Thin film resistive mesh space debris detection circuit and method based on encoding scheme

Abstract

The application provides a coding mode-based thin film resistance network space debris detection circuit and method, which comprises a coding thin film resistance network composed of parallel resistance wire arrays arranged orthogonally on both sides, for generating on-off signals caused by broken wires due to debris impact; an on-off comparison circuit connected to the coding thin film resistance network, for converting the on-off state of the resistance wire into a high or low level identification signal; an on-off identification circuit connected to the on-off comparison circuit, for collecting the identification signals of each channel in parallel and outputting the broken wire state; the resistance wire of the coding thin film resistance network is connected to the signal channel through a grouping and cyclic connection mode, and the total number of the signal channels is less than the total number of the resistance wires. The application can identify the size information in two dimensional directions, improve the positioning accuracy of the impact position, and thus improve the detection parameter test accuracy of the entire detector.

Description

Technical Field

[0001] This invention relates to the field of space debris environment detection technology, and in particular to a thin-film resistor network space debris detection circuit and method based on coding. Background Technology

[0002] The space environment contains numerous sub-millimeter and millimeter-sized fragments, posing a very high probability of collision with spacecraft and significant risks. To obtain environmental parameters related to space debris, various countries have conducted research and on-orbit testing of space debris detection technologies based on different principles. Early methods primarily employed single detection techniques such as semiconductor detectors, ionization detectors, piezoelectric detectors, resistive grid detectors, and acoustic emission, mainly acquiring debris flux information. In recent years, international attention has shifted towards the comprehensive detection of multiple physical parameters of space debris, including flux, size, velocity, and direction. This has led to the development of space debris detection structures combining various detection technologies, including a combination of thin-film resistors and acoustic emission detection. The choice of circuit processing method on the thin-film resistor sensor significantly impacts the detector's performance. Existing thin-film resistor grid circuit designs have imperfect detection effects, requiring circuit design optimization to improve its debris information acquisition capabilities. Summary of the Invention

[0003] In view of this, the present invention provides a thin-film resistor network space debris detection circuit and method based on an encoding method. One or more embodiments of this specification also relate to a thin-film resistor network space debris detection method based on an encoding method, a thin-film resistor network space debris detection device based on an encoding method, a computing device, a computer-readable storage medium, and a computer program, to address the technical deficiencies existing in the prior art.

[0004] According to a first aspect of the present invention, a thin-film resistive grid space debris detection circuit based on an encoding method is provided, comprising:

[0005] A coded thin-film resistor network consisting of an array of parallel resistive wires arranged orthogonally on both sides is used to generate on / off signals by breaking wires caused by debris impact.

[0006] A continuity comparison circuit connected to an coded thin-film resistor network is used to convert the continuity state of the resistor wire into a high-level or low-level identification signal.

[0007] The on / off identification circuit, which is connected to the on / off comparison circuit, is used to acquire the identification signals of each channel in parallel and output the off-line status.

[0008] In this system, the resistor wires of the coded thin-film resistor network are connected to the signal channels in a grouped cyclic connection manner, and the total number of signal channels is less than the total number of resistor wires.

[0009] In some embodiments, the width and spacing of the resistive wires of the coded thin-film resistive grid are both 50 micrometers, the number of wires on one side is 2000, and the two sides orthogonally form an effective detection area of ​​20 cm × 20 cm.

[0010] In some embodiments, the on / off comparison circuit includes a voltage divider resistor and a comparator, with one end of the voltage divider resistor connected to the signal channel and the other end connected to the power supply voltage.

[0011] One input of the comparator is connected to the voltage divider node of the signal channel, and the other input is connected to a preset threshold voltage;

[0012] When the resistor wire connected to the signal channel breaks, the voltage at the voltage divider node exceeds the threshold voltage, and the comparator outputs a high level as a breakage indicator.

[0013] In some embodiments, the on / off identification circuit uses an FPGA chip, whose I / O channels are directly connected to the signal channels, enabling it to simultaneously acquire the level status of all signal channels;

[0014] The FPGA chip identifies a high level as a disconnection state and a low level as an intact state, with a detection cycle of less than 1 microsecond.

[0015] In some embodiments, the resistive wires of the coded thin-film resistive grid are divided into upper and lower groups, with n signal channels in the upper group and m signal channels in the lower group, and satisfying m = n + 2, where m and n are both natural numbers;

[0016] The upper conductor is divided into m / 2 cyclic groups, each group containing n conductors that are sequentially connected to n signal channels;

[0017] The lower conductors are divided into n / 2 cyclic groups, each group containing m conductors that are sequentially connected to m signal channels.

[0018] In some embodiments, the number of resistor wires is 24, with the top 12 wires divided into 3 loop groups, each group connecting 4 signal channels;

[0019] The 12 wires below are divided into two loop groups, each group connecting to 6 signal channels;

[0020] The total number of signal channels is 10, enabling continuity detection of 24 wires.

[0021] According to a second aspect of the present invention, a method for detecting space debris using a thin-film resistive grid based on an encoding method is provided. This method is implemented based on the aforementioned circuit and includes:

[0022] The specific disconnected resistor wire number is determined based on the disconnection signals of the upper and lower signal channels;

[0023] When a fragment impact causes an adjacent conductor to break, the impact location is determined by cross-verifying the combination of broken conductors in the upper and lower channels.

[0024] In some embodiments, locating the impact location by cross-validating the combination of broken wires in the upper and lower channels includes:

[0025] The X and Y coordinates of the fragment are determined by the intersection of the broken wire signals on both sides;

[0026] Calculate the dimensions of the fragment in both the X and Y dimensions based on the number of broken wires on both sides.

[0027] According to a third aspect of the present invention, a thin-film resistive grid space debris detection device based on an encoding method is provided, comprising:

[0028] The determination module is configured to determine the specific disconnected resistor wire number based on the disconnection signals of the upper and lower signal channels;

[0029] The positioning module is configured to locate the impact position by cross-verifying the combination of broken wires in the upper and lower channels when a debris impact causes an adjacent wire to break.

[0030] In some embodiments, locating the impact location by cross-validating the combination of broken wires in the upper and lower channels includes:

[0031] The X and Y coordinates of the fragment are determined by the intersection of the broken wire signals on both sides;

[0032] Calculate the dimensions of the fragment in both the X and Y dimensions based on the number of broken wires on both sides.

[0033] At least one embodiment of the present invention employs a structure in which parallel resistive wire arrays are fabricated on both the front and back sides of a thin film. The circuit processing method adopts a high-speed on / off judgment of multi-channel resistive wires, which can identify dimensional information in two dimensions. At the same time, it can obtain impact time and location information through physical means, thereby improving the positioning accuracy of the impact position and thus improving the detection parameter testing accuracy of the entire detector. Attached Figure Description

[0034] Figure 1 This is a simplified structural diagram of a debris detector on the International Space Station using existing technology.

[0035] Figure 2 This is a schematic diagram of the signal channel encoding method in a thin-film resistor network space debris detection circuit based on an encoding method, provided in some embodiments of this specification;

[0036] Figure 3 This is a schematic diagram of the on / off comparison circuit of a single signal channel in a thin-film resistor network space debris detection circuit based on an encoding method, provided in some embodiments of this specification;

[0037] Figure 4 This is a schematic diagram of a thin-film resistor network detection circuit based on an encoding method, provided in some embodiments of this specification.

[0038] Figure 5 This is a flowchart of a thin-film resistor grid space debris detection method based on an encoding method, provided in some embodiments of this specification;

[0039] Figure 6 This is a schematic diagram of the decoding of the positions of 24 resistive wires in a thin-film resistive grid space debris detection circuit based on an encoding method, provided in some embodiments of this specification.

[0040] Figure 7 This is a schematic diagram of an orthogonal design of a resistor wire array in a thin-film resistor grid space debris detection circuit based on an encoding method, provided in some embodiments of this specification;

[0041] Figure 8 This is a simplified structural diagram of a thin-film resistor grid space debris detection device based on an encoding method, provided in some embodiments of this specification. Detailed Implementation

[0042] Many specific details are set forth in the following description to provide a full understanding of this specification. However, this specification can be implemented in many other ways than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this specification. Therefore, this specification is not limited to the specific implementations disclosed below.

[0043] The terminology used in one or more embodiments of this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the one or more embodiments of this specification. The singular forms “a” and “the” as used in one or more embodiments of this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items. The modifications “a” and “a plurality” as used in this disclosure are illustrative and not restrictive, and those skilled in the art will understand that they should be understood as “one or more” unless the context clearly indicates otherwise.

[0044] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this specification, and similarly, second may also be referred to as first. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to a determination."

[0045] like Figure 1 As shown, the debris detector on the International Space Station is designed with a two-layer structure. The first layer uses a thin-film resistor to acquire debris size, and four acoustic emission sensors are also arranged on the resistor to obtain impact location information. The second layer uses a structure with four acoustic emission sensors arranged on a thin metal plate to locate the impact point through acoustic emission signals. The first layer sensor consists of single-sided parallel resistive wires fabricated on a thin film. The circuitry involves connecting multiple resistive wires in parallel. When debris impacts the thin-film resistor, it causes localized breaks in the resistive wires, resulting in a change in the parallel resistance value. The number of broken wires is determined based on the change in resistance, further assessing the debris's size. The impact time and location information are obtained from the four acoustic emission sensors on the thin film. The two-layer structure together enables the testing of parameters such as debris flux, size, velocity, and orientation.

[0046] The debris detectors on the International Space Station employ a combined thin-film resistive grid and acoustic emission detection method. The first layer of the detector consists of a single-layer parallel resistive wire array fabricated on a thin film. Signal processing involves connecting multiple resistive wires in parallel. When debris impacts the resistive wire array, it causes localized breaks in the resistive wires, resulting in changes in the parallel resistance. The number of broken wires is determined based on the magnitude of the resistance change, further assessing the debris's size. This technical approach only tests size in one dimension, and the accuracy of size measurement is directly related to the accuracy of resistance measurement. Differences in the resistive wire manufacturing process and damage to the resistive wires can affect the accuracy of size information acquisition. This technical approach also indicates that the thin-film resistive grid cannot obtain the impact time and location information of the debris; it relies on four acoustic emission sensors on the thin-film resistor. Because the thin-film resistive grid is a parallel resistive wire array, the propagation speed of the wave signal generated by the ultra-high-speed impact of the debris exhibits anisotropic characteristics, with significant differences in velocity across different directions. Therefore, the error in location analysis and time calculation based on wave signal propagation speed is relatively large, typically reaching several centimeters in location error and several microseconds in time error. Because the detector needs to analyze the impact direction of debris based on the impact location of the thin-film resistive grid and the impact velocity based on the impact time of the grid, and debris velocities typically reach several kilometers per second, assuming a 20-centimeter spacing between the two detector structures, the debris travels between the two structures for tens of microseconds. This results in significant errors in the detector's detection of the impact direction and velocity, affecting the overall detection performance. To obtain more accurate debris environmental parameters, it is necessary to optimize the thin-film resistive grid detection structure and its signal processing method.

[0047] This invention designs a thin-film resistive grid detection circuit based on an encoding method. It employs a structure where parallel resistive wire arrays are fabricated on both the front and back sides of a thin film. The circuit processing utilizes comparator judgment and a multi-channel signal encoding design to identify the continuity of each resistive wire to test information such as the size, impact location, and impact time of the fragment. The thin-film resistive grid detection structure can distinguish dimensions in two dimensions, with a fragment impact location detection error of ±100 micrometers and a fragment impact time measurement error of ±1 microsecond. Taking a 20-centimeter gap between the two detection layers as an example, the average measurement error of the detector in the speed range of 6.5 km / s to 8 km / s is approximately 9%.

[0048] Compared to existing detector designs, this invention uses a coded thin-film resistive grid detection circuit to directly acquire the two-dimensional dimensions, impact time, and location information of debris. In contrast, existing thin-film resistive grids only measure one-dimensional dimensions and require acoustic emission sensors mounted on the grid to obtain impact time and location information. The principles and circuit configurations of these methods differ significantly. This approach improves the accuracy of debris size, impact location, and impact time, thereby enhancing the overall performance of the detector.

[0049] According to some embodiments of this specification, a thin-film resistor network space debris detection circuit based on an encoding method is provided, specifically including: an encoded thin-film resistor network composed of an array of parallel resistive wires arranged orthogonally on both sides, used to generate an on / off signal by a break caused by debris impact; an on / off comparison circuit connected to the encoded thin-film resistor network, used to convert the on / off state of the resistive wires into a high-level or low-level identification signal; and an on / off identification circuit connected to the on / off comparison circuit, used to collect the identification signals of each channel in parallel and output the break status; wherein, the resistive wires of the encoded thin-film resistor network are connected to the signal channels in a grouped cyclic connection manner, and the total number of signal channels is less than the total number of resistive wires.

[0050] Orthogonal arrangement on both sides refers to the perpendicular crisscrossing of resistive wires on both sides of the thin-film substrate, forming a grid structure for dual-coordinate positioning. Parallel resistive wire arrays are assemblies composed of slender resistive elements arranged at equal intervals, serving as the physical sensing units of the detection network. Encoded thin-film resistive grids are composite structures that group and encode wires according to specific connection rules, enabling the detection of more wire states with fewer signal channels. On / off signals are circuit state changes generated when a resistive wire breaks, reflecting debris impact events. On / off comparison circuits are hardware modules that convert wire resistance changes into logic levels, including voltage divider resistors and voltage comparators. Identification signals are high and low level signals output by the comparator, used to characterize the wire's on / off state. Breakage states refer to the open circuit caused by a physical break in the wire, providing direct evidence of debris impact. Grouped cyclic connection is a wiring strategy that groups wires according to specific rules and rotates them to signal channels. The total number of signal channels refers to the actual number of circuit channels used for detection, which is far less than the total number of wires.

[0051] Through innovative orthogonal grid design and coding multiplexing technology, the hardware architecture is significantly simplified while ensuring detection accuracy. The thin-film resistor structure offers advantages such as light weight and low power consumption. Combined with high-speed signal processing circuitry, it can monitor and accurately locate space debris impact events in real time. The grouped cyclic connection method overcomes the limitations of traditional point-to-point detection, enabling the compact deployment of large-scale wire arrays, which is particularly suitable for applications sensitive to size and weight, such as spacecraft protection.

[0052] The beneficial effects of one of the embodiments in this specification include at least the following: the structure of preparing parallel resistance wire arrays on the front and back sides of the thin film, the circuit processing method adopting a high-speed on / off judgment of multi-channel resistance wires, which can identify size information in two dimensions, and at the same time obtain impact time and position information through physical means, which can improve the positioning accuracy of impact position, thereby improving the detection parameter testing accuracy of the entire detector.

[0053] In some embodiments, the width and spacing of the resistive wires of the coded thin-film resistive grid are both 50 micrometers, the number of wires on one side is 2000, and the two sides orthogonally form an effective detection area of ​​20 cm × 20 cm.

[0054] The width of the resistive conductors refers to the lateral physical dimensions of the conductor on the thin-film substrate, directly affecting current carrying capacity and breakage sensitivity. The spacing between resistive conductors, the minimum distance between the edges of adjacent conductors, determines the smallest resolvable unit of the detection grid. A collection of parallel conductors arranged on a single surface of the thin-film substrate constitutes the basic layer of the detection network.

[0055] In some embodiments, the on / off comparison circuit includes a voltage divider resistor and a comparator. One end of the voltage divider resistor is connected to the signal channel, and the other end is connected to the power supply voltage. One input terminal of the comparator is connected to the voltage divider node of the signal channel, and the other input terminal is connected to a preset threshold voltage. When the resistor wire connected to the signal channel is broken, the voltage of the voltage divider node exceeds the threshold voltage, and the comparator outputs a high level as a breakage indicator.

[0056] A voltage divider resistor is a fixed-value component connected in series in the detection circuit to proportionally reduce the input voltage to a suitable detection range. The comparator, an analog device with differential inputs, outputs high and low level signals by comparing the input signal with a reference voltage. Voltage sampling points at the resistor connections in the voltage divider network are used to obtain voltage values ​​at specific ratios. A preset reference voltage value for the threshold voltage serves as the critical criterion for the comparator to determine the state of the input signal.

[0057] In some embodiments, the continuity identification circuit uses an FPGA chip, whose I / O channel is directly connected to the signal channel, and can simultaneously acquire the level status of all signal channels; the FPGA chip identifies a high level as a disconnection state and a low level as an undisconnected state, with a detection cycle of less than 1 microsecond.

[0058] In some embodiments, the resistive wires of the coded thin-film resistive grid are divided into upper and lower groups. The upper group has n signal channels and the lower group has m signal channels, satisfying m = n + 2, where m and n are natural numbers. The upper wires are divided into m / 2 cyclic groups, each containing n wires that are sequentially connected to n signal channels. The lower wires are divided into n / 2 cyclic groups, each containing m wires that are sequentially connected to m signal channels.

[0059] In some embodiments, the number of resistive wires is 24. The upper 12 wires are divided into 3 loop groups, each group connecting 4 signal channels; the lower 12 wires are divided into 2 loop groups, each group connecting 6 signal channels; the total number of signal channels is 10, realizing the continuity detection of 24 wires.

[0060] The beneficial effects of one of the embodiments in this specification include at least the following: the structure of preparing parallel resistance wire arrays on the front and back sides of the thin film, the circuit processing method adopting a high-speed on / off judgment of multi-channel resistance wires, which can identify size information in two dimensions, and at the same time obtain impact time and position information through physical means, which can improve the positioning accuracy of impact position, thereby improving the detection parameter testing accuracy of the entire detector.

[0061] The invention will be further illustrated by a specific example below:

[0062] like Figure 2 As shown, during the coding design, the resistor wires are divided into two groups of 12 wires each, resulting in 10 read signal channels: four upper read signal channels (n1 to n4) and six lower read signal channels (m1 to m6). Figure 2 As shown, two sets of resistor wires are connected and interleaved using different cyclic sequences: 12 resistor wires are led out from the top, divided into m / 2 = 3 cycles, each cycle containing n = 4 signals; 12 resistor wires are led out from the bottom, divided into n / 2 = 2 cycles, each cycle containing m = 6 signals. In this way, 24 resistor wires can be led out through 10 readout signal channels.

[0063] Continue to refer to Figure 3 The on / off comparison circuit employs a comparator circuit design to indicate the on / off status of the resistor wires connected to the signal channel. Three resistor wires are connected to the n1 signal channel, forming a parallel circuit by grounding these three wires. A comparator circuit compares the voltage signals at the two input terminals. One input terminal of the comparator is connected to the n1 signal channel, which is connected to the voltage signal VCC through a voltage divider resistor R. The voltage signal of the n1 signal channel can be calculated using the voltage divider signal. The other input terminal of the comparator is connected to the voltage signal VCC1.

[0064] This invention designs a continuity comparison circuit that can output an indicator of the continuity status of the resistor wires connected to the signal channel. Initially, when all three resistor wires connected to the n1 signal channel are unbroken, the voltage division at the input comparator for the n1 signal channel is less than the voltage VCC1 at the other end of the comparator. The comparator then outputs a low level, indicating that no disconnection has occurred. When any of the three resistor wires connected to the n1 signal channel is broken, the resistance of the parallel circuit increases, leading to an increase in the voltage division at the input comparator for the n1 signal channel. Therefore, if even one resistor wire is broken, the voltage division at the input comparator for the n1 signal channel will be greater than VCC1, and the comparator outputs a high level, indicating a break. Following the same circuit design, n1 to n4 and m1 to m6 are designed as a 10-channel continuity comparison circuit, capable of generating indicators of the continuity status of 24 resistor wires.

[0065] The continuity identification circuit uses an FPGA chip. The I / O channel of the FPGA chip can directly identify the level state in the signal channel. Signal channels n1 to n4 and m1 to m6 are connected to the I / O channel of the FPGA chip respectively. The signal channels can be read at the same time, and their high and low level status can be identified. A low level is identified as no disconnection has occurred, and a high level is identified as a disconnection has occurred.

[0066] Continue to refer to Figure 4 This diagram illustrates a single-sided structure of a thin-film resistor network detection circuit based on an encoding method. It can identify the on / off state of 24 resistive wires through 10 signal channels. These 10 signal channels are simultaneously acquired via an FPGA chip, and the entire detection circuit can identify the on / off state in less than 1 microsecond.

[0067] like Figure 5 As shown, corresponding to the circuit embodiment described above, this specification also provides an embodiment of a thin-film resistor network space debris detection method based on an encoding method. This method is implemented based on the aforementioned circuit and includes: determining the specific disconnected resistor wire number based on the disconnection signals of the upper and lower signal channels; when a debris impact causes an adjacent wire to disconnect, locating the impact position by cross-verifying the disconnection combination of the upper and lower channels.

[0068] In some embodiments, the location decoding method determines the X and Y coordinates of the fragment by the intersection of the broken wire signals on both sides; and calculates the size of the fragment in both X and Y dimensions based on the number of broken wires on both sides.

[0069] As a concrete example, such as Figure 6As shown in the diagram, taking the decoding method for 24 one-dimensional resistor wire positions as an example, the circles in the diagram indicate that the 3rd and 4th resistor wires have broken. The 3rd resistor wire is connected to the lower signal channel m2, and the 4th resistor wire is connected to the upper signal channel n2. During decoding, based on the lower signal channel m2, the broken position can be deduced to be the 3rd or 15th resistor wire; based on the upper signal channel n2, the broken position can be deduced to be the 4th, 12th, or 20th resistor wire. In the case of a broken wire event caused by a debris impact, only adjacent resistor wires will break. Therefore, these two broken signals must come from two consecutive resistor wires. Only resistor wires 3 and 4 are adjacent; resistor wires 15, 12, and 20 are not adjacent.

[0070] As another concrete example, the same circuit design is used on both sides of the thin film, and the resistor wire arrays on both sides are orthogonally designed, such as... Figure 7 As shown, based on the broken wire number information on both sides, it is possible to further obtain the number of broken wires and the location information of the broken wires.

[0071] If a thin-film resistor network detection structure with 2000 resistance wires on the front and 2000 electrical group wires on the back is designed, the single-sided readout signal channel of the thin-film resistor network detection circuit based on the coding method can be designed with n=44 and m=n+2=46 channels. The on / off status of 2024 resistance wires can be identified through 90 signal channels on one side, and the number and location of broken wires of 2000 resistance wires on the front and 2000 electrical group wires on the back can be identified through 180 signal channels on both sides. Its circuit scale is small, and the time period for the entire detection circuit to identify the on / off status can be less than 1 microsecond.

[0072] Corresponding to the above-described method embodiments, this specification also provides embodiments of a thin-film resistor grid space debris detection device based on an encoding method. Figure 8 This specification illustrates a schematic diagram of a thin-film resistor grid space debris detection device based on an encoding method, according to some embodiments thereof. Figure 8 As shown, the device includes:

[0073] The determination module 801 is configured to determine the specific disconnected resistor wire number based on the disconnection signals of the upper and lower signal channels;

[0074] The positioning module 802 is configured to locate the impact position by cross-verifying the combination of broken wires in the upper and lower channels when the impact of the debris causes the adjacent wires to break.

[0075] In some embodiments, locating the impact location by cross-validating the combination of broken wires in the upper and lower channels includes:

[0076] The X and Y coordinates of the fragment are determined by the intersection of the broken wire signals on both sides;

[0077] Calculate the dimensions of the fragment in both the X and Y dimensions based on the number of broken wires on both sides.

[0078] For example, the size of a fragment in the X dimension can be determined based on the minimum and maximum values ​​of its X coordinates, and the size of a fragment in the Y dimension can be determined based on the minimum and maximum values ​​of its Y coordinates. Alternatively, the approximate rectangular area of ​​the corresponding fragment can be calculated using the minimum and maximum values ​​of its X and Y coordinates. Or, an irregular region of the corresponding fragment can be formed based on each X and Y coordinate.

[0079] The above is a schematic scheme of a thin-film resistive grid space debris detection device based on an encoding method according to this embodiment. It should be noted that the technical solution of this encoding-based thin-film resistive grid space debris detection device belongs to the same concept as the aforementioned encoding-based thin-film resistive grid space debris detection method. Details not described in detail in the encoding-based thin-film resistive grid space debris detection device can be found in the description of the encoding-based thin-film resistive grid space debris detection method described above.

[0080] The preferred embodiments disclosed above are merely illustrative of this specification. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this invention. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize this specification. This specification is limited only by the claims and their full scope and equivalents.

Claims

1. A thin-film resistor network space debris detection circuit based on an encoding method, characterized in that, include: A coded thin-film resistor network consisting of an array of parallel resistive wires arranged orthogonally on both sides is used to generate on / off signals by breaking wires caused by debris impact. A continuity comparison circuit connected to an coded thin-film resistor network is used to convert the continuity state of the resistor wire into a high-level or low-level identification signal. The on / off identification circuit, which is connected to the on / off comparison circuit, is used to acquire the identification signals of each channel in parallel and output the off-line status. In this case, the resistor wires of the coded thin-film resistor network are connected to the signal channels in a grouped cyclic connection method, and the total number of signal channels is less than the total number of resistor wires. The resistive wires of the coded thin-film resistor network are divided into two groups, upper and lower. The upper group has n signal channels and the lower group has m signal channels, and m = n + 2, where m and n are both natural numbers. The upper conductor is divided into m / 2 cyclic groups, each group containing n conductors that are sequentially connected to n signal channels; The lower wires are divided into n / 2 cyclic groups, each group containing m wires that are sequentially connected to m signal channels; There are 24 resistor wires, with the top 12 wires divided into 3 loop groups, each group connecting 4 signal channels; The 12 wires below are divided into two loop groups, each group connecting to 6 signal channels; The total number of signal channels is 10, enabling continuity detection of 24 wires.

2. The circuit according to claim 1, characterized in that: The width and spacing of the resistive wires in the coded thin-film resistor network are both 50 micrometers, with 2000 wires on one side and two sides orthogonally forming an effective detection area of ​​20 cm × 20 cm.

3. The circuit according to claim 1, characterized in that: The on / off comparison circuit includes a voltage divider resistor and a comparator. One end of the voltage divider resistor is connected to the signal channel, and the other end is connected to the power supply voltage. One input of the comparator is connected to the voltage divider node of the signal channel, and the other input is connected to a preset threshold voltage; When the resistor wire connected to the signal channel breaks, the voltage at the voltage divider node exceeds the threshold voltage, and the comparator outputs a high level as a breakage indicator.

4. The circuit according to claim 1, characterized in that: The continuity identification circuit uses an FPGA chip, whose I / O channels are directly connected to the signal channels, enabling it to simultaneously acquire the level status of all signal channels. The FPGA chip identifies a high level as a disconnection state and a low level as an intact state, with a detection cycle of less than 1 microsecond.

5. A method for detecting space debris using a thin-film resistive grid based on an encoding method, characterized in that, The method is implemented based on the circuit according to any one of claims 1 to 4, and the method includes: The specific disconnected resistor wire number is determined based on the disconnection signals of the upper and lower signal channels; When a fragment impact causes an adjacent conductor to break, the impact location is determined by cross-verifying the combination of broken conductors in the upper and lower channels.

6. The method of claim 5, wherein: The impact location was determined by cross-validating the combination of broken wires in the upper and lower channels, including: The X and Y coordinates of the fragment are determined by the intersection of the broken wire signals on both sides; Calculate the dimensions of the fragment in both the X and Y dimensions based on the number of broken wires on both sides.

7. A coded pattern based thin film resistive mesh space debris detection apparatus, said apparatus implemented based on the circuit of any one of claims 1 to 4, characterized in that, include: The determination module is configured to determine the specific disconnected resistor wire number based on the disconnection signals of the upper and lower signal channels; The positioning module is configured to locate the impact position by cross-verifying the combination of broken wires in the upper and lower channels when a debris impact causes an adjacent wire to break.

8. The apparatus of claim 7, wherein: The impact location is determined by cross-validating the combination of broken wires in the upper and lower channels, including: The X and Y coordinates of the fragment are determined by the intersection of the broken wire signals on both sides; Calculate the dimensions of the fragment in both the X and Y dimensions based on the number of broken wires on both sides.

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