Automatic turntable pick-and-place equipment for semiconductor chip processing

Abstract

The application belongs to the field of semiconductor chip processing, and particularly relates to an automatic swing plate material taking and placing equipment for semiconductor chip processing. The automatic swing plate material taking and placing equipment for semiconductor chip processing with automatic material taking, placing and positioning comprises a mounting plate, a first electric track, a sliding plate, an arc-shaped track and the like. The first electric track is symmetrically arranged on the mounting plate through bolts, the sliding plate is fixed between the sliding blocks of the first electric track through bolts, the arc-shaped track is horizontally arranged on the sliding plate through bolts, and the swing arm is slidably connected to the arc-shaped track. The swing arm can rotate at different angles to realize the functions of material taking, processing and placing. During the material taking process, the placing mechanism can automatically place the material, the material is automatically positioned through the cooperation of the positioning mechanism and the automatic opening mechanism without manual intervention, and after the material processing is completed, the automatic opening mechanism automatically releases the material, and the pushing mechanism lifts the material.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor chip processing, and particularly relates to an automatic chuck loading and unloading device for semiconductor chip processing. Background Technology

[0002] In modern semiconductor manufacturing processes, automated handling of wafers (uncut silicon wafers) and other related materials is a key factor in improving production efficiency and ensuring product quality. Traditional material handling methods typically rely on manual operation or semi-automated systems. These methods are not only inefficient but also prone to introducing human error, leading to inconsistent product quality and even damage to high-value wafer materials.

[0003] During wafer loading and unloading, existing positioning technologies are often not precise enough, requiring manual calibration to ensure correct wafer placement. This manual operation is not only time-consuming but also prone to introducing errors, affecting product consistency and quality.

[0004] Therefore, there is an urgent need to develop an automatic chuck-type material handling equipment for semiconductor chip processing that automatically picks up, places, and positions materials. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, the present invention provides an automatic chuck loading and unloading device for semiconductor chip processing, which automatically picks up, places, and positions materials.

[0006] The technical implementation of the present invention is as follows: an automatic chuck loading and unloading device for semiconductor chip processing, comprising a mounting plate, a first electric track, a sliding plate, an arc track, a swing arm, a rotary motor, and a positioning mechanism. The first electric track is symmetrically arranged vertically on the front center of the mounting plate. The sliding plate is fixed between the sliders of the first electric track. The arc track is horizontally mounted on the sliding plate. The swing arm is slidably connected on the arc track. The end of the swing arm is rotatably connected to the mounting plate. A material placement groove is opened at the top of the swing arm. A rotary motor is fixedly connected to the mounting plate below the swing arm's rotation point. The output shaft of the rotary motor is fixedly connected to the swing arm. A positioning mechanism is provided at the placement groove position of the swing arm. The positioning mechanism includes a clamping plate and a first spring. The clamping plate is symmetrically slidably connected to the swing arm at the placement groove position. The first spring is connected between the clamping plate and the swing arm.

[0007] Optionally, the positioning mechanism also includes a miniature air pump, an air tube, and an airbag. The miniature air pump is fixedly connected to the swing arm below the clamp, and an airbag is provided on the inner side of the clamp. An air tube is connected between the airbag and the adjacent miniature air pump.

[0008] Optionally, it also includes a feeding mechanism. The feeding mechanism is provided on the left side of the mounting plate. The feeding mechanism includes a material frame, a hinge plate, an insert plate, a dual-axis motor, a lead screw, and a connecting rod. The material frame is fixedly connected to the left side of the front side of the mounting plate. The lower left and right sides of the material frame are rotatably equipped with hinge plates. The left and right sides of the hinge plates are provided with slotted holes. The left and right walls of the material frame inside the slotted holes are slidably equipped with insert plates. The upper insert plate is slidably connected to the slotted hole adjacent to it through a shaft. When the hinge plate rotates, it can drive the upper and lower insert plates on the same side to move in opposite directions. The dual-axis motor is fixedly connected to the side of the material frame. The output shaft of the dual-axis motor is connected to a lead screw through a coupling. The end of the lead screw is rotatably connected to the material frame. The lead screw is connected to a connecting rod through a thread. The connecting rod is slidably connected to the material frame. The connecting rod is fixedly connected to the adjacent insert plate.

[0009] Optionally, it also includes an automatic opening mechanism. An automatic opening mechanism is provided between the top of the clamping plate and the lower left and right sides of the front side of the mounting plate. The automatic opening mechanism includes an opening rod and a push block. A push block is provided on the top of the clamping plate, and an opening rod is symmetrically provided on the lower left and right sides of the front side of the mounting plate by bolts.

[0010] Optionally, the support rod is located below the material frame, and the top view of the support rod shows a funnel-shaped cross-section, with the retracted end of the support rod facing the clamping plate.

[0011] Optionally, it also includes a pushing mechanism. A pushing mechanism is provided between the swing arm and the front right side of the mounting plate. The pushing mechanism includes a pad, a second spring, a T-shaped guide rod and a Z-shaped rod. A T-shaped guide rod is vertically slidably provided in the middle of the placement groove of the swing arm. A pad is connected to the top of the T-shaped guide rod. A second spring is connected between the lower part of the T-shaped guide rod and the bottom of the swing arm. A Z-shaped rod is fixedly connected to the mounting plate on the right side of the T-shaped guide rod.

[0012] Optionally, the middle of the Z-shaped bar is an inclined plane that slopes upward to the right.

[0013] Optionally, it also includes a material picking mechanism. The material picking mechanism is fixedly connected to the mounting plate above the Z-shaped rod. The material picking mechanism includes a second electric track, a telescopic cylinder and an electric suction cup. The second electric track is fixedly connected to the mounting plate above the Z-shaped rod. The telescopic cylinder is vertically fixedly connected to the slider of the second electric track. The output end of the bottom of the telescopic cylinder is connected to an electric suction cup.

[0014] This invention has the following advantages: By rotating the swing arm at different angles, it can realize three functions: material picking, processing, and material unloading. During the material picking process, the unloading mechanism can automatically put down the material. Through the cooperation of the positioning mechanism and the automatic spreading mechanism, the material is automatically positioned without manual intervention. After the material is processed, the automatic spreading mechanism automatically releases the material, while the pushing mechanism lifts the material to facilitate material picking. This achieves the functions of automatic material picking, automatic material transportation to the processing work, and automatic material removal after processing. It realizes the integration of material picking, processing, and unloading, improves work efficiency, and reduces labor intensity. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the material handling process of the present invention.

[0016] Figure 2 This is a three-dimensional structural diagram of the material feeding process of the present invention.

[0017] Figure 3 This is a three-dimensional structural diagram of the swing arm movement and rotation component of the present invention.

[0018] Figure 4 This is a three-dimensional structural diagram of the positioning mechanism of the present invention.

[0019] Figure 5 This is a three-dimensional structural diagram of the automatic opening mechanism of the present invention.

[0020] Figure 6 This is a three-dimensional structural diagram of the feeding mechanism of the present invention.

[0021] Figure 7 This is a three-dimensional structural diagram of the feeding mechanism of the present invention.

[0022] Figure 8 This is a three-dimensional structural diagram of the material handling mechanism of the present invention.

[0023] The meanings of the reference numerals in the figure are as follows: 1: Mounting plate, 2: First electric track, 3: Sliding plate, 4: Arc track, 5: Swing arm, 6: Rotary motor, 7: Positioning mechanism, 71: Clamping plate, 72: First spring, 73: Miniature air pump, 74: Air pipe, 75: Airbag, 8: Discharge mechanism, 81: Material frame, 82: Hinge plate, 83: Straight hole, 84: Insert plate, 85: Dual-axis motor, 86: Lead screw, 87: Connecting rod, 9: Automatic opening mechanism, 91: Opening rod, 92: Push block, 10: Pushing mechanism, 1011: Pad block, 1012: Second spring, 1013: T-shaped guide rod, 1014: Z-shaped rod, 11: Picking mechanism, 1101: Second electric track, 1102: Telescopic cylinder, 1103: Electric suction cup. Detailed Implementation

[0024] References to embodiments herein mean that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0025] Example: An automatic chuck loading and unloading device for semiconductor chip processing, such as... Figures 1-4 As shown, the device includes a mounting plate 1, a first electric track 2, a sliding plate 3, an arc track 4, a swing arm 5, a rotary motor 6, and a positioning mechanism 7. The first electric track 2 is symmetrically arranged vertically on the front center of the mounting plate 1 by bolts. The sliding plate 3 is fixed between the sliders of the first electric track 2 by bolts. The first electric track 2 drives the sliding plate 3 to move laterally. The arc track 4 is horizontally mounted on the sliding plate 3 by bolts. The swing arm 5 is slidably connected to the arc track 4. The end of the swing arm 5 is rotatably connected to the mounting plate 1. A material placement groove is opened on the top of the swing arm 5. The rotary motor 6 is fixedly connected to the mounting plate 1 below the rotation point of the swing arm 5 by bolts. The output shaft of the rotary motor 6 is fixedly connected to the swing arm 5. The rotary motor 6 can drive the swing arm 5 to rotate. The positioning mechanism 7 is set at the placement groove of the swing arm 5.

[0026] like Figure 4 As shown, the positioning mechanism 7 includes a clamping plate 71, a first spring 72, a miniature air pump 73, an air tube 74, and an airbag 75. The clamping plate 71 is symmetrically slidably connected to the swing arm 5 at the placement slot position. The first spring 72 is connected between the clamping plate 71 and the swing arm 5. The miniature air pump 73 is fixedly connected to the swing arm 5 below the clamping plate 71 by bolts. An airbag 75 is provided on the inner side of the clamping plate 71. An air tube 74 is connected between the airbag 75 and the adjacent miniature air pump 73. Gas can be injected into the airbag 75 and the gas can be released from the airbag 75 through the miniature air pump 73.

[0027] like Figure 6As shown, it also includes a feeding mechanism 8. The feeding mechanism 8 is provided on the left side of the mounting plate 1. The feeding mechanism 8 includes a material frame 81, a hinge plate 82, an insert plate 84, a dual-axis motor 85, a lead screw 86, and a connecting rod 87. The material frame 81 is fixedly connected to the front left side of the mounting plate 1 by bolts. The lower left and right sides of the material frame 81 are rotatably equipped with hinge plates 82. The left and right sides of the hinge plates 82 are provided with slotted holes 83. The left and right walls of the material frame 81 inside the slotted holes 83 are slidably equipped with insert plates 84. The upper insert plate 84 is slidably connected to the adjacent slotted hole 83 by a shaft. When the hinge plate 82 rotates, it can drive the same... The upper and lower insert plates 84 on one side move in opposite directions. A dual-axis motor 85 is fixedly connected to the side of the material frame 81 by bolts. A lead screw 86 is connected to the output shaft of the dual-axis motor 85 by a coupling. The end of the lead screw 86 is rotatably connected to the material frame 81. A connecting rod 87 is threadedly connected to the lead screw 86. The connecting rod 87 is slidably connected to the material frame 81 and fixedly connected to the adjacent insert plate 84. By controlling the rotation of the dual-axis motor 85, the connecting rod 87 can be moved closer or further apart, causing the upper insert plates 84 to move closer or further apart, and causing the lower insert plates 84 to move closer or further apart.

[0028] like Figure 2 and Figure 5 As shown, it also includes an automatic opening mechanism 9. An automatic opening mechanism 9 is provided between the top of the clamping plate 71 and the lower left and right sides of the front side of the mounting plate 1. The automatic opening mechanism 9 includes an opening rod 91 and a push block 92. A push block 92 is provided on the top of the clamping plate 71. An opening rod 91 is symmetrically provided on the lower left and right sides of the front side of the mounting plate 1 by bolts. The opening rod 91 is below the material frame 81. The top view of the opening rod 91 shows that the cross-section is funnel-shaped. The retracted end of the opening rod 91 faces the clamping plate 71.

[0029] like Figure 7 As shown, it also includes a pushing mechanism 10. The pushing mechanism 10 is provided between the swing arm 5 and the front right side of the mounting plate 1. The pushing mechanism 10 includes a pad 1011, a second spring 1012, a T-shaped guide rod 1013 and a Z-shaped rod 1014. The T-shaped guide rod 1013 is vertically slidably provided in the middle of the placement groove of the swing arm 5. The top of the T-shaped guide rod 1013 is connected to the pad 1011. The upper surface of the pad 1011 is flush with the bottom surface of the placement groove. The lower part of the T-shaped guide rod 1013 is connected to the bottom of the swing arm 5 by the second spring 1012. The Z-shaped rod 1014 is fixedly connected to the mounting plate 1 on the right side of the T-shaped guide rod 1013 by bolts. The middle part of the Z-shaped rod 1014 is an inclined surface that slopes upward to the right.

[0030] like Figure 8As shown, it also includes a material picking mechanism 11. The material picking mechanism 11 is fixedly connected to the mounting plate 1 above the Z-shaped rod 1014 by bolts. The material picking mechanism 11 includes a second electric track 1101, a telescopic cylinder 1102 and an electric suction cup 1103. The second electric track 1101 is fixedly connected to the mounting plate 1 above the Z-shaped rod 1014 by bolts. The telescopic cylinder 1102 is vertically fixedly connected to the slider of the second electric track 1101 by bolts. The output end of the bottom of the telescopic cylinder 1102 is connected to the electric suction cup 1103. The telescopic cylinder 1102 can drive the electric suction cup 1103 to move vertically.

[0031] In use: Place the semiconductor chip to be processed into the material frame 81. Then, the first electric track 2 drives the sliding plate 3 and its upper device to move to the left, causing the push block 92 to move to the left. When the push block 92 moves to the left and contacts the opening rod 91, the push block 92 moves outward and separates under the action of the opening rod 91, causing the clamping plate 71 to move outward. The first spring 72 is compressed. When the placement slot of the swing arm 5 moves to directly below the material frame 81, the first electric track 2 stops working. At this time, the dual-axis motor 85 is controlled to rotate, causing the connecting rods 87 to move closer together, which in turn causes the upper insertion plate 84 to move closer together. The upper insertion plates 84 moving closer together support the material above the bottom semiconductor chip. At the same time, the upper insertion plates 84 are close to each other. At this moment, due to the action of the hinge plate 82, the lower insert plates 84 separate from each other. The lowest semiconductor chip, without the support of the insert plate 84, falls into the placement slot of the swing arm 5. Then, the dual-axis motor 85 is controlled to drive the connecting rod 87 to separate and reset, thereby driving the insert plate 84 to reset. The semiconductor chip falls on the lower insert plate 84. Then, the first electric track 2 drives the sliding plate 3 and its upper device to move to the right to the middle of the mounting plate 1. At this time, the push block 92 leaves the support rod 91, the first spring 72 resets, and drives the clamping plate 71 to move inward to clamp and position the material. If the edge of the material cannot be clamped by a hard object, gas can be injected into the air bag 75 by the micro air pump 73 to inflate the air bag 75 to prevent the material from being crushed.

[0032] When the sliding plate 3 and its upper device move to the middle of the mounting plate 1, the rotary motor 6 is controlled to rotate 90 degrees counterclockwise, causing the swing arm 5 to rotate 90 degrees, conveying the material to the processing work area for processing. After the material processing is completed, the rotary motor 6 is controlled to rotate 90 degrees counterclockwise again. Figure 2The first electric track 2 drives the sliding plate 3 and its upper device to move to the right. During the movement of the sliding plate 3 to the right, the push block 92 contacts the right-side support rod 91, causing the clamping plate 71 to open. Then, the bottom end of the T-shaped guide rod 1013 contacts the upward-sloping surface of the Z-shaped rod 1014, and the T-shaped guide rod 1013 moves upward. The second spring 1012 is compressed, and the upward movement of the T-shaped guide rod 1013 drives the pad block 1011 to move upward, lifting the material. At this time, the telescopic cylinder 1102 is extended, driving the electric suction cup 1103 to move downward to suck up the material. After that, the telescopic cylinder 1102 resets, and then... The telescopic cylinder 1102 is moved to the right to the material discharge position via the second electric track 1101, and the electric suction cup 1103 is stopped. The material is released. At this time, the telescopic cylinder 1102 is reset via the second electric track 1101. At the same time, the sliding plate 3 and its device are moved to the middle of the mounting plate 1 via the first electric track 2. The push block 92 separates from the clamping plate 71, the clamping plate 71 is reset, the T-shaped guide rod 1013 separates from the Z-shaped rod 1014, the T-shaped guide rod 1013 and its device are reset, and then the rotary motor 6 is controlled to rotate 180 degrees clockwise. The above operation is repeated to convey and process the material.

[0033] Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art that various changes or modifications can be made to the invention without departing from the principles and spirit of the invention as defined by the claims. Therefore, the detailed description of the embodiments in this disclosure is for illustrative purposes only and is not intended to limit the invention; rather, the scope of protection is defined by the content of the claims.

Claims

1. An automatic chuck loading and unloading device for semiconductor chip processing, comprising a mounting plate (1), a first electric track (2), a sliding plate (3), an arc track (4), a swing arm (5), a rotary motor (6), and a positioning mechanism (7), wherein the first electric track (2) is symmetrically arranged vertically on the front middle of the mounting plate (1), and the sliding plate (3) is fixed between the sliders of the first electric track (2), characterized in that: A curved track (4) is horizontally installed on the side of the sliding plate (3) away from the first electric track (2). A swing arm (5) is slidably connected on the curved track (4). The end of the swing arm (5) is rotatably connected to the mounting plate (1). A material placement groove is opened on the top of the swing arm (5). A rotary motor (6) is fixedly connected below the rotation point of the swing arm (5) and on the mounting plate (1). The output shaft of the rotary motor (6) is fixedly connected to the rotating part of the swing arm (5). A positioning mechanism (7) is provided at the placement groove position of the swing arm (5). The positioning mechanism (7) includes a clamping plate (71) and a first spring (72). The clamping plate (71) is symmetrically slidably connected on the swing arm (5) at the placement groove position. The first spring (72) is connected between the clamping plate (71) and the swing arm (5). It also includes a feeding mechanism (8). The feeding mechanism (8) is provided on the left side of the mounting plate (1). The feeding mechanism (8) includes a material frame (81), a hinge plate (82), an insert plate (84), a dual-axis motor (85), a lead screw (86), and a connecting rod (87). The material frame (81) is fixedly connected to the left side of the front side of the mounting plate (1). The lower left and right sides of the material frame (81) are rotatably provided with hinge plates (82). The left and right sides of the hinge plates (82) are provided with slotted holes (83). The left and right sides of the material frame (81) and the inside of the slotted holes (83) are slidably provided with insert plates (84). The insert plates (84) are vertically oriented. Two are set, and the upper insert plate (84) and its adjacent slotted hole (83) are slidably connected by a shaft. When the hinge plate (82) rotates, it can drive the upper and lower insert plates (84) on the same side to move in opposite directions. A dual-axis motor (85) is fixedly connected to the side of the material frame (81). A lead screw (86) is connected to the output shaft of the dual-axis motor (85) through a coupling. The end of the lead screw (86) is rotatably connected to the material frame (81). A connecting rod (87) is threadedly connected to the lead screw (86). The connecting rod (87) is slidably connected to the material frame (81). The connecting rod (87) is fixedly connected to its adjacent insert plate (84). It also includes a pushing mechanism (10). The pushing mechanism (10) is provided between the swing arm (5) and the front right side of the mounting plate (1). The pushing mechanism (10) includes a pad (1011), a second spring (1012), a T-shaped guide rod (1013) and a Z-shaped rod (1014). The T-shaped guide rod (1013) is vertically slidably provided in the middle of the placement groove of the swing arm (5). The top of the T-shaped guide rod (1013) is connected to the pad (1011). The lower part of the T-shaped guide rod (1013) is connected to the bottom of the swing arm (5) with the second spring (1012). The Z-shaped rod (1014) is fixedly connected to the mounting plate (1) on the right side of the T-shaped guide rod (1013). It also includes a material picking mechanism (11). The material picking mechanism (11) is fixedly connected to the mounting plate (1) above the Z-shaped rod (1014). The material picking mechanism (11) includes a second electric track (1101), a telescopic cylinder (1102) and an electric suction cup (1103). The second electric track (1101) is fixedly connected to the mounting plate (1) above the Z-shaped rod (1014). The telescopic cylinder (1102) is vertically fixedly connected to the slider of the second electric track (1101). The output end of the telescopic cylinder (1102) is connected to the electric suction cup (1103).

2. The automatic chuck loading and unloading device for semiconductor chip processing according to claim 1, characterized in that: The positioning mechanism (7) also includes a micro air pump (73), an air tube (74) and an air bag (75). The micro air pump (73) is fixedly connected on the swing arm (5) and below the clamp (71). An air bag (75) is provided on the inner side of the clamp (71). An air tube (74) is connected between the air bag (75) and the adjacent micro air pump (73).

3. The automatic chuck loading and unloading device for semiconductor chip processing according to claim 1, characterized in that: It also includes an automatic opening mechanism (9). An automatic opening mechanism (9) is provided between the top of the clamping plate (71) and the lower front side of the mounting plate (1) on both sides. The automatic opening mechanism (9) includes an opening rod (91) and a push block (92). A push block (92) is provided on the top of the clamping plate (71). An opening rod (91) is symmetrically provided on the lower front side of the mounting plate (1) by bolts.

4. An automatic chuck loading and unloading device for semiconductor chip processing according to claim 3, characterized in that: The support rod (91) is below the material frame (81). The top view of the support rod (91) shows a funnel-shaped cross-section, and the retracted end of the support rod (91) faces the clamp (71).

5. An automatic chuck loading and unloading device for semiconductor chip processing according to claim 1, characterized in that: The middle part of the Z-shaped bar (1014) is an inclined plane that slopes upward to the right.

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