Semiconductor chip inkjet device

Abstract

The application discloses a kind of semiconductor chip ink-jet device, it is related to ink-jet processing technical field, including ink-jet component, including rack, the rack is equipped with conveying piece, including displacement clamp on rack, the fixed block is fixed on displacement clamp, fixed clamp is arranged in displacement clamp side, the top of the rack is equipped with ink-jet mechanism;And, feeding component, setting in rack side, including displacement plate on rack.The beneficial effects of the application are that through the setting of the feeding component, the template can be pre-clamped by the hollow plate and the carrier, and positioned and prevented from falling off by the limiting piece, ensuring the stability of the template placement, which is conducive to the template being sent into the conveying piece for transmission and achieving the purpose of shielding and covering, reducing the probability of contamination of the semiconductor chip on the template.

Description

Technical Field

[0001] This invention relates to the field of inkjet processing technology, and in particular to an inkjet device for semiconductor chips. Background Technology

[0002] Semiconductor chips are microelectronic devices made from semiconductor materials. In actual processing, inkjet devices (based on inkjet printing technology) precisely spray liquid flux in the form of micron-sized droplets onto the substrate surface, reducing the risk of defects caused by frequent contact between personnel and the product.

[0003] In existing inkjet devices, the workpieces containing multiple semiconductors are still manually fed in and clamped and transported by the device's own transport mechanism. The actual feeding is affected by human intervention, resulting in generally unstable feeding. It is also difficult to calibrate with the subsequent transport mechanism and cannot simultaneously clean the workpiece by blowing air, which affects the quality of subsequent inkjet processing. Summary of the Invention

[0004] In view of the problems existing in the above-mentioned semiconductor chip inkjet devices, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is that the feeding stability of inkjet devices in the prior art is generally affected by human intervention, and it is also impossible to simultaneously clean the workpiece by spraying, which affects the quality of subsequent inkjet processing.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a semiconductor chip inkjet device, comprising,

[0007] An inkjet assembly includes a frame, a conveyor mounted on the frame, a displacement clamp located on the frame, a locking block fixed to the displacement clamp, a fixing clamp on one side of the displacement clamp, and an inkjet mechanism located at the top of the frame; and...

[0008] A feeding assembly, located on one side of the frame, includes a displacement plate on the frame, a hollow plate on one side of the displacement plate, a screw embedded in the displacement plate, a receiving component on the top of the screw, a bearing component mounted on the screw, the bearing component including a fixed shell fixed to the frame, a displacement shell threadedly connected to the screw, a template placed inside the fixed shell, and a limiting component on the top of the hollow plate, the limiting component including an insert rod slidably connected to the hollow plate.

[0009] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, an electromagnetic nozzle is embedded in the displacement plate, the air outlet of the electromagnetic nozzle is connected to the air inlet of the hollow plate, and an arc groove is formed on the card block.

[0010] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, an annular inclined groove is provided at the bottom of the insertion rod, a spring is sleeved on the insertion rod, a protruding ring is fixed on the insertion rod, one end of the spring is fixed to the top of the hollow plate, and the other end of the spring is fixed to the insertion rod.

[0011] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, the template has a limiting hole at its top and slides with the insertion rod, and the template has a displacement groove at its top and communicates with the limiting hole.

[0012] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, the housing includes a fixed base located at the top of the screw, a housing sleeve rotatably connected to the fixed base, and a locking bolt threadedly connected to the top of the housing sleeve.

[0013] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, one end of the screw passes through the fixed shell and is rotatably connected to the fixed shell, one side of the fixed shell is fixed to the frame, one end of the screw passes through the displacement shell and is threadedly connected to the displacement shell, the displacement shell is slidably connected to the frame, and a bracket is fixed to one end of both the fixed shell and the displacement shell.

[0014] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, the bottoms of the two fixing bases are respectively fixed to the tops of the fixing shell and the displacement shell, and the hollow plate is slidably connected to the storage sleeve.

[0015] As a preferred embodiment of the semiconductor chip inkjet device of the present invention, wherein: an air jet hole is provided at the bottom of the hollow plate, a mold groove is provided at the top of the template, the air jet hole is located at the top of the mold groove, a first electrode seat is fixed on one side of the hollow plate, a second electrode seat is fixed on the frame and cooperates with the first electrode seat, and a bouncer is embedded on the frame and cooperates with the displacement plate.

[0016] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, the conveying component further includes a linear motor fixed on the frame, a support frame fixed to both the moving end of the linear motor and the frame, a belt conveyor mechanism being provided inside the support frame, an electric push rod being fixed on the frame, and a suction nozzle being fixed to the output end of the electric push rod.

[0017] In a preferred embodiment of the semiconductor chip inkjet device of the present invention, a three-dimensional running mechanism is provided on the top of the frame, a weighing mechanism is provided on the frame and located at the bottom of the inkjet mechanism, a positioning groove is provided on the weighing mechanism, and a controller is provided at the bottom of the frame.

[0018] The beneficial effects of this invention are as follows: by setting up the feeding component, it can be used in conjunction with the hollow plate and the carrier to pre-clamp the template, and with the limiting component to position and prevent it from falling off, ensuring the stability of the template placement, which is conducive to sending the template into the conveyor for transmission, and achieving the purpose of shielding and covering, reducing the probability of semiconductor chips on the template being contaminated. At the same time, when completing the template positioning operation, it can also achieve the purpose of spray cleaning, which is more in line with actual use requirements. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural diagram of a semiconductor chip inkjet device.

[0021] Figure 2 This is a structural diagram of the inkjet assembly in a semiconductor chip inkjet device.

[0022] Figure 3 Another perspective view of the partial structure of a semiconductor chip inkjet device.

[0023] Figure 4 This is a structural diagram of the displacement clamp and displacement plate of a semiconductor chip inkjet device.

[0024] Figure 5 This is a cross-sectional view of the displacement plate of a semiconductor chip inkjet device.

[0025] Figure 6 For semiconductor chip inkjet devices Figure 5 Enlarged view of point A in the middle.

[0026] Figure 7 This is a separate diagram of the hollow plate, template, and carrier of a semiconductor chip inkjet device.

[0027] Figure 8 This is a rear view of the hollow plate and displacement clamp of a semiconductor chip inkjet device.

[0028] Figure 9 This is a side sectional view of the displacement clamp, hollow plate, and template of a semiconductor chip inkjet device.

[0029] Figure 10 For semiconductor chip inkjet devices Figure 9 Enlarged view of section B in the middle.

[0030] Figure 11 This is a template structure diagram of a semiconductor chip inkjet device.

[0031] In the diagram: 1. Inkjet assembly; 11. Frame; 12. Conveyor; 12-1. Displacement clamp; 12-11. Locking block; 12-12. Arc groove; 12-2. Fixing clamp; 12-3. Support frame; 12-4. Belt transmission mechanism; 12-5. Electric push rod; 12-6. Nozzle; 12-7. Linear motor; 13. Inkjet mechanism; 14. Three-dimensional running mechanism; 15. Positioning groove; 16. Weighing mechanism; 17. Controller; 2. Feeding assembly; 21. Displacement plate; 21-1. Electromagnetic nozzle; 22. Hollow plate; 2 2-1 First electrode holder; 22-2 Air jet hole; 23 Rebound device; 24 Screw; 25 Storage component; 25-1 Fixed base; 25-2 Storage sleeve; 25-3 Locking bolt; 26 Second electrode holder; 27 Bearing component; 27-1 Fixed shell; 27-2 Displacement shell; 27-3 Bracket; 28 Template; 28-1 Mold groove; 28-2 Limiting hole; 28-3 Displacement groove; 29 Limiting component; 29-1 Insert rod; 29-11 Annular inclined groove; 29-2 Spring; 29-3 Protruding ring. Detailed Implementation

[0032] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0033] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0034] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0035] Example 1

[0036] Reference Figure 1 and Figure 2 This is the first embodiment of the present invention. This embodiment provides a semiconductor chip inkjet device, which includes an inkjet component 1 and a feeding component 2. By setting the feeding component 2, pre-clamping processing can be performed to ensure the stability of the workpiece placement, which is beneficial to the cooperation with the subsequent transmission mechanism and to achieve the purpose of shielding and covering, reducing the probability of semiconductor chip contamination. At the same time, when completing the positioning operation, the purpose of blowing and cleaning can also be achieved.

[0037] Specifically, the inkjet assembly 1 includes a frame 11, on which a conveyor 12 is mounted, including a displacement clamp 12-1 located on the frame 11, a locking block 12-11 fixed on the displacement clamp 12-1, a fixing clamp 12-2 provided on one side of the displacement clamp 12-1, and an inkjet mechanism 13 provided on the top of the frame 11.

[0038] The inkjet mechanism 13 includes an ink cartridge, a precision inkjet valve, and a printhead. The ink cartridge is used to store inkjet raw materials, and when the precision inkjet valve is opened, the printhead ejects the ink to process the semiconductor chip. The working principle of this part is existing technology and can be clearly understood by those skilled in the art, so it will not be described in detail here.

[0039] Specifically, the feeding assembly 2 is located on one side of the frame 11 and includes a displacement plate 21 on the frame 11. A hollow plate 22 is provided on one side of the displacement plate 21. A screw 24 is embedded in the displacement plate 21. A storage component 25 is provided on the top of the screw 24. A bearing component 27 is installed on the screw 24. The bearing component 27 includes a fixed shell 27-1 fixed to the frame 11. A displacement shell 27-2 is threadedly connected to the screw 24. A template 28 is placed inside the fixed shell 27-1. A limiting component 29 is provided on the top of the hollow plate 22. The limiting component 29 includes an insert rod 29-1 that is slidably connected to the hollow plate 22.

[0040] The storage component 25 allows for the positioning and storage of the hollow board 22, ensuring the stability of the hollow board 22 during installation.

[0041] By setting the support component 27, it can be flexibly adjusted according to the specifications of the template 28 to meet various template 28 placement requirements. It also has a simple structure and uses less material, thus reducing costs.

[0042] Example 2

[0043] Reference Figures 2 to 11 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0044] Specifically, an electromagnetic nozzle 21-1 is embedded in the displacement plate 21, and the air outlet of the electromagnetic nozzle 21-1 is connected to the air inlet on the hollow plate 22. An arc groove 12-12 is opened on the locking block 12-11.

[0045] The other end of the electromagnetic nozzle 21-1 is connected to the air outlet of the external ion gun. When the electromagnetic nozzle 21-1 is open and the external ion gun is working, the gas will enter the hollow plate 22 through the electromagnetic nozzle 21-1.

[0046] The bottom of the insertion rod 29-1 is provided with an annular inclined groove 29-11, a spring 29-2 is sleeved on the insertion rod 29-1, a protruding ring 29-3 is fixed on the insertion rod 29-1, one end of the spring 29-2 is fixed to the top of the hollow plate 22, and the other end of the spring 29-2 is fixed to the insertion rod 29-1.

[0047] The top of the template 28 has a limiting hole 28-2, which slides with the insertion rod 29-1. The top of the template 28 has a displacement groove 28-3, which communicates with the limiting hole 28-2.

[0048] The displacement groove 28-3 is designed to meet the sliding space requirements at the bottom of the insertion rod 29-1, which is beneficial for the stable separation of the template 28 and the limiting member 29.

[0049] The insertion rod 29-1 is T-shaped, and when inserted and locked to the template 28, it appears as shown in the attached diagram of the instruction manual. Figure 10 As shown, the smooth outer ring on the insertion rod 29-1 slides in contact with the limiting hole 28-2, while part of the annular inclined groove 29-11 is located inside the limiting hole 28-2 and does not contact the limiting hole 28-2.

[0050] As the displacement clamp 12-1 moves closer to the template 28, the arc groove 12-12 on the locking block 12-11 will contact the annular inclined groove 29-11, thereby squeezing the insertion rod 29-1 upward. This causes the smooth outer ring on the insertion rod 29-1 to no longer contact the limiting hole 28-2, while the annular inclined groove 29-11 contacts the inner wall of the limiting hole 28-2. The insertion rod 29-1 is then pushed out of the limiting hole 28-2, and the spring 29-2 is stretched.

[0051] Since the hollow plate 22 rotates around the fixed base 25-1, when the insertion rod 29-1 moves, the hollow plate 22 will also rotate and open to a certain angle under the action of the spring 29-2.

[0052] The storage component 25 includes a fixed base 25-1 located at the top of the screw 24, a storage sleeve 25-2 rotatably connected to the fixed base 25-1, and a locking bolt 25-3 threadedly connected to the top of the storage sleeve 25-2.

[0053] The bottom end of the locking bolt 25-3 is in close contact with the top of the hollow plate 22, which is used to lock the hollow plate 22 in the screwed-in state to ensure the installation stability of the hollow plate 22.

[0054] One end of the screw 24 passes through the fixed housing 27-1 and is rotatably connected to the fixed housing 27-1. One side of the fixed housing 27-1 is fixed to the frame 11. One end of the screw 24 passes through the displacement housing 27-2 and is threadedly connected to the displacement housing 27-2. The displacement housing 27-2 is slidably connected to the frame 11. One end of both the fixed housing 27-1 and the displacement housing 27-2 is fixed with a bracket 27-3.

[0055] The bottoms of the two fixed bases 25-1 are fixed to the tops of the fixed shell 27-1 and the displacement shell 27-2 respectively, and the hollow plate 22 is slidably connected inside the storage sleeve 25-2.

[0056] By setting the screw 24, the displacement shell 27-2 can slide and move when the drive screw 24 rotates, and the position of the fixed seat 25-1 on one side can be adjusted synchronously to adapt to hollow boards 22 and templates 28 of different specifications.

[0057] The hollow plate 22 has an air jet hole 22-2 at the bottom and a mold groove 28-1 at the top of the template 28. The air jet hole 22-2 is located at the top of the mold groove 28-1. A first electrode seat 22-1 is fixed on one side of the hollow plate 22. A second electrode seat 26 is fixed on the frame 11 and cooperates with the first electrode seat 22-1. A rebounder 23 is embedded on the frame 11 and cooperates with the displacement plate 21.

[0058] The mold groove 28-1 meets the space requirements for placing semiconductor chips. Through the cooperation of the jet hole 22-2 and the mold groove 28-1, gas can be sprayed onto the semiconductor chip in the mold groove 28-1 through the jet hole 22-2. Then, when the ion gun is working, the gas with positive and negative ions is evenly sprayed onto the semiconductor chip to achieve the purpose of electrostatic neutralization.

[0059] After neutralization, the electrostatic voltage on the semiconductor chip surface is significantly reduced (approaching zero), the adsorption force (electrostatic force) between dust and the surface disappears, and dust impurities are discharged with the airflow, ensuring the cleanliness of the semiconductor chip surface, which is beneficial for subsequent inkjet processing.

[0060] The conveyor 12 also includes a linear motor 12-7 fixed on the frame 11. The moving end of the linear motor 12-7 and the frame 11 are both fixed with a support frame 12-3. The support frame 12-3 is equipped with a belt transmission mechanism 12-4. An electric push rod 12-5 is fixed on the frame 11. A suction nozzle 12-6 is fixed at the output end of the electric push rod 12-5.

[0061] By setting the linear motor 12-7, the corresponding support frame 12-3 can be driven to move during operation, and then the displacement clamp 12-1 and the fixed clamp 12-2 cooperate to complete the clamping of the template 28.

[0062] The support frame 12-3 meets the installation space requirements for the belt transmission mechanism 12-4, which includes a transmission motor, pulleys and a transmission belt. The transmission motor is fixed on the support frame 12-3, the pulleys are rotatably connected to the support frame 12-3, and the transmission belt is sleeved between multiple pulleys to enable the multiple pulleys to drive and connect. The displacement clamp 12-1 and the fixed clamp 12-2 are fixed on the transmission belt.

[0063] With this design, when the transmission motor is working, the transmission belt will drive the displacement clamp 12-1 to move.

[0064] With the electric push rod 12-5 and the suction nozzle 12-6, the position of the suction nozzle 12-6 can be adjusted by the lifting and lowering of the electric push rod 12-5, and multiple semiconductor chips can be transferred to the next process when the suction nozzle 12-6 is adsorbing semiconductor chips.

[0065] The suction platform where the nozzle 12-6 is located is equipped with an electric heater, which is used to heat the semiconductor chip material during operation, which is beneficial to the smooth progress of subsequent inkjet printing processes.

[0066] A three-dimensional running mechanism 14 is provided on the top of the frame 11, and a weighing mechanism 16 is provided on the frame 11 and located at the bottom of the inkjet mechanism 13. A positioning groove 15 is provided on the weighing mechanism 16, and a controller 17 is provided at the bottom inside the frame 11.

[0067] The three-dimensional running mechanism 14 includes an X-axis linear motor, a Y-axis linear motor, and a Z-axis linear motor, used to flexibly adjust the position of the inkjet mechanism 13; the weighing mechanism 16 includes a horizontal calibration rod and a precision weigher, which can weigh the product and the amount of inkjet during the inkjet process, thereby controlling the opening and closing of the precise inkjet valve in the inkjet mechanism 13, which is beneficial to control the total amount of inkjet and ensure the quality of inkjet processing; the controller 17 can control the working status of various electrical equipment. The working principle of this part is all existing technology, which can be clearly understood by those skilled in the art, and will not be described in detail here.

[0068] The weighing mechanism 16 monitors the chip weight in real time, and the controller 17 dynamically adjusts the opening of the precision inkjet valve according to a preset threshold (such as ±0.1mg) to achieve closed-loop control of inkjet volume.

[0069] In use, the semiconductor chip material is placed into the mold groove 28-1. Then, the template 28 is positioned by the hollow plate 22 and the carrier 27 and moved into the frame 11. The displacement clamp 12-1 and the fixed clamp 12-2 complete the clamping and transfer of the template 28. Then, after being adsorbed by the suction nozzle 12-6, the electric push rod 12-5 is controlled to adjust the position of the template 28. Finally, with the assistance of the positioning groove 15, the inkjet mechanism 13 sprays the semiconductor material.

[0070] In the above process, firstly, according to the specifications of template 28, drive screw 24 to rotate, adjust the position of displacement shell 27-2 and corresponding fixed seat 25-1, so that fixed shell 27-1 and displacement shell 27-2 cooperate to complete the initial positioning and storage of template 28. At the same time, the two storage sleeves 25-2 cooperate to meet the storage space requirements of hollow board 22.

[0071] Insert the movable hollow plate 22 into the storage sleeve 25-2, and screw in the locking bolt 25-3 to lock the hollow plate 22 in place.

[0072] Rotating the hollow plate 22 will cause the storage sleeve 25-2 to rotate around the fixing base 25-1, pulling up the insertion rod 29-1. Adjusting the position of the bottom end of the insertion rod 29-1 will stretch the spring 29-2 until the hollow plate 22 rotates to a horizontal position, aligning the insertion rod 29-1 with the template 28. Releasing the insertion rod 29-1 will allow it to insert into the limiting hole 28-2 with the help of the spring 29-2, as shown in the attached diagram of the instruction manual. Figure 10 As shown, the bottom of the protruding ring 29-3 contacts the top of the template 28, repositioning the template 28.

[0073] After the hollow plate 22 is rotated and closed, its first electrode seat 22-1 will also contact the second electrode seat 26 and make the circuit conductive. Ion gas is sprayed onto the semiconductor material to achieve synchronous cleaning without the need for additional actions by the operator.

[0074] The operator can smoothly place the displacement plate 21 into the frame 11, and then control the corresponding belt transmission mechanism 12-4 to work, adjust the position of the displacement clamp 12-1 and the fixed clamp 12-2, and the fixed clamp 12-2 will contact one side of the template 28 first. Then, control the linear motor 12-7 to work, so that the displacement clamp 12-1 gradually approaches the template 28.

[0075] As the displacement clamping plate 12-1 moves, the locking block 12-11 gradually approaches the insertion rod 29-1 until the arc groove 12-12 slides into contact with the annular inclined groove 29-11, squeezing the insertion rod 29-1 upward. The spring 29-2 is stretched, and under the positioning of the fixed seat 25-1, the hollow plate 22 will rotate. The annular inclined groove 29-11 contacts the inner wall of the limiting hole 28-2, finally causing the insertion rod 29-1 to completely disengage from the limiting hole 28-2 and be placed into the displacement groove 28-3. The displacement clamping plate 12-1 and the fixed clamping plate 12-2 cooperate to complete the clamping of the template 28.

[0076] When the hollow plate 22 rotates to a certain angle, the first electrode seat 22-1 will separate from the second electrode seat 26, the electromagnetic nozzle 21-1 will automatically close, and the gas will no longer flow.

[0077] The belt conveyor mechanism 12-4 causes the displacement clamp 12-1 and the fixed clamp 12-2 to move synchronously, which allows the template 28 to detach from the fixed shell 27-1 and the displacement shell 27-2, thus completing a stable and convenient material conveying process.

[0078] Example 3

[0079] Reference Figures 3 to 11 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0080] Specifically, a sliding groove is provided on the frame 11, which slides in conjunction with the displacement shell 27-2. The screw 24 is rotatably connected in the sliding groove, and a handwheel is fixed at one end of the screw 24, which allows the operator to drive the screw 24 to rotate easily and effortlessly.

[0081] In practical applications, in order to facilitate the accurate movement of the displacement plate 21 into the frame 11 over a long distance, guide rails can be fixed on both sides of the displacement plate 21, and corresponding guide wheels can be placed on the frame 11 to improve the ease of operation.

[0082] Both the first electrode holder 22-1 and the second electrode holder 26 are composed of an insulating seat and a conductor. The conductor is embedded in the insulating seat. When the hollow plate 22 is rotated to a horizontal state, the first electrode holder 22-1 will contact the second electrode holder 26, so that the corresponding circuit is connected, while avoiding excessive rotation of the hollow plate 22.

[0083] A short pipe is fixed to the air inlet end of the hollow plate 22, which is connected to the electromagnetic nozzle 21-1 in the installed state.

[0084] The electromagnetic nozzle 21-1 includes a solenoid valve, a hose, and a fixed tube. The solenoid valve is normally closed and opens when in operation. It is fixed on the displacement plate 21 and connected in series with the circuit of the first electrode seat 22-1 and the second electrode seat 26. When the first electrode seat 22-1 and the second electrode seat 26 are in contact and conducting, the solenoid valve opens. The fixed tube is embedded in the storage sleeve 25-2 and connects with the short tube on the hollow plate 22. One end of the hose is connected to the solenoid valve and the other end is connected to the fixed tube. When the angle of the storage part 25 changes, the solenoid valve and the fixed tube can still be kept in a connected state.

[0085] A damping ring is provided between the fixed base 25-1 and the storage sleeve 25-2 to prevent the storage sleeve 25-2 from rotating freely without external force.

[0086] In practical applications, in order to ensure that the gas used by the ion gun can be uniformly sprayed from multiple mold slots 28-1, a gas distributor is installed in the template 28 to redistribute the flowing gas and ensure the uniformity of subsequent spraying of semiconductor materials.

[0087] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A semiconductor chip inkjet device, characterized in that: include, An inkjet assembly (1) includes a frame (11) on which a conveyor (12) is mounted, including a displacement clamp (12-1) located on the frame (11), a locking block (12-11) fixed on the displacement clamp (12-1), a fixing clamp (12-2) provided on one side of the displacement clamp (12-1), and an inkjet mechanism (13) provided on the top of the frame (11); and, The feeding assembly (2) is located on one side of the frame (11) and includes a displacement plate (21) on the frame (11). A hollow plate (22) is provided on one side of the displacement plate (21). A screw (24) is embedded in the displacement plate (21). A storage component (25) is provided on the top of the screw (24). A bearing component (27) is installed on the screw (24). The bearing component (27) includes a fixed shell (27-1) fixed on the frame (11). A displacement shell (27-2) is threaded on the screw (24). A template (28) is placed inside the fixed shell (27-1). A limiting component (29) is provided on the top of the hollow plate (22). The limiting component (29) includes a plug rod (29-1) slidably connected to the hollow plate (22). The displacement plate (21) is equipped with an electromagnetic nozzle (21-1), the outlet of the electromagnetic nozzle (21-1) is connected to the inlet of the hollow plate (22), and the card block (12-11) is provided with an arc groove (12-12). The bottom of the insertion rod (29-1) is provided with an annular inclined groove (29-11), a spring (29-2) is sleeved on the insertion rod (29-1), a protruding ring (29-3) is fixed on the insertion rod (29-1), one end of the spring (29-2) is fixed to the top of the hollow plate (22), and the other end of the spring (29-2) is fixed to the insertion rod (29-1); The template (28) has a limiting hole (28-2) at the top, which is slidably engaged with the insertion rod (29-1). The template (28) also has a displacement groove (28-3) at the top, which is connected to the limiting hole (28-2). The hollow plate (22) has an air jet hole (22-2) at the bottom, and the template (28) has a mold groove (28-1) at the top. The air jet hole (22-2) is located at the top of the mold groove (28-1). A first electrode seat (22-1) is fixed on one side of the hollow plate (22). A second electrode seat (26) is fixed on the frame (11) and cooperates with the first electrode seat (22-1). A rebounder (23) is embedded on the frame (11) and cooperates with the displacement plate (21). The conveying component (12) also includes a linear motor (12-7) fixed on the frame (11). The moving end of the linear motor (12-7) and the frame (11) are both fixed with a support frame (12-3). A belt transmission mechanism (12-4) is provided inside the support frame (12-3). An electric push rod (12-5) is fixed on the frame (11). A suction nozzle (12-6) is fixed at the output end of the electric push rod (12-5).

2. The semiconductor chip inkjet device as described in claim 1, characterized in that: The storage component (25) includes a fixed seat (25-1) located at the top of the screw (24), a storage sleeve (25-2) is rotatably connected to the fixed seat (25-1), and a locking bolt (25-3) is threadedly connected to the top of the storage sleeve (25-2).

3. The semiconductor chip inkjet device as described in claim 2, characterized in that: One end of the screw (24) passes through the fixed shell (27-1) and is rotatably connected to the fixed shell (27-1). One side of the fixed shell (27-1) is fixed to the frame (11). One end of the screw (24) passes through the displacement shell (27-2) and is threadedly connected to the displacement shell (27-2). The displacement shell (27-2) is slidably connected to the frame (11). One end of both the fixed shell (27-1) and the displacement shell (27-2) is fixed with a bracket (27-3).

4. The semiconductor chip inkjet device as described in claim 3, characterized in that: The bottoms of the two fixed seats (25-1) are fixed to the tops of the fixed shell (27-1) and the displacement shell (27-2), respectively, and the hollow plate (22) is slidably connected inside the storage sleeve (25-2).

5. The semiconductor chip inkjet device as described in claim 1, characterized in that: A three-dimensional running mechanism (14) is provided on the top of the frame (11), a weighing mechanism (16) is provided on the frame (11) and at the bottom of the inkjet mechanism (13), a positioning groove (15) is provided on the weighing mechanism (16), and a controller (17) is provided at the bottom of the frame (11).

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