Packaging method of purple light full-spectrum LED device and LED device

Abstract

The embodiment of the invention relates to the technical field of LED processing, and provides a purple light full-spectrum LED device packaging method and an LED device, and the method comprises the steps: providing a packaging carrier plate; fixing the solid crystal glue, the first purple light chip and the second purple light chip on the packaging carrier plate by using a solid crystal machine, and drying the solid crystal glue by using an oven; pN junctions of the first purple light chip and the second purple light chip are connected by using gold threads according to a set series-parallel connection mode by using a wire welding machine; a box dam ring is formed on the packaging carrier plate through a box dam machine; mixing a mixture of fluorescent powder and packaging glue, placing the mixture in a space formed by the box dam ring on a packaging carrier plate, placing the packaging carrier plate in a high-speed centrifuge, and sinking the fluorescent powder to the bottom of the packaging carrier plate to form an initial LED device; and if the initial LED device meets the preset finished product requirement, putting the initial LED into an oven at 170 DEG C, and drying the packaging adhesive to obtain a target LED device. And the display effect of the manufactured LED device is improved.

Description

Technical Field

[0001] The present application relates to the field of LED packaging technology, and in particular to a packaging method for a purple full-spectrum LED device and an LED device. Background Art

[0002] LED, short for Light Emitting Diode, is a semiconductor solid-state light-emitting device. It uses a solid semiconductor chip as the luminescent material, releasing energy through the recombination of electrons and holes to produce light. LEDs are characterized by their efficient conversion of electrical energy into light. LED blue light chips excite yellow phosphors, causing them to emit yellow light. The combination of blue and yellow light creates white light. As the LED market expands, expectations for LEDs to produce results similar to natural light are growing. Therefore, LEDs not only excite yellow phosphors, but also green and red phosphors, raising the color rendering index of LED-based light-emitting devices from 70 to 80, 90, and even 95.

[0003] However, existing solutions for manufacturing LED devices typically use semiconductor excitation light sources and blue, green, red, and near-infrared phosphor materials to produce LED devices. However, these solutions have some drawbacks in certain specific spectra, such as a significantly low spectral similarity index, which reduces the display effect of the LED device. Summary of the Invention

[0004] The embodiments of the present application provide a packaging method for a purple full-spectrum LED device and an LED device, which can improve the spectral similarity index of the manufactured LED device, so that the light emitted by the manufactured LED device is closer to the natural spectrum, thereby improving the display effect.

[0005] A first aspect of an embodiment of the present application provides a packaging method for a purple full-spectrum LED device, the method comprising:

[0006] Provide packaging carrier board;

[0007] Using a die-bonding machine to fix the die-bonding adhesive, the first Ziguang chip and the second Ziguang chip on the package carrier, and using an oven to dry the die-bonding adhesive;

[0008] Using a wire bonding machine, connect the PN junctions of the first and second Ziguang chips using gold wires in a set series-parallel connection mode;

[0009] A dam machine is used to form a dam ring on the package carrier;

[0010] The phosphor mixture and the encapsulation adhesive are mixed and placed in the space formed by the dam ring on the encapsulation carrier. The encapsulation carrier is placed in a high-speed centrifuge to sink the phosphor to the bottom of the encapsulation carrier to form an initial LED device.

[0011] If the initial LED device meets the preset finished product requirements, the initial LED is placed in an oven at 170° C. to dry the encapsulation glue, thereby obtaining a target LED device.

[0012] In a possible implementation, the package carrier includes an aluminum substrate and a BT layer, and the BT layer is disposed on the aluminum substrate.

[0013] In a possible implementation, the BT layer includes a circuit layer, and the circuit layer is used to supply power to the first and second Unisplendour chips after the first and second Unisplendour chips are connected.

[0014] In a possible implementation, the peak wavelength band of the first ultraviolet chip is 380 nm-410 nm, and the peak wavelength band of the second ultraviolet chip is 400 nm-430 nm.

[0015] In a possible implementation, the phosphor mixture includes blue phosphor, cyan phosphor, green phosphor, orange phosphor, red phosphor and near-infrared phosphor.

[0016] In one possible implementation, the mass ratio of the blue phosphor is 20%-80%, the mass ratio of the cyan phosphor is 0%-5%, the mass ratio of the green phosphor is 10%-50%, the mass ratio of the orange phosphor is 0%-5%, the mass ratio of the red phosphor is 0.1%-10% and the mass ratio of the near-infrared phosphor is 5%-50%.

[0017] In a possible implementation, the chemical formula of the material of the blue phosphor is Sr5(PO4)3Cl:Eu2+;

[0018] The chemical formula of the cyan phosphor material is BaSi2O5N2:Eu2+;

[0019] The chemical formula of the green phosphor material is Lu3Al5O12:Ce3+;

[0020] The chemical formula of the orange phosphor material is Sr2Si5N8:Eu2+;

[0021] The chemical formula of the red phosphor material is (Sr,Ca)AlSiN3:Eu2+;

[0022] The chemical formula of the material of the near-infrared phosphor is La3Ga5(CeSi)O14:Cr3+.

[0023] In a possible implementation, the phosphor mixture and the packaging adhesive are mixed by vacuum stirring.

[0024] In one possible implementation, the method further includes:

[0025] Performing a performance test on the initial LED device to obtain a performance test result;

[0026] Determine whether the initial LED device meets preset finished product requirements based on the performance test results.

[0027] A second aspect of an embodiment of the present application provides an LED device, which is manufactured using the packaging method for a purple full-spectrum LED device as described in any one of the first aspects.

[0028] The method of implementing the embodiment of the present application has the following beneficial effects:

[0029] The phosphor mixture includes cyan phosphor and orange phosphor, and the wavelength of red phosphor is adjusted to effectively make up for the defects of 480nm, 580nm, and 680nm, making it closer to the natural spectrum and improving the SSI index. This makes the light emitted by the manufactured LED device closer to the natural spectrum and improves the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 A schematic diagram of the structure of an LED device is provided for an embodiment of the present application;

[0032] Figure 2 A schematic flow chart of a packaging method for a purple full-spectrum LED device is provided for an embodiment of the present application;

[0033] Figure 3 An experimental comparison data diagram of an LED device is provided for an embodiment of the present application;

[0034] Figure 4 Another experimental comparison data diagram of an LED device is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] The terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0037] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0038] To better understand the packaging method for a full-spectrum purple LED device provided in an embodiment of the present application, the following briefly describes the packaging method for a full-spectrum purple LED device in an existing solution. In existing solutions, four types of phosphors are typically used to manufacture the LED device. For example, the LED device includes a semiconductor excitation light source and blue, green, red, and near-infrared phosphor materials. The LED device can achieve a continuous spectrum in the 400-780nm band and a color rendering index (Ra) greater than 95. However, its spectrum exhibits significant dips at 480nm, 580nm, and 680nm (compared to the natural spectrum, its SSI index is relatively low, at around 90 (maximum 100)), which reduces the display effect.

[0039] In order to solve the above problems, the embodiments of the present application provide a packaging method for a purple full-spectrum LED device. In this method, the mixture of phosphors includes cyan phosphors and orange phosphors, and the wavelength band of red phosphors is adjusted, effectively compensating for the defects of 480nm, 580nm, and 680nm, making it closer to the natural spectrum and improving the SSI index. Therefore, the light emitted by the manufactured LED device is closer to the natural spectrum, thereby improving the display effect.

[0040] See also Figure 1 , Figure 1 The present invention provides a schematic diagram of the structure of an LED device. Figure 1 As shown, the LED device includes a packaging carrier (including an aluminum substrate 2 and a BT layer 1), a die-bonding glue 4, a first purple chip 5, a second purple chip 14, a packaging glue 7, a gold wire 6, a dam 3, a blue phosphor 8, a cyan phosphor 9, a green phosphor 10, an orange phosphor 11, a red phosphor 12, and a near-infrared phosphor 13. The BT layer 1 is provided on the aluminum substrate 2. It is formed into a specific shape on the BT layer 1 to block the packaging glue and prevent it from flowing out. The first purple chip 5 and the second purple chip 14 are fixed on the aluminum substrate 2 of the packaging carrier. The phosphor mixture may also include other phosphors, which are not specifically limited here.

[0041] The BT layer 1 includes a circuit layer, which is used to connect the first and second purple light chips 5 and 14 and provide power to them. The package carrier has a dam ring 3. The dam ring 3 is used to accommodate the mixture of phosphors and encapsulation glue 7 after mixing. The phosphors include blue phosphor 8, cyan phosphor 9, green phosphor 10, orange phosphor 11, red phosphor 12, and near-infrared phosphor 13.

[0042] See also Figure 2 , Figure 2 The present invention provides a schematic flow chart of a packaging method for a purple full-spectrum LED device. Figure 2 As shown, the method includes:

[0043] S1. Provide packaging substrate.

[0044] S2. Use a die-bonding machine to fix the die-bonding adhesive 4, the first ultraviolet chip 5, and the second ultraviolet chip 14 on the packaging carrier, and use an oven to dry the die-bonding adhesive 4.

[0045] S3 . Use a wire bonding machine to connect the PN junctions of the first and second purple light chips 5 and 14 using gold wires 6 in a set series-parallel connection manner.

[0046] S4. Use a dam machine to form a dam circle 3 on the packaging carrier.

[0047] S5. Mix the phosphor mixture and the packaging glue 7 and place them in the space formed by the dam circle on the packaging carrier. Place the packaging carrier in a high-speed centrifuge to sink the phosphor to the bottom of the packaging carrier to form an initial LED device.

[0048] S6. If the initial LED device meets the preset finished product requirements, the initial LED is placed in an oven at 170° C. to dry the encapsulation glue, thereby obtaining a target LED device.

[0049] The package carrier includes an aluminum substrate 2 and a BT layer 1, wherein the BT layer is arranged on the aluminum substrate. Figure 2 As shown, Figure 2 A schematic diagram of the target LED device is shown in FIG. Specifically, a specific shape is formed on the BT layer 1 to block the packaging glue and prevent it from flowing out. The first purple chip 5 and the second purple chip 14 are fixed on the aluminum substrate 2 of the packaging carrier.

[0050] In a possible implementation, the BT layer includes a circuit layer, and the circuit layer is used to supply power to the first and second Unisplendour chips after the first and second Unisplendour chips are connected.

[0051] In a possible implementation, the peak wavelength band of the first ultraviolet chip is 380 nm-410 nm, and the peak wavelength band of the second ultraviolet chip is 400 nm-430 nm.

[0052] In a possible implementation, the phosphor mixture includes a blue phosphor 8 , a cyan phosphor 9 , a green phosphor 10 , an orange phosphor 11 , a red phosphor 12 , and a near-infrared phosphor 13 .

[0053] In one possible implementation, the mass ratio of the blue phosphor is 20%-80%, the mass ratio of the cyan phosphor is 0%-5%, the mass ratio of the green phosphor is 10%-50%, the mass ratio of the orange phosphor is 0%-5%, the mass ratio of the red phosphor is 0.1%-10% and the mass ratio of the near-infrared phosphor is 5%-50%.

[0054] In a possible implementation, the chemical formula of the material of the blue phosphor is Sr5(PO4)3Cl:Eu2+;

[0055] The chemical formula of the cyan phosphor material is BaSi2O5N2:Eu2+;

[0056] The chemical formula of the green phosphor material is Lu3Al5O12:Ce3+;

[0057] The chemical formula of the orange phosphor material is Sr2Si5N8:Eu2+;

[0058] The chemical formula of the red phosphor material is (Sr,Ca)AlSiN3:Eu2+;

[0059] The chemical formula of the material of the near-infrared phosphor is La3Ga5(CeSi)O14:Cr3+.

[0060] In a possible implementation, the phosphor mixture and the packaging adhesive are mixed by vacuum stirring.

[0061] In one possible implementation, the method further includes:

[0062] Performing a performance test on the initial LED device to obtain a performance test result;

[0063] Determine whether the initial LED device meets preset finished product requirements based on the performance test results.

[0064] During performance testing, the first and second purple light chips are powered via the electrodes in the BT layer. These chips emit purple light, which excites a phosphor colloid (a colloid comprising a phosphor mixture and encapsulating adhesive), emitting multiple colors of light that mix into white light. This mixed white light is then subjected to SSI and Ra tests to obtain test results.

[0065] The Spectral Similarity Index (SSI) is an indicator used to evaluate the similarity between a light source's spectrum and that of a standard light source. The higher the SSI value of an LED light, the closer its spectrum is to natural light.

[0066] If, in the test results, the SSI is higher than the preset SSI, and the Ra is higher than the preset Ra, it is determined that the initial LED device meets the preset finished product requirements.

[0067] In this example, the phosphor mixture includes cyan phosphor and orange phosphor, and the wavelength band of red phosphor is adjusted to effectively compensate for the defects of 480nm, 580nm, and 680nm, making it closer to the natural spectrum and improving the SSI index. As a result, the light emitted by the manufactured LED device is closer to the natural spectrum, thereby improving the display effect.

[0068] In a specific implementation, the present invention provides another packaging method for a purple full-spectrum LED device, as follows:

[0069] 1. Aluminum substrate 1 + BT layer 2 is a carrier board in the form of COB packaging;

[0070] 2. A specific shape is formed above the BT layer to block the encapsulation glue and prevent it from flowing out;

[0071] 3. Use a die bonder to fix chip A5 and chip B14 on the carrier board with die bond adhesive 4, and use an oven to dry the die bond adhesive.

[0072] 4. Use a wire bonding machine to connect the PN junctions of different chips with gold wires in series and parallel according to the set configuration;

[0073] 5. Use a dam machine to apply a circle of dam glue on the BT layer to protect the gold wire and prevent the fluorescent glue from flowing out.

[0074] 6. Mix multiple phosphors in a certain weight ratio;

[0075] 7. Use packaging glue to mix multiple phosphors by vacuum stirring;

[0076] 8. Place the mixed colloid into the space formed by the dam and carrier plate;

[0077] 9. Place the COB carrier into a high-speed centrifuge to completely sink the phosphor to the bottom of the COB carrier;

[0078] Forming LED devices

[0079] 10. The BT layer has a circuit layer, which is powered by positive and negative electrodes, and the LED chip emits purple light;

[0080] The violet light excites the phosphor colloid, emitting light of multiple colors that mix into white light.

[0081] 11. Light up the test and check if the test results meet the production requirements (high Ra and high SSI)

[0082] 12. Place the COB that meets the requirements into the oven at 170°C to dry the encapsulation glue (depending on the specific baking conditions of the encapsulation glue).

[0083] Among them, a specific parameter table is as follows:

[0084]

[0085] Among them, C is a blue phosphor with a peak wavelength of 445-460nm. The typical peak wavelength is 450nm. Its material formula is Sr5(PO4)3Cl:Eu2+, and the dosage is 20%-80%.

[0086] D is a cyan phosphor with a peak wavelength between 490-510nm, and a typical peak wavelength of 495nm. Its chemical formula is BaSi2O5N2:Eu2+, and its dosage is between 0% and 5%.

[0087] E is a green phosphor with a peak wavelength of 510-530nm, and a typical peak wavelength of 520nm. Its chemical formula is Lu3Al5O12:Ce3+, and its dosage is 10%-50%.

[0088] F is an orange phosphor with a peak wavelength between 600-620nm and a typical peak wavelength of 608nm. Its chemical formula is Sr2Si5N8:Eu2+ and its dosage is between 0% and 5%.

[0089] G is a red phosphor with a peak wavelength of 640-665nm, and a typical peak wavelength of 655nm. Its chemical formula is (Sr, Ca)AlSiN3:Eu2+, and its dosage is 0.1%-10%.

[0090] H is a near-infrared phosphor with a peak wavelength of 700-750nm, and a typical peak wavelength of 710nm. Its chemical formula is La3Ga5(CeSi)O14:Cr3+, and its dosage is 5%-50%.

[0091] An embodiment of the present application provides an LED device, which is manufactured by using the packaging method of the purple full-spectrum LED device as described in any one of the aforementioned embodiments.

[0092] In a specific embodiment, Figure 3 As shown, a graph of experimental comparison data of the above-mentioned LED device is provided. Figure 3 In the figure, the horizontal axis is wavelength and the vertical axis is radiation power. Figure 3 It can be seen from the figure that the LED device of the present application has a smoother curve and higher product performance than the existing solution.

[0093] Figure 4 shows another schematic diagram of experimental comparison. The specific parameters are as follows:

[0094]

[0095] The corresponding materials are as follows:

[0096]

[0097] Specifically, 5 comparative experiments are provided, and the experimental results are as follows: Figure 4 As shown. Figure 4 In the figure, the horizontal axis is wavelength and the vertical axis is radiation power, which has good energy performance.

[0098] It should be noted that for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that this application is not limited by the order of the actions described, because according to this application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by this application.

[0099] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0100] The above is a detailed introduction to the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. At the same time, for those skilled in the art, according to the idea of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A packaging method for a purple full-spectrum LED device, characterized in that: The method comprises: Provide packaging carrier board; Using a die-bonding machine to fix the die-bonding adhesive, the first Ziguang chip and the second Ziguang chip on the package carrier, and using an oven to dry the die-bonding adhesive; Using a wire bonding machine, connect the PN junctions of the first and second Ziguang chips using gold wires in a set series-parallel connection mode; A dam machine is used to form a dam ring on the package carrier; The phosphor mixture and the encapsulation adhesive are mixed and placed in the space formed by the dam ring on the encapsulation carrier. The encapsulation carrier is placed in a high-speed centrifuge to sink the phosphor to the bottom of the encapsulation carrier to form an initial LED device. If the initial LED device meets the preset finished product requirements, the initial LED is placed in an oven at 170° C. to dry the encapsulation glue, thereby obtaining a target LED device.

2. The packaging method of the purple full-spectrum LED device according to claim 1, characterized in that: The packaging carrier includes an aluminum substrate and a BT layer, and the BT layer is arranged on the aluminum substrate.

3. The packaging method of the purple full-spectrum LED device according to claim 2, characterized in that: The BT layer includes a circuit layer, and the circuit layer is used to supply power to the first and second Ziguang chips after the first and second Ziguang chips are connected.

4. The packaging method of the purple full-spectrum LED device according to claim 3, characterized in that: The peak wavelength band of the first ultraviolet chip is 380nm-410nm, and the peak wavelength band of the second ultraviolet chip is 400nm-430nm.

5. The packaging method of the purple full-spectrum LED device according to claim 4, characterized in that: The phosphor mixture includes blue phosphor, cyan phosphor, green phosphor, orange phosphor, red phosphor and near-infrared phosphor.

6. The packaging method of the purple full-spectrum LED device according to claim 5, characterized in that: The mass ratio of the blue phosphor is 20%-80%, the mass ratio of the cyan phosphor is 0%-5%, the mass ratio of the green phosphor is 10%-50%, the mass ratio of the orange phosphor is 0%-5%, the mass ratio of the red phosphor is 0.1%-10% and the mass ratio of the near-infrared phosphor is 5%-50%.

7. The packaging method of the purple full-spectrum LED device according to claim 6, characterized in that: The chemical formula of the material of the blue phosphor is Sr5(PO4)3Cl:Eu2+; The chemical formula of the cyan phosphor material is BaSi2O5N2:Eu2+; The chemical formula of the green phosphor material is Lu3Al5O12:Ce3+; The chemical formula of the orange phosphor material is Sr2Si5N8:Eu2+; The chemical formula of the red phosphor material is (Sr,Ca)AlSiN3:Eu2+; The chemical formula of the material of the near-infrared phosphor is La3Ga5(CeSi)O14:Cr3+.

8. The packaging method of the purple full-spectrum LED device according to any one of claims 1 to 7, characterized in that: The phosphor mixture and the packaging glue are mixed by vacuum stirring.

9. The packaging method of the purple full-spectrum LED device according to claim 8, characterized in that: The method further comprises: Performing a performance test on the initial LED device to obtain a performance test result; Determine whether the initial LED device meets preset finished product requirements based on the performance test results.

10. An LED device, characterized in that: The LED device is manufactured by using the packaging method of the purple full-spectrum LED device according to any one of claims 1 to 9.

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