Adhesive film for circuit connection and method for manufacturing circuit connection structure

CN120464337APending Publication Date: 2025-08-12RESONAC CORP
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Patent Information

Application Number
CN202510604225.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2019-03-13
Filing Date
2020-03-11
Publication Date
2025-08-12

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Abstract

The invention provides an adhesive film for circuit connection and a method for manufacturing a circuit connection structure. This adhesive film (11) for circuit connection is provided with a peelable support film (12), a first adhesive layer (13) that is provided on the support film and contains conductive particles (P), and a second adhesive layer (14) that is laminated on the first adhesive layer (13), and the thickness of the first adhesive layer is 0.1-1.0 times the average particle diameter of the conductive particles.
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Citation Information

Patent Citations

  • Reel member and film winding method

    JP2003034468A