Cooling device

Abstract

The invention relates to a cooling device (1) for cooling a component (2), comprising a base element (4), which has a first surface (5) and a second surface (3) opposite the first surface (5) and forming a rear side, and comprising a cooling structure, which has a cooling element (6), the cooling structure is arranged on the base element (4) so as to protrude from the first surface (5). The rear side of the base element (3) is formed with a bend and has a pre-stress. Alternatively or in addition, at least one auxiliary element (15) is provided on the rear side for producing an integrally bonded connection between the cooling device (1) and the component (2).

Description

Field of the Invention

[0001] The present invention relates to a cooling device for a cooling member, the cooling device including a base element having a first surface and a second surface opposite the first surface and forming a back side, and having a cooling structure having cooling elements, the cooling structure being provided on the base element protruding from the first surface.

[0002] Furthermore, the present invention relates to a method for manufacturing a cooling device, the method including steps of providing a material and constructing a cooling structure from the material. Background Art

[0003] So-called power electronic components, such as power semiconductors, are well known from the prior art. Such components are often used, for example, also in motor vehicles. It is also known that these components generate a large amount of heat during operation, which usually has to be dissipated by means of a cooling medium. For this purpose, very different coolers are known in the prior art, and also so-called pin-fin cooling bodies, which are surrounded and flushed by a cooling medium and thus transfer heat from the pins to the cooling medium. For example, DE102019108106A1 describes a cooler for a power semiconductor in an inverter, the cooler being designed in two parts and including: a bottom plate as a first part, which is thermally conductively attached to the power semiconductor; a cooling body as a second part, which is arranged on the bottom plate, the cooling body having at least one corrugated void portion, which is continuously constructed from the side of the cooling body facing away from the bottom plate to the side facing the cooling body; the first part and the second part are connected to each other and are coated with a layer that protects the two parts from electrochemical reduction.

[0004] DE102018216859A1 discloses a device for cooling a component, the device having: a first base body and a second base body; cylindrical and / or conical first cooling ribs constructed in the first base body, the first cooling ribs being able to be circulated by a coolant; and cylindrical and / or conical second cooling ribs constructed in the second base body, the second cooling ribs being able to be circulated by a coolant, the second base body being joined to the first base body such that the second cooling ribs are located between the first cooling ribs without contacting the first base body. Summary of the Invention

[0005] The object of the present invention is to improve the material-locking engagement of the cooling device to the component to be cooled.

[0006] The object of the present invention is achieved in the cooling device mentioned at the beginning by the fact that a bend is formed on the back side of the base element, so that the base element has a prestress, and / or at least one auxiliary element is provided on the back side for establishing a material-locking connection between the cooling device and the component.

[0007] Furthermore, the object of the present invention is achieved by the method mentioned at the beginning, according to which it is provided that a sintered powder is used as the material, a green body is manufactured from the sintered powder by pressing, the green body is sintered to form a shaped body, and the cooling structure in the form of a cooling element is manufactured from the shaped body by shaping. For this purpose, a part of the shaped body is pressed by a shaping die, and the back side of the basic element is manufactured in such a way that it is pre-tensioned by means of the bend, and / or at least one auxiliary element is provided on the back side for establishing a material-locking connection between the cooling device and the component.

[0008] It is advantageous here that by pre-tensioning or bending the base element, warping that may occur during the soldering process in the power electronics device or the component to be connected to the cooling device can be avoided, or conversely, deformation or tensioning of the cooling device caused by temperature effects here can be avoided. Therefore, a reduction in the contact surface between the cooling device and the power electronics device or the component and the associated performance degradation can be avoided. Compared with other methods, the bend and / or the at least one auxiliary element can be simply incorporated into the existing process steps for establishing a material-locking connection, so that no additional process steps, such as machining the contact surface between the base element and the power electronics device or the component, are required for its manufacture. By means of the at least one auxiliary element, the configuration of the material-locking connection can be better defined, and in this way, the cooling device can also be more simply made to abut against the power electronics device or the component over the entire surface, and thus improved heat dissipation can be achieved.

[0009] According to an embodiment variant of the present invention, it can be provided that the bend is a bend of the base element that is concave with respect to the cooling element, in particular the base element is constructed in a flat-concave manner. Therefore, the support of the cooling device on the component to be cooled can be more simply constructed for establishing a material-locking connection, and thereby the connection process itself can be simplified.

[0010] For this purpose, according to an embodiment variant, it can be provided that the concave bend has a plurality of different radii of curvature, so that the cooling device can be better adapted to different material-locking connection methods. At the same time, the cooling device can thus also be pre-tensioned only locally (more strongly), and in this way, the influence of the pre-bending on the material of the cooling device can be reduced.

[0011] In order to construct a uniform layer thickness of the additional material for establishing a material-locking connection, it is advantageous according to another implementation variant of the present invention that the base element has bends with a minimum radius of curvature in mutually opposed edge regions.

[0012] According to another implementation variant of the present invention, it can be provided that the auxiliary element is a recess in the second surface of the base element. The recess can serve as a "trapper" for the liquid additional material during the establishment of the material-locking connection, so that the excessive runoff of the additional material can be reduced or prevented. Thus, if necessary, the material-locking connection can be restricted to discrete regions of the cooling device or the component to be cooled.

[0013] In order to improve these effects, according to one implementation variant, it can be provided for this purpose that the recess has a maximum depth between 0.05 mm and 0.5 mm. Below 0.05 mm, the construction of the recess is vulnerable to errors in the connection formation because the recess may not be filled / filled with the additional material. With a depth greater than 0.5 mm, the gap of the structural material-locking connection between the cooling device and the component may be changed too much, so that a uniform connection layer may perhaps not be formed.

[0014] According to another implementation variant, in order to construct a uniform connection layer from the additional material between the cooling device and the component, it can be provided that the auxiliary element is a protrusion on the second surface of the base element.

[0015] Here it can be advantageous that, according to one implementation variant, the protrusion has a maximum height between 0.05 mm and 0.5 mm. As in the case of the recess, a gap thickness with a height less than 0.05 mm can be too small for constructing a uniform connection layer. On the other hand, with a height greater than 0.5 mm, the connection layer can be constructed too thick, whereby the heat dissipation may be deteriorated. In addition, when the gap thickness is greater than 0.5 mm, the liquid additional material may perhaps flow out of the connection region, whereby there is a risk of constructing a non-uniform connection layer.

[0016] According to another implementation variant of the present invention, it can be provided that the base element and the cooling element are made of sintered material, and the cooling element is manufactured by shaping the material of the base element. Here it is advantageous that, by shaping the base element into the cooling element, no waste is generated for the manufacture of the cooling element, as is the case, for example, in machining. In addition, all the cooling elements of the cooling device can be manufactured simultaneously, whereby a corresponding increase in productivity can be achieved. Here, for shaping it is advantageous that, although the green body already has the corresponding strength due to sintering, it can still be shaped more simply compared to solid material due to the pores.

[0017] For the same reason, it is advantageous that, according to another implementation variant of the present invention, the auxiliary element is manufactured in one piece with the base element by powder metallurgy. Thus, no other process steps for constructing the auxiliary element are required.

[0018] It can be provided corresponding to an implementation variant of the present invention that the cooling element is height-calibrated after forming the preform. Thus, the bending of the abutment surface of the base element against the component can be taken into account by simple method steps, in particular by stress relief during the establishment of the material-locking connection and its effect on the height profile of the cooling structure to reduce the bending.

[0019] To simplify the method and in particular to avoid machining the base element, it can be provided according to an implementation variant of the present invention that the bending of the back side of the base element is constructed during the height calibration, and / or the auxiliary element is constructed on the back side of the base element during the forming of the preform for establishing a material-locking connection. With the latter implementation variant, the step of height calibration can also be simplified because there is no risk of compressing an existing structure for the auxiliary element. Description of the Drawings

[0020] For a better understanding of the present invention, the present invention is explained in detail with the aid of the following drawings.

[0021] In strongly simplified schematic diagrams respectively:

[0022] Figure 1 A side view of a cooling device with a component to be cooled is shown;

[0023] Figure 2 An axonometric view of the cooling device is shown;

[0024] Figure 3 A side view of an implementation variant of the cooling device is shown;

[0025] Figure 4 A bottom view of another implementation variant of the cooling device is shown;

[0026] Figure 5 A bottom axonometric view of another implementation variant of the cooling device is shown;

[0027] Figure 6 An implementation variant of the preform is shown;

[0028] Figure 7 An implementation variant of a forming die for manufacturing the cooling device is shown. Detailed Description of the Invention

[0029] It should be noted first that in the embodiments described differently, the same components are provided with the same reference signs or the same component names, and the disclosure contained in the entire description can be transferred meaningfully to the same components with the same reference signs or the same component names. The positional descriptions selected in the description, such as above, below, lateral, etc., also refer to the directly described and illustrated drawings, and these positional descriptions are transferred meaningfully to the new positions when the positions change.

[0030] In Figure 1 a side view of the cooling device 1 is shown.

[0031] The cooling device 1 is used to cool one component 2 or a plurality of components 2 or an assembly. For this purpose, the cooling device has a second surface 3 forming the back side and is in particular directly applied against at least one component 2, and thus is preferably in direct contact with the component 2 for heat exchange.

[0032] The component 2 is preferably an electronic component, in particular a so-called power electronic component or a high-power electronic component or a power semiconductor or a high-power semiconductor, but can also be implemented differently. Such a component 2 or an assembly composed of these components 2 or having these components can in particular be provided for powers in the range from a few kilowatts to megawatts. Such a component 2 is used, for example, to convert electrical energy using switching electronic elements. Typical applications are converters or frequency converters in the field of electric drive technology, solar inverters for power grids or switched-mode power supplies for regenerated energy (usually converting an alternating voltage into a direct voltage by means of a rectifier and converting the direct voltage into an alternating voltage by means of an inverter), and converters for wind turbines, for example control systems, battery management systems, etc. in the drive technology of the electric drive system of an electric vehicle or a hybrid vehicle. The power electronic component can be, for example, a semiconductor, in particular a so-called power semiconductor, such as an IGBT.

[0033] Since such a component 2 is itself known from the relevant prior art, in order to avoid repetition in terms of details, reference is made to this prior art in this regard.

[0034] The cooling device 1 includes a base element 4, which also forms the back side 3 of the cooling device 1, and the base element has a cooling structure on the first surface 5, or the cooling device is composed of the base element 4 and the cooling structure. The cooling structure is formed by cooling elements 6, which are arranged on the base element 4 protruding from the first surface 5 and are integrally connected to the base element, as can also be seen from Figure 2It can be seen. In other words, in the preferred implementation variant, the cooling device consists of only a single component. Regardless of this unity, within the scope of the present invention, there is the possibility that for each component 2 or for an assembly composed of at least one such component 2 / having at least one such component 2, a plurality of cooling devices 1 according to the present invention can be combined with each other to form a cooling device group. Therefore, the cooling device 1 can in particular also be modularly assembled into a cooling device group.

[0035] The base element 4 and the cooling element 6 are made of or consist of sintered material. Additionally, the cooling element 6 is manufactured by shaping from the base element 4.

[0036] In the preferred implementation variant, the density of the base element 4 and the cooling element 6 is at least 98%, in particular at least 98.5%, preferably at least 99% of the solid density of the material used.

[0037] Here, the solid density refers to the density of a cooling device manufactured by melting and metallurgy from the same material, that is, a component composed of solid material. The solid material here refers to a metallic material without pores except for defects, as it typically exists in sintered components.

[0038] The cooling element 6 is arranged to be circulated by a cooling fluid, such as water, so that the heat received by the cooling device 1 is removed via this cooling fluid. Preferably, the cooling device 1 is a so-called pin-fin cooling device.

[0039] The cooling element 6 of the shown implementation variant is constructed cylindrically. However, the cooling element can also have different shapes, such as a frustoconical shape or generally a shape with a cross-section tapering in the direction of the cooling element head 7, such as a truncated pyramid shape. The cooling element 6 can also have a cross-section expanding in the direction of the cooling element head 7, such as being constructed in a mushroom shape. This can be achieved non-cuttingly by extruding onto the cooling element head 7 after the cooling element 6 is formed, for example, during the height calibration of the cooling element 6.

[0040] The cross-section of the cooling element 6 can be circular, elliptical, rhombic, square, etc.

[0041] Additionally, all the cooling elements 6 can be constructed identically. However, cooling elements 6 with different shapes can also be provided or combined on the base element 4.

[0042] The height 8 of the cooling element 6 above the first surface 5 of the base element 4 can preferably be between 2 mm and 20 mm.

[0043] In the simplest design of the cooling device 1, all cooling elements 6 of the cooling device 1 have the same height 8 within the tolerance range. However, within the scope of the present invention, there is a possibility that the height of a part of the cooling elements 6 can be smaller than the height of the remaining cooling elements 6.

[0044] It can also be provided that 300 to 1300, in particular 300 to 1000, for example 300 to 750 cooling elements 6 are provided or constructed per dm² of the first surface. In particular, this quantity has proven to be advantageous in the manufacture of the cooling device 1, that is, in forming the basic element 4 into the cooling element 6, because damage to the cooling element 6 or incompletely constructed cooling elements 6 can thus be avoided or reduced.

[0045] In Figure 3 a side view of an implementation variant of the cooling device 1 is shown. Additionally, this cooling device has a basic element 4, on the first surface 5 of which a cooling structure is provided, which has cooling elements 6.

[0046] Different from the implementation variant of the cooling device 1 according to Figure 1 in this implementation variant according to Figure 3 a bending portion is provided on the back side, i.e., the second surface 3, of the basic element 4, and the basic element 4 is pre-tightened by manufacturing this bending portion.

[0047] In the shown implementation variant, the bending portion is constructed with a concave trend with respect to the cooling element 6. The basic element 4 can in particular be constructed as flat-concave. However, as can be seen from the dashed line in Figure 3 for the first surface 5, the first surface can also be constructed at least approximately following the trend of the second surface 3 (the back side of the basic element 4).

[0048] As additionally indicated by the dashed line in Figure 3 at least the second surface 3 or the entire basic element 4 can have a convex bending portion with respect to the cooling element 6.

[0049] Preferably, the bending portion is constructed in the course of the length 10 of the basic element 4 (see Figure 1 ). However, the bending portion can also be constructed in the course of the width 11 of the basic element 4.

[0050] The bending portion can be constructed with a constant radius of curvature 12 over the entire course. According to another implementation variant, it can be provided that the bending portion has a plurality of different radii of curvature 12. In particular, it can be provided that the basic element 4 has bending portions with the smallest radius of curvature 12 in the mutually opposed edge regions 13, 14.

[0051] Preferably, the bending portion is symmetrically configured in the direction from the first edge region 13 to the second edge region 14. However, the bending portion can also be configured with an asymmetric direction.

[0052] The bending portion can, for example, have a direction such as an ellipse, a parabola, etc. Other direction shapes are also possible.

[0053] The cooling element 6 can be arranged on the bent base element 4 with the same orientation, as Figure 3 shown by the solid line. This can especially be the case when the base element is configured as a flat-concave one. However, the orientation of the cooling element 6 can also be configured following the direction of the bending portion of the base element 4, as shown by the cooling element 6 depicted by the dashed line in the left image portion in Figure 3 this. If the base element 4 reduces the bending portion and especially configures the base element as a flat base element 4, then this orientation can be changed during the formation of the material-locking connection with the component 2 by stress relief in the base element 4 due to the acting heat. This is shown by the dashed arrow on the left in Figure 3 this.

[0054] There is also the possibility that the height 8 of the cooling element 6 is adapted to the bending direction, so that the cooling element head 7 is at the same height when the base element 4 has a bending portion.

[0055] The radius of curvature 12 of the base element 4 can be selected from the range of 250 mm to 5000 mm, especially 1000 mm to 4000 mm. Thus, a maximum deflection of 1.25 mm can be achieved over a length of 100 mm or 200 mm. For the case where the bending portion has multiple different radii of curvature 12, all radii of curvature 12 are equally preferably selected from this range.

[0056] In Figure 4 a bottom view of another implementation variant of the cooling device 1 is shown.

[0057] It should be mentioned here that the implementation variants of the cooling device 1 described for Figure 3 , Figure 4 and Figure 5 can be used independently by themselves. Similarly, combinations of these implementation variants are possible. Thus, when referring to the flatly configured base element 4 below, this base element can also be configured in a bent manner, as described for Figure 3 this.

[0058] In Figure 4 the flat second surface 3 on the back side of the base element 4 can be seen (for this also see Figure 1). At least one auxiliary element 15 is provided on this dorsal side for establishing a material-locking connection between the cooling device and the component 2. In the specifically shown embodiment variant, the auxiliary element 15 is a recess. However, the auxiliary element 15 can also be a protrusion on the second surface 3, as shown in the embodiment variant according to Figure 5 shows this.

[0059] The recess is used to accommodate additional material for material locking and prevent the molten additional material from flowing away / flowing out during the construction of the material-locking connection between the cooling device 1 and the component 2 (see Figure 1 ).

[0060] Conversely, the protrusion is used to create a particularly uniform gap between the cooling device 1 and the component 2, so that the additional material is constructed with at least a substantially uniform layer thickness via the connection surface (the surface to which the additional material is applied), so that there is no difference in terms of the thermal resistance between the cooling device 1 and the component 2 via the connection surface as much as possible.

[0061] It should be mentioned here that the material-locking connection can in principle be constructed as an adhesive connection. However, in the preferred embodiment variant of the present invention, this is a brazing connection and the additional material is solder. However, in particular, the cooling device 1 and the component 2 are not connected by a sintered brazing method.

[0062] In Figure 4 only one auxiliary element 15 is shown. However, more than one auxiliary element 15 can also be provided, for example two, three, four, etc., as can be seen from Figure 5 However, the specifically shown number of the auxiliary elements 15 in Figure 5 should not be understood restrictively for the present invention. In particular, the number of the auxiliary elements can depend on the size of the base element 4.

[0063] In addition, the plurality of auxiliary elements 15 is not limited to the protrusions. A plurality of discrete recesses distributed on the second surface 3 can also be provided as the auxiliary elements 15.

[0064] Within the scope of the present invention, a combination of recesses and protrusions as the auxiliary elements 15 on the second surface 3 of the base element 4 is also possible.

[0065] The recess can be constructed circular, oval, egg-shaped, approximately round, triangular, quadrangular, pentagonal, etc. in a top view. More complex shapes are also possible, as can be seen from the example of the recess in Figure 4 .

[0066] The recess can have a maximum depth between 0.05 mm and 0.5 mm for the above reasons.

[0067] Preferably, when there are a plurality of recesses on the back side of the base element 4, all the recesses are constructed identically. However, it is also possible to provide a plurality of recesses with different configurations.

[0068] For the reasons mentioned above, the at least one convex portion may have a maximum height between 0.05 mm and 0.5 mm. In the case of a plurality of convex portions, all the convex portions may be constructed identically. Similarly, convex portions with different configurations may be provided on the second surface 3 of the base element 4.

[0069] The convex portion may be constructed in a granular, tabular, etc. form. The convex portion may have a cross-section such as a circle, oval, ellipse, substantially circular, triangle, quadrilateral, etc. in a top view, for example.

[0070] The convex portion may have a length 16 between 0.5 mm and the total length of the base element 4. Additionally, the convex portion may have a width 17 between 0.5 mm and the total width of the base element 4.

[0071] The recesses may have a total surface extension dimension between 0.1% and 50% of the surface of the second surface 3 of the base element 4.

[0072] The base element 4 may have a thickness between 1 mm and 3 mm, and a larger thickness up to 5 mm is also possible.

[0073] The connection layer between the cooling device 1 and the component 2 may have a layer thickness between 0.01 mm and 0.5 mm.

[0074] According to another embodiment variant, it may be provided that the base element 4 and the cooling element 6 are made of sintered material, and the cooling element 6 is manufactured by shaping the material of the base element 4, as described below.

[0075] The at least one auxiliary element 15 may also be manufactured by powder metallurgy and constructed integrally with the base element 4.

[0076] For manufacturing the cooling device 1, sintered powder or the powder used in powder metallurgy (especially metal powder) is used. Sintered powder with correspondingly good thermal conductivity is preferably used. In particular, sintered powder based on aluminum or aluminum alloy or based on copper or copper alloy or MMC powder (metal matrix composite) is used.

[0077] The manufacturing of the cooling device is carried out in a powder metallurgy manner according to the powder metallurgy method. The cooling device 1 is therefore preferably a sintered component. For this purpose, a green compact is manufactured from sintered powder that can be made by mixing individual (metal) powders in a corresponding die (female die). The powders may be used pre-alloyed if necessary. The density of the green compact is preferably at least 80% of the solid density of the material, especially between 80% and 96%.

[0078] The green body is then dewaxed at room temperature and subjected to one-stage, two-stage or multi-stage sintering and then preferably cooled to room temperature. The sintering can be carried out at a temperature between 500° C. and 1300° C., for example.

[0079] Since these method sequences and the method parameters used therein are likewise known from the prior art, in order to avoid repetitions, reference is made to the relevant prior art in this regard.

[0080] By sintering, a preform 18 is formed from the green body, as is exemplified in Figure 6 The preform 18 can be designed as a flat plate, so that the second surface 3 and the first surface 5 extend parallel to each other.

[0081] According to one embodiment variant of the method, it can be provided that the first surface 5 of the preform 18 on which the cooling structure is formed is produced at least partially curved, as in Figure 6 Indicated by dashed lines in the figure. Due to the improved formability of the preform 18, other shapes of the first surface of the preform 18 are possible. Thus, first pin-fin additions or cooling element additions (round, egg-shaped, oval, etc.) with a height between 0.1 mm and 2.0 mm can already be preformed. In addition, structures (waves, ribs, etc.) can be deliberately introduced into the first surface 5 of the preform 18 in order to increase the turbulence of the cooling fluid if necessary.

[0082] The preform 18 can then be recompressed. However, the recompression preferably takes place simultaneously with the shaping of the preform 18 into the cooling element 6.

[0083] The preform 18 is formed in a forming die 19. For this purpose, the preform 18 is placed in the forming die 19 or is placed against it. In the simplest case, the forming die 19 is formed by a perforated plate 20. The perforated plate 20 has recesses 21, in particular penetrations, into which a part of the material of the preform 18 is pressed or through which a part of the material of the preform 18 is pressed, thereby forming the cooling element 6. The remaining part of the material of the preform 18 that is not pressed into the forming die 19 or through the forming die 19 forms the base element 4.

[0084] The recess 21 , ie its cross section, is adapted accordingly to the cross section of the cooling element 6 to be produced.

[0085] The shaping tool 19 can also have a different appearance, ie it does not necessarily have to be a simple perforated plate 20. The shaping tool 19 can be designed in particular as a "pot-shaped" die.

[0086] For shaping, the punch 22 is placed against the back side (second surface 3) of the preform 18 and pressed against the preform 18 with a predefined pressure, said back side also constituting the back side of the base element 4. The shaping can be carried out, for example, at a pressure between 700 MPa and 1600 MPa. Additionally, the shaping can be carried out during a time period of at most 10 seconds, in particular between 0.1 second and 10 seconds. Additionally, the shaping is preferably carried out at room temperature (20 °C), i.e., cold shaping, or the shaping can also be carried out after preheating the preform 18 to a temperature between 50 °C and 300 °C, for example between 50 °C and 150 °C, and / or in or with a shaping die 19 heated to a temperature between 50 °C and 300 °C, for example between 50 °C and 150 °C.

[0087] After shaping the preform 18, i.e., forming, the cooling device 1 can be completed. However, there is also the possibility of reprocessing the cooling device 1. For example, the height of the cooling element 6 can be calibrated or generally recompressed, and the punch can also be used for this purpose. In addition, the first surface 5 and the cooling element 6 can be provided with a corrosion-resistant coating.

[0088] The at least one auxiliary element 15 can likewise be manufactured during the reprocessing. The auxiliary element can also be manufactured during powder pressing after sintering. In this case, the punch 22 must have corresponding voids or protrusions so as not to compress the auxiliary element 15 when shaping the preform 18.

[0089] However, in a preferred embodiment variant, the at least one auxiliary element 15 is manufactured while shaping the preform 18. For this purpose, the punch 22 can have a protrusion 24 for constructing the above-mentioned recess in the second surface 3 of the base element 4 and / or a recess 25 for constructing the above-mentioned protrusion on the second surface 3 of the base element 4 on the abutment surface 23 that can be applied to the preform 18. The number of protrusions 24 and / or recesses 25 on the punch 22 depends on the number of auxiliary elements 15 to be manufactured.

[0090] It can additionally be stipulated that the manufacturing of the at least one auxiliary element 15 is carried out during the height calibration of the cooling element 6. For this purpose, the support surface of the die or the clamping element has corresponding protrusions 24 or recesses 25, and the base element 4 is placed on the support surface for height calibration.

[0091] It should be mentioned here that the shaping of the preform 18 can be carried out in one stage or in multiple stages. In a multi-stage implementation, the cooling element 6 is not shaped in one step but in multiple steps. In particular, in a multi-stage embodiment variant, it can be advantageous to construct the auxiliary element 15 during the height calibration of the cooling element 6 when necessary.

[0092] The bending of the base element 4 explained previously can likewise be carried out during the shaping of the preform 18 or during the height calibration of the cooling element 6 that may have to be carried out if necessary. For this purpose, the abutment surface 23 of the punch 22 that is bent is only implicitly shown as a dashed line in Figure 7 The bending of the abutment surface 23 is opposite to the bending of the base element 4 to be produced. Therefore, no machining is necessary for constructing the bending of the base element 4.

[0093] The various embodiments show possible implementation variants. It should be noted here that combinations of the individual implementation variants with one another are also possible.

[0094] It is finally to be noted as a matter of course that, for a better understanding of the structure of the cooling device 1 or the shaping die 19, they are not necessarily shown to scale.

[0095] List of reference signs

[0096] 1 Cooling device

[0097] 2 Component

[0098] 3 Surface

[0099] 4 Base element

[0100] 5 Surface

[0101] 6 Cooling element

[0102] 7 Cooling element head

[0103] 8 Height

[0104] 9 Structural element

[0105] 10 Length

[0106] 11 Width

[0107] 12 Radius of curvature

[0108] 13 Edge region

[0109] 14 Edge region

[0110] 15 Auxiliary element

[0111] 16 Length

[0112] 17 Width

[0113] 18 Preform

[0114] 19 Shaping die

[0115] 20 Perforated plate

[0116] 21 Void

[0117] 22 Punch

[0118] 23 abutting surface

[0119] 24 convex part

[0120] 25 concave part.

Claims

1. Cooling device (1) for cooling a component (2), said cooling device comprising a base element (4) having a first surface (5) and a second surface (3) opposite the first surface (5) and forming the back side, and having a cooling structure with cooling elements (6), said cooling structure being provided on the base element (4) protruding beyond the first surface (5), characterized in that, The back side of the base element (3) is configured with a bend and has a prestress, and / or at least one auxiliary element (15) is provided on the back side for establishing a material-locking connection between the cooling device (1) and the component (2).

2. The cooling device (1) according to claim 1, characterized in that The bend is a concave bend of the base element (4) with respect to the cooling element (6), in particular, the base element (4) is configured in a flat-concave shape.

3. The cooling device (1) according to claim 2, characterized in that, The concave bend has a plurality of different radii of curvature (12).

4. The cooling device (1) according to claim 3, characterized in that, The base element (4) has bends with a minimum radius of curvature (12) in mutually opposed edge regions (13, 14).

5. The cooling device (1) according to any one of claims 1 to 4, characterized in that The auxiliary element (15) is a recess in the second surface (3).

6. The cooling device (1) according to claim 5, characterized in that, The recess has a maximum depth between 0.05 mm and 0.5 mm.

7. The cooling device (1) according to any one of claims 1 to 6, characterized in that, The auxiliary element (15) is a protrusion on the second surface (3).

8. The cooling device (1) according to claim 7, characterized in that, The protrusion has a maximum height between 0.05 mm and 0.5 mm.

9. The cooling device (1) according to any one of claims 1 to 8, characterized in that The base element (4) and the cooling element (6) are made of sintered material, and the cooling element (6) is manufactured by shaping the material of the base element (4).

10. The cooling device (1) according to any one of claims 1 to 9, characterized in that, The auxiliary element (15) is manufactured in one piece with the base element (4) by powder metallurgy.

11. A method for manufacturing a cooling device (1), the method comprising the steps of providing a material and constructing a cooling structure from the material, characterized in that, Sintered powder is used as the material. A green body is manufactured from the sintered powder by pressing, the green body is sintered into a shaped blank (18), and the cooling structure in the form of the cooling element (6) is manufactured from the shaped blank (18) by shaping. For this purpose, a part of the shaped blank (18) is pressed by a shaping die (19), and the back side of the base element (4) is manufactured in a manner that is pre-tensioned with the bend, and / or at least one auxiliary element (15) is provided on the back side for establishing a material-locking connection between the cooling device (1) and the component (2).

12. The method according to claim 11, wherein The height of the cooling element (6) is calibrated after shaping the shaped blank (18).

13. The method according to claim 12, characterized in that, The bend on the back side of the base element (4) is configured during the height calibration.

14. The method according to any one of claims 11 to 13, characterized in that The auxiliary element (15) is configured on the back side of the base element (4) during shaping the shaped blank (18) for establishing a material-locking connection.

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