A modular heat sink with electromagnetic coupling thermal conduction connection

Abstract

The application discloses a modular radiator of electromagnetic coupling heat conduction connection, and belongs to the technical field of radiators. The whole radiator is composed of a plurality of radiating units. The radiating unit comprises a shell, an electromagnetic coupling connection device located on the side of the shell and a heat conduction medium channel located in the shell. The radiating units are attracted to each other by external magnetic field to realize close and connected adhesion. The application solves the problems of the connection mode of the radiator in the prior art in terms of heat conduction efficiency, installation and maintenance convenience and reliability, and meets the heat dissipation demand of a large-area heat exchange area.

Description

Technical Field

[0001] This invention relates to the field of radiator design and manufacturing technology, and more specifically, to a modular radiator for electromagnetic coupling heat conduction connection in a large area heat exchange region. Background Technology

[0002] In the operation of modern industrial and electronic equipment, such as server clusters in large data centers, large transformers in power systems, and electronic equipment in the aerospace field, a large amount of heat is generated. To ensure the stable operation and performance of these devices, efficient heat dissipation is required for these large heat-generating areas. Traditional heat sink connection methods mainly include mechanical connections (such as bolted connections and snap-fit ​​connections) and welding connections. Although mechanical connections are convenient for installation and disassembly, the contact thermal resistance at the connection points is relatively large, affecting the heat transfer efficiency; moreover, under long-term vibration or impact environments, the connection is prone to loosening, leading to a decrease in heat dissipation performance. While welding connections can ensure good heat conduction performance, the installation process is complex, making it inconvenient for later maintenance and module replacement; if a unit fails, the entire heat sink may need to be scrapped, resulting in resource waste and increased costs. Therefore, existing heat sink connection methods have shortcomings in terms of heat conduction efficiency, ease of installation and maintenance, and reliability, and cannot well meet the heat dissipation requirements of large heat exchange areas. Innovative heat sink design methods urgently need to address these challenges. Summary of the Invention

[0003] The present invention provides a modular heat sink with electromagnetic coupling and thermal conduction connection, which aims to solve the problems of high difficulty in the production and installation of large-size heat sinks and high equipment requirements.

[0004] The technical solution provided by this invention is as follows:

[0005] A modular heat sink with electromagnetic coupling and thermal conduction connection includes one or more heat dissipation units. The heat dissipation unit includes a housing, an electromagnetic coupling connection device located on the side of the housing, and a thermal conduction medium channel located inside the housing.

[0006] When adjacent heat sink units approach each other, the electromagnetic coupling elements on the heat sink units generate a magnetic force that attracts each other through the action of an external magnetic field, achieving a tight fit and connection. Furthermore, the magnetic field interaction between the electromagnetic coupling elements generates eddy currents inside the heat sink units to promote heat conduction.

[0007] The heat conduction medium channel is used to transport coolant, and has a heat dissipation fin structure inside to enhance the heat dissipation capacity of the radiator.

[0008] The electromagnetic coupling element is made of high-temperature resistant, high-performance magnetic material. The external magnetic field is generated by an external magnetic field generator, which can adjust the strength and direction of the magnetic field.

[0009] The modular heat sink also includes an intelligent control system, which includes a temperature sensor and a controller. The temperature sensor can monitor the unit temperature in real time and transmit the signal to the controller. The controller can adjust the strength and direction of the external magnetic field according to a preset temperature threshold, thereby changing the electromagnetic coupling strength between units and ensuring that the units operate at a suitable temperature.

[0010] Beneficial effects:

[0011] 1. This invention provides a modular heat sink with electromagnetic coupling and heat conduction connection, comprising one or more heat dissipation units. Each heat dissipation unit includes a housing, an electromagnetic coupling connection device located on the side of the housing, and a heat conduction medium channel located inside the housing. This application, through modular design, addresses the shortcomings of existing large-area heat sinks in terms of heat conduction efficiency, ease of installation and maintenance, and reliability.

[0012] 2. The modular heat sink with electromagnetic coupling heat conduction connection described in this invention can be assembled into heat sink arrays of different shapes and sizes through electromagnetic coupling connection devices, which can adapt to different heat dissipation needs and large heat exchange areas.

[0013] 3. The electromagnetic coupling connection method between the modular heat sink heat dissipation units of the electromagnetic coupling heat conduction connection described in this invention has the characteristics of no mechanical wear, no contact resistance, and resistance to vibration and impact. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a modular heat sink structure with electromagnetic coupling and thermal conduction connection proposed in this invention.

[0016] Figure 2 This is a main body diagram of a single heat dissipation unit of a modular heat sink with electromagnetic coupling and thermal conduction connection proposed in this invention.

[0017] Figure 3 This is a top view of a single heat dissipation unit of a modular heat sink with electromagnetic coupling and thermal conduction connection proposed in this invention.

[0018] Figure 4This is a side view of a single heat dissipation unit of a modular heat sink with electromagnetic coupling and thermal conduction connection proposed in this invention.

[0019] Figure 5 This is a cross-sectional view of a single heat dissipation unit of a modular heat sink with electromagnetic coupling and thermal conduction connection proposed in this invention.

[0020] Figure 6 This is a schematic diagram of an electromagnetic coupling element for a modular heat sink with electromagnetic coupling thermal conduction connection proposed in this invention.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1. Housing; 2. Electromagnetic coupling connection device; 3. External magnetic field generating device; 4. Coolant inlet pipe; 5. Coolant outlet pipe; 6. Heat dissipation unit; 7. Cover plate; 8. Heat conduction medium channel; 9. Intelligent control system. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the embodiments described are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] Reference Figure 1 As shown, this embodiment provides a modular heat sink with electromagnetic coupling and thermal conduction connection. The heat sink includes multiple independent heat dissipation units 6, which are arrayed and interconnected.

[0025] Reference Figure 2-4 As shown, the heat dissipation unit 6 in this embodiment includes a housing 1, an electromagnetic coupling connection device 2 outside the housing, a coolant inlet pipe 4, and a coolant outlet pipe 5. The housing, coolant inlet pipe, and coolant outlet pipe are manufactured using an integrated molding process. The electromagnetic coupling connection device is fixed to the outside of the coolant inlet and outlet pipes by welding. After the heat dissipation unit housing is connected by the electromagnetic coupling connection device, the coolant flows through each heat dissipation unit through the inlet and outlet pipes.

[0026] Reference Figure 5 As shown, the heat dissipation unit 6 in this embodiment has a heat conduction medium channel 8 inside, and an intelligent control system 9 is provided near the fluid outlet.

[0027] Reference Figure 6 As shown, the electromagnetic coupling connection device 2 described in this embodiment is equipped with an external magnetic field generator 3.

[0028] In this embodiment, the heat dissipation units are connected in series or in parallel through an electromagnetic coupling connection device. The electromagnetic coupling connection device 2 is equipped with an external magnetic field generator. The external magnetic field generator generates an external magnetic field, which causes the electromagnetic coupling elements on the heat dissipation unit to generate a magnetic force that attracts each other, thereby achieving a tight fit connection.

[0029] In this embodiment, the coolant inlet pipe 4 and the coolant outlet pipe 5 are interconnected so that the coolant flows into the heat dissipation unit 6. Multiple heat dissipation unit interfaces can be connected and used simultaneously as needed. Unused fluid inlet and outlet interfaces are sealed with cover plates 7, which is simple, convenient and can meet a variety of usage requirements.

[0030] In this embodiment, the cover plate 7 is fixed to the heat dissipation unit interface by welding or detachable bolts.

[0031] Specifically, the heat dissipation units 6 are magnetically coupled to each other. The external magnetic field generator 3 is activated, and the strength and direction of the magnetic field are adjusted to attract the electromagnetic coupling elements on the modules, achieving a tight connection between the modules. During the assembly process, it is important to check whether the contact surfaces between the modules are flat and tight. If there are gaps or unevenness, adjustments should be made promptly.

[0032] Connect the coolant circulation system, inject coolant into the heat transfer medium channel 8, check the coolant circulation, and ensure that the coolant can flow normally without leakage.

[0033] During system operation, the temperature sensors in the intelligent control system 9 monitor the temperature of each module in real time and transmit the temperature signals to the controller. The controller automatically adjusts the strength and direction of the external magnetic field based on the temperature signals to ensure the stable operation and efficient heat dissipation of the radiator system.

[0034] In use, this invention presets parameters such as temperature thresholds in the intelligent control system based on the device's heat generation. Simultaneously, an external magnetic field generator is activated, producing a magnetic field that attracts the magnetic materials on adjacent heat dissipation units, enabling rapid assembly and tight connection of the modules. During operation, thermistor temperature sensors distributed in each heat dissipation unit monitor the module temperature in real time and transmit the temperature signal to the controller. Upon receiving the temperature signal, the controller compares it with the preset temperature threshold, adjusts the electromagnetic coupling strength and coolant flow rate of the modules, and adjusts the number of heat dissipation units according to heat dissipation requirements.

[0035] It should be understood that some technical terms that may be used in the description of this application, such as "top," "around," "bottom," "center," "inner," and "outer," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this application. In summary, the above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A modular heat sink with electromagnetic coupling and thermal conduction connection, characterized in that: The radiator is composed of several heat dissipation units, which are connected by magnetic force. Each heat dissipation unit includes a housing, an electromagnetic coupling connection device located on the side of the housing, and a heat conduction medium channel located inside the housing. The electromagnetic coupling connection device, through the action of an external magnetic field, causes the electromagnetic coupling elements on the heat dissipation unit to generate a magnetic force that attracts each other, thereby achieving a tight connection between the heat dissipation units. Furthermore, the magnetic field interaction between the electromagnetic coupling elements generates eddy currents inside the heat dissipation unit to promote heat conduction. The electromagnetic coupling connection device is equipped with an external magnetic field generator. The external magnetic field is generated by an external magnetic field generator, which can adjust the strength and direction of the magnetic field. The modular heat sink also includes an intelligent control system, which includes a temperature sensor and a controller. The controller receives the temperature signal transmitted by the temperature sensor and adjusts the strength and direction of the external magnetic field according to a preset temperature threshold to control the electromagnetic coupling strength and heat conduction efficiency between the heat sink units.

2. The modular heat sink with electromagnetic coupling thermal conduction connection according to claim 1, characterized in that: The heat conduction medium channel transmits coolant and has a heat dissipation fin structure inside.

3. The modular heat sink with electromagnetic coupling thermal conduction connection according to claim 1, characterized in that: The electromagnetic coupling element is made of high-temperature resistant, high-performance magnetic material.

4. The modular heat sink with electromagnetic coupling thermal conduction connection according to claim 3, characterized in that: The magnetic material is typically a high-temperature resistant samarium cobalt permanent magnet or a ferrite permanent magnet.

5. The modular heat sink with electromagnetic coupling thermal conduction connection according to claim 1, characterized in that: When the temperature of a certain unit exceeds a threshold, the intelligent control system will increase the electromagnetic coupling strength of that unit and increase the coolant flow rate to reduce the unit temperature.

6. A modular heat sink with electromagnetic coupling thermal conduction connection according to claim 1, characterized in that: The heat dissipation units are assembled into arrays of different numbers and sizes of heat dissipation units through an electromagnetic coupling connection device to meet different heat dissipation requirements and large heat exchange areas.

7. A modular heat sink with electromagnetic coupling thermal conduction connection according to claim 1, characterized in that: The electromagnetic coupling connection between the heat dissipation units has the characteristics of no mechanical wear, no contact resistance, and resistance to vibration and impact.

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