一种双面散热模块的结壳热阻测量方法和装置
By measuring the junction thermal resistance of a double-sided heat dissipation module using the transient dual-interface method under conditions of top and bottom separation, the problem that the traditional TDIM method cannot accurately measure the single-sided junction thermal resistance of press-fit IGBTs is solved, and high-precision thermal resistance measurement is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAZHONG UNIV OF SCI & TECH
- Filing Date
- 2025-05-15
- Publication Date
- 2026-07-17
AI Technical Summary
The traditional TDIM method cannot directly measure the single-sided junction-shell thermal resistance of press-fit IGBTs under double-sided cooling conditions, resulting in measurement errors and poor repeatability.
The transient dual-interface method was used to measure the junction thermal resistance of the double-sided heat dissipation module under the condition of top and bottom separation. By changing the thermal conductivity of the contact interface, the heat flow ratio of the top and bottom surfaces was decoupled for calculation to eliminate the influence of asymmetric structure.
This method improves the accuracy of junction thermal resistance measurement for double-sided heat dissipation modules, provides a theoretical basis and application prospects, and solves the problems of measurement error and poor repeatability of the traditional TDIM method.
Smart Images
Figure CN120427685B_ABST