Foreign matter eliminating apparatus for encapsulating electronic components and abnormality control method thereof

Abstract

An outgassing apparatus for packaging electronic components and an abnormality control method thereof, the outgassing apparatus includes a chamber and a control module for controlling the working temperature and the working pressure of the chamber, the abnormality control method includes obtaining the working temperature and the working pressure of the chamber; determining whether one of the working temperature and the working pressure of the chamber meets a preset value; when one of the working temperature and the working pressure of the chamber does not meet the preset value, the control module starts an emergency treatment program, so that the working temperature and the working pressure are reduced to a level at which the packaging electronic components can be transferred to another outgassing apparatus.

Description

[0001] This application claims priority to Chinese Patent Application No. 202410162114.X, filed on February 5, 2024, entitled "Foreign Object Removal Device and Abnormal Control Method for Encapsulating Electronic Components", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to a foreign matter removal device, and more particularly to a foreign matter removal device for removing foreign matter from packaged electronic components and its abnormality control method. Background Technology

[0003] In the packaging process of electronic components, to eliminate foreign matter (such as bubbles, grease, flux residue, and other contaminants) during the process, it is necessary to control the cavity temperature and air pressure of the baking equipment. This eliminates foreign matter in the material layers during packaging. However, during operation, various abnormal conditions may cause the temperature or air pressure to deviate from the set range. This can lead to interruption or failure of the foreign matter removal process, resulting in defective packaged electronic components and wasting packaging resources and costs. Therefore, how to better control the temperature and air pressure of the equipment and how to salvage electronic components that are halfway through the process in case of abnormal conditions are topics worthy of further research in this field. Summary of the Invention

[0004] Therefore, one of the objectives of this invention is to provide a foreign matter removal device that can control abnormal temperature and air pressure.

[0005] Therefore, the foreign matter removal device of the present invention is used to remove foreign matter from a packaged electronic component. The foreign matter removal device includes a cavity, a temperature module, a pressure module and a control module. The cavity forms a cavity space; the temperature module is disposed in the cavity and includes a heater for increasing the working temperature in the cavity space and a cooler for decreasing the working temperature in the cavity space, as well as a temperature detection unit for detecting the working temperature in the cavity space; the pressure module is disposed in the cavity and includes a booster for increasing the working air pressure in the cavity space and a pressure relief valve for decreasing the working air pressure in the cavity space, as well as a pressure detection unit for detecting the working air pressure in the cavity space; the control module is connected to the temperature module and the pressure module, and is used to initiate an emergency response procedure when at least one of the working temperature or working air pressure of the cavity space is in an abnormal state and cannot be controlled to return to a preset value state, thereby controlling the pressure module to maintain the working air pressure of the cavity space above a preset pressure value, rapidly cooling down the working temperature of the cavity space in a cooling mode, and then adjusting the working air pressure of the cavity space to a level that allows the cavity to be opened so that the packaged electronic components can be transferred to another foreign object removal device.

[0006] In some embodiments, the foreign object removal device further includes a backup booster, wherein the control module can switch to the backup booster to provide the working pressure when the pressure detection unit detects that the working pressure of the cavity space is in an abnormal state.

[0007] In some embodiments, the foreign object removal device further includes an alarm module connected to the control module, which issues an alarm when at least one of the operating temperature or operating pressure of the cavity is in an abnormal state.

[0008] In some embodiments, the foreign object removal device further includes a human-machine interface connected to the control module, providing input to set preset values ​​for the operating temperature and the operating air pressure.

[0009] Another objective of the present invention is to provide an abnormal control method for abnormal control of temperature and air pressure in the aforementioned foreign matter removal device.

[0010] In the abnormal control method of the foreign object removal device of the present invention, the foreign object removal device is used to remove foreign objects from the packaged electronic components. The abnormal control method includes obtaining the working temperature and working air pressure of the cavity; the control module determines the working temperature and working air pressure, firstly rapidly lowers the working temperature and keeps the working air pressure of the cavity space above a preset air pressure value, and then slowly lowers the working air pressure of the cavity space so that the packaged electronic components can be transferred to another foreign object removal device.

[0011] In some implementations, the control module initiates an emergency response procedure, controlling the cavity to rapidly cool down at a rate of 5°C / min or higher.

[0012] In some implementations, when the operating temperature does not meet the preset value, before the emergency procedure is initiated, the control module re-controls the operation of a temperature module of the foreign object removal device to restore the operating temperature of the cavity to the preset value. If it cannot be restored, the control module rapidly lowers the operating temperature of the cavity to a state where the packaged electronic components can be removed from the cavity.

[0013] In some implementations, when the working air pressure does not meet the preset value, before initiating the emergency response procedure, the control module re-controls the operation of a pressure module of the foreign object removal device to restore the working air pressure of the cavity to the preset value. If it cannot be restored, the control module rapidly lowers the working temperature of the cavity to a predetermined temperature and maintains the working air pressure of the cavity above a preset pressure value. Then, the working air pressure of the cavity space is gradually reduced so that the packaged electronic component device can be transferred to another foreign object removal device.

[0014] In some implementations, when the working air pressure does not meet the preset value, before starting the emergency response procedure, the control module detects whether there is a backup booster that can make the working air pressure meet the preset value. If so, the backup booster is switched to replace the booster of the foreign object removal device to make the working air pressure meet the preset value.

[0015] In some implementations, when the control module detects that there is no backup booster to make the working air pressure meet the preset value, or that the backup booster cannot make the working air pressure meet the preset value, the control module initiates the emergency response procedure, controls the working temperature of the cavity to drop rapidly to a predetermined temperature, and keeps the working air pressure of the cavity above a preset air pressure value, and then slowly reduces the working air pressure of the cavity space so that the packaged electronic component device can be transferred to another foreign object removal device.

[0016] In some implementation examples, during this emergency response procedure, after the operating temperature drops rapidly, the control module gradually reduces the working air pressure in the cavity space, controlling the gradual reduction of the working air pressure at a rate of 5 kg / cm² per minute. 2 The following speed decreases.

[0017] In some implementations, the operating temperature of the cavity is controlled to rapidly decrease to a predetermined temperature, which is no greater than 100 degrees Celsius.

[0018] In some implementations, during the emergency response procedure, after the operating temperature is rapidly reduced, the control module controls the operating air pressure to slow down the rate of decrease after the foreign object removal device has completed removing the foreign object from the packaged electronic component.

[0019] In some implementations, during the emergency response procedure, 150% of the preset air pressure value is not less than the ratio of the air pressure value before cooling to the temperature value reached after cooling and the temperature value before cooling.

[0020] The present invention has at least the following advantages: by using the foreign matter removal device and its abnormality control method, when an abnormality occurs in the process of removing foreign matter from the packaged electronic component, the abnormality can be eliminated quickly in the most effective way. When it is confirmed that the abnormality cannot be eliminated, the temperature can be quickly reduced and the pressure can be gradually reduced. The packaged electronic component that has not yet completed the removal of foreign matter can be removed and transferred to another foreign matter removal device to continue operation, so as to avoid damage to the packaged electronic component due to equipment abnormality, thereby effectively reducing the cost loss caused by the defect rate. Attached Figure Description

[0021] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein:

[0022] Figure 1 This is a system block diagram of an embodiment of the foreign matter removal device for packaged electronic components of the present invention;

[0023] Figure 2 It is a cross-sectional schematic diagram of a packaged electronic component;

[0024] Figure 3 This is an example of a temperature-pressure curve.

[0025] Figure 4 This is a flowchart illustrating the steps of an embodiment of the abnormal control method for the foreign matter removal device of the present invention; and

[0026] Figure 5 This is a flowchart of another implementation of the anomaly control method.

[0027] Symbol explanation:

[0028] 1: Cavity

[0029] 11 cavity space

[0030] 12 working platforms

[0031] 2 temperature modules

[0032] 21 heaters

[0033] 22 temperature detection units

[0034] 23 Cooler

[0035] 3 air pressure modules

[0036] 3a standby booster

[0037] 31 turbocharger

[0038] 32 pressure relief valve

[0039] 33 bar pressure detection unit

[0040] 4 control modules

[0041] 5-Package Electronic Components

[0042] 51 carrier board

[0043] 52 chip

[0044] 53 Material Layers

[0045] 6 Warning Modules

[0046] 7 Human-Computer Interface

[0047] Steps 100, 101, 102, and 105

[0048] Branch steps 101a, 101b, 101c, 101d, 101e

[0049] Sub-steps 102a, 102b, and 103c Detailed Implementation

[0050] Before the invention is described in detail, it should be noted that similar components are represented by the same numbers in the following description.

[0051] See Figure 1 and Figure 2An embodiment of the foreign matter removal device for encapsulated electronic components of the present invention includes a cavity 1, a temperature module 2, a pressure module 3, a backup booster 3a, a control module 4, an alarm module 6, and a human-machine interface 7 connected to the control module 4. The encapsulated electronic component 5 includes a carrier board 51, a chip 52, and a material layer 53 between the carrier board 51 and the chip 52. The carrier board 51 may be at least one of a printed circuit board, an organic substrate, a glass substrate, a metal substrate, a lead frame, a wafer, a silicon interposer, or a package. The foreign matter removal device is used to remove foreign matter from the material layer 53. In the following embodiments, the foreign matter refers to air bubbles present in the material layer 53. However, in other embodiments, the device can also be used to remove contaminants such as grease, flux residue, and volatile solvents. Therefore, the foreign matter referred to can also refer to the aforementioned contaminants such as grease, flux residue, and volatile solvents. The removal is, for example, achieved by controlling the temperature and air pressure to expel the foreign matter from the material layer 53.

[0052] A cavity space 11 is formed within the cavity 1, and a working platform 12 is provided within the cavity space 11 for placing packaged electronic components 5. A temperature module 2 is disposed within the cavity 1 to detect and control the operating temperature within the cavity space 11, for example, between 25 degrees Celsius and 800 degrees Celsius, but the present invention is not limited thereto. In one embodiment, the operating temperature is, for example, between room temperature and 400 degrees Celsius. The temperature module 2 includes a heater 21, a temperature detection unit 22, and a cooler 23. The heater 21 may include a heating element and its corresponding circuitry, and the heating element may be disposed within the cavity space 11, for example. The cooler 23 may also include a cooling element and its corresponding circuitry. In one embodiment, the cooler 23 is disposed outside the cavity 1, and a circulation pipe connects the cavity space 11 and the cooler 23. The cooler 23 cools the gas from the cavity space 11 and then returns the gas to the cavity space 11. The heater 21 is used to increase the working temperature inside the cavity space 11, while the cooler 23 is used to decrease the working temperature inside the cavity space 11. The temperature detection unit 22 is used to detect the working temperature inside the cavity space 11 and transmit the detected working temperature back to the control module 4, providing the control module 4 with the basis for whether to adjust the heater 21 to heat or start the cooler 23 to cool down.

[0053] The pneumatic module 3 is used to detect and control the working pneumatic pressure within the cavity space 11. It includes a booster 31 connected to the cavity 1, a pressure relief valve 32 disposed in the cavity 1, and a pneumatic pressure detection unit 33. The booster 31 may include a boosting component and its corresponding circuitry and piping. The boosting component is, for example, a booster cylinder. In one embodiment, the booster 31 may include two boosting components and two piping lines respectively cooperating with the two boosting components. In another embodiment, the booster 31 may include two boosting components and a piping line cooperating with the two boosting components. In yet another embodiment, the pneumatic module has multiple boosters 31 connected to the cavity. The booster 31 is used to increase the working air pressure within the cavity space 11, for example, to 2 atmospheres. The pressure relief valve 32 is used to relieve the working air pressure within the cavity space 11. The air pressure detection unit 33 is used to detect the working air pressure within the cavity space 11 and transmit the detected working air pressure back to the control module 4, providing the control module 4 with a reference for whether to adjust the booster 31 to increase the air pressure or activate the pressure relief valve 32 to relieve pressure. The standby booster 3a is designed to be controllable and can switch operation with the booster 31 of the air pressure module 3.

[0054] Control module 4 is connected to temperature module 2 and pressure module 3. Control module 4 can be implemented using, for example, a programmable logic controller (PLC) in conjunction with software. Its function is to control temperature module 2 and pressure module 3 to follow a preset temperature-pressure curve (e.g., ...). Figure 3The system operates as shown, ensuring that the working temperature and pressure within the cavity space 11 meet preset values ​​during the foreign object removal process, thus successfully completing the foreign object removal operation. Furthermore, when the working temperature and / or working pressure become abnormal during the foreign object removal process (i.e., deviating from the aforementioned preset temperature and pressure values ​​to a certain extent; in one embodiment, the abnormality refers to the detected working temperature or working pressure exceeding or falling below the preset temperature or pressure value by a certain value, such as 10% or more, and lasting for a certain period of time, such as 30 seconds or more; in another embodiment, the abnormality refers to the detected working temperature or working pressure exceeding or falling below the preset temperature or pressure value by 5% or more, and lasting for more than 10 seconds), it can determine whether to continue or initiate an emergency response procedure, using a rapid cooling mode to lower the working temperature of the cavity space 11 and controlling the air pressure module 3 to maintain the working temperature of the cavity space 11. The pressure is maintained within a preset pressure range. In one embodiment, the preset pressure value may be a certain value not lower than the working pressure before cooling, a fixed value over multiple time periods, or a pressure value that varies with temperature. For example, 150% of the temperature-varying pressure value (P2) is not lower than [the pressure value before cooling (P1) multiplied by the temperature reached after cooling (T2) divided by the temperature value before cooling (T1), i.e., P1xT2 / T1]. The temperature is measured in zettallions (K). As the temperature continues to decrease, the preset air pressure value also changes. In other words, to maintain the balance of temperature and pressure within the cavity space 11 and on the packaged electronic component 5, the ratio of 150% of the cooled air pressure (P2) to the air pressure before cooling (P1) is not less than the ratio of the cooled temperature (T2) to the temperature before cooling (T1) (i.e., 1.5P2 / P1 ≥ T2 / T1). Next, the working air pressure of the cavity space 11 is gradually reduced to 1 atmosphere or to a pressure that allows the cavity door to be opened, thereby enabling the packaged electronic component 5 to be transferred to another foreign matter removal device or temporary storage area. In one embodiment, a robotic arm can be used to transfer the packaged electronic component 5, before the foreign matter removal operation is completed, to another foreign matter removal device or temporary storage area; in another embodiment, manual operation can be used to transfer the packaged electronic component 5, before the foreign matter removal operation is completed, to another foreign matter removal device or temporary storage area; however, the present invention is not limited thereto.

[0055] The warning module 6 is connected to the control module 4. Specifically, it can be, for example, a warning signal displayed on the human-machine interface 7 of the foreign object removal device, or an alarm, used to issue a warning when at least one of the operating temperature or operating pressure of the cavity space 11 is in an abnormal state, so that the operator can take appropriate action, such as initiating an emergency response procedure. The alarm can be, for example, a warning buzzer installed on the foreign object removal device.

[0056] See Figure 1 , Figure 4An embodiment of the abnormal control method for the foreign matter removal device for packaged electronic components of the present invention utilizes the aforementioned foreign matter removal device and includes the following steps:

[0057] Step 100: Obtain the working temperature and working pressure of cavity space 1. In this step, the working temperature and working pressure inside cavity space 11 are detected by temperature detection unit 22 and pressure detection unit 33, respectively, and transmitted back to control module 4. Control module 4 receives the working temperature and working pressure from temperature detection unit 22 and pressure detection unit 33. Here, temperature detection unit 22 and pressure detection unit 33 may be set to periodically detect the working temperature and working pressure inside cavity 1 and transmit the data back to control module 4. In one embodiment, temperature detection unit 22 and pressure detection unit 33 continuously detect the working temperature and working pressure inside cavity 1 and continuously transmit the data back to control module 4, but this invention is not limited to this.

[0058] Step 101: Determine whether the operating temperature and operating pressure meet a preset value. The preset value here refers to the preset temperature and preset pressure that should be met at each stage of the entire foreign object removal process for different packaged electronic components 5 in order to successfully complete the foreign object removal operation (e.g., corresponding...). Figure 3 The preset temperature-pressure curve is used. Therefore, in this step, when the control module 4 receives the working temperature and working pressure from the temperature detection unit 22 and the pressure detection unit 33 for a specific period of time, it compares them with the preset temperature and preset pressure that should be met for that period of time, thereby determining whether the current working temperature and working pressure in the cavity space 11 meet the preset temperature and preset pressure. When the obtained working temperature and working pressure meet the preset values, steps 100 and 101 are repeated according to the set timed detection.

[0059] When at least one of the operating temperature and operating pressure fails to meet the preset temperature or preset pressure, and cannot be controlled to return to the preset value, the control module 4 initiates an emergency response procedure, namely step 102, to reduce the operating temperature and operating pressure to a level where the packaged electronic component 5 can be transferred to another foreign object removal device. Before executing step 102, for abnormal operating temperature and abnormal operating pressure, the following two branch steps are executed: step 101a, step 101b, and step 101c. Step 101a mainly addresses the handling of abnormal operating temperature, while steps 101b and 101c mainly address the handling of abnormal operating pressure. Regarding these two branch steps, the control module 4 can set the order of execution according to actual needs. For example, step 101a can be performed first, and step 101b can be performed when the operating temperature is normal; or step 101b can be performed first, and step 101a can be performed when the operating pressure is normal; or steps 101a and 101b can be performed synchronously or asynchronously. In step 101a, when the operating temperature detected by the control module 4 does not meet the preset temperature, the control module 4 first re-controls the heater 21 (if the detected operating temperature is lower than the preset temperature) or the cooler 23 (if the detected operating temperature is higher than the preset temperature) to operate, or increases the power of the heater 21 or the cooler 23, in an attempt to restore the operating temperature of the cavity space 11 to meet the preset temperature. If it is still impossible to control it back to the preset value state, for example, if it does not meet the preset temperature and still cannot be returned to the preset value state after a period of time, then the aforementioned emergency handling procedure, i.e., step 102, is entered. Step 102 includes sub-steps 102a and 102b. Sub-step 102a is to perform rapid cooling and slow pressure reduction, and sub-step 102b is to remove and transfer the packaged electronic component 5. Specifically, in sub-step 102a, the cooler 23 is first activated for rapid cooling, and the pressure module 3 is controlled to maintain the working pressure of the cavity space 11 above a preset pressure value, so that the temperature of the cavity space 11 drops to a preset temperature, that is, a temperature at which the packaged electronic component 5 can be removed from the cavity space 11, for example, not greater than 100 degrees Celsius, in one embodiment, for example, not greater than 80 degrees Celsius, in another embodiment, for example, not greater than 40 degrees Celsius. Then, the pressure is gradually reduced, and the working pressure of the cavity space 11 is gradually reduced to one atmosphere or the pressure at which the cavity door can be opened. Then, sub-step 102b can be performed to quickly transfer the packaged electronic component 5 that has not yet completed the foreign object removal operation to another foreign object removal device to continue the foreign object removal operation. In one embodiment, a robotic arm can be used to transfer the packaged electronic component 5 that has not yet completed the foreign object removal operation to another foreign object removal device; in another embodiment, manual operation can be used to transfer the packaged electronic component 5 that has not yet completed the foreign object removal operation to another foreign object removal device; however, the present invention is not limited thereto.It should be noted that, since the temperature module 2 has been confirmed to be malfunctioning and unable to continue operating normally after the aforementioned sub-step 101a, step 102 aims to safely and quickly remove the semi-finished product that has not yet completed the foreign object removal process, and to allow it to be moved to another machine for further processing. This is to prevent the unfinished packaged electronic component 5 from remaining in the cavity 1 and aging excessively, thus causing it to be scrapped. Therefore, rapid cooling is required. In addition, during the rapid cooling process, to avoid irreversible damage to the packaged electronic component 5 due to rapid changes in temperature and air pressure, the working air pressure in the cavity space 11 must be kept above a preset air pressure value in coordination with the rapid temperature drop. Once the working temperature drops to a temperature suitable for the packaged electronic component 5 to be removed, the working air pressure is then gradually reduced to one atmosphere or the pressure required to open the cavity door, allowing the packaged electronic component 5 to be removed and transferred as quickly as possible. Figure 4 Step 102b is shown. The rapid cooling rate can be, for example, 5°C / min or higher. In one embodiment, it can be, for example, 20°C / min or higher. In one embodiment, rapid cooling is performed by maintaining the working pressure of the cavity space 11 above a preset pressure value.

[0060] The aforementioned consideration for gradually reducing the working pressure is that, before the working temperature and pressure become abnormal, the cavity space 11 is under high temperature and high pressure. To prevent the working pressure from dropping too quickly after rapid cooling, which could lead to an imbalance with the internal pressure of the packaged electronic component 5 and consequently cause deformation of the chip 52, a gradual pressure reduction method is adopted after rapid cooling to prevent deformation of the chip 52 due to the imbalance between the internal and external pressures. The specific rate of pressure reduction could be, for example, 5 kg / cm² per minute. 2 The following rate of descent, or, for example, a rate of descent slower than the rate of descent after the foreign matter removal device has completed the removal of foreign matter from the packaged electronic component 5, for example, at... Figure 3 In this context, the voltage reduction speed of segment a is the reduction speed after the foreign matter in the packaged electronic component 5 has been removed normally. The aforementioned slow voltage reduction speed can be slower than this segment's voltage reduction speed.

[0061] Regarding the handling of abnormal working air pressure in steps 101b and 101c, when the received working air pressure does not conform to the preset air pressure, in step 101b, the control module 4 first re-controls the booster 31 (if the detected working air pressure is lower than the preset air pressure) or the pressure relief valve 32 (if the detected working air pressure is higher than the preset air pressure) to attempt to restore the working air pressure in the cavity space 11 to conform to the preset air pressure. If it still cannot be controlled to return to the preset value state, then step 101c is performed. In step 101c, the control module 4 detects whether there is a backup booster 3a. If so, step 101e is performed: the backup booster 3a is activated, switching the operation of the backup booster 3a to replace the booster 31 of the air pressure module 3, and step 100 is re-executed to detect whether the working air pressure conforms to the preset air pressure again. In step 101c, if there is no backup booster 3a, or even if the booster 31 of the pressure module 3 has been replaced by the backup booster 3a, it still cannot meet the preset pressure, then the control module 4 executes step 102 of the aforementioned emergency procedure, controlling the rapid decrease of the operating temperature of the cavity space 11, and then controlling the decrease of the operating pressure at a slow rate, so that the packaged electronic components 5 can be transferred to another foreign object removal device, such as... Figure 4 The step 102b is shown. In one embodiment, the control module 4 re-controls the operation of the booster 31 of the pressure module 3. The booster 31 may include two booster components and two pipelines respectively cooperating with the two booster components. In another embodiment, the booster 31 may include two booster components and a pipeline cooperating with the two booster components. In yet another embodiment, the control module 4 re-controls the operation of a pressure module 3 of the foreign object removal device. The pressure module has multiple boosters 31 connected to the cavity.

[0062] See Figure 5 In another embodiment, before step 102, a step 103c may be performed as needed: determining whether to continue the emergency response procedure based on the completion status of the foreign object removal operation. In this step, if at least one of the operating temperature or operating air pressure detected by the control module 4 does not meet the preset conditions, and if the foreign object removal operation has progressed for a certain period of time, that is, the foreign object removal operation has been basically completed, then it is not necessary to start the emergency response procedure, and the process can be completed according to the original schedule. Figure 5Step 105, in other words, when the abnormality occurs when the foreign object removal operation is nearing completion, since the abnormality at this time will not affect the foreign object removal result of the packaged electronic component 5, there is no need to initiate the emergency response procedure, and the procedure for completing the foreign object removal operation can be directly continued. Here, the determination of whether the foreign object removal operation has been completed can be based on the physical properties of the material layer 53 to be removed, and the control module 4 can be set accordingly. The determination condition can be based on the operation time. For example, in one embodiment, if the foreign object removal operation has been carried out for more than 60% of the time, the emergency response procedure will not be initiated, and the procedure for completing the foreign object removal operation can be directly continued.

[0063] In the foregoing Figure 4 , Figure 5 In step 101c, in an implementation where a backup booster 3a is provided for switching, before executing step 101c, the control module 4 can first execute step 101d: determine whether the current source of air pressure is already the backup booster 3a. If yes, step 101c is omitted if there is no other available backup booster 3a to switch to. If no, step 101c continues.

[0064] In another scenario, the factor causing at least one of the operating temperature and operating pressure to fail to meet the preset temperature or preset pressure, requiring the control module 4 to initiate an emergency response procedure as described in step 102, may also be caused by a temporary power outage or power failure. In this case, before proceeding with step 102, the temperature module 2 or the pressure module 3 can be activated first using an uninterruptible power supply (or backup power supply), followed by the execution of the emergency response procedure to rapidly cool down and then gradually depressurize, so that the packaged electronic component 5 can be removed, preventing the unfinished packaged electronic component 5 from remaining in the cavity 1 and aging excessively and becoming unusable.

[0065] In addition, it should be noted that when comparing the set working temperature and working air pressure with the preset temperature and preset air pressure, a positive and negative tolerance range can be allowed for the preset temperature and preset air pressure depending on the actual usage. As long as the positive and negative tolerance range is not exceeded, the working temperature and working air pressure can be regarded as the same as the preset temperature and preset air pressure.

[0066] In summary, this invention, through its foreign matter removal device and anomaly control method, enables the most effective and rapid elimination of abnormalities when the packaged electronic component 5 experiences an anomaly during the foreign matter removal process. Furthermore, when it is confirmed that the anomaly cannot be eliminated, it can rapidly cool down and gradually reduce the pressure, and remove the packaged electronic component 5 that has not yet completed the foreign matter removal operation so that it can be transferred to another foreign matter removal device to continue operation. This avoids damage and scrapping of the packaged electronic component 5 due to equipment malfunctions, thereby effectively reducing the cost losses caused by the defect rate. Therefore, this invention truly achieves its objective.

[0067] However, the above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the patent specification of the present invention shall still fall within the scope of the patent of the present invention.

Claims

1. A foreign matter removal device for packaged electronic components, used to remove foreign matter from a packaged electronic component, characterized in that, The foreign matter removal device includes: A cavity, forming a cavity space; A temperature module is disposed in the cavity and includes a heater for increasing the operating temperature in the cavity space, a cooler for decreasing the operating temperature in the cavity space, and a temperature detection unit for detecting the operating temperature of the cavity space. A pressure module, disposed in the cavity, includes a booster for increasing the working air pressure within the cavity space, a pressure relief valve for decreasing the working air pressure within the cavity space, and a pressure detection unit for detecting the working air pressure within the cavity space; and A control module, connected to the temperature module and the pressure module, is used to initiate an emergency response procedure when at least one of the working temperature and the working pressure of the cavity space is in an abnormal state: the working temperature of the cavity space is reduced in a rapid cooling mode, and the working pressure of the cavity space is maintained above a preset pressure value by the pressure module. After the temperature of the cavity space drops to the set temperature, the working pressure of the cavity space is then slowly reduced.

2. The foreign matter removal device as described in claim 1, characterized in that, It also includes a backup booster, wherein the control module can switch to the backup booster to provide the working pressure when the pressure detection unit detects that the working pressure of the cavity space is in the abnormal state.

3. The foreign matter removal device as described in claim 1, characterized in that, It also includes an alarm module connected to the control module, which issues an alarm when at least one of the working temperature or working pressure of the cavity space is in the abnormal state.

4. The foreign matter removal device as described in claim 1 or 3, characterized in that, It also includes a human-machine interface connected to the control module, providing input to set preset values ​​for the operating temperature and the operating air pressure.

5. The foreign matter removal device as described in claim 1, characterized in that, The booster includes two boosting components and at least one pipeline that cooperates with the two boosting components.

6. An abnormal control method for a foreign object removal device, characterized in that, The foreign object removal device is used to remove foreign objects from packaged electronic components. The foreign object removal device includes a cavity and a control module for controlling the operating temperature and operating pressure of the cavity. The anomaly control method includes: The working temperature and working air pressure of the cavity are obtained; The control module determines whether the operating temperature and operating air pressure meet a preset value; and When at least one of the operating temperature and the operating air pressure does not meet the preset value, the control module initiates an emergency response procedure: first, the operating temperature is rapidly reduced to a predetermined temperature, and the operating air pressure in the cavity space is maintained above a preset air pressure value, and then the operating air pressure in the cavity space is gradually reduced.

7. The anomaly control method as described in claim 6, characterized in that, The control module initiates an emergency response procedure, controlling the cavity to rapidly cool down at a rate of 5°C / min or higher.

8. The anomaly control method as described in claim 6, characterized in that, When the operating temperature does not meet the preset value, before starting the emergency response procedure, the control module re-controls the operation of a temperature module of the foreign object removal device to restore the operating temperature of the cavity to the preset value. If it cannot be restored, the control module rapidly lowers the operating temperature of the cavity to a state where the packaged electronic components can be removed from the cavity.

9. The anomaly control method as described in claim 6, characterized in that, When the working air pressure does not meet the preset value, before starting the emergency response procedure, the control module re-controls the operation of one air pressure module of the foreign object removal device to restore the working air pressure of the cavity to the preset value. If it cannot be restored, the control module starts the emergency response procedure.

10. The anomaly control method as described in claim 6, characterized in that, When the working air pressure does not meet the preset value, before starting the emergency response procedure, the control module detects whether there is a backup booster that can make the working air pressure meet the preset value. If so, the backup booster is switched to replace the booster of the foreign object removal device to make the working air pressure meet the preset value.

11. The anomaly control method as described in claim 10, characterized in that, When the control module detects that there is no backup booster to make the working air pressure meet the preset value, or that the backup booster cannot make the working air pressure meet the preset value, the control module initiates the emergency response procedure, controls the working temperature of the cavity to drop rapidly to a predetermined temperature, and keeps the working air pressure of the cavity above a preset air pressure value, and then slowly reduces the working air pressure of the cavity space so that the packaged electronic components can be transferred to another foreign object removal device.

12. The anomaly control method as described in claim 6, 9, or 11, characterized in that, In the emergency response procedure, after the operating temperature drops rapidly, the control module gradually reduces the working air pressure in the cavity space at a rate of 5 kg / cm² per minute. 2 The following speed gradually decreases.

13. The anomaly control method as described in claim 6, 9, or 11, characterized in that, The control system rapidly reduces the operating temperature of the cavity to a predetermined temperature, which is no greater than 100 degrees Celsius.

14. The anomaly control method as described in claim 6, 9, or 11, characterized in that, In the emergency response procedure, after the control module controls the operating temperature to drop rapidly, it controls the operating air pressure to slow down the rate of decrease after the foreign matter removal device has completed the removal of foreign matter from the packaged electronic components.

15. The anomaly control method as described in claim 6, characterized in that, In the emergency response procedure, 150% of the preset air pressure value shall not be less than the ratio of the air pressure value before cooling to the temperature value reached after cooling and the temperature value before cooling.

16. The anomaly control method as described in claim 9, characterized in that, The air pressure module has multiple boosters connected to the cavity.

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