固晶机
By separating the die picking and die bonding processes and utilizing the compensation mechanism of the transfer platform and visual inspection mechanism, the problem of insufficient accuracy and stability of the die bonder during long-term operation is solved, achieving a high level of accuracy and stability, and making it suitable for various wafer requirements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NODING INTELLIGENCE
- Filing Date
- 2025-04-21
- Publication Date
- 2026-07-17
AI Technical Summary
The actuators of existing die bonders are difficult to maintain high precision during long-term operation, mainly due to their cumbersome design and complex operating logic, which affects the placement accuracy and stability.
The crystal picking and bonding processes are divided into two independent steps, which are executed separately by the crystal picking mechanism and the crystal bonding mechanism. The operation logic is simplified and the accuracy and stability are improved by the stability of the transfer platform and the compensation mechanism of the vision inspection mechanism.
Despite the limitations of material physical properties, it maintains high-precision operation over long periods, improving placement accuracy and stability, and expanding its application range to meet different wafer requirements.
Smart Images
Figure CN120376459B_ABST