Circuit board manufacturing methods and circuit boards

Abstract

This application relates to the field of circuit board manufacturing technology, and proposes a circuit board manufacturing method and a circuit board. The circuit board manufacturing method includes: drilling a first hole that needs to be plugged and a second hole that does not need to be plugged on the circuit board, and performing copper plating and electroplating; covering a first side of the circuit board with a plugging plate to plug the first hole, the plugging plate having a plurality of injection holes corresponding to the first hole, wherein at least one injection hole is a first injection hole, the distance between the first hole and the second hole corresponding to the first injection hole is greater than a predetermined distance, and the radius of the first injection hole is larger than the radius of the first hole; and at least one injection hole is a second injection hole, the distance between the first hole and the second hole corresponding to the second injection hole is less than or equal to a predetermined distance, and the radius of the second injection hole is larger than the radius of the first hole but smaller than the radius of the first injection hole. The above circuit board manufacturing method solves the problem that resin or ink can easily seep into the holes that do not need to be plugged by changing the diameter of the injection holes.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing technology, and in particular to a circuit board manufacturing method and a circuit board. Background Technology

[0002] When a circuit board undergoes a via-filling process, if the holes requiring filling are too close to those that do not, resin or ink can easily seep into the holes that do not need filling. When the holes that do not need filling are NPTH (Non-Plated Through Hole) holes, the copper at the hole opening where resin or ink has seeped in is resisted by corrosion, resulting in residual copper at the hole opening.

[0003] For such issues, the industry typically drills the holes that need plugging separately, then metallizes them before plugging, and finally drills the holes that don't need plugging. However, for products with high hole position accuracy requirements, secondary drilling can easily cause positioning deviations, affecting hole position accuracy, and adding a secondary drilling process also increases manufacturing costs. Summary of the Invention

[0004] In view of this, embodiments of this application provide a circuit board manufacturing method and a circuit board to solve the problem that resin or ink can easily seep into holes that do not need to be plugged.

[0005] The first aspect of this application discloses a method for manufacturing a circuit board, comprising:

[0006] Drill the first hole that needs to be plugged and the second hole that does not need to be plugged on the circuit board, and then perform copper plating and electroplating.

[0007] A plugging plate is placed over the first side of the circuit board. The plugging plate has a plurality of injection holes arranged corresponding to the first hole.

[0008] At least one of the injection holes is a first injection hole, the distance between the first hole and the second hole corresponding to the first injection hole is greater than a predetermined distance, and the radius of the first injection hole is larger than the radius of the first hole; and,

[0009] At least one of the injection holes is a second injection hole, the distance between the first hole and the second hole corresponding to the second injection hole is less than or equal to the set distance, the radius of the second injection hole is larger than the radius of the first hole, and the radius of the second injection hole is smaller than the radius of the first injection hole.

[0010] The beneficial effects of the circuit board manufacturing method provided in this application are as follows: When plugging the first hole, if the distance between the first hole and the second hole is greater than a set distance, resin or ink is less likely to seep into the second hole; if the distance between the first hole and the second hole is less than or equal to the set distance, resin or ink can easily seep into the second hole. Therefore, when the distance between the first hole and the second hole is greater than the set distance, the radius of the first injection hole can be set normally, that is, the radius of the first injection hole is larger than the radius of the first hole, so that resin and ink can flow normally; when the distance between the first hole and the second hole is less than or equal to the set distance, the radius of the second injection hole can be reduced, that is, the radius of the second injection hole is larger than the radius of the first hole and smaller than the radius of the first injection hole, so as to reduce the amount of resin or ink flowing and reduce the risk of resin or ink seeping into the second hole. This solves the problem that resin or ink can easily seep into holes that do not need to be plugged.

[0011] In some embodiments, the set distance is 0.6-0.9 mm; and / or, the radius of the first injection hole is 0.15-0.2 mm larger than the radius of the first hole, and the radius of the second injection hole is 0.05-0.1 mm larger than the radius of the first hole.

[0012] In some embodiments, after plugging the first hole, the baking plate is placed vertically, and at least a portion of the first hole is a non-risk hole, wherein...

[0013] The non-risk hole is located below the second hole; and / or,

[0014] The non-risk hole is located diagonally below the second hole; and / or,

[0015] The non-risk hole is located diagonally above the second hole, and the vertical projection of the non-risk hole does not coincide with the vertical projection of the second hole.

[0016] In some embodiments, a portion of the first hole is a non-risk hole, and a portion of the first hole is a risk hole, wherein...

[0017] The risk hole is located above the second hole; and / or,

[0018] The risk hole is located diagonally above the second hole, and the vertical projection of the risk hole at least partially overlaps with the vertical projection of the second hole;

[0019] The plug also has an auxiliary hole located between the two injection holes corresponding to the non-risk hole and the risk hole.

[0020] In some embodiments, the radius of the auxiliary hole is 0.4-0.6 times the radius of the first hole.

[0021] In some embodiments, the centers of the auxiliary hole, the non-risk hole, and the risk hole lie on a circle centered at the center of the second hole.

[0022] In some embodiments, the distance between the auxiliary hole and the risk hole is 0.6-0.9 mm; and / or, the distance between the auxiliary hole and the non-risk hole is 0.6-0.9 mm.

[0023] In some embodiments, a plurality of auxiliary holes are provided between the non-risk holes and the risk holes, and the distance between two adjacent auxiliary holes is 0.6-0.9 mm.

[0024] In some embodiments, when the via plug is covered on the first side of the circuit board, the via plug pad is covered on the second side of the circuit board;

[0025] The plugging pad has a plurality of vent holes arranged corresponding to the first hole, and the vent holes are tangent to or separate from the second hole.

[0026] The second aspect of this application provides a circuit board manufactured by the circuit board manufacturing method described in the first aspect.

[0027] The circuit board adopts any one or more embodiments of the circuit board manufacturing method described above, and therefore has the beneficial effects of the embodiments described above, which will not be repeated here.

[0028] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of a circuit board before the first hole is plugged in the prior art.

[0031] Figure 2 yes Figure 1 A schematic diagram of the circuit board after the first hole is plugged.

[0032] Figure 3 This is a schematic diagram of the structure of the via patch covering the circuit board according to some embodiments of this application;

[0033] Figure 4 This is a schematic diagram of the structure of a plugging pad covering a circuit board in the prior art;

[0034] Figure 5 This is a schematic diagram of the structure of a plugging pad covering a circuit board according to some embodiments of this application;

[0035] Figure 6 This is a schematic diagram of a vertically placed circuit board in the prior art;

[0036] Figure 7 This is a schematic diagram of a vertically placed circuit board structure provided in some embodiments of this application;

[0037] Figure 8 This is a schematic diagram of the resin or ink penetration direction when a circuit board is placed vertically in the prior art.

[0038] Figure 9 This is a schematic diagram of the structure of adding auxiliary holes to the plug plate according to some embodiments of this application;

[0039] Figure 10 This is a schematic diagram of the resin or ink penetration direction when the circuit board is placed vertically according to some embodiments of this application;

[0040] Figure 11 yes Figure 10 A schematic diagram of the structure of the resin or ink after grinding.

[0041] The markings in the diagram mean:

[0042] 10. Circuit board;

[0043] 11. First hole; 11a. Non-risk hole; 11b. Risk hole;

[0044] 12. Second hole;

[0045] 13. Copper surface;

[0046] 14. Hole copper;

[0047] 15. Dielectric layer;

[0048] 16. Resin;

[0049] 20. Plug plate;

[0050] 21. Injection hole; 21a. First injection hole; 21b. Second injection hole;

[0051] 22. Auxiliary holes;

[0052] 30. Hole plugging gasket;

[0053] 31. Ventilation holes. Detailed Implementation

[0054] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0056] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0057] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0058] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0059] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0060] In the description of the embodiments of this application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0061] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0062] The product has N layers. Taking N=2 as an example, please refer to... Figure 1 The circuit board 10 includes a dielectric layer 15 and two copper surface layers 13, which are located on opposite sides of the dielectric layer 15 in the thickness direction. A single drilling operation drills both a first hole 11 and a second hole 12. The first hole 11 needs to be plugged, for example, using resin 16 or ink. The second hole 12 is an NPTH hole and does not need to be plugged. Furthermore, after the first hole 11 is plugged, the copper 14 of the second hole 12 needs to be etched away.

[0063] Please refer to Figure 2 When plugging the first hole 11, if the distance between the first hole 11 and the second hole 12 is small, the resin 16 or ink can easily seep into the second hole 12. The seeped resin 16 or ink prevents the copper 14 of the second hole 12 from being completely etched away, resulting in residual copper at the opening of the second hole 12, which affects the quality of the product.

[0064] Analysis shows that the resin 16 or ink seeps into the second hole 12 mainly from the plug end and the baking plate end. The following analysis will focus on these two aspects.

[0065] Plug end: Please refer to Figure 3 and Figure 4During hole plugging, a plugging plate 20 and a plugging pad 30 are respectively provided on the upper and lower sides of the circuit board 10. The plugging pad 30 is fixed on the hole plugging machine. Resin 16 or ink enters the first hole 11 of the circuit board 10 through the injection hole 21 drilled by the plugging plate 20. At the same time, a vent hole 31 is drilled on the plugging pad 30 at the position corresponding to the first hole 11 to ensure the air permeability of the first hole 11 during plugging, so that the resin 16 or ink can penetrate into the first hole 11 more easily. Whether there is oil leakage at the plugged end is mainly related to the degree of diffusion and the degree of misalignment of the resin 16 or ink. Among them, the degree of diffusion of the resin 16 or ink is mainly related to the design of the plugging plate 20 and the plugging pad 30, and the degree of misalignment of the resin 16 or ink is mainly related to the manual alignment during hole plugging.

[0066] Baking plate end: Please refer to Figure 6 and Figure 8 The plugging process involves plugging the holes → baking the insert → grinding → plugging inspection. After plugging, the insert needs to be baked. The viscosity of the resin 16 or ink gradually decreases as the temperature rises. When the temperature rises to a certain range, such as above 35℃, the viscosity decreases, and the resin 16 or ink has good fluidity. When the second hole 12 is located below the first hole 11, the resin 16 or ink will penetrate into the second hole 12 due to gravity.

[0067] To address the issue that resin 16 or ink can easily seep into holes that do not require plugging, this application proposes a circuit board manufacturing method and a circuit board.

[0068] The first aspect of this application provides a method for manufacturing a circuit board. Please refer to... Figure 1 and Figure 3 Circuit board manufacturing methods include:

[0069] Drill a first hole 11 that needs to be plugged and a second hole 12 that does not need to be plugged on the circuit board 10, and then perform copper plating and electroplating.

[0070] A plugging plate 20 is placed on the first side of the circuit board 10. The plugging plate 20 has a plurality of injection holes 21 arranged corresponding to the first hole 11.

[0071] At least one injection hole 21 is a first injection hole 21a, the distance between the first hole 11 and the second hole 12 corresponding to the first injection hole 21a is greater than a set distance W, and the radius of the first injection hole 21a is larger than the radius of the first hole 11; and at least one injection hole 21 is a second injection hole 21b, the distance between the first hole 11 and the second hole 12 corresponding to the second injection hole 21b is less than or equal to the set distance W, the radius of the second injection hole 21b is larger than the radius of the first hole 11, and the radius of the second injection hole 21b is smaller than the radius of the first injection hole 21a.

[0072] The first hole 11 that needs to be plugged can be understood as the first hole 11 needing to be plugged with resin 16 or ink. Optionally, the first hole 11 is a PTH hole. There are multiple first holes 11.

[0073] The second hole 12 that does not require plugging can be understood as not needing to be plugged with resin 16 or ink. Optionally, the second hole 12 is an NPTH hole. The number of second holes 12 can be one or more.

[0074] Optionally, the plugging plate 20 is a plugging aluminum plate.

[0075] The plugging sheet 20 is placed over the first side of the circuit board 10, which can be understood as the upper side of the circuit board 10. During plugging, resin 16 or ink enters the first hole 11 through the injection hole 21.

[0076] The setting distance W varies depending on the thickness of the circuit board 10 and the density of the holes. (When the substrate has a dense distribution of holes to be filled, the resin 16 or ink is more likely to accumulate. The thicker the board and the larger the thickness-to-diameter ratio, the greater the amount of resin 16 or ink required, and the larger W needs to be). Optionally, the setting distance W is between 0.6-0.9 mm. For example, the setting distance W can be 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm.

[0077] Optionally, the radius R1 of the first injection hole 21a is 0.15-0.2mm larger than the radius R of the first hole 11, that is, R1=R+(0.15-0.2mm), or R1=R+0.15mm, and the radius R1 of the first injection hole 21a is the radius of the injection hole 21 that is conventionally plugged.

[0078] Optionally, the radius R2 of the second injection hole 21b is 0.05-0.1mm larger than the radius R of the first hole 11, i.e., R2 = R + (0.05-0.1mm). Alternatively, R2 = R + 0.1mm. The radius R2 of the second injection hole 21b is smaller than the radius R1 of the first injection hole 21a, i.e., the radius R2 of the second injection hole 21b is smaller than the radius of the injection hole 21 that is conventionally plugged. This can reduce the amount of resin 16 or ink applied, and reduce the risk of resin 16 or ink seeping into the second hole 12.

[0079] It is understood that the number of first injection holes 21a can be one or more, and the number of second injection holes 21b can be one or more.

[0080] The beneficial effects of the circuit board manufacturing method provided in this application embodiment are as follows: when plugging the first hole 11, if the distance between the first hole 11 and the second hole 12 is greater than the set distance W, the resin 16 or ink will not easily penetrate into the second hole 12; if the distance between the first hole 11 and the second hole 12 is less than or equal to the set distance W, the resin 16 or ink will easily penetrate into the second hole 12. Therefore, when the distance between the first hole 11 and the second hole 12 is greater than the set distance W, the radius R1 of the first injection hole 21a can be adjusted normally, meaning the radius R1 of the first injection hole 21a is larger than the radius R of the first hole 11, allowing the resin 16 and ink to flow normally. When the distance between the first hole 11 and the second hole 12 is less than or equal to the set distance W, the radius of the second injection hole 21b can be reduced, meaning the radius R2 of the second injection hole 21b is larger than the radius R of the first hole 11, and the radius R2 of the second injection hole 21b is larger than the radius R1 of the first injection hole 21a, reducing the amount of resin 16 or ink flowing and lowering the risk of resin 16 or ink seeping into the second hole 12. This solves the problem of resin 16 or ink easily seeping into holes that do not need to be plugged.

[0081] Please refer to Figure 4 and Figure 5 In some embodiments, when the plugging sheet 20 is covered on the first side of the circuit board 10, the plugging pad 30 is covered on the second side of the circuit board 10; the plugging pad 30 has a plurality of vent holes 31 arranged corresponding to the first hole 11, and the vent holes 31 are tangent to the second hole 12.

[0082] The via plug 20 covers the first side of the circuit board 10, and the via plug 30 covers the second side of the circuit board 10. This can be understood as the via plug 20 and the via plug 30 being located on opposite sides of the thickness direction of the circuit board 10. During via plugging, the via plug 20 is positioned above the circuit board 10, and the via plug 30 is positioned below the circuit board 10.

[0083] Typically, the size of the vent hole 31 of the plugging pad 30 is determined based on the structure of the circuit board 10. To improve the misalignment caused by the misalignment between the plugging pad 30 and the plugging plate 20, the diameter of the vent hole 31 is usually designed with a radius R3 = R + (0.6-0.9 mm), optionally R3 = R + 0.8 mm. However, when the distance between the first hole 11 and the second hole 12 is close, the position of the vent hole 31 of the plugging pad 30 will overlap with the position of the second hole 12, such as... Figure 4 As shown, resin 16 or ink can easily penetrate into the second hole 12.

[0084] By adjusting the diameter of the vent hole 31 of the plugging pad 30 or moving the position of the vent hole 31, the position of the vent hole 31 of the plugging pad 30 is made tangent to the position of the second hole 12, such as... Figure 5As shown. When plugging the hole, because the area below the second hole 12 is not drilled through, the risk of resin 16 or ink seeping into the second hole 12 is reduced.

[0085] In other embodiments, the position of the vent hole 31 of the plugging pad 30 can be adjusted or the position of the vent hole 31 can be moved so that the position of the vent hole 31 of the plugging pad 30 is separated from the position of the second hole 12.

[0086] Please refer to Figure 6 and Figure 7 In some embodiments, after plugging the first hole 11, the baking plate is placed vertically, and all the first holes 11 are non-risk holes 11a, wherein the non-risk holes 11a are below the second hole 12; and / or, the non-risk holes 11a are diagonally below the second hole 12; and / or, the non-risk holes 11a are diagonally above the second hole 12, and the vertical projection of the non-risk holes 11a does not coincide with the vertical projection of the second hole 12.

[0087] Vertical refers to Figure 6 The X direction in the equation.

[0088] It is understood that a non-risk hole 11a is provided below, diagonally below, or diagonally above the second hole 12; or, a non-risk hole 11a is provided below and diagonally below the second hole 12; or, a non-risk hole 11a is provided below and diagonally above the second hole 12; or, a non-risk hole 11a is provided diagonally below and diagonally above the second hole 12; or, a non-risk hole 11a is provided below, diagonally below, and diagonally above the second hole 12.

[0089] During baking, resin 16 or ink will seep from top to bottom due to gravity, such as... Figure 6 As shown, the two units on the left will not have the risk of resin 16 or ink seeping into the second hole 12, that is, the first hole 11 of the left unit is a non-risk hole 11a; however, the two units on the right have the risk of resin 16 or ink seeping into the second hole 12, and some of the first holes 11 of the right unit are non-risk holes 11a, while some of the first holes 11 are risk holes 11b.

[0090] Therefore, by adjusting the layout orientation, all units are arranged according to... Figure 6 Insert the plate into the unit on the left side, such as... Figure 7 As shown, there is no risk of resin 16 or ink seeping into the second hole 12 in any of the units.

[0091] Please refer to Figure 8 and Figure 9In some embodiments, when the second hole 12 is surrounded by the first hole 11, regardless of the layout orientation, there is a risk that some resin 16 or ink will seep into the second hole 12. That is, part of the first hole 11 is a non-risk hole 11a, wherein the non-risk hole 11a is below the second hole 12; and / or, the non-risk hole 11a is diagonally below the second hole 12; and / or, the non-risk hole 11a is diagonally above the second hole 12, and the vertical projection of the non-risk hole 11a does not coincide with the vertical projection of the second hole 12.

[0092] Part of the first hole 11 is a risk hole 11b, wherein the risk hole 11b is located above the second hole 12; and / or, the risk hole 11b is located diagonally above the second hole 12, and the vertical projection of the risk hole 11b at least partially coincides with the vertical projection of the second hole 12.

[0093] The plug plate 20 also has an auxiliary hole 22, which is located between the two injection holes 21 corresponding to the non-risk hole 11a and the risk hole 11b. The non-risk hole 11a is located below or diagonally below the auxiliary hole 22.

[0094] By setting the auxiliary hole 22, the resin 16 or ink can be allowed to seep from the risk hole 11b into the non-risk area through the water droplet polymerization effect, so as to prevent the resin 16 or ink from seeping into the second hole 12.

[0095] The water droplet coalescence effect refers to the phenomenon where two or more water droplets gradually merge together when they approach each other, driven by surface tension and intermolecular forces. This is a natural tendency for liquids to minimize their surface energy. Due to intermolecular forces (such as van der Waals forces), a layer of "elastic film" forms on the liquid surface, causing the water droplets to tend towards a spherical shape (minimizing surface area).

[0096] When baking the plate, especially when the temperature rises to 35°C, the viscosity of resin 16 or ink decreases and the fluidity of resin 16 or ink is better. At this time, the resin 16 or ink at the opening of the first hole 11 at different positions is treated as water droplets.

[0097] Without special treatment, resin 16 or ink may seep into the opening of the second hole 12 due to gravity. Figure 8 As shown; when an auxiliary hole 22 is provided between the risk hole 11b and the non-risk hole 11a, through the water droplet fusion effect, the resin 16 or ink, after polymerization, penetrates into the non-risk area and finally flows out from the bottom of the non-risk hole 11b, as shown. Figure 10 As shown, resin 16 or ink will not seep into the second hole 12 due to gravity.

[0098] In some embodiments, the radius R4 of the auxiliary hole 22 is 0.4-0.6 times the radius R of the first hole 11, i.e., R4 = R * (0.4-0.6); this avoids excessive oil seepage at the auxiliary hole 22 when plugging the hole. If the radius R4 of the auxiliary hole 22 is designed to be too large, because there is no corresponding through hole at that position to accommodate too much resin 16 or ink, oil seepage is likely to occur, and there is also a greater risk of oil seeping into the hole.

[0099] Optionally, the radius R4 of the auxiliary hole 22 is 0.5 times the radius R of the first hole 11. Of course, the radius R4 of the auxiliary hole 22 can also be 0.4 times or 0.6 times the radius R of the first hole 11.

[0100] Please refer to Figure 9 In some embodiments, the center of the auxiliary hole 22, the center of the non-risk hole 11a, and the center of the risk hole 11b lie on a circle centered on the center of the second hole 12.

[0101] This can be understood as the center of auxiliary hole 22, the center of non-risk hole 11a, and the center of risk hole 11b being at the same distance from the center of second hole 12.

[0102] Among them, the two injection holes 21 corresponding to the non-risk hole 11a and the risk hole 11b can both be the first injection hole 21a or both be the second injection hole 21b.

[0103] In some embodiments, the distance H2 between the auxiliary hole 22 and the risk hole 11b is 0.6-0.9 mm; the distance H3 between the auxiliary hole 22 and the non-risk hole 11b is 0.6-0.9 mm.

[0104] It is understandable that the distance H2 between the auxiliary hole 22 and the risk hole 11b can be 0.6mm, 0.7mm, 0.8mm or 0.9mm, etc.

[0105] It is understandable that the distance H3 between the auxiliary hole 22 and the non-risk hole 11a can be 0.6mm, 0.7mm, 0.8mm or 0.9mm, etc.

[0106] H2 and H3 can be the same or different. When H2 and H3 are the same, for example, H2 = H3 = 0.7 mm.

[0107] In some embodiments, when the distance H1 between the non-risk hole 11a and the risk hole 11b is large (e.g., when both H2 and H3 are greater than the upper limit of 0.9 mm), a plurality of auxiliary holes 22 are provided between the non-risk hole 11a and the risk hole 11b, and the spacing between two adjacent auxiliary holes 22 is 0.6-0.9 mm.

[0108] Among them, two, three, or four or more auxiliary holes 22 can be provided between the non-risk hole 11a and the risk hole 11b.

[0109] It is understandable that the spacing between two adjacent auxiliary holes 22 can be 0.6mm, 0.7mm, 0.8mm or 0.9mm, etc.

[0110] Please refer to Figure 11 In some embodiments, after the resin 16 or ink has fully cured, a grinding machine is used to remove the resin 16 or ink around the first hole 11 and the residual resin 16 or ink in the area of ​​the auxiliary hole 22, leaving only the resin 16 or ink at the first hole 11. The surface of the plugged plate is inspected using an optical inspection machine to obtain a plugged plate with the first hole 11 intact and no resin 16 or ink seeping into the second hole 12.

[0111] The circuit board manufacturing method provided in this application embodiment is as follows: pre-process (material cutting, inner layer circuit, AOI, lamination, drilling target, milling edge) → drilling (including the first hole 11 that needs to be plugged and the second hole 12 that does not need to be plugged) → copper plating → plugging → plugging baking board → plugging grinding → outer layer circuit → post-process (AOI, solder mask, immersion gold, forming, testing).

[0112] Drilling: After the previous process is completed normally, the first hole 11 and the second hole 12 are drilled simultaneously using a mechanical drilling machine.

[0113] Copper plating and electroplating: First, a copper layer of 0.3 to 0.5 μm is deposited on the walls of the first hole 11 and the second hole 12 using copper plating equipment; after copper plating, the circuit board 10 is transferred to electroplating equipment for electroplating so that the thickness of the surface copper 13 and the hole copper 14 meets the requirements.

[0114] Hole plugging: The optimized hole plugging plate 20 and hole plugging pad 30 are used to plug the first hole 11. The optimized hole plugging tool can ensure that the amount of resin 16 or ink applied is reduced, making it less likely for resin 16 or ink to seep into the second hole 12. In addition, it needs to be confirmed that after optimizing the layout direction, all first holes 11 are non-risk holes 11a; when some first holes 11 are risk holes 11b, the hole plugging plate 20 is designed with auxiliary holes 22. When inserting the board, it is necessary to ensure that the auxiliary holes 22 are between the non-risk holes 11a and the risk holes 11b.

[0115] Hole-filling baking plate: After confirming that the insertion plate orientation is correct, bake the resin 16 or ink at the specified temperature. Before baking the hole-filling plate, remove the hole-filling sheet 20 and the hole-filling pad 30.

[0116] Hole plugging and grinding: After baking the plate, the excess resin 16 or ink on the copper surface is removed by grinding with a combination of abrasive belt + ceramic + non-woven cloth. This includes the resin 16 or ink after the hole plugging plate 20 adds auxiliary holes 22, resulting in the first hole 11 plugged by resin 16 or ink and the second hole 12 not penetrated by resin 16 or ink (at this time, the copper in the hole is not etched).

[0117] Outer layer circuit: When making the outer layer circuit, the position of the second hole 12 is not covered with dry film. When etching the outer layer circuit, the copper 14 of the second hole 12 can be etched to obtain the circuit layer, the first hole 11 of resin 16 or ink plug and the second hole 12 that is not penetrated by resin 16 or ink (at this time, the copper in the hole is etched).

[0118] After completing the following processes in sequence (AOI, solder mask, immersion gold, router, testing, FQC, FQA, packaging).

[0119] The circuit board manufacturing method provided in this application improves the penetration of resin 16 or ink into the second hole 12 by optimizing the design of the plugging plate 20 (adjusting the hole diameter) and the plugging pad 30. By adjusting the panel orientation and optimizing the plugging plate 20 (adding auxiliary holes 22), the penetration of resin 16 or ink into the second hole 12 by the baking end after plugging is also improved.

[0120] Through the above optimizations, the problem of resin 16 or ink seeping into the second hole 12 caused by the first hole 11 being too close to the second hole 12 can be solved without increasing costs.

[0121] The second aspect of this application provides a circuit board 10, which is manufactured by the circuit board manufacturing method described in the first aspect.

[0122] The circuit board 10 adopts any one or more embodiments of the circuit board manufacturing method described above, and thus has the beneficial effects of the embodiments described above, which will not be described in detail here.

[0123] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing a circuit board, characterized in that, include: Drill the first hole that needs to be plugged and the second hole that does not need to be plugged on the circuit board, and then perform copper plating and electroplating. A plugging plate is placed over the first side of the circuit board. The plugging plate has a plurality of injection holes arranged corresponding to the first hole. At least one of the injection holes is a first injection hole, the distance between the first hole and the second hole corresponding to the first injection hole is greater than a set distance, and the radius of the first injection hole is larger than the radius of the first hole; as well as, At least one of the injection holes is a second injection hole, the distance between the first hole and the second hole corresponding to the second injection hole is less than or equal to the set distance, the radius of the second injection hole is larger than the radius of the first hole, and the radius of the second injection hole is smaller than the radius of the first injection hole.

2. The circuit board manufacturing method as described in claim 1, characterized in that, The set distance is 0.6-0.9 mm; and / or, the radius of the first injection hole is 0.15-0.2 mm larger than the radius of the first hole, and the radius of the second injection hole is 0.05-0.1 mm larger than the radius of the first hole.

3. The circuit board manufacturing method as described in claim 1, characterized in that, After plugging the first hole, the baking plate is placed vertically. At least a portion of the first hole is a non-risk hole. The non-risk hole is located below the second hole; and / or, The non-risk hole is located diagonally below the second hole; and / or, The non-risk hole is located diagonally above the second hole, and the vertical projection of the non-risk hole does not coincide with the vertical projection of the second hole.

4. The circuit board manufacturing method as described in claim 3, characterized in that, Some of the first holes are non-risk holes, and some of the first holes are risk holes. The risk hole is located above the second hole; and / or, The risk hole is located diagonally above the second hole, and the vertical projection of the risk hole at least partially overlaps with the vertical projection of the second hole; The plug also has an auxiliary hole located between the two injection holes corresponding to the non-risk hole and the risk hole.

5. The circuit board manufacturing method as described in claim 4, characterized in that, The radius of the auxiliary hole is 0.4-0.6 times the radius of the first hole.

6. The circuit board manufacturing method as described in claim 4, characterized in that, The centers of the auxiliary hole, the non-risk hole, and the risk hole lie on a circle centered at the center of the second hole.

7. The circuit board manufacturing method as described in claim 4, characterized in that, The distance between the auxiliary hole and the risk hole is 0.6-0.9 mm; and / or, the distance between the auxiliary hole and the non-risk hole is 0.6-0.9 mm.

8. The circuit board manufacturing method as described in claim 7, characterized in that, Multiple auxiliary holes are provided between the non-risk holes and the risk holes, and the distance between two adjacent auxiliary holes is 0.6-0.9 mm.

9. The circuit board manufacturing method as described in claim 1, characterized in that, When the via-plugging sheet is placed over the first side of the circuit board, the via-plugging pad is placed over the second side of the circuit board; The plugging pad has a plurality of vent holes arranged corresponding to the first hole, and the vent holes are tangent to or separate from the second hole.

10. A circuit board, characterized in that, The circuit board is manufactured by the circuit board manufacturing method as described in any one of claims 1-9.

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