X direction". Figure 13 The horizontal direction from the left hand side to the right hand side is designated as the "+X direction", and the opposite direction is designated as the "-X direction". Furthermore, in the horizontal direction Y, which is orthogonal to the X direction, the front side of the device (near the front in the figure) is designated as the "-Y direction", and the back side of the device is designated as the "+Y direction". Moreover, the upward and downward directions in the vertical direction Z are designated as the "+Z direction" and "-Z direction", respectively.

[0103] In the coating apparatus 1B, along the transport direction Dt of the substrate 3, that is, along the (+X direction), the input conveyor 100, the input transfer unit 200, the lifting unit 300, the output transfer unit 400, and the output conveyor 110 are arranged close to each other in this order, as detailed below, and they form a transport path of the substrate 3 that extends in a generally horizontal direction.

[0104] The substrate 3, which is the object of processing, is removed from... Figure 13The substrate 3 is fed into the input conveyor 100 from the left side. The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 that rotates the roller conveyor 101. By rotating the roller conveyor 101, the substrate 3 is moved horizontally to the downstream side, i.e., in the (+X) direction. The input transfer unit 200 includes a roller conveyor 221 and a rotation and lifting drive mechanism 222, which has the functions of driving the roller conveyor 221 to rotate and lifting the roller conveyor 221. The roller conveyor 221 rotates, thereby further transporting the substrate 3 in the (+X) direction. In addition, the roller conveyor 221 lifts, thereby changing the vertical position of the substrate 3. Using the input transfer unit 200 configured in this way, the substrate 3 is transferred from the input conveyor 100 to the floating unit 300.

[0105] The levitation section 300 includes an upstream levitation platform 301, a central levitation platform 302, and a downstream levitation platform 303. Both the upstream and downstream levitation platforms 301 and 303 have a plurality of air ejection holes arranged in a matrix on the entire surface of a plate-shaped platform. Furthermore, by applying compressed air to each ejection hole, the substrate 3 is levied using the airflow generated by the ejection of compressed air from each ejection hole. Thus, on the upstream and downstream levitation platforms 301 and 303, the substrate 3 is levied from the aforementioned platform surface to a predetermined levitation height, for example, 10 to 500 micrometers. To supply compressed air to each ejection hole, such as... Figure 13 As shown, a buoyancy control mechanism 335 is provided.

[0106] In addition to the aforementioned ejection holes, the downstream floating stage 303 also has a plurality of lifting pins. Furthermore, a lifting pin drive mechanism 334 is provided to move the lifting pins up and down. The plurality of lifting pins are configured to pass through the gaps between the ejection holes and be spaced at predetermined intervals, facing the entire back surface of the substrate 3. Moreover, the lifting pins are driven by the lifting pin drive mechanism 334, which is located below the surface of the stage, to move up and down in the vertical direction (Z-axis direction). That is, during descent, the top of the lifting pin descends further towards the (-Z) direction than the stage surface of the downstream floating stage 303; during ascent, the top of the lifting pin rises to a position where the substrate 3 is handed over to the transfer robot (not shown). Since the lower surface of the substrate 3 is supported and lifted by the rising lifting pins, the substrate 3 rises from the stage surface of the downstream floating stage 303. Thus, the substrate 3 can be unloaded from the coating apparatus 1B using the transfer robot.

[0107] On the other hand, the central floating platform 302 is configured as follows and has a higher floating accuracy than the upstream floating platform 301 and the downstream floating platform 303. Specifically, the central floating platform 302 has a rectangular plate-shaped platform surface. On this platform surface, a plurality of holes are distributed in a matrix pattern with a narrower spacing than the ejection holes provided on the upstream and downstream floating platforms 301 and 303. Furthermore, unlike the upstream and downstream floating platforms 301 and 303, in the central floating platform 302, half of the holes function as compressed air ejection holes, and the other half function as suction holes. That is, compressed air is ejected from the ejection holes toward the back surface of the substrate 3, and compressed air is introduced into the space between the platform surface and the back surface of the substrate 3. On the other hand, it is configured to draw air from the space via the suction holes. By ejecting and drawing air into the aforementioned space, the compressed air flow ejected from each ejection hole diffuses horizontally within the space and is then drawn into the adjacent suction hole, resulting in a more stable pressure balance in the air layer (pressurized gas layer) of the space. This allows for highly precise and stable control of the levitation height of the substrate 3. Furthermore, the levitation control mechanism 335 controls the supply of compressed air to each ejection hole and the drawing of air from the suction hole.

[0108] The substrate 3, which is transferred into the levitation section 300 via the input transfer section 200, is propelled in the (+X) direction by the rotation of the roller conveyor 221 and transported onto the upstream levitation stage 301. The upstream levitation stage 301, the central levitation stage 302, and the downstream levitation stage 303 support the substrate 3 in a levitation state, but do not have the function of moving the substrate 3 in the horizontal direction. The transport of the substrate 3 in the levitation section 300 is performed by the substrate transport section 500, which is disposed below the upstream levitation stage 301, the central levitation stage 302, and the downstream levitation stage 303.

[0109] The substrate transport unit 500 includes: a chuck mechanism 551 that supports the substrate 3 from below by partially abutting against the peripheral portion of the lower surface of the substrate 3; and an adsorption and travel control mechanism 552 that applies negative pressure to the adsorption pad (not shown) of the adsorption member provided at the upper end of the chuck mechanism 551 to adsorb and hold the substrate 3, and that reciprocates the chuck mechanism 551 in the X direction. When the substrate 3 is held by the chuck mechanism 551, the back surface of the substrate 3 is positioned higher than the surface of each stage of the lifting unit 300. Therefore, the substrate 3 is held horizontally by the chuck mechanism 551 adsorbing and holding its peripheral portion, and by the buoyancy applied from the lifting unit 300. Furthermore, in order to detect the vertical position of the surface of the substrate 3 during the stage where the back surface of the substrate 3 is partially held by the chuck mechanism 551, a thickness measurement sensor SN is disposed near the roller conveyor 221. By positioning the chuck (not shown) directly below the sensor SN in a state where the substrate 3 is not held, the sensor SN can detect the vertical position of the surface of the adsorption member, i.e., the adsorption surface.

[0110] The chuck mechanism 551 holds the substrate 3, which has been transferred from the input transfer section 200 to the floating section 300. In this state, the chuck mechanism 551 moves in the (+X) direction, thereby transporting the substrate 3 from above the upstream floating stage 301 to above the downstream floating stage 303 via the upper part of the central floating stage 302. The transported substrate 3 is then transferred to the output transfer section 400 located on the (+X) side of the downstream floating stage 303.

[0111] The output transfer unit 400 includes: a roller conveyor 441; and a rotation and lifting drive mechanism 442, which has the functions of driving the roller conveyor 441 to rotate and lifting the roller conveyor 441. The roller conveyor 441 rotates, thereby applying a pushing force in the (+X) direction to the substrate 3, and the substrate 3 is further transported along the transport direction Dt. Additionally, the roller conveyor 441 lifts, thereby changing the vertical position of the substrate 3. Using the output transfer unit 400, the substrate 3 is transferred from above the downstream floating stage 303 to the output conveyor 110.

[0112] The output conveyor 110 includes a roller conveyor 111 and a rotary drive mechanism 112 for driving the roller conveyor 111 to rotate. Through the rotation of the roller conveyor 111, the substrate 3 is further transported in the (+X) direction and ultimately discharged from the coating apparatus 1B. Furthermore, the input conveyor 100 and the output conveyor 110 can be configured as part of the structure of the coating apparatus 1B, or they can be configured separately from the coating apparatus 1B. Alternatively, for example, a substrate delivery mechanism from another unit located upstream of the coating apparatus 1B can be used as the input conveyor 100. Additionally, a substrate receiving mechanism from another unit located downstream of the coating apparatus 1B can be used as the output conveyor 110.

[0113] Along the transport path of the substrate 3 as described above, a coating mechanism 700 for applying a resist liquid to the surface 31 of the substrate 3 is provided. The coating mechanism 700 has a slit nozzle 2 with the same structure as in the first embodiment. Additionally, as... Figure 13 As shown, the nozzle drive mechanism 800 is connected to the slit nozzle 2. Through the nozzle drive mechanism 800, the slit nozzle 2 is positioned at the coating position above the central floating platform 302. Figure 13 The position shown by the solid line), the upper position or maintenance position separated from the coating position. Furthermore, the connection between the coating liquid supply mechanism and the slit nozzle 2 shown in the figure is omitted. The resist liquid is supplied from the coating liquid supply mechanism and sprayed out from the downward opening nozzle 21 at the bottom of the nozzle as a treatment liquid.

[0114] The nozzle 2 has an outlet 21 extending along the Y direction and is supported by a nozzle support (not shown) to spray resist liquid vertically downwards (to the -Z side). The nozzle support is connected to the nozzle drive mechanism 800. In particular, when the resist liquid is supplied to the surface 31 of the substrate 3 using the nozzle 2, such as... Figure 4 As shown by the dashed line, after the nozzle 2 moves to a position above the coating position, it descends until the gap between the nozzle 21 and the substrate 3 reaches a predetermined value. Thus, the nozzle 2 is positioned at the coating position. Then, in this positioned state, resist liquid is sprayed from the nozzle 21 onto the surface 31 of the substrate 3, while the substrate 3 is transported in the (+X) direction. In other words, the nozzle 2 performs the coating process by moving relative to the substrate 3 in the (-X) direction. That is, in this embodiment, the (-X) direction corresponds to the "relative movement direction" of the present invention. Furthermore, a nozzle guard NG is installed on the front side of the nozzle 2 in the (-X) direction of relative movement.

[0115] In order to perform the prescribed maintenance on the slit nozzle 2 constructed in this way, such as Figure 13As shown, a nozzle maintenance unit 6 with the same structure as in the first embodiment is provided on the coating mechanism 700. That is, it includes: a nozzle cleaning standby unit 7 for performing a so-called pre-dispensing process; a foreign matter detection unit 8 for detecting the adhesion of foreign matter to the nozzle guard NG; a nozzle cleaning unit 9 for cleaning the slit nozzle 2; and a dry guard cleaner 12, which is an example of the "foreign matter removal unit" of the present invention. The nozzle cleaning standby unit 7, the foreign matter detection unit 8, the nozzle cleaning unit 9, and the dry guard cleaner 12 are arranged in this order along the relative movement direction (-X). Furthermore, similar to the first embodiment, before the coating process, the control unit 10 determines whether there is foreign matter ( Figure 4 The reference numeral F in the attached diagram is attached to the nozzle guard NG. If the determination results in that there is foreign matter attached to the nozzle guard NG, the control unit 10 immediately performs dry guard cleaning treatment on the foreign matter using the dry guard cleaner 12 after the restricted coating process.

[0116] As described above, in the sixth embodiment, similarly to the first embodiment, the adhesion of foreign matter to the nozzle guard NG is detected before performing the coating process. Therefore, the same effect as in the first embodiment can be obtained, such as preventing the coating process from being performed when foreign matter F is attached to the nozzle guard NG.

[0117] Thus, in the sixth embodiment, the adsorption and travel control mechanism 552 is equivalent to an example of the "nozzle moving part" of the present invention.

[0118] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made in addition to the above without departing from its spirit. For example, in the sixth embodiment, the present invention is applied to a substrate processing apparatus of the so-called floating method, but the dry protective component cleaner 12 provided in the fourth and fifth embodiments can also be used as a foreign matter removal unit.

[0119] This invention is applicable to all substrate processing techniques in which a treatment liquid is supplied from a slit nozzle to a substrate and coated thereon, with a nozzle guard disposed on the front side of the slit nozzle that moves relative to the substrate.

Claims

1. A substrate processing apparatus for coating a processing liquid onto the surface of a substrate, characterized in that, have: A slit nozzle having a slit-shaped outlet for ejecting the treatment liquid. The nozzle moving part moves the slit nozzle, which is in a downward-facing position, above the substrate and relative to the substrate in a direction along the surface of the substrate. A plate-shaped nozzle guard, in the relative movement direction of the slit nozzle relative to the substrate via the nozzle moving part during the application of the treatment liquid, is positioned in front of the slit nozzle and moves integrally with the slit nozzle. The dry foreign matter removal unit removes foreign matter adhering to the nozzle protector by drawing in ambient gas from the nozzle protector and applying negative pressure to the foreign matter.

2. The substrate processing apparatus according to claim 1, characterized in that, The foreign matter removal unit has: The suction head, while simultaneously drawing air from below the nozzle protector to the surrounding environment, moves freely along the length of the nozzle protector. The suction unit, via the suction head, draws in ambient gas from the nozzle guard, and The head moving part moves the suction head along the length direction of the nozzle protector while the suction part is drawing in the ambient gas surrounding the nozzle protector.

3. The substrate processing apparatus according to claim 1, characterized in that, The foreign matter removal unit has: The suction head, along the length of the nozzle guard, cleans the surrounding ambient gas from below, positioned at a predetermined cleaning location on the nozzle guard. The suction unit draws in the ambient gas surrounding the nozzle guard via the suction head.

4. The substrate processing apparatus according to claim 3, characterized in that, The suction head has: The relative position of the ambient gas, relative to the overall ambient gas surrounding the nozzle protective element located at the cleaning position of the protective element, and The brush component, in the relative movement direction, is erected facing the nozzle protector on at least one of the front and rear sides relative to the portion opposite the ambient gas. The slit nozzle and the nozzle guard move relative to the brush member in the relative movement direction so that the brush member and the nozzle guard slide into contact with each other, thereby sweeping the foreign object from the nozzle guard to the opposite part of the ambient gas.

5. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that, have: The pre-ejection section, before ejecting the treatment liquid from the nozzle outlet onto the surface of the substrate, at a pre-ejection position separated from the substrate, ejects a predetermined amount of the treatment liquid from the nozzle outlet and stands ready. The control unit controls the pre-ejection section and the foreign matter removal section. The foreign object removal unit is disposed in the direction of relative movement in front of the pre-ejection unit, and is located at a distance from the pre-ejection unit equal to the distance from the slit nozzle to the nozzle guard. The control unit controls the pre-ejection section and the foreign matter removal section so that the ejection or standby of the treatment liquid in the pre-ejection section and the removal of the foreign matter in the foreign matter removal section are at least partially performed in parallel.

6. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that, have: The nozzle cleaning section cleans the slit nozzle, and The control unit controls the nozzle cleaning unit and the foreign object removal unit. The foreign object removal unit is disposed in the direction of relative movement in front of the nozzle cleaning unit, and is located at a distance from the nozzle cleaning unit equal to the distance from the slit nozzle to the nozzle guard. The control unit controls the nozzle cleaning unit and the foreign matter removal unit so that the cleaning of the slit nozzle by the nozzle cleaning unit and the removal of the foreign matter by the foreign matter removal unit are performed at least partially in parallel.

7. A substrate processing method, characterized in that, include: In the coating process, while spraying the treatment liquid from the nozzle outlet with the nozzle opening close to the surface of the substrate, the nozzle and a plate-shaped nozzle guard are moved relative to the substrate. This prevents foreign matter from adhering to the nozzle by utilizing the nozzle guard, which is positioned in front of the nozzle in the relative movement direction of the nozzle, while simultaneously coating the surface of the substrate with the treatment liquid. In the dry removal process, prior to the coating process, negative pressure is applied to the foreign matter adhering to the nozzle protector by drawing in ambient gas from the nozzle protector, thereby removing the foreign matter adhering to the nozzle protector.

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