Semiconductor device and manufacturing method thereof

CN120390426APending Publication Date: 2025-07-29SOI MICRO CO LTD
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Patent Information

Application Number
CN202510386222.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-28
Publication Date
2025-07-29

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Abstract

The invention discloses a semiconductor device and a manufacturing method thereof. According to an embodiment, a semiconductor device may include: a channel portion including a core layer having a first doping type and a shell layer having a second doping type opposite to the first doping type stacked on each other; the source / drain parts are arranged on the two opposite sides of the channel part, and the source / drain parts have the first doping type; and a gate stack on the channel portion, in which the channel portion has a shape protruding toward the gate stack.
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