Electronic device

Abstract

The application relates to the technical field of electronic products, and discloses an electronic device. The electronic device comprises a main body part and a decoration part arranged on the main body part, wherein the main body part and the decoration part jointly enclose a cavity, a wind channel shell is arranged in the cavity, the wind channel shell divides the cavity into a first cavity and a second cavity which are not communicated with each other, the first cavity is a closed cavity, the decoration part is used for forming the second cavity, and air inlets and outlets are arranged on the decoration part and are communicated with the second cavity and the outside of the electronic device. A normal projection of the first cavity on a first plane at least partially overlaps a normal projection of the second cavity on the first plane, and the first plane is parallel to the thickness direction of the electronic device. A heat dissipation device is arranged in the second cavity, and the heat dissipation device is used for dissipating heat of a heat source in the first cavity. The electronic device can simultaneously consider the heat dissipation effect, the reliability of sealing and waterproofing and the miniaturization design requirement.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] With increasingly demanding performance requirements for electronic devices, the power consumption of electronic components is rapidly increasing, leading to higher heat dissipation. Air-cooled heat dissipation solutions are gradually becoming the mainstream solution for electronic devices due to their excellent heat dissipation performance.

[0003] Currently, air-cooled heat dissipation devices are installed inside electronic devices. These devices have air inlets and outlets to allow airflow and thus heat dissipation. Furthermore, waterproof and breathable membranes are installed on the air inlets and outlets to prevent moisture from entering. However, these waterproof and breathable membranes can obstruct airflow, resulting in poor heat dissipation. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides an electronic device, including a heat dissipation device. By rationally arranging the position of the heat dissipation device, it is possible to simultaneously achieve heat dissipation effect, reliable sealing and waterproofing, and miniaturization design requirements.

[0005] This application provides an electronic device. The electronic device includes a main body and a decorative element disposed on the main body. The main body and the decorative element together form a cavity. A duct housing is provided within the cavity, dividing the cavity into a first cavity and a second cavity that are not interconnected. The first cavity is a sealed cavity. The decorative element forms the second cavity and has inlet and outlet vents connecting the second cavity to the outside of the electronic device. The orthographic projection of the first cavity onto a first plane at least partially overlaps with the orthographic projection of the second cavity onto a first plane, which is parallel to the thickness direction of the electronic device. A heat dissipation device is provided in the second cavity for dissipating heat from a heat source in the first cavity.

[0006] In the aforementioned electronic device, because the first cavity is a sealed cavity and the second cavity is an open cavity, and the first and second cavities are not connected, water from outside the electronic device can only flow within the second cavity, which is isolated from the first cavity, and cannot enter the first cavity. This allows the first cavity to provide a sealed and waterproof protection for the internal electronic components. Simultaneously, the open second cavity provides sufficient airflow for the heat dissipation device, effectively improving its heat dissipation performance. Furthermore, using existing structural components (e.g., decorative parts) to form the open second cavity does not increase the overall size of the electronic device. Additionally, the first and second cavities share a portion of their thickness, ensuring sufficient space within the second cavity to house the heat dissipation device without increasing the overall size of the electronic device, thus fully utilizing its internal space. In summary, this electronic device combines heat dissipation, miniaturization, and waterproof sealing.

[0007] In one possible implementation of the first aspect described above, the decorative element is a camera back cover. Thus, while forming the second cavity, the decorative element can also protect the camera and provide an aesthetically pleasing finish, making the electronic device more design-oriented.

[0008] In one possible implementation of the first aspect described above, the duct housing is a cylindrical structure, including a first end and a second end, both of which are open. The first end is sealed to the decorative element, and the second end is sealed to the main body. Thus, the main body and the duct housing together form a first cavity, and the main body, the decorative element, and the duct housing together form a second cavity.

[0009] In one possible implementation of the first aspect described above, the main body includes a back shell and a middle frame, the middle frame including a support plate and a frame surrounding the support plate. The back shell covers the frame and is sealed to the frame, and a first through hole is provided on the back shell, with a decorative element sealed to the first through hole. A first end of the duct housing is sealed to the decorative element, and a second end is sealed to the support plate.

[0010] In one possible implementation of the first aspect described above, the wall of the first through hole includes a first arc-shaped wall, and the decorative element includes a second arc-shaped wall. The first arc-shaped wall surrounds the outer periphery of the second arc-shaped wall and together with the second arc-shaped wall, forms a waterproof adhesive receiving groove. Exemplarily, the waterproof adhesive receiving groove contains waterproof adhesive, thereby achieving a sealing and waterproofing function.

[0011] Because the waterproof adhesive receiving groove is formed by the first and second arc-shaped walls, its cross-section is also arc-shaped, allowing it to hold more waterproof adhesive and effectively improving the reliability of the connection between the main body and the decorative parts. Secondly, the first and second arc-shaped walls also make the transition between the main body and the decorative parts smoother, thus effectively improving the aesthetics and refinement of the joint between them.

[0012] In one possible implementation of the first aspect described above, the decorative element further includes a sealant-blocking wall connected to the second arc-shaped wall, the sealant-blocking wall being abutted against the first arc-shaped wall to prevent the waterproof adhesive from leaking from the waterproof adhesive receiving groove.

[0013] In one possible implementation of the first aspect mentioned above, the hardness of the material of the adhesive barrier is less than the hardness of the material of the second curved wall.

[0014] Because the material of the adhesive barrier is relatively soft, it can deform slightly during the pressure holding process after adhesive application to release stress. This effectively avoids the problem of concentrated force on the back shell caused by the decorative parts, which could lead to the back shell cracking, and further reduces the assembly difficulty.

[0015] In one possible implementation of the first aspect described above, the materials of the retaining wall and the second arc-shaped wall are nano-injection molded materials. That is, the second arc-shaped wall and the retaining wall can be integrally molded using a nano-injection molding process, which is less difficult to manufacture and results in a more reliable overall connection of the finished product. For example, the second arc-shaped wall can be made of metal, and the retaining wall can be made of plastic.

[0016] In one possible implementation of the first aspect mentioned above, the main body also includes a heat spreader plate, and a second through hole communicating with the second cavity is provided on the support plate of the middle frame. The heat spreader plate is located on the side of the support plate facing away from the back shell, and covers the second through hole and is sealed to the second through hole.

[0017] In this way, the heat spreader can be used to form a second cavity, which can transfer the heat from the heat source to the heat dissipation device located in the second cavity, and can also effectively diffuse the concentrated heat, thereby eliminating hot spots and equalizing the temperature, which plays an important role in the heat dissipation performance of electronic devices.

[0018] In one possible implementation of the first aspect described above, a slot adapted to the second end of the duct housing is provided on the support plate. The second end of the duct housing is inserted into the slot, and together with the slot, forms a waterproof adhesive receiving groove. Exemplarily, the waterproof adhesive receiving groove can contain waterproof adhesive, thereby achieving a sealing and waterproofing function.

[0019] It is understood that the aforementioned slot and the second end of the air duct housing are in a clearance fit. Therefore, the assembly precision (or positioning precision) requirements between the slot and the second end of the air duct housing are not high, making assembly easier. Furthermore, the slot effectively prevents waterproof adhesive from leaking from the waterproof adhesive receiving groove to the screen side, ensuring excellent sealing reliability.

[0020] In one possible implementation of the first aspect described above, the opening of the slot is chamfered. This allows the second end of the duct housing to be easily inserted into the slot during the assembly of the duct housing and the middle frame, thus reducing the difficulty of assembling the duct housing and the middle frame.

[0021] In one possible implementation of the first aspect described above, the decorative element protrudes relative to the back cover along the thickness direction of the electronic device. This allows for a larger volume of the second cavity to accommodate a larger, more efficient heat dissipation device, thereby further improving heat dissipation.

[0022] In one possible implementation of the first aspect described above, the duct housing has a groove-shaped structure, including a first end and a second end. The first end is a groove opening facing the decorative element and sealed to it. The second end is a groove bottom wall facing the main body. Thus, the main body and the duct housing together form a first cavity, and the decorative element and the duct housing together form a second cavity.

[0023] Because the duct housing has a recessed structure, it only needs to be sealed at its first end to the decorative element to form a sealed second cavity, without needing to be sealed to the main body. Furthermore, there is no need for sealing connections between other components within the main body (e.g., between the heat spreader and the middle frame). This reduces two sealing paths: the sealing path between the duct housing and the main body, and the sealing path between other components within the main body (e.g., between the heat spreader and the middle frame), thereby further improving the waterproof sealing effect.

[0024] In one possible implementation of the first aspect described above, the electronic device further includes a battery and a connecting circuit board. The battery is disposed within the first cavity, and the connecting circuit board is used to electrically connect a heat dissipation device to the battery.

[0025] Based on this, the heat dissipation device can be powered by the electronic device's own battery without the need for an external power source, making it simpler and more convenient to use and better suited for various application scenarios.

[0026] In one possible implementation of the first aspect described above, a third through hole is provided on the duct housing, and a connecting circuit board extends from the first cavity to the second cavity through the third through hole, with the third through hole and the connecting circuit board being sealed together. For example, the gap between the connecting circuit board and the third through hole is filled with waterproof adhesive to achieve a waterproof seal.

[0027] The size of the third through hole can be set as small as possible, just enough to allow the circuit board to pass through. This reduces the size of the waterproof space that needs to be sealed, thereby further improving the waterproof effect.

[0028] In one possible implementation of the first aspect mentioned above, the first cavity is provided with a motherboard, which can control the working state of the heat dissipation device, such as starting and stopping the heat dissipation device, or adjusting the heat dissipation intensity of the heat dissipation device, so that the heat dissipation device can better meet the heat dissipation needs under different application scenarios.

[0029] In one possible implementation of the first aspect described above, the heat dissipation device includes a cooling fan. The cooling fan is capable of blowing heat from the heat source to the outside of the electronic device, thereby achieving heat dissipation. Attached Figure Description

[0030] Figure 1 An exemplary structure of a mobile phone in some embodiments is shown, which is a front view of the mobile phone;

[0031] Figure 2 An exemplary structure of another mobile phone in some embodiments is shown, which is a side view of the mobile phone;

[0032] Figure 3A A perspective view of the mobile phone in an embodiment of this application is shown;

[0033] Figure 3B The mobile phone edge shown in the embodiment of this application is illustrated. Figure 3A A sectional view of section AA in the middle;

[0034] Figure 4 An exemplary structure of a mobile phone without a heat dissipation device is shown in an embodiment of this application;

[0035] Figure 5A The mobile phone edge shown in the embodiment of this application is illustrated. Figure 3A A cross-sectional view of section AA, where the motherboard and heat sink are not shown;

[0036] Figure 5B according to Figure 5A An exploded view of the mobile phone in an embodiment of this application is shown;

[0037] Figure 6 An exemplary structure of a heat dissipation module in a mobile phone is shown in an embodiment of this application;

[0038] Figure 7 This application illustrates a mobile phone in an embodiment of the mobile phone. Figure 5A A magnified view of a portion of region M1 in the middle;

[0039] Figure 8A This application illustrates a mobile phone in an embodiment of the mobile phone. Figure 7A magnified view of a section in the M2 region;

[0040] Figure 8B according to Figure 8A An exploded view of the main body and decorative parts of the mobile phone in an embodiment of this application is shown;

[0041] Figure 9A This application illustrates the mobile phone in an embodiment of the mobile phone. Figure 7 A magnified view of a portion of the M3 region;

[0042] Figure 9B according to Figure 9A An exploded view of the main body and air duct housing of the mobile phone in an embodiment of this application is shown;

[0043] Figure 10A This application illustrates a mobile phone in an embodiment of the mobile phone. Figure 3A A sectional view of section BB in the middle;

[0044] Figure 10B This application illustrates a mobile phone in an embodiment of the mobile phone. Figure 10A A sectional view of the CC section;

[0045] Figure 11A A cross-sectional view of mobile phone 1' in an embodiment of this application is shown;

[0046] Figure 11B according to Figure 11A An exploded view of mobile phone 1' in an embodiment of this application is shown. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0048] This application provides an electronic device including a heat dissipation device. The heat dissipation device includes a cooling fan for airflow to dissipate heat from heat sources within the electronic device.

[0049] It is understood that the electronic devices provided in this application include, but are not limited to, any of the following electronic devices that require heat dissipation and waterproofing: mobile phones, tablet computers, e-book readers, televisions, laptop computers, personal digital assistants (PDAs), personal computers (PCs), notebook computers, in-vehicle devices, and wearable devices. This application does not specifically limit these categories. Furthermore, it is understood that the heat source can be any of various electronic components, such as application processors (MAPs), radio frequency amplifiers (RFAs), power amplifiers (PAs), power management ICs (PMICs), chips (e.g., system-on-chips (SOCs)), central processing units (CPUs), or batteries.

[0050] For ease of description, the following text will use a mobile phone as an example and the motherboard as the heat source to describe this solution. The motherboard can integrate electronic components such as processors, memory and communication modules.

[0051] In some embodiments, the heat dissipation device is located inside the phone. Specifically, Figure 1 An exemplary structure of a mobile phone 1a in some embodiments is shown, and it is a front view of the mobile phone 1a. Reference Figure 1 The mobile phone 1a includes a motherboard 100a, a heat dissipation device 200a, and a housing 300a. The housing 300a forms a cavity S1a. The motherboard 100a is located at the top P1 of the cavity S1a. The heat dissipation device 200a is an air-cooled heat dissipation device, including a cooling fan 210a and heat dissipation fins 220a. The heat dissipation device 200a is located at the bottom P2 of the cavity S1a. A through-hole 310a is provided on the housing 300a at a position corresponding to the cooling fan 210a, serving as an air inlet and outlet. Based on this, the cooling fan 210a can drive air to flow between the inside and outside of the mobile phone 1a through the through-hole 310a, and the flowing air can carry away the heat absorbed by the heat dissipation fins 220a from the motherboard 100a through the heat-conducting plate 400a, thereby achieving heat dissipation for the motherboard 100a.

[0052] To provide a waterproof seal for the motherboard 100a, a waterproof and breathable membrane 320a is installed on the through-hole 310a, allowing the cavity S1a to be waterproof and breathable. However, the airflow rate of the waterproof and breathable membrane 320a per unit time is relatively small, which cannot meet the air intake and exhaust requirements of a normal air-cooled heat dissipation device 200a, resulting in poor heat dissipation performance of the heat dissipation device 200a.

[0053] Therefore, in some embodiments, the heat dissipation device is located on the outside of the phone. Specifically, Figure 2 An exemplary structure of another mobile phone 1b in some embodiments is shown, which is a side view of the mobile phone 1b. Reference Figure 2 The casing 300b of the mobile phone 1b forms a sealed cavity S1b, in which the motherboard 100b is housed. The front of the casing 300b is used to support the screen (not shown), while the back has an open cavity S2b, which is connected to the outside through a through-hole 230b. The cooling fan 210b and the heat dissipation fins 220b of the heat dissipation device 200b are both located in the cavity S2b, and airflow is achieved through the through-hole 230b.

[0054] In the above solution, since the heat dissipation device 200b is directly disposed outside the cavity S1b, the cavity S1b is not easily corroded by moisture, thus solving the problem of poor heat dissipation caused by the waterproof and breathable membrane. However, the heat dissipation device 200b will occupy a large amount of additional space (e.g., the thickness space along the Z direction), resulting in a larger overall size of the mobile phone 1b (e.g., the size of the mobile phone 1b along the Z direction), which is not conducive to the miniaturization design of the mobile phone 1b.

[0055] Based on this, this application provides an electronic device. This electronic device, through the rational arrangement of the heat dissipation device, can simultaneously achieve effective heat dissipation, reliable sealing and waterproofing, and miniaturization requirements. The following description uses a mobile phone as an example, with reference to the accompanying drawings, to detail the technical solution of this application.

[0056] Figure 3A and Figure 3B An exemplary structure of mobile phone 1 in an embodiment of this application is shown. Wherein, Figure 3A This is a 3D image of phone 1. Figure 3B For mobile phone 1 edge Figure 3A Cross-sectional view of section AA. (Reference) Figure 3A and Figure 3B The mobile phone 1 includes a main body 01 and decorative parts 02.

[0057] The main body 01 can generally have a cuboid structure. This cuboid structure can include both rectangular parallelepiped structures and structures approximating cuboids (for example, the outer surface of the cuboid structure can be partially concave or partially convex). The main body 01 can include a screen 11. When a user holds the main body 01, they can view videos, images, or perform other touch operations through the screen 11.

[0058] Decorative component 02 is provided on the main body 01 to ensure the appearance and performance of the mobile phone 1. For example Figure 3A and Figure 3B As shown, decorative element 02 can be disposed on the back of the main body 01 as a camera back cover to protect the rear camera (not shown), while also serving as an aesthetic decoration to make the back of the main body 01 more design-oriented. The back of the main body 01 can refer to the surface of the main body 01 facing away from the user when the user holds the main body 01 and faces the screen 11.

[0059] The main body 01 and the decorative part 02 together form a cavity S0. A duct housing 03 is provided in the cavity S0. The duct housing 03 divides the cavity S0 into a first cavity S1 and a second cavity S2.

[0060] The first cavity S1 is a sealed cavity. A motherboard 100 is housed within the first cavity S1. It can be understood that the first cavity S1 can serve as the main cavity of the mobile phone 1, and the components housed within it are not limited to the motherboard 100; it can also contain other electronic components for realizing the functions of the mobile phone 1, such as a battery and a camera, which will not be listed here.

[0061] The second cavity S2 is an open cavity. A heat dissipation device 200 is provided in the second cavity S2. The heat dissipation device 200 includes a cooling fan 210 and heat dissipation fins 220. It can be understood that the second cavity S2 is used to form an airflow channel to achieve heat dissipation of the motherboard 100 by the heat dissipation device 200.

[0062] For example, the decorative element 02 has a through hole 21, which connects the second cavity S2 and the outside of the mobile phone 1, serving as an air inlet and outlet. The cooling fan 210 can drive gas (e.g., air) to flow between the inside and outside of the mobile phone 1 through the through hole 21. Figure 3B An exemplary flow direction of gas is shown by a wavy dashed arrow. The flowing gas can carry away the heat absorbed by the heat sink fins 220 from the motherboard 100, thereby reducing the temperature of the heat sink fins 220 and achieving heat dissipation.

[0063] The first cavity S1 and the second cavity S2 are not connected to each other. Furthermore, the orthographic projection of the first cavity S1 onto the first plane F1 at least partially overlaps with the orthographic projection of the second cavity S2 onto the first plane F1. The first plane F1 is parallel to the thickness direction of the mobile phone 1 (e.g., ...). Figure 3B (As shown in the Z-direction). For example, in this embodiment, the first plane F1 can be the thickness direction and length direction of the mobile phone 1 (e.g., Figure 3A As shown in the X direction, or Figure 3B The first plane F1 is the plane perpendicular to the paper surface. In other embodiments, the first plane F1 can also be the thickness direction and width direction of the mobile phone 1 (e.g., Figure 3B The plane containing the X, Y, and Z directions (as shown in the Y direction). For example, the X, Y, and Z directions can be mutually perpendicular.

[0064] In the aforementioned mobile phone 1, since the first cavity S1 is a sealed cavity and the second cavity S2 is an open cavity, and the first cavity S1 and the second cavity S2 are not connected to each other, water outside the mobile phone 1 can only flow in the second cavity S2, which is isolated from the first cavity S1, and cannot enter the first cavity S1. This allows the first cavity S1 to provide a sealed and waterproof protection for its internal electronic components (e.g., the motherboard 100). Simultaneously, the open second cavity S2 can provide a sufficiently large airflow to the heat dissipation device 200, thereby effectively improving the heat dissipation effect of the heat dissipation device 200.

[0065] Secondly, by using existing structural components of the phone 1 (e.g., decorative component 02) to form an open second cavity S2, and by having the second cavity S2 and the first cavity S1 share a portion of their thickness, heat dissipation can be achieved without increasing the external dimensions of the phone 1. For example, Figure 4 An exemplary structure of a mobile phone 1c without a heat dissipation device 200 is shown in this embodiment of the application. (Comparison) Figure 3B and Figure 4 Compared to mobile phone 1c without a heat dissipation device, the only change in the appearance of mobile phone 1 with a heat dissipation device 200 is the addition of through holes 12 for forming air inlets and outlets on the decorative part 02, without increasing the external dimensions. Furthermore, the first cavity S1 and the second cavity S2 share a portion of their thickness. Therefore, without increasing the external dimensions of mobile phone 1, the second cavity S2 can have sufficient space to house the heat dissipation device 200, making full use of the internal space of mobile phone 1 and balancing its heat dissipation function with its miniaturized design.

[0066] Furthermore, the heat dissipation device 200 provided in this application can be positioned closer to the motherboard 100, thereby achieving better heat dissipation. For example, as described above... Figure 1As shown, to accommodate the layout of other components, the mobile phone 1a has a through hole 310a at the bottom position P2 as an air inlet and outlet. Therefore, the heat dissipation device 200a can only be placed close to the bottom position P2. The heat dissipation device 200a is far from the motherboard 100a, resulting in poor heat dissipation. In this application, however, the through hole 21 is opened on the decorative part 02 as an air inlet and outlet. Therefore, the position of the decorative part 02 can be flexibly adjusted according to the actual situation, so that the heat dissipation device 200 is closer to the motherboard 100 in the XY plane. Furthermore, the first cavity S1 and the second cavity S2 share a portion of the thickness space. Therefore, the heat dissipation device 200 in the second cavity S2 can also be closer to the motherboard 100 in the first cavity S1 in the Z direction, resulting in better heat dissipation.

[0067] It is understandable that the above Figure 3A and Figure 3B The location of the decorative element 02 is only schematically shown. In other embodiments, the decorative element 02 may also be located in other places on the main body 01 (e.g., the side, the front, etc.) as a back cover for other electronic components (e.g., fingerprint recognition module, etc.) in the mobile phone 1. Alternatively, in other embodiments, the decorative element 02 may only be used to decorate the mobile phone 1 and not to protect other components in the mobile phone 1; this application does not impose any limitations on this.

[0068] It can also be understood that the decorative element 02, while forming an open second cavity S2, can also work with other components to form a closed cavity to accommodate electronic components. For example, when the decorative element 02 is a camera back cover, it can also work with other housings to form a closed cavity to accommodate the camera, thereby providing waterproof protection for the camera. That is, the decorative element 02 can have a portion with through holes 21 to form an open second cavity S2, and another portion without through holes 21 to form a closed cavity. In some other embodiments, the decorative element 02 can also be used to form an open second cavity S2, but not to form other closed cavities; this application does not impose any limitations on this.

[0069] Furthermore, this application does not impose any restrictions on the shape of the decorative element 02. For example, in this embodiment, the overall shape of the decorative element 02 is similar to a cylinder. In other embodiments, the shape of the decorative element 02 can also be a cuboid, a hemisphere, a frustum, or other irregular shapes.

[0070] The following section, in conjunction with the accompanying drawings, further describes the specific implementation methods of the first cavity S1 and the second cavity S2 in mobile phone 1, as well as the specific implementation methods of sealing and waterproofing.

[0071] In some feasible solutions, the duct housing 03 can be a cylindrical structure extending along the Z direction, with its two ends sealed to the main body 01 and the decorative element 02, respectively, thereby dividing the cavity S0 into a first cavity S1 and a second cavity S2. The main body 01 and the duct housing 03 together form the first cavity S1, while the main body 01, the decorative element 02, and the duct housing 03 together form the second cavity S2.

[0072] For example, Figure 5A and Figure 5B This paper illustrates an exemplary structure of the first cavity S1 and the second cavity S2 in mobile phone 1 according to an embodiment of this application, wherein, Figure 5A For mobile phone 1 edge Figure 3A A cross-sectional view of section AA, where the motherboard 100 and heat sink 200 are not shown. Figure 5B This is an exploded view of phone 1. (Reference) Figure 5A and Figure 5B In some embodiments of this application, the main body 01 also includes a back shell 12, a middle frame 13, and a vapor chamber 14 (VC).

[0073] The back cover 12 is fitted onto the middle frame 13 and is sealed to the middle frame 13. A through hole 121 (as an example of a first through hole) is provided on the back cover 12. The through hole 121 extends through the back cover 12 in the Z direction. A decorative piece 02 is disposed within the through hole 121 and is sealed to the through hole 121. Exemplarily, the back cover 12 can serve as the battery back cover of the mobile phone 1, used to protect the battery (not shown) and other electronic components (e.g., the motherboard 100).

[0074] The mid-frame 13 includes a support plate 13a and a frame 13b. The support plate 13a is used to support electronic components (e.g., motherboard 100) and enhance the overall strength of the mobile phone 1. The frame 13b surrounds the support plate 13a and is used for a sealed connection with the screen 11 and the back cover 12.

[0075] A through-hole 131 (as an example of a second through-hole) is provided on the support plate 13a. The through-hole 131 extends through the middle frame 13 in the Z direction. The heat spreader 14 is located on the side of the support plate 13a facing away from the back cover 12, and covers the through-hole 131, and is sealed to the through-hole 131. In this way, the heat spreader 14 can be exposed through the through-hole 131. That is, when viewed along the direction from the back cover 12 to the middle frame 13, the part of the heat spreader 14 that is not covered by the middle frame 13 can be seen through the through-hole 131. The heat spreader 14 is a pump-free phase change heat dissipation device, which can effectively diffuse concentrated heat, thereby eliminating hot spots and equalizing the temperature, and plays an important role in the heat dissipation performance of the mobile phone 1.

[0076] Based on this, the back shell 12, middle frame 13, heat spreader 14 and decorative part 02 of the main body 01 together form cavity S0.

[0077] The duct housing 03 has a cylindrical structure and extends along the Z direction. Both the first end 31 and the second end 32 of the duct housing 03 are open openings. The first end 31 is sealed to the decorative element 02. The second end 32 is sealed to the support plate 13a of the middle frame 13. Thus, the cavity S0 can be divided into a first cavity S1 and a second cavity S2 by the duct housing 03. The back shell 12 of the main body 01, the middle frame 13, and the duct housing 03 together form the first cavity S1. The heat dissipation plate 14 of the main body 01, the decorative element 02, and the duct housing 03 together form the second cavity S2. It can be understood that the first cavity S1 is circumferentially disposed around the duct housing 03 on the outer periphery of the second cavity S2.

[0078] refer to Figure 3B and combined Figure 5A and Figure 5B The heat generated by the motherboard 100 in the first cavity S1 can be transferred to the heat spreader 14 through the support plate 13a of the middle frame 13. Since the heat spreader 14 is in contact with the heat dissipation fins 220, the heat spreader 14 can directly conduct heat to the heat dissipation fins 220 in the second cavity S2. Finally, the heat dissipation fan 210 dissipates the heat on the heat dissipation fins 220 to the outside of the mobile phone 1, thereby realizing the heat dissipation of the motherboard 100 by the heat dissipation device 200.

[0079] In some embodiments of this application, the second cavity S2 and the heat dissipation device 100 located in the second cavity S2 can jointly form a heat dissipation module. Figure 6 An exemplary structure of the heat dissipation module 04 in mobile phone 1 according to an embodiment of this application is shown. (Refer to...) Figure 6 and combined Figure 3A and Figure 3B , Figure 5A and Figure 5B The second cavity S2 is formed by the heat spreader 14 of the main body 01, the decorative part 02, and the air duct housing 03. Therefore, the heat spreader 14, decorative part 02, air duct housing 03, and heat dissipation device 200 of the main body 01 can jointly form a heat dissipation module 04. The modular heat dissipation module 04 facilitates rapid assembly, thereby effectively improving the assembly efficiency of the mobile phone 1. Furthermore, it can also achieve independent air tightness measurement, so as to check air tightness problems by module before assembling the mobile phone 1.

[0080] In some embodiments of this application, the decorative element 02 protrudes relative to the back shell 12 of the main body portion 01 along the Z direction. This results in a larger volume of the second cavity S2 to accommodate a larger, more efficient cooling fan 210 and cooling fins 220, thereby further improving heat dissipation.

[0081] In some embodiments of this application, the decorative element 02 may have multiple through holes 21 to form air inlets and outlets. This effectively increases the air inlet and outlet area, thereby improving the heat dissipation effect of the heat dissipation device 200. Comparing the mobile phone 1 provided in this application with the above-mentioned… Figure 1 The air inlet and outlet configuration of the mobile phone 1a in the example shown is such that a single through-hole 310a is provided as both the air inlet and outlet, and both are located on one side, resulting in a small air inlet and outlet area and poor heat dissipation. In contrast, the multiple through-holes 21 in the mobile phone 1 of this application can form a larger air inlet and outlet area, leading to better heat dissipation.

[0082] In some implementations, multiple through holes 21 are arranged around the outer peripheral surface of the decorative element 02. Alternatively, in other alternative implementations, the multiple through holes 21 may be formed in other places on the decorative element 02, such as on the end face of the decorative element 02. This application does not limit this, as long as the air intake and exhaust requirements of the heat dissipation device 200 can be met.

[0083] After introducing the exemplary structure of the first cavity S1 and the second cavity S2 of the mobile phone 1, the following describes, with reference to the accompanying drawings, the specific implementation method of sealing and waterproofing between the components in the mobile phone 1 that form the cavity S0, the first cavity S1 and the second cavity S2.

[0084] Figure 7 This application illustrates that mobile phone 1 in an embodiment of the present application... Figure 5A A magnified view of a portion of region M1. (Reference) Figure 7 In the main body 01, the screen 11 and the frame 13b of the middle frame 13 are sealed together by waterproof adhesive 310. The back shell 12 and the frame 13b of the middle frame 13 are sealed together by waterproof adhesive 310. The through hole 131 on the heat spreader 14 and the support plate 13a of the middle frame 13 are sealed together by waterproof adhesive 320. The decorative part 02 is sealed together with the back shell 12 of the main body 01 by waterproof adhesive 320, thus forming a cavity S0 together with the main body 01.

[0085] In some embodiments of this application, the main body 01 and the decorative element 02 can be sealed together by an arc-shaped wall. This can also be understood as the joint between the main body 01 and the decorative element 02 being rounded.

[0086] Specifically, Figure 8A and Figure 8B A schematic diagram showing the sealed connection between the decorative element 02 and the main body 01 in an embodiment of this application is shown, wherein, Figure 8A For mobile phone 1 Figure 7 A magnified view of a portion of region M2. Figure 8B for Figure 8AExploded view of the main body 01 and decorative part 02 of mobile phone 1. (Refer to 8A and...) Figure 8B The wall of the through hole 121 on the back shell 12 of the main body 01 includes a first arcuate wall 122. The first arcuate wall 122 protrudes relative to the planar portion 123 of the back shell 12 along the Z direction, making the portion of the back shell 12 near the through hole 121 resemble a crater. The decorative element 02 includes a second arcuate wall 22. Exemplarily, the curvature of the second arcuate wall 22 can be greater than that of the first arcuate wall 22. That is, the radius of curvature of the second arcuate wall 22 is smaller than that of the first arcuate wall 122. The first arcuate wall 122 surrounds the outer periphery of the second arcuate wall 22 and together with the second arcuate wall 22, forms a waterproof adhesive receiving groove 330. The waterproof adhesive receiving groove 330 contains waterproof adhesive 320, thereby achieving a sealing and waterproofing function.

[0087] Since the waterproof adhesive receiving groove 330 is formed by the first arc-shaped wall 122 and the second arc-shaped wall 121, its cross-section is also arc-shaped, allowing it to hold more waterproof adhesive 320, thereby effectively improving the connection reliability between the main body 01 and the decorative part 02. Secondly, the first arc-shaped wall 122 and the second arc-shaped wall 121 also make the transition between the main body 01 and the decorative part 02 smoother, thus effectively improving the aesthetics and refinement of the joint between the main body 01 and the decorative part 02.

[0088] In some embodiments of this application, the decorative element 02 further includes a sealant-retaining wall 23 connected to the second arc-shaped wall 22. The sealant-retaining wall 23 is abutted against the first arc-shaped wall 122 to prevent the waterproof adhesive 320 from leaking from the waterproof adhesive receiving groove 330. The hardness of the material of the sealant-retaining wall 23 is less than the hardness of the material of the second arc-shaped wall 22.

[0089] Because the material of the backing wall 23 has relatively low hardness, during the pressure holding process after the back shell 12 and the decorative part 02 are glued together with waterproof adhesive 320, the backing wall 23 can undergo slight deformation to release stress, thereby effectively avoiding the problem of the back shell 12 cracking due to the concentrated force exerted by the decorative part 02 on the back shell 12, and further reducing the assembly difficulty.

[0090] In some embodiments of this application, the materials of the second arc-shaped wall 22 and the adhesive-blocking wall 23 can be nano-molding technology (NMT) materials. That is, the second arc-shaped wall 22 and the adhesive-blocking wall 23 can be integrally molded using nano-molding technology, which has lower molding difficulty and better overall connection reliability of the finished product. For example, the second arc-shaped wall 22 can be made of metal, and the adhesive-blocking wall 23 can be made of plastic. Nano-molding is a process that combines metal and plastic using nanotechnology. First, the metal surface is nano-treated, and then the plastic is directly injection molded onto the metal surface, allowing the metal and plastic to be integrally formed.

[0091] In some embodiments of this application, waterproof adhesive 310 and waterproof adhesive 320 can be different types of adhesives to achieve better waterproofing for different types of structures. For example, the joint surfaces between the frame 13b of the middle frame 13 and the screen 11 and back shell 12 are mostly large flat surfaces, so waterproof adhesive 310 can be a solid waterproof adhesive. However, the joint gap between the through hole 131 on the support plate 13a of the middle frame 13 and the heat spreader 14 is small, and the joint gap between the decorative part 02 and the back shell 12 is an arc-shaped gap. Therefore, waterproof adhesive 320 can be a waterproof hot melt adhesive, which can more fully fill these irregular (e.g., arc-shaped) and narrow gaps, thereby effectively ensuring waterproof reliability.

[0092] In some embodiments of this application, the two ends of the air duct housing 02 can be sealed and connected to the support plate 13a of the middle frame 13 of the main body part 01 and the decorative part 02 respectively by waterproof adhesive 320, thereby dividing the cavity S0 into the first cavity S1 and the second cavity S2.

[0093] Continue to refer to Figure 8A and combined Figure 7 In some embodiments of this application, the joint surface between the first end 31 of the duct housing 03 and the decorative part 02 is approximately flat, and the waterproof adhesive 320 is disposed between the first end 31 and the decorative part 02 to glue the duct housing 03 and the decorative part 02 together, thereby achieving a sealed connection between the duct housing 03 and the decorative part 02.

[0094] Figure 9A and Figure 9B This illustration shows a schematic diagram of the sealed connection between the duct housing 03 and the main body portion 01 in an embodiment of this application. Figure 9A For mobile phone 1 in Figure 7 A magnified view of a portion of the M3 region. Figure 9B for Figure 9A Exploded view of the main body 01 and the air duct housing 03 of mobile phone 1. (Reference) Figure 9A and Figure 9BIn some embodiments of this application, the duct housing 03 and the main body 01 are connected by a slot seal.

[0095] Specifically, a slot 132 is provided on the support plate 13a of the middle frame 13. The slot 132 surrounds the outer periphery of the through hole 131 on the middle frame 13, and its opening faces the air duct housing 03. The slot 132 is adapted to the second end 32 of the air duct housing 03. For example, the second end 32 of the air duct housing 03 is in a plane perpendicular to the Z direction (i.e., the XY plane, for example). Figure 9A and Figure 9B The orthographic projection of the second plane F2 (shown in the diagram) is a rectangular ring. The orthographic projection of the slot 132 in the second plane F2 can also be a rectangular ring, and the slot width D1 of the slot 132 is slightly larger than the wall thickness D2 of the second end 32 of the air duct housing 03.

[0096] The second end 32 of the air duct housing 03 is inserted into the slot 132, and together with the slot 132, forms a waterproof adhesive receiving groove 340. The waterproof adhesive receiving groove 340 contains waterproof adhesive 320, thereby achieving a sealing and waterproofing function.

[0097] It is understood that the slot 132 and the second end 32 of the air duct housing 03 are in a clearance fit. Therefore, the assembly accuracy (or positioning accuracy) requirements between the slot 132 and the second end 32 of the air duct housing 03 are not high, making assembly easier. Furthermore, the slot 132 can effectively prevent the waterproof adhesive 320 from leaking from the waterproof adhesive receiving groove 340 to the screen side, ensuring excellent sealing reliability.

[0098] In some embodiments of this application, the slot 132 is further provided with a guide portion 133 for guiding the second end 32 of the air duct housing 03 into the slot 132 to reduce assembly difficulty.

[0099] Specifically, the guide portion 133 communicates with the slot 132, and the width of the guide portion 133 gradually increases in the direction away from the slot 132, giving it an overall trumpet-like shape. Alternatively, it can be understood that the opening of the slot 132 is chamfered (e.g., beveled or rounded). Thus, during the assembly of the air duct housing 03 and the middle frame 13, the second end 32 of the air duct housing 03 can be easily inserted into the guide portion 133, and then inserted into the slot 132 via the guide portion 133, making the assembly of the air duct housing 03 and the middle frame 13 easier.

[0100] In some embodiments of this application, the mobile phone 1 further includes a connecting circuit board for connecting the heat dissipation device 200 and the battery inside the mobile phone 1. In this way, the battery of the mobile phone 1 itself can power the heat dissipation device 200, eliminating the need for the heat dissipation device 200 to be connected to an external power source before heat dissipation. This makes it simple, convenient, and widely applicable.

[0101] Specifically, Figure 10A This application illustrates that mobile phone 1 in an embodiment of the present application... Figure 3A A sectional view of section BB in the middle. Figure 10B This application illustrates that mobile phone 1 in an embodiment of the present application... Figure 10A A sectional view of section CC. (Reference) Figure 10A and Figure 10B A battery 300 is housed in the first cavity S1. The battery 300 powers the electronic components (e.g., the motherboard 100) in the mobile phone 1 to ensure its normal operation. A through hole 33 is provided on the air duct housing 03 (as an example of a third through hole). A connecting circuit board 400 extends from the first cavity S1 to the second cavity S2 via the through hole 33. One end of the connecting circuit board 400 is electrically connected to the battery 300 located in the first cavity S1, and the other end is electrically connected (e.g., by spot welding) to the battery contacts inside the cooling fan 210 located in the second cavity S2. In this way, the battery 300 can transfer electrical energy to the cooling fan 210 through the connecting circuit board 400, ensuring that the cooling fan 210 can start normally to achieve heat dissipation.

[0102] Furthermore, the sealed connection between the connecting circuit board 400 and the through hole 33 ensures that the first cavity S1 and the second cavity S2 are not interconnected, thus ensuring the waterproof reliability of the mobile phone 1. For example Figures 10A-10B As shown, the gap between the connecting circuit board 400 and the through hole 33 is filled with waterproof adhesive 320 to achieve a waterproof sealing effect.

[0103] The size of the aforementioned through-hole 33 can be set as small as possible, just enough to allow the circuit board 400 to pass through. This reduces the size of the waterproof space that needs to be sealed, thereby further improving the waterproof effect.

[0104] Compare the mobile phone 1 provided in this application with the above-mentioned Figure 2 The heat dissipation device 200b in the illustrated mobile phone 1b is independently located on the outside of the phone 1b, requiring an external power source for heat dissipation, which is inconvenient and has limited applicability. In contrast, in this application, the heat dissipation device 200 is integrated inside the mobile phone 1, powered by the phone 1's own battery 300, eliminating the need for an external power source. This makes it simpler and more convenient to use, and better suited for various application scenarios.

[0105] In some embodiments of this application, the operating state of the cooling fan 210 can also be controlled by the motherboard 100 (e.g., starting or stopping the cooling fan 210 or adjusting the fan speed, etc.). Continuing to compare the mobile phone 1 provided in this application with the above-mentioned… Figure 2In the example shown, the heat dissipation device 200b in mobile phone 1b cannot directly control the start and stop of the cooling fan 210b through its internal motherboard 100b. This results in poor flexibility and limited applicability of the heat dissipation device 200b. In this application, however, the heat dissipation device 200 is integrated inside the mobile phone 1. The motherboard 100 can send different signals to the battery 300 to control the working state of the cooling fan 210, thereby enabling the heat dissipation device 200 to better meet the heat dissipation needs of different application scenarios. For example, the motherboard 100 can send a signal to the battery 300 instructing the cooling fan 210 to start. Upon receiving this signal, the battery 300 supplies power to the cooling fan 210, causing it to start working. Alternatively, the motherboard 100 can also send a signal to the battery 300 instructing the cooling fan 210 to stop. Upon receiving this signal, the battery 300 stops supplying power to the cooling fan 210, causing it to stop working. For example, the motherboard 100 can also send a signal to the battery 300 to instruct the cooling fan 210 to adjust its speed, so that the current supplied by the battery 300 to the cooling fan 210 increases or decreases, thereby controlling the speed of the cooling fan 210 to increase or decrease.

[0106] In some embodiments of this application, the connecting circuit board 400 can be a flexible printed circuit board (FPC). Flexible circuit boards are typically made of polyimide or polyester film as a substrate and have the characteristics of being able to be bent, folded and twisted freely, so as to make fuller use of the internal space of the mobile phone 1 for wiring.

[0107] It is understood that in the above embodiments, the back shell 12 and middle frame 13 of the main body 01, and the cylindrical air duct shell 03 together form the first cavity S1. The heat dissipation plate 14, decorative part 02, and cylindrical air duct shell 03 of the main body 01 together form the second cavity S2. This is only an illustrative example, and this application is not limited thereto. In other embodiments, the first cavity S1 may also be formed by other components of the main body 01 and the cylindrical air duct shell 03. Similarly, the second cavity S2 may also be formed by other components of the main body 01, the decorative part 02, and the cylindrical air duct shell 03.

[0108] For example, in some alternative embodiments, a through hole is provided on the support plate 13a of the middle frame 13 at a position corresponding to the motherboard 100, so that the heat spreader 14 can fit against the motherboard 100. Thus, the back shell 12, middle frame 13, heat spreader 14, and air duct shell 03 of the main body 01 form a first cavity S1. The heat generated by the motherboard 100 located in the first cavity S1 can be directly transferred to the heat spreader 14. The heat spreader 14 then transfers the heat to the heat dissipation fins 220, thereby facilitating heat dissipation from the motherboard 100 by the heat dissipation device 200.

[0109] For example, in some alternative embodiments, the through hole 131 may not be provided on the support plate 13a of the middle frame 13. That is, the heat spreader 14 and the heat dissipation fins 220 are separated by the support plate 13a. In this way, the middle frame 13, the decorative part 02, and the air duct housing 03 of the main body 01 form the second cavity S2. The heat dissipation fins 220 located in the second cavity S2 absorb heat from the heat spreader 14 through the middle frame 13, or directly absorb heat generated by the motherboard 100 through the middle frame 13, and then dissipate the heat to the outside of the mobile phone 1. In this way, one sealing path can be reduced: the sealing path between the heat spreader 14 and the support plate 13a of the middle frame 13, thereby further improving the waterproof sealing effect.

[0110] Figure 11A and Figure 11B This paper illustrates another exemplary structure of the first cavity S1 and the second cavity S2 in the mobile phone 1' according to an embodiment of this application, wherein, Figure 11A This is a cross-sectional view of phone 1'. Figure 11B This is an exploded view of mobile phone 1', where the heat dissipation device 200 is not shown.

[0111] and Figure 5A and Figure 5B Compared to the phone shown in Figure 1, Figure 11A and Figure 11B The difference in the mobile phone 1' shown is that the structure of the air duct housing 03 is different, which results in a different way of forming the second cavity S2 and a different number of sealing paths, which will be described in detail below with reference to the accompanying drawings.

[0112] refer to Figure 11A and Figure 11B The duct housing 03 has a groove-shaped structure, meaning that the first end 31 of the duct housing 03 includes an open opening 34, and the second end 32 is the bottom wall of the groove. The opening 34 faces the decorative part 02 and is sealed to the decorative part 02. The main body 01 and the duct housing 03 together form a first cavity S1. The decorative part 02 and the duct housing 03 together form a second cavity S2.

[0113] Since the air duct housing 03 has a groove-shaped structure, it only needs to be sealed to the decorative part 02 through the opening 34 to form a sealed second cavity S2, without needing to be sealed to the support plate 13a of the middle frame 13. Secondly, in the main body 01, only the screen 11 and the frame 13b of the middle frame 13 need to be sealed together, and the back cover 12 and the frame 13b of the middle frame 13 need to be sealed together to form a sealed first cavity S1 together with the air duct housing 13. The internal heat spreader 14 does not need to be sealed to the support plate 13a of the middle frame 13. That is, the mobile phone 1' can reduce two sealing paths: the sealing path between the heat spreader 14 and the support plate 13a of the middle frame 13, and the sealing path between the air duct housing 03 and the support plate 13a of the middle frame 13, thereby further improving the waterproof sealing effect.

[0114] The following describes several exemplary implementations of forming the first cavity S1.

[0115] Continue reading Figure 11A and Figure 11B In some implementations, the support plate 13a of the middle frame 13 does not have through holes. That is, when viewed from the back shell 12 toward the middle frame 13, the heat spreader 14 is completely blocked by the middle frame 13. Thus, the back shell 12, the middle frame 13, and the air duct shell 03 of the main body 01 together form the first cavity S1.

[0116] At this time, the heat generated by the motherboard 100 in the first cavity S1 can be transferred to the air duct housing 03 through the middle frame 13, and then the air duct housing 03 transfers the heat to the heat dissipation fins 220 in the second cavity S2. Subsequently, the heat dissipation fan 210 dissipates the heat on the heat dissipation fins 220 to the outside of the mobile phone 1, thereby realizing the heat dissipation device 200 dissipates heat from the motherboard 100. At the same time, the heat generated by the motherboard 100 can also be transferred to the heat spreader 14 through the middle frame 13. The heat spreader 14 can diffuse the concentrated heat, thereby eliminating hot spots and achieving temperature uniformity, which helps to dissipate heat.

[0117] In some other implementations, a through hole is provided on the support plate 13a of the middle frame 13. The heat spreader 14 can be exposed through the through hole to facilitate heat conduction. In this way, the screen 11, back shell 12, middle frame 13 and air duct shell 03 of the main body 01 together form the first cavity S1.

[0118] For example, a through hole can be provided on the support plate 13a of the middle frame 13 at the position corresponding to the motherboard 100, so that the heat spreader 14 can be attached to the motherboard 100. At this time, the heat generated by the motherboard 100 in the first cavity S1 can be diffused through the heat spreader 14, resulting in better heat dissipation.

[0119] For example, a through hole can also be provided on the support plate 13a of the middle frame 13 at the position corresponding to the bottom of the air duct housing 03, so that the heat dissipation plate 14 can fit in close to the air duct housing 03. At this time, the heat dissipation fins 220 located in the second cavity S2 can absorb the heat on the heat dissipation plate 14 through the air duct housing 03 and then dissipate the heat to the outside of the mobile phone 1'.

[0120] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0121] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0122] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0123] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, characterized in that, It includes a main body and a decorative element disposed on the main body, wherein the decorative element is a camera back cover, wherein: The main body and the decorative part together form a cavity. The cavity is provided with a duct shell, which divides the cavity into a first cavity and a second cavity that are not connected to each other. The first cavity is a closed cavity. The decorative part is used to form the second cavity, and the decorative part has an air inlet and an air outlet that connect the second cavity and the outside of the electronic device. The orthographic projection of the first cavity onto the first plane at least partially overlaps with the orthographic projection of the second cavity onto the first plane, and the first plane is parallel to the thickness direction of the electronic device; The second cavity is equipped with a heat dissipation device, which is used to dissipate heat from the heat source in the first cavity.

2. The electronic device according to claim 1, characterized in that, The air duct housing is a cylindrical structure, including a first end and a second end. Both the first end and the second end are open. The first end is sealed to the decorative part, and the second end is sealed to the main body.

3. The electronic device according to claim 2, characterized in that, The main body includes a back shell and a middle frame, the middle frame including a support plate and a frame surrounding the support plate; The back cover is placed on the frame and is sealed to the frame. A first through hole is provided on the back cover. The decorative piece is placed on the first through hole and is sealed to the first through hole. The first end of the air duct housing is sealed to the decorative element, and the second end is sealed to the support plate.

4. The electronic device according to claim 3, characterized in that, The wall of the first through hole includes a first arc-shaped wall, and the decorative element includes a second arc-shaped wall. The first arc-shaped wall surrounds the outer periphery of the second arc-shaped wall and together with the second arc-shaped wall forms a waterproof adhesive receiving groove.

5. The electronic device according to claim 4, characterized in that, The decorative component also includes a backing wall connected to the second arc-shaped wall, the backing wall being fitted to the first arc-shaped wall.

6. The electronic device according to claim 5, characterized in that, The hardness of the material of the adhesive barrier is less than that of the material of the second arc-shaped wall.

7. The electronic device according to claim 5, characterized in that, The adhesive barrier and the second arc-shaped wall are made of nano-injection molding material.

8. The electronic device according to claim 3, characterized in that, The main body also includes a heat spreader plate. The support plate of the middle frame has a second through hole that communicates with the second cavity. The heat spreader plate is located on the side of the support plate facing away from the back shell and covers the second through hole, and is sealed to the second through hole.

9. The electronic device according to claim 3, characterized in that, The support plate has a slot that matches the second end of the air duct housing. The second end of the air duct housing is inserted into the slot and together with the slot, forms a waterproof adhesive receiving groove.

10. The electronic device according to claim 9, characterized in that, The slot opening has a chamfer.

11. The electronic device according to claim 3, characterized in that, The decorative element protrudes relative to the back cover along the thickness direction of the electronic device.

12. The electronic device according to claim 1, characterized in that, The air duct housing has a groove-shaped structure, including a first end and a second end. The first end is the groove opening, facing the decorative piece and sealed to the decorative piece. The second end is the bottom wall of the groove, facing the main body.

13. The electronic device according to claim 1, characterized in that, The electronic device further includes a battery and a connecting circuit board, wherein the battery is disposed in the first cavity, and the connecting circuit board is used to electrically connect the heat dissipation device and the battery.

14. The electronic device according to claim 13, characterized in that, The air duct housing has a third through hole, and the connecting circuit board extends from the first cavity to the second cavity through the third through hole, and the third through hole is sealed to the connecting circuit board.

15. The electronic device according to claim 1, characterized in that, The first cavity is equipped with a motherboard, which can control the working status of the heat dissipation device.

16. The electronic device according to claim 1, characterized in that, The heat dissipation device includes a cooling fan.

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