Chip detection and sorting equipment for an oven intelligent timer and a process thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- YANGZHOU BAOAMAC ELECTRONICS
- Filing Date
- 2025-05-23
- Publication Date
- 2026-08-07
AI Technical Summary
[0005]作为本发明的进一步改进,为了解决传统移栽装置仅能直线移动、无法精准定位不同上料位置的问题,提升芯片移栽的灵活性与定位精度;所述芯片移栽装置包括安装块、滑块、连接组件、驱动电机组件和吸盘;所述安装块固定安装于设备箱体上,所述滑块设置于安装块的上端,所述连接组件安装在滑块上;所述驱动电机组件设置于连接组件上,所述驱动电机组件与滑块相连接;所述吸盘设置于连接组件的下端,所述滑块在安装块上进行水平滑动,带动吸盘准确移动至芯片上料装置的上方吸取芯片并将芯片移栽至检测旋转平台的芯片放置槽中
[0010] One beneficial effect of this invention is that: by using a dual-sided synchronous detection system, combined with corresponding detection devices on the upper and lower surfaces and a dual-camera structure that slides in opposite directions, comprehensive defect identification of the upper and lower surfaces of the chip is achieved, completely eliminating the risk of missed detection; the automated tray supply and transfer system monitors the number of trays in real time through sensors, and, in conjunction with a servo motor-driven precision positioning mechanism, achieves unmanned operation of automatic supply of empty trays and classification and transfer of full trays, significantly reducing manual intervention; the high-precision tray transfer device utilizes multi-layer slide rails and a tray gripping mechanism with a rotating function, and achieves precise transfer and attitude adjustment of trays between multiple workstations through a servo motor and a rotary cylinder assembly; the gripping robot automatically sorts chips to corresponding trays according to the detection results, and the entire process is integrated and scheduled by the control system, realizing unmanned operation from chip loading to sorting completion, significantly improving production efficiency, detection accuracy and equipment compatibility, effectively reducing labor costs and ensuring product quality.
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Figure CN120421237B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of automated testing equipment technology, and in particular to a chip-based testing and sorting device for an oven intelligent timer and its process. Background Technology
[0002] In the production process of oven smart timer chips, chip inspection and sorting are crucial steps to ensure product quality. Traditional chip inspection and sorting equipment typically suffers from the following shortcomings: First, low automation, requiring manual intervention in chip loading, transfer, and tray replacement, leading to low production efficiency and susceptibility to human error; second, limited inspection capabilities, only able to inspect a single surface of the chip, making comprehensive defect identification difficult; third, reliance on manual tray management, with untimely empty tray supply and delayed full tray transfer resulting in long downtime and impacting production continuity; furthermore, insufficient sorting accuracy, lacking intelligent inspection result analysis and automated sorting control, easily leading to the mixing of qualified and unqualified chips. Therefore, there is an urgent need for a highly integrated, high-precision, comprehensive, and fully automated chip inspection and sorting equipment and process to meet the chip quality control requirements of oven smart timer production lines. Summary of the Invention
[0003] To address some of the problems existing in the prior art, this invention provides a chip detection and sorting device for an oven's intelligent timer. Through highly integrated design, this device achieves full automation of chip detection and sorting, significantly improving production efficiency and detection accuracy.
[0004] To achieve the above objectives, the present invention provides a chip detection and sorting device for an oven intelligent timer, comprising a device housing and a chip tray. The bottom of the device housing is fitted with multiple stabilizing feet and casters. The device housing is equipped with a detection rotating platform and a sorting rotating platform, each with a uniformly arranged chip placement slot and a tray placement slot. A chip loading device is located at the outer end of the detection rotating platform, and a chip transfer device is correspondingly located at the side end of the chip loading device for transferring chips from the corresponding loading device to the detection rotating platform. The device housing also includes a chip surface defect detection device and a chip... The system includes an under-chip surface defect detection device and detection holes; the chip upper surface defect detection device is positioned above the detection rotating platform and is used to detect defects on the upper surface of the chip; the chip lower surface defect detection device is positioned below the detection rotating platform, and the chip lower surface defect detection device can detect defects on the lower surface of the chip through the detection holes; a gripping robot is installed between the detection rotating platform and the sorting rotating platform to grip the inspected chips onto the sorting rotating platform; a tray supply device is installed on the side of the sorting rotating platform to supply empty trays to the tray placement slot; the equipment housing is also equipped with a tray transfer device and a non-conforming chip tray placement device. The sorting and rotating platform includes a tray placement station for qualified chips and a tray transfer device positioned above the tray supply device, a tray placement station for defective chips, and a tray placement station for qualified chips. The chip upper surface defect detection device and the chip lower surface defect detection device have identical structures and are arranged vertically, including a connecting block, a connecting vertical plate, and a horizontal guide rail. The connecting block is fixedly mounted on the equipment housing, and the connecting vertical plate is connected to the connecting block. Multiple horizontal guide rails are mounted on the connecting vertical plate and are parallel to each other. A first vertical plate and a second vertical plate are mounted on the horizontal guide rails, and the first and second vertical plates are respectively... A first detection camera and a second detection camera are installed accordingly; a first drive motor and a second drive motor are also provided on the connecting vertical plate, and the first drive motor and the second drive motor are respectively connected to the first vertical plate and the second vertical plate; the first drive motor and the second drive motor respectively drive the first vertical plate and the second vertical plate to slide in opposite directions on the horizontal guide rail, thereby driving the first detection camera and the second detection camera to move synchronously and detect different positions on the upper and lower surfaces of the chip; a through hole is provided through the middle of the chip placement slot, and the range of the through hole is larger than the chip to be detected range; the outer edge of the chip is placed on the chip placement slot and the part of the chip to be detected is embedded in the through hole.
[0005] As a further improvement of the present invention, in order to solve the problem that traditional transfer devices can only move in a straight line and cannot accurately position different loading positions, and to improve the flexibility and positioning accuracy of chip transfer, the chip transfer device includes a mounting block, a slider, a connecting component, a drive motor assembly, and a suction cup; the mounting block is fixedly mounted on the equipment housing, the slider is located at the upper end of the mounting block, and the connecting component is mounted on the slider; the drive motor assembly is located on the connecting component and is connected to the slider; the suction cup is located at the lower end of the connecting component, and the slider slides horizontally on the mounting block, driving the suction cup to accurately move above the chip loading device to pick up the chip and transfer the chip to the chip placement slot of the detection rotating platform.
[0006] As a further improvement of the present invention, in order to expose the chips layer by layer to the pick-up position and realize automatic continuous chip feeding, thereby improving feeding efficiency and stability, the chip feeding device includes an internal upper lifting mechanism; the upper lifting mechanism includes a base plate on which an electric push rod assembly is mounted; a U-shaped plate is mounted on the electric push rod assembly, and a connecting plate is connected to the output end of the electric push rod assembly; a plurality of connecting optical rods are mounted at the lower end of the connecting plate, the connecting optical rods passing through the U-shaped plate and having a limit block installed at their ends; the connecting plate moves upward through the electric push rod assembly, lifting the chips upward one by one, facilitating the pick-up of the chips by the suction cup; the limit block at the end of the connecting optical rod is used to limit the movement distance of the connecting optical rod on the U-shaped plate.
[0007] As a further improvement of the present invention, in order to simultaneously process multi-station trays and achieve precise transfer of trays between multiple stations, thereby improving the flexibility and efficiency of tray transfer, the tray transfer device includes a first connecting block and a second connecting block. The lower ends of both the first and second connecting blocks are provided with multiple support columns, which are then fixed to the equipment housing. The first and second connecting blocks are symmetrically arranged, and a second slide rail is provided on the inner side of each block. A third connecting block and a fourth connecting block are mounted on the second slide rail, and the third and fourth connecting blocks can move horizontally on the second slide rail. Each of the third and fourth connecting blocks is provided with a first slide rail and a third slide rail, which are parallel to each other. A tray gripping mechanism is provided on both the first and third slide rails, and the tray gripping mechanism can move horizontally on the first and third slide rails.
[0008] As a further improvement of the present invention, in order to enable the material tray to be adjusted in height and angle during the handling process, ensuring adaptation to different workstation angles and improving the accuracy of material tray placement, the material tray gripping mechanism includes a stabilizing mounting block. One end of the stabilizing mounting block is connected to a first connecting side plate. Both the stabilizing mounting block and the first connecting side plate are provided with mounting sliders, which are connected to a first slide rail and a third slide rail. The other end of the stabilizing mounting block is provided with multiple vertical guide rails, on which a second connecting side plate is clamped. The stabilizing mounting block is also provided with a servo motor, which drives the second connecting side plate to move up and down on the vertical guide rails. The second connecting side plate is also provided with a rotary cylinder assembly, and a vacuum suction cup assembly is installed at the lower end of the rotary cylinder assembly. Multiple connecting vertical rods are provided between the second connecting side plate and the vacuum suction cup assembly. The second connecting side plate is driven by the servo motor to move the vacuum suction cup assembly up and down to different heights. The vacuum suction cup assembly can be rotated by the rotary cylinder assembly, causing the material tray to rotate synchronously, facilitating accurate placement of the material tray at the designated position.
[0009] As a further improvement of the present invention, in order to realize automatic replenishment and quantity management of empty trays and ensure the continuity of the sorting process, the tray supply device includes a base plate, on which a vertical mounting connecting plate is provided; multiple tray support guide rails are arranged in parallel on the vertical mounting connecting plate, and tray supports are clamped on the tray support guide rails; a driving component is also provided on the base plate, and the tray supports can move up and down on the tray support guide rails through the driving component; a lower limit block is provided at the bottom end of the tray support guide rails to limit the lowest position of the tray supports; multiple sensors are also provided on the side end of the vertical mounting connecting plate, and the number of trays is detected by the sensors.
[0010] One beneficial effect of this invention is that: by using a dual-sided synchronous detection system, combined with corresponding detection devices on the upper and lower surfaces and a dual-camera structure that slides in opposite directions, comprehensive defect identification of the upper and lower surfaces of the chip is achieved, completely eliminating the risk of missed detection; the automated tray supply and transfer system monitors the number of trays in real time through sensors, and, in conjunction with a servo motor-driven precision positioning mechanism, achieves unmanned operation of automatic supply of empty trays and classification and transfer of full trays, significantly reducing manual intervention; the high-precision tray transfer device utilizes multi-layer slide rails and a tray gripping mechanism with a rotating function, and achieves precise transfer and attitude adjustment of trays between multiple workstations through a servo motor and a rotary cylinder assembly; the gripping robot automatically sorts chips to corresponding trays according to the detection results, and the entire process is integrated and scheduled by the control system, realizing unmanned operation from chip loading to sorting completion, significantly improving production efficiency, detection accuracy and equipment compatibility, effectively reducing labor costs and ensuring product quality.
[0011] As a further improvement of the present invention, in order to achieve efficient and accurate operation of chip detection and sorting, the present invention also provides a process for a chip detection and sorting device for an oven intelligent timer. The process is designed with full automation and includes the following steps: Step 1: Chip loading. The internal lifting mechanism of the chip loading device is activated, and the electric push rod assembly on its base plate pushes the connecting plate upward to lift the chip. The limiting block at the end of the connecting rod restricts the movement distance, so that the chips are exposed in sequence at the loading position, waiting for transplanting. Step 2: Chip transfer. The chip transfer device uses the slider on the mounting block and the connecting component to drive the slider to slide horizontally through the drive motor component, which moves the suction cup to the top of the chip loading device to pick up the chip and then transfer it to the chip placement slot of the detection rotating platform. Step 3: Chip Inspection. The rotating inspection platform rotates, causing the chip to pass sequentially through the upper chip surface defect inspection device and the lower chip surface defect inspection device. The first and second drive motors of the upper chip surface defect inspection device drive the first and second vertical plates to slide opposite each other on the horizontal guide rail connecting the vertical plates, causing the first and second inspection cameras to move synchronously and perform multi-angle inspection of the upper chip surface. The lower chip surface defect inspection device performs synchronous inspection of the lower chip surface through the inspection holes, completing omnidirectional defect identification. Step 4: Empty tray supply and transfer. The drive component of the tray supply device drives the tray support to move up and down on the tray support guide rail on the vertical mounting plate of the base plate. The sensor detects the number of trays and supplies empty trays to the sorting rotary platform. The tray gripping mechanism of the tray transfer device moves horizontally on the first, second, and third slide rails through the mounting slider. The servo motor drives the second connecting side plate to move up and down on the vertical guide rail of the stable mounting block, so that the vacuum suction cup assembly reaches the target tray position and transfers the empty trays to the tray placement slot of the sorting rotary platform in sequence. Step 5: Chip sorting and transfer. Based on the test results, the gripping robot picks up qualified chips and places them onto the empty trays in the corresponding tray placement slots of the qualified chip tray placement station on the sorting rotating platform. Unqualified chips are picked up onto the empty trays in the corresponding tray placement slots of the unqualified chip tray placement station. Then, the rotating cylinder assembly drives the vacuum suction cup assembly to rotate and transfer the trays filled with chips from the sorting rotating platform to the corresponding unqualified chip tray placement station or qualified chip tray placement station, completing the entire process of testing and sorting chips for the oven's intelligent timer.
[0012] Another beneficial effect of this invention is that: in the chip loading stage, the coordinated action of the electric push rod assembly and the limiting block of the upper mechanism achieves the sequential and stable exposure of chips, avoiding the lag and error of manual replenishment, and laying the foundation for subsequent transfer; in the chip transfer stage, a combined motion mechanism of slider drive and rotary assembly is adopted to ensure accurate transfer of chips to the inspection station, improving transfer efficiency and positioning accuracy; in the chip inspection step, a double-sided synchronous inspection system is used to take multi-angle pictures of the upper and lower surfaces of the chip using opposing sliding dual inspection cameras, combined with the inspection hole design to achieve all-round defect identification, improving inspection efficiency; in the empty tray supply and transfer step, a tray gripping mechanism driven by sensors and servo motors is used to achieve automatic supply of empty trays and accurate classification and storage of full trays; finally, in the chip sorting step, relying on the coordination of the gripping robot and the rotary cylinder assembly, qualified and unqualified products are placed into the corresponding trays according to the inspection results, and automated unloading is completed by the tray transfer device. The entire process forms a closed-loop control, which significantly reduces the need for manual intervention and the risk of product omission while improving production efficiency.
[0013] In operation, the present invention firstly involves the upper lifting mechanism inside the chip loading device pushing the connecting plate upwards to lift the chip via an electric push rod assembly. A limiting block at the end of the connecting rod restricts the movement distance, exposing the chips sequentially to the loading position. Subsequently, the chip transfer device utilizes a slider on the mounting block in cooperation with the connecting assembly. A drive motor assembly drives the slider to slide horizontally, while the connecting assembly moves a suction cup above the loading device to pick up the chip, which is then transferred to the chip placement slot on the rotating inspection platform. Next, the rotating inspection platform rotates, causing the chip to pass sequentially through the upper chip surface defect detection device and the lower chip surface defect detection device. The first and second drive motors of the upper chip surface defect detection device drive the first and second vertical plates to slide opposite each other on the transverse guide rail connecting the vertical plates, causing the first and second inspection cameras to move synchronously, performing multi-angle inspection of the chip surface. The lower chip surface defect detection device performs synchronous inspection of the chip surface through inspection holes, completing omnidirectional defect identification. Then, the material tray is supplied... The device's drive assembly moves the tray support up and down on the tray support guide rail on the vertical mounting plate of the base plate. Sensors detect the number of trays and supply empty trays to the sorting rotary platform. The tray gripping mechanism of the tray transfer device moves horizontally on the first, second, and third slide rails via a mounting slider. A servo motor drives the second connecting side plate up and down on the vertical guide rail of the stable mounting block, allowing the vacuum suction cup assembly to reach the target tray position and sequentially transfer the empty trays to the tray placement slots of the sorting rotary platform. Finally, based on the detection results, the gripping robot grabs qualified chips onto the empty trays in the tray placement slots corresponding to the qualified chip tray placement positions on the sorting rotary platform, and grabs unqualified chips onto the empty trays in the tray placement slots corresponding to the unqualified chip tray placement positions. The rotary cylinder assembly drives the vacuum suction cup assembly to rotate and transfer the chip-filled trays from the sorting rotary platform to the corresponding unqualified chip tray placement positions or qualified chip tray placement positions, completing the entire process of detecting and sorting chips for the oven's intelligent timer. Attached Figure Description
[0014] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention.
[0015] Figure 2 This is a top view of the present invention.
[0016] Figure 3 This is a schematic diagram of the chip transfer device in this invention.
[0017] Figure 4 This is a schematic diagram of the upper lifting mechanism in this invention.
[0018] Figure 5This is a schematic diagram of the chip surface defect detection device of the present invention.
[0019] Figure 6 This is a schematic diagram of the material tray transfer device in this invention.
[0020] Figure 7 This is a schematic diagram of the material tray gripping mechanism in this invention.
[0021] Figure 8 This is a schematic diagram of the material tray supply device in this invention.
[0022] Figure 9 This is a schematic diagram of the process flow of the present invention.
[0023] The components include: 1. Equipment housing; 2. Chip transfer device; 201. Mounting block; 202. Slider; 203. Connecting assembly; 204. Drive motor assembly; 205. Suction cup; 3. Chip loading device; 301. Base plate; 302. Electric push rod assembly; 303. U-shaped plate; 304. Connecting rod; 305. Limiting block; 306. Connecting plate; 4. Stabilizing column feet; 5. Casters; 6. Detection rotating platform; 7. Chip placement slot; 8. Chip upper surface defect detection device; 801. Connecting block; 802. Connecting vertical plate; 803. First drive motor; 804. Second drive motor; 805. Horizontal guide rail; 806. Second vertical plate; 807. Second detection camera; 808. First vertical plate; 809. First detection camera; 9. Chip lower surface defect detection device; 10. Detection hole; 11. Gripping robot; 12. Material tray transfer device; 121. Support column; 12. 2 First connecting block, 123 Second connecting block, 124 Third connecting block, 125 Fourth connecting block, 126 First slide rail, 127 Second slide rail, 128 Third slide rail, 129 Tray gripping mechanism, 1291 Stable mounting block, 1292 First connecting side plate, 1293 Mounting slider, 1294 Vertical guide rail, 1295 Rotary cylinder assembly, 1296 Second connecting side plate, 1297 Connecting vertical rod, 1298 Vacuum suction cup assembly, 1299 Servo motor, 13 Unqualified chip tray placement station, 14 Sorting rotary platform, 15 Tray placement slot, 16 Tray supply device, 161 Base plate, 162 Vertical mounting connecting plate, 163 Tray bracket guide rail, 164 Tray bracket, 165 Drive assembly, 166 Lower limit block, 167 Sensor, 17 Qualified chip tray placement station. Detailed Implementation
[0024] To enable those skilled in the art to better understand the technical solutions in this application, the following description is provided in conjunction with the appendix. Figure 1-9 The present invention will be further described below. The following embodiments are only used to illustrate the technical solutions of the present invention more clearly, and should not be used to limit the scope of protection of the present invention.
[0025] As shown in the figure, a chip detection and sorting device for an oven's intelligent timer includes a device housing 1 and a tray for holding chips. The bottom of the device housing 1 is fitted with multiple stabilizing feet 4 and casters 5. The device housing 1 is equipped with a detection rotating platform 6 and a sorting rotating platform 14, each with a uniformly arranged chip placement slot 7 and tray placement slot 15. A chip loading device 3 is located at the outer end of the detection rotating platform 6, and a chip transfer device 2 is correspondingly located at the side end of the chip loading device 3 for transferring chips from the corresponding loading device to the detection rotating platform 6. The device housing 1 also includes a chip upper surface defect detection device 8 and a chip lower surface defect detection device 8. The system includes a detection device 9 and a detection hole 10; the chip upper surface defect detection device 8 is located above the detection rotating platform 6 and is used to detect defects on the upper surface of the chip; the chip lower surface defect detection device 9 is located below the detection rotating platform 6 and can detect defects on the lower surface of the chip through the detection hole 10; a gripping robot 11 is provided between the detection rotating platform 6 and the sorting rotating platform 14 to grip the detected chips onto the sorting rotating platform 14; a tray supply device 16 is provided on the side of the sorting rotating platform 14 to supply empty trays to the tray placement slot 15; the equipment housing 1 is also equipped with a tray transfer device 12 and a non-conforming chip tray placement device. Position 13 and qualified chip tray placement station 17; the tray transfer device 12 is set above the sorting rotary platform 14 and is used to transfer the tray between the tray supply device 16, the unqualified chip tray placement station 13 and the qualified chip tray placement station 17; the chip upper surface defect detection device 8 and the chip lower surface defect detection device 9 have the same structure and are arranged vertically and vertically, including a connecting block 801, a connecting vertical plate 802 and a horizontal guide rail 805; the connecting block 801 is fixedly installed on the equipment housing 1, and the connecting vertical plate 802 is connected to the connecting block 801; the horizontal guide rail 805 is installed on the connecting vertical plate 802, and multiple horizontal guide rails 805 are arranged and are parallel to each other; on the horizontal guide rail 805 The chip is equipped with a first vertical plate 808 and a second vertical plate 806, on which a first detection camera 809 and a second detection camera 807 are respectively mounted. A first drive motor 803 and a second drive motor 804 are also provided on the connecting vertical plate 802, and are respectively connected to the first vertical plate 808 and the second vertical plate 806. The first drive motor 803 and the second drive motor 804 drive the first vertical plate 808 and the second vertical plate 806 to slide opposite each other on the horizontal guide rail 805, thereby causing the first detection camera 809 and the second detection camera 807 to move synchronously and detect different positions on the upper and lower surfaces of the chip.A through hole is provided through the center of the chip placement slot 7, and the range of the through hole is larger than the chip to be tested range; the outer edge of the chip is placed on the chip placement slot 7 and the chip to be tested portion is embedded in the through hole; the chip transfer device 2 includes a mounting block 201, a slider 202, a connecting component 203, a drive motor assembly 204, and a suction cup 205; the mounting block 201 is fixedly mounted on the device housing 1, the slider 202 is disposed at the upper end of the mounting block 201, and the connecting component 203 is mounted on the slider 202; the drive motor assembly 204 is disposed on the connecting component 203 and is connected to the slider 202; the suction cup 205... 05 is located at the lower end of the connecting component 203. The slider 202 slides horizontally on the mounting block 201, driving the suction cup 205 to accurately move above the chip loading device 3 to pick up the chip and transfer the chip to the chip placement slot 7 of the detection rotating platform 6. The chip loading device 3 includes an internal upper lifting mechanism. The upper lifting mechanism includes a base plate 301, on which an electric push rod assembly 302 is mounted. A U-shaped plate 303 is mounted on the electric push rod assembly 302, and a connecting plate 306 is connected to the output end of the electric push rod assembly 302. A plurality of connecting light rods 304 are mounted at the lower end of the connecting plate 306, and the connecting light rods 304 pass through... A U-shaped plate 303 is provided with a limiting block 305 installed at its end; the connecting plate 306 moves upward via an electric push rod assembly 302, pushing the chips upward in sequence to facilitate the suction cup 205 to pick up the chips; the limiting block 305 at the end of the connecting rod 304 is used to limit the movement distance of the connecting rod 304 on the U-shaped plate 303; the material tray transfer device 12 includes a first connecting block 122 and a second connecting block 123, the lower ends of the first connecting block 122 and the second connecting block 123 are provided with multiple support columns 121 and are fixed to the equipment housing 1 by the support columns 121; the first connecting block 122 and the second connecting block 123 are symmetrically arranged, the first connecting block A second slide rail 127 is provided on the inner side of both the first and second connecting blocks 122 and 123; a third connecting block 124 and a fourth connecting block 125 are mounted on the second slide rail 127, and the third connecting block 124 and the fourth connecting block 125 can move horizontally on the second slide rail 127; a first slide rail 126 and a third slide rail 128 are provided on the third connecting block 124 and the fourth connecting block 125, and the first slide rail 126 and the third slide rail 128 are parallel to each other; a material tray gripping mechanism 129 is provided on the first slide rail 126 and the third slide rail 128, and the material tray gripping mechanism 129 can move horizontally on the first slide rail 126 and the third slide rail 128;The material tray gripping mechanism 129 includes a stabilizing mounting block 1291. One end of the stabilizing mounting block 1291 is connected to a first connecting side plate 1292. Both the stabilizing mounting block 1291 and the first connecting side plate 1292 are provided with mounting sliders 1293, which are connected to a first slide rail 126 and a third slide rail 128. The other end of the stabilizing mounting block 1291 is provided with multiple vertical guide rails 1294, on which second connecting side plates 1296 are fitted. The stable mounting block 1291 is also equipped with a servo motor 1299, which drives the second connecting side plate 1296 to move up and down on the vertical guide rail 1294. The second connecting side plate 1296 is also equipped with a rotary cylinder assembly 1295, the lower end of which is fitted with a vacuum suction cup assembly 1298. A connecting vertical rod 1297 is provided between the second connecting side plate 1296 and the vacuum suction cup assembly 1298, and this connecting vertical rod 1297 is provided with multiple... The second connecting side plate 1296 is driven by a servo motor 1299, which moves the vacuum suction cup assembly 1298 up and down to different heights. The vacuum suction cup assembly 1298 can be rotated by a rotary cylinder assembly 1295, which drives the material tray to rotate synchronously, making it easy to accurately place the material tray in a designated position. The material tray supply device 16 includes a base plate 161, on which a vertical mounting connecting plate 162 is provided. Multiple material tray brackets are arranged in parallel on the vertical mounting connecting plate 162. The guide rail 163 has a tray holder 164 mounted on it. A drive assembly 165 is also provided on the base plate 161, allowing the tray holder 164 to move up and down on the guide rail 163. A lower limit block 166 is provided at the bottom of the guide rail 163 to limit the lowest position of the tray holder 164. Multiple sensors 167 are also provided on the side of the vertical mounting connecting plate 162 to detect the number of trays.
[0026] The process of a chip-based sorting and detection device for an oven's intelligent timer, as shown in the figure, includes the following steps: Step 1: Chip loading. The upper lifting mechanism inside the chip loading device 3 is activated. The electric push rod assembly 302 on its base plate 301 pushes the connecting plate 306 to lift the chip upward. The limiting block 305 at the end of the connecting rod 304 restricts the movement distance, so that the chips are exposed in sequence at the loading position, waiting for transplantation. Step 2: Chip transfer. The chip transfer device 2 uses the slider 202 on the mounting block 201 to cooperate with the connecting component 203. The drive motor component 204 drives the slider 202 to slide horizontally, which drives the suction cup 205 to move above the chip loading device 3 to pick up the chip and then transfer it to the chip placement slot 7 of the detection rotating platform 6. Step 3: Chip Inspection. The rotating inspection platform 6 rotates, causing the chip to pass sequentially through the upper chip surface defect inspection device 8 and the lower chip surface defect inspection device 9. The first drive motor 803 and the second drive motor 804 of the upper chip surface defect inspection device 8 drive the first vertical plate 808 and the second vertical plate 806 to slide opposite each other on the transverse guide rail 805 connecting the vertical plate 802, thereby driving the first inspection camera 809 and the second inspection camera 807 to move synchronously and perform multi-angle inspection of the upper chip surface. The lower chip surface defect inspection device 9 performs synchronous inspection of the lower chip surface through the inspection hole 10, completing all-round defect identification. Step 4: Empty tray supply and transfer. The drive component 165 of the tray supply device 16 drives the tray bracket 164 to move up and down on the tray bracket guide rail 163 on the vertical mounting connecting plate 162 of the base plate 161. The sensor 167 detects the number of trays and supplies empty trays to the sorting rotary platform 14. The tray gripping mechanism 129 of the tray transfer device 12 moves horizontally on the first slide rail 126, the second slide rail 127, and the third slide rail 128 via the mounting slider 1293. The servo motor 1299 drives the second connecting side plate 1296 to move up and down on the vertical guide rail 1294 of the stable mounting block 1291, so that the vacuum suction cup assembly 1298 reaches the target tray position and transfers the empty trays to the tray placement slot 15 of the sorting rotary platform 14 in sequence. Step 5: Chip sorting and transfer. Based on the detection results, the gripping robot 11 picks up qualified chips and places them on the sorting rotary platform 14 onto the empty tray in the tray placement slot 15 corresponding to the qualified chip tray placement station 17. Unqualified chips are picked up and placed on the empty tray in the tray placement slot 15 corresponding to the unqualified chip tray placement station 13. Then, the rotary cylinder assembly 1295 drives the vacuum suction cup assembly 1298 to rotate and transfer the tray full of chips from the sorting rotary platform 14 to the corresponding unqualified chip tray placement station 13 or qualified chip tray placement station 17, completing the entire process of detection and sorting of chips for the oven's intelligent timer.
[0027] This invention is not limited to the above embodiments. Based on the technical solutions disclosed in this invention, those skilled in the art can make some substitutions and modifications to some of the technical features without creative effort, and these substitutions and modifications are all within the protection scope of this invention.
Claims
1. A chip detection and sorting device for an oven intelligent timer, comprising a device housing (1) and a tray for holding chips, wherein the bottom of the device housing (1) is provided with a plurality of stabilizing feet (4) and casters (5); characterized in that: The equipment housing (1) is provided with a detection rotating platform (6) and a sorting rotating platform (14). Multiple chip placement slots (7) and tray placement slots (15) are evenly arranged on the detection rotating platform (6) and sorting rotating platform (14), respectively. A chip loading device (3) is provided at the outer end of the detection rotating platform (6), and a chip transfer device (2) is correspondingly provided at the side end of the chip loading device (3) to transfer the chip from the corresponding loading device to the detection rotating platform (6). The equipment housing (1) is also provided with a chip upper surface defect detection device (8), a chip lower surface defect detection device (9), and a detection hole (10). The chip upper surface defect detection device (8) 8) The chip is placed above the inspection rotating platform (6) for defect detection on the upper surface of the chip; the chip lower surface defect detection device (9) is placed below the inspection rotating platform (6), and the chip lower surface defect detection device (9) can detect defects on the lower surface of the chip through the detection hole (10); a gripping robot (11) is provided between the inspection rotating platform (6) and the sorting rotating platform (14) for gripping the inspected chip to the sorting rotating platform (14); a tray supply device (16) is provided on the side of the sorting rotating platform (14) for supplying empty trays to the tray placement slot (15); a tray transfer device is also provided on the equipment housing (1). (12) Non-conforming chip tray placement station (13) and conforming chip tray placement station (17); the tray transfer device (12) is set above the sorting rotating platform (14) and is used to transfer the tray between the tray supply device (16), the non-conforming chip tray placement station (13) and the conforming chip tray placement station (17); the chip upper surface defect detection device (8) and the chip lower surface defect detection device (9) have the same structure and are set up vertically and vertically, including a connecting block (801), a connecting vertical plate (802) and a horizontal guide rail (805); the connecting block (801) is fixedly installed on the equipment box (1), and the connecting vertical plate (802) and the connecting block (805) are connected to each other. 801) Connected; the horizontal guide rail (805) is installed on the connecting vertical plate (802), and multiple horizontal guide rails (805) are provided and are parallel to each other; a first vertical plate (808) and a second vertical plate (806) are clamped on the horizontal guide rail (805), and a first detection camera (809) and a second detection camera (807) are respectively installed on the first vertical plate (808) and the second vertical plate (806); a first drive motor (803) and a second drive motor (804) are also provided on the connecting vertical plate (802), and the first drive motor (803) and the second drive motor (804) are respectively connected to the first vertical plate (808) and the second vertical plate (806);The first drive motor (803) and the second drive motor (804) respectively drive the first vertical plate (808) and the second vertical plate (806) to slide opposite each other on the horizontal guide rail (805), thereby driving the first detection camera (809) and the second detection camera (807) to move synchronously and detect different positions on the upper and lower surfaces of the chip; a through hole is provided through the middle of the chip placement slot (7), and the range of the through hole is larger than the chip to be detected range; the outer edge of the chip is placed on the chip placement slot (7) and the part of the chip to be detected is embedded in the through hole.
2. The oven intelligent timer chip detection and sorting device according to claim 1, characterized in that: The chip transfer device (2) includes a mounting block (201), a slider (202), a connecting component (203), a drive motor assembly (204), and a suction cup (205). The mounting block (201) is fixedly mounted on the equipment housing (1). The slider (202) is located at the upper end of the mounting block (201). The connecting component (203) is mounted on the slider (202). The drive motor assembly (204) is located on the connecting component (203) and is connected to the slider (202). The suction cup (205) is located at the lower end of the connecting component (203). The slider (202) slides horizontally on the mounting block (201), driving the suction cup (205) to move accurately above the chip loading device (3) to pick up the chip and transfer the chip to the chip placement slot (7) of the detection rotating platform (6).
3. The oven intelligent timer chip detection and sorting device according to claim 2, characterized in that: The chip loading device (3) includes an internal lifting mechanism; the lifting mechanism includes a base plate (301), on which an electric push rod assembly (302) is provided; a U-shaped plate (303) is provided on the electric push rod assembly (302), and a connecting plate (306) is connected to the output end of the electric push rod assembly (302); a plurality of connecting light rods (304) are provided at the lower end of the connecting plate (306), the connecting light rods (304) pass through the U-shaped plate (303) and are provided with a limit block (305) at their ends; the connecting plate (306) moves upward through the electric push rod assembly (302) to lift the chips upward in sequence, so that the suction cup (205) can pick up the chips; the limit block (305) at the end of the connecting light rod (304) is used to limit the movement distance of the connecting light rod (304) on the U-shaped plate (303).
4. The oven intelligent timer chip detection and sorting device according to claim 1, characterized in that: The material tray transfer device (12) includes a first connecting block (122) and a second connecting block (123). Multiple support columns (121) are provided at the lower ends of both the first connecting block (122) and the second connecting block (123), and are fixed to the equipment housing (1) via the support columns (121). The first connecting block (122) and the second connecting block (123) are symmetrically arranged, and a second slide rail (127) is provided on the inner side of both the first connecting block (122) and the second connecting block (123). A third connecting block (124) and a fourth connecting block (125) are mounted on the second slide rail (127). 5) The third connecting block (124) and the fourth connecting block (125) can move horizontally on the second slide rail (127); the third connecting block (124) and the fourth connecting block (125) are each provided with a first slide rail (126) and a third slide rail (128), the first slide rail (126) and the third slide rail (128) are parallel to each other; the first slide rail (126) and the third slide rail (128) are each provided with a material tray gripping mechanism (129), the material tray gripping mechanism (129) can move horizontally on the first slide rail (126) and the third slide rail (128).
5. The oven intelligent timer chip detection and sorting device according to claim 4, characterized in that: The material tray gripping mechanism (129) includes a stabilizing mounting block (1291). One end of the stabilizing mounting block (1291) is connected to a first connecting side plate (1292). Both the stabilizing mounting block (1291) and the first connecting side plate (1292) are provided with mounting sliders (1293), which are connected to the first slide rail (126) and the third slide rail (128) through the mounting sliders (1293). The other end of the stabilizing mounting block (1291) is provided with multiple vertical guide rails (1294), on which a second connecting side plate (1296) is clamped. The stabilizing mounting block (1291) is also provided with a servo motor (1299), which drives the second connecting side plate (1296) to move... The vertical guide rail (1294) moves up and down; a rotary cylinder assembly (1295) is also provided on the second connecting side plate (1296), and a vacuum suction cup assembly (1298) is installed at the lower end of the rotary cylinder assembly (1295); a connecting vertical rod (1297) is provided between the second connecting side plate (1296) and the vacuum suction cup assembly (1298), and multiple connecting vertical rods (1297) are provided; the second connecting side plate (1296) is driven by a servo motor (1299) to drive the vacuum suction cup assembly (1298) to move up and down to different heights; the vacuum suction cup assembly (1298) can be rotated by the rotary cylinder assembly (1295) to drive the material tray to rotate synchronously, so as to accurately place the material tray in the designated position.
6. The oven intelligent timer chip detection and sorting device according to claim 1, characterized in that: The tray supply device (16) includes a base plate (161) on which a vertical mounting connecting plate (162) is provided; multiple tray support rails (163) are arranged in parallel on the vertical mounting connecting plate (162), and tray supports (164) are clamped on the tray support rails (163); a driving assembly (165) is also provided on the base plate (161), and the tray supports (164) can move up and down on the tray support rails (163) by the driving assembly (165); a lower limit block (166) is provided at the bottom end of the tray support rails (163) to limit the lowest position of the tray supports (164); multiple sensors (167) are also provided on the side end of the vertical mounting connecting plate (162) and the number of trays is detected by the sensors (167).
7. The process for a chip-based intelligent timer sorting device for ovens according to claim 1, characterized in that: The steps are as follows: Step 1: Chip loading. The upper lifting mechanism inside the chip loading device (3) is activated. The electric push rod assembly (302) on its base plate (301) pushes the connecting plate (306) to lift the chip upward. The limiting block (305) at the end of the connecting rod (304) restricts the movement distance, so that the chips are exposed in sequence at the loading position, waiting for transplantation. Step 2: Chip transfer. The chip transfer device (2) uses the slider (202) on the mounting block (201) to cooperate with the connecting component (203). The drive motor component (204) drives the slider (202) to slide horizontally, which drives the suction cup (205) to move to the chip loading device (3) to pick up the chip and then transfer it to the chip placement slot (7) of the detection rotating platform (6). Step 3: Chip inspection. The inspection rotating platform (6) rotates, causing the chip to pass sequentially through the upper chip surface defect inspection device (8) and the lower chip surface defect inspection device (9). The first drive motor (803) and the second drive motor (804) of the upper chip surface defect inspection device (8) drive the first vertical plate (808) and the second vertical plate (806) to slide opposite each other on the horizontal guide rail (805) connecting the vertical plate (802), thereby driving the first inspection camera (809) and the second inspection camera (807) to move synchronously and perform multi-angle inspection on the upper surface of the chip. The lower chip surface defect inspection device (9) performs synchronous inspection on the lower surface of the chip through the inspection hole (10) to complete all-round defect identification. Step 4: Empty tray supply and transfer. The drive component (165) of the tray supply device (16) drives the tray bracket (164) to move up and down on the tray bracket guide rail (163) on the vertical mounting connecting plate (162) of the base plate (161). The sensor (167) detects the number of trays and supplies empty trays to the sorting rotary platform (14). The tray gripping mechanism (129) of the tray transfer device (12) moves horizontally on the first slide rail (126), the second slide rail (127), and the third slide rail (128) through the mounting slider (1293). The servo motor (1299) drives the second connecting side plate (1296) to move up and down on the vertical guide rail (1294) of the stable mounting block (1291), so that the vacuum suction cup assembly (1298) reaches the target tray position and transfers the empty trays to the tray placement slot (15) of the sorting rotary platform (14) in sequence. Step 5: Chip sorting and transfer. The gripping robot (11) grabs qualified chips onto the empty tray in the tray placement slot (15) corresponding to the qualified chip tray placement station (17) on the sorting rotary platform (14) according to the detection results. Unqualified chips are grabbed onto the empty tray in the tray placement slot (15) corresponding to the unqualified chip tray placement station (13). Then, the rotary cylinder assembly (1295) drives the vacuum suction cup assembly (1298) to rotate and transfer the tray full of chips from the sorting rotary platform (14) to the corresponding unqualified chip tray placement station (13) or qualified chip tray placement station (17), completing the entire process of detection and sorting of chips for oven smart timer.
Citation Information
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