Glue dot thickness detection method, controller, light source arrangement, and storage medium

Abstract

This application discloses a method, controller, light source device, and storage medium for detecting adhesive dots thickness. The method is applied to a light source device, which includes a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly, and a total reflection mirror. The method includes: controlling the light source emitter to emit a target light source, which is then split by the optical fiber coupler onto the first and second lens assemblies to obtain reference light and signal light; setting multiple reference points to move the first lens assembly to the reference points, and receiving interference signals transmitted by the optical fiber coupler at each reference point, wherein the interference signals are obtained by combining the reference light reflected by the total reflection mirror and the signal light reflected by the adhesive dot to be tested through the optical fiber coupler; determining the phase delay of all interference signals, and determining the adhesive dot thickness of the adhesive dot to be tested based on all phase delays. The embodiments of this application can improve the accuracy and efficiency of adhesive dot thickness detection.

Description

Technical Field

[0001] This application relates to the field of sample detection technology, and in particular to a method for detecting adhesive dots thickness, a controller, a light source device, and a storage medium. Background Technology

[0002] In modern industrial production, automatic dispensing machines are widely used in various industries such as electronics, microcircuits, and LEDs, primarily for the connection, coating, and sealing of product components. They not only improve product quality but also increase production efficiency and enable dispensing processes in complex situations.

[0003] In industrial production, automatic dispensing machines are generally used for dispensing. However, due to limitations in the dispensing machine's processing capabilities, a large number of defective products are often produced, such as insufficient glue, broken glue, or no glue at all. If these defective products cannot be detected in a timely manner, they will seriously affect the final application performance of the product. Summary of the Invention

[0004] This application provides a method, controller, light source device, and storage medium for detecting adhesive dots thickness, which can improve the accuracy of adhesive dots thickness detection and further improve the detection efficiency.

[0005] In a first aspect, embodiments of this application provide a method for detecting adhesive dot thickness, applied to a light source device, the light source device including a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly, and a total reflection mirror; the method includes:

[0006] The light source emitter is controlled to emit a target light source, which is then split by the fiber optic coupler and directed to the first lens assembly and the second lens assembly to obtain a reference light and a signal light. The reference light is used to illuminate the total reflection mirror, and the signal light is used to illuminate the adhesive dot to be tested.

[0007] Multiple reference points are set to move the first lens assembly to the reference points, and interference signals sent by the fiber coupler are received at each reference point. The interference signals are obtained by combining the reference light reflected by the total internal reflection mirror and the signal light reflected by the adhesive dot to be tested through the fiber coupler.

[0008] Determine the phase delay of all the interference signals, and determine the thickness of the adhesive dot to be tested based on all the phase delays.

[0009] In some embodiments, controlling the light source emitter to emit a target light source, such that the target light source is split by the fiber optic coupler and directed to the first lens assembly and the second lens assembly to obtain reference light and signal light, includes:

[0010] The light source emitter is controlled to emit a target light source, so that the target light source passes through the fiber optic coupler to obtain a first beam and a second beam;

[0011] The first light beam is controlled to illuminate the total reflection mirror through the first lens assembly to obtain a reference light, and the second light beam is controlled to illuminate the adhesive point to be tested through the second lens assembly to obtain a signal light.

[0012] In some embodiments, the reference points include a first reference point, a second reference point, and a third reference point, wherein the distances from the first reference point, the second reference point, and the third reference point to the fiber coupler increase sequentially; setting multiple reference points to move the first lens assembly to the reference points, and receiving interference signals transmitted by the fiber coupler at each reference point, includes:

[0013] The first lens assembly is moved to the first reference point so that the fiber coupler combines the first reference light reflected by the total reflection mirror and the signal light reflected by the adhesive dot to be tested to generate a first interference signal.

[0014] The first lens assembly is moved to the second reference point so that the fiber coupler combines the second reference light reflected by the total reflection mirror and the signal light reflected by the adhesive dot under test to generate a second interference signal.

[0015] The first lens assembly is moved to the third reference point so that the fiber coupler combines the third reference light reflected by the total reflection mirror and the signal light reflected by the adhesive dot to be tested to generate a third interference signal.

[0016] The system receives a first interference signal generated by the fiber optic coupler at the first reference point, a second interference signal generated at the second reference point, and a third interference signal generated at the third reference point.

[0017] In some embodiments, determining the phase delay of all the interference signals includes:

[0018] Obtain the wavelength and bandwidth of the target light source;

[0019] For each interference signal, the phase difference of the interference signal is detected based on the wavelength and bandwidth of the light source to obtain the phase delay of the interference signal.

[0020] In some embodiments, determining the adhesive dot thickness based on all the phase delays includes:

[0021] The tomographic image corresponding to the interference signal is determined based on the phase delay;

[0022] The transverse and longitudinal scan images of the adhesive dots to be tested are obtained by using a preset optical coherence tomography technique, and the transverse feature descriptors of the transverse scan image and the longitudinal feature descriptors of the longitudinal scan image are extracted according to a preset feature detection algorithm.

[0023] The horizontal and vertical feature descriptors are matched and calculated to obtain a fused image;

[0024] The thickness of the adhesive dot to be tested is determined based on the fused image and the tomographic image.

[0025] In some embodiments, determining the tomographic image corresponding to the interference signal based on the phase delay includes:

[0026] The depth information of the adhesive dot to be tested is extracted from the interference signal based on the phase delay;

[0027] A tomographic image is obtained by performing phase calculation on the depth information using a preset image processing algorithm.

[0028] In some embodiments, determining the adhesive dot thickness of the adhesive dot to be tested based on the fused image and the tomographic image includes:

[0029] The tomographic image and the fused image are preprocessed;

[0030] Structural analysis was performed on the preprocessed fused image to obtain the three-dimensional structure of the adhesive dots to be tested;

[0031] The thickness of the adhesive dot to be tested is determined based on the preprocessed tomographic image and the three-dimensional structure.

[0032] Secondly, embodiments of this application also provide a controller, the controller including a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the adhesive dot thickness detection method as described in the first aspect.

[0033] Thirdly, embodiments of this application also provide a light source device, the light source device including a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly, a total reflection mirror, and the controller described in the second aspect.

[0034] Fourthly, embodiments of this application also provide a computer-readable storage medium storing computer-executable instructions for causing a computer to perform the adhesive dot thickness detection method as described in the first aspect.

[0035] The adhesive dot thickness detection method provided in this application embodiment has at least the following beneficial effects: the light source device includes a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly, and a total reflection mirror. In the process of measuring adhesive dot thickness, this embodiment first controls the light source emitter to emit a target light source, which is then split into a first lens assembly and a second lens assembly via an optical fiber coupler. This splits the target light source into a reference light and a signal light. The reference light is used to illuminate the total internal reflection mirror, and the signal light is used to illuminate the adhesive dot to be measured. This splits the target light source into a reference beam and a sample beam. Multiple reference points are then set, and the first lens assembly is moved to these reference points to change the optical path of the reference arm. At each reference point, interference signals transmitted by the optical fiber coupler are received. These interference signals are obtained by combining the reference light reflected by the total internal reflection mirror and the signal light reflected by the adhesive dot to be measured through the optical fiber coupler. This allows the interference signals from the optical fiber coupler to be received at all reference points. The phase delay of all interference signals is then determined, and the adhesive dot thickness is determined based on these phase delays. This achieves accurate measurement of the adhesive dot thickness and ensures the accuracy of the test results. This application embodiment directly determines the interference signal by the signal light reflected back from the surface of the adhesive dot to be tested, and then calculates the thickness of the adhesive dot to be tested by calculating the phase delay of the interference signal. It does not require the use of multiple objects of different heights to continuously adjust the test, which is convenient to operate, improves the detection efficiency, and ensures the accuracy of the detection results.

[0036] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the description and the accompanying drawings. Attached Figure Description

[0037] The accompanying drawings are used to provide a further understanding of the technical solutions of this application and form part of the specification. They are used together with the examples of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0038] Figure 1 This is a schematic diagram of the frame of the light source device provided in the embodiments of this application;

[0039] Figure 2 This is a flowchart illustrating the specific method of the adhesive dot thickness detection method provided in the embodiments of this application;

[0040] Figure 3 This is a flowchart illustrating the specific process of obtaining the reference light and the signal light, as provided in the embodiments of this application.

[0041] Figure 4This is a flowchart illustrating the specific process of receiving the interference signal transmitted by the fiber optic coupler at each reference point, as provided in the embodiments of this application.

[0042] Figure 5 This is a flowchart illustrating the determination of the phase delay of all interference signals according to an embodiment of this application;

[0043] Figure 6 This is a flowchart illustrating the specific process of determining the thickness of the adhesive dot based on all phase delays, according to an embodiment of this application.

[0044] Figure 7 This is a flowchart illustrating the determination of the tomographic image corresponding to the interference signal based on the phase delay, according to an embodiment of this application.

[0045] Figure 8 This is a flowchart illustrating the specific process of determining the thickness of the adhesive dot based on a fused image and a tomographic image, according to an embodiment of this application.

[0046] Figure 9 This is a schematic diagram of the hardware structure of the controller provided in the embodiments of this application. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0048] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0050] The adhesive dot thickness detection method provided in this application can be applied to a terminal, a server, or software running on either a terminal or a server. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, or smartwatch, etc.; the server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms; the software can be an application implementing the above method, but is not limited to the above forms.

[0051] The embodiments of this application can be used in numerous general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer computer devices, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0052] In modern industrial production, automatic dispensing machines are widely used in various industries such as electronics, microcircuits, and LEDs, primarily for the connection, coating, and sealing of product components. They not only improve product quality but also increase production efficiency and enable dispensing processes in complex situations.

[0053] In industrial production, automatic dispensing machines are generally used for dispensing. However, due to limitations in the dispensing machine's processing capabilities, a large number of defective products are often produced, such as insufficient glue, broken glue, or no glue at all. If these defective products cannot be detected in a timely manner, they will seriously affect the final application performance of the product.

[0054] To address the aforementioned issues, this application provides a method for detecting adhesive dot thickness, a controller, a light source device, and a storage medium. The light source device includes a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly, and a total reflection mirror. In the process of measuring adhesive dot thickness, this embodiment first controls the light source emitter to emit a target light source, which is then split into a first lens assembly and a second lens assembly via an optical fiber coupler. This splits the target light source into a reference light and a signal light. The reference light is used to illuminate the total internal reflection mirror, and the signal light is used to illuminate the adhesive dot to be measured. This splits the target light source into a reference beam and a sample beam. Multiple reference points are then set, and the first lens assembly is moved to these reference points to change the optical path of the reference arm. At each reference point, interference signals transmitted by the optical fiber coupler are received. These interference signals are obtained by combining the reference light reflected by the total internal reflection mirror and the signal light reflected by the adhesive dot to be measured through the optical fiber coupler. This allows the interference signals from the optical fiber coupler to be received at all reference points. The phase delay of all interference signals is then determined, and the adhesive dot thickness is determined based on these phase delays. This achieves accurate measurement of the adhesive dot thickness and ensures the accuracy of the test results. This application embodiment directly determines the interference signal by the signal light reflected back from the surface of the adhesive dot to be tested, and then calculates the thickness of the adhesive dot to be tested by calculating the phase delay of the interference signal. It does not require the use of multiple objects of different heights to continuously adjust the test, which is convenient to operate, improves the detection efficiency, and ensures the accuracy of the detection results.

[0055] Reference Figure 1 , Figure 1 This is a schematic diagram of the framework of the light source device provided in the embodiments of this application.

[0056] In some embodiments, the light source device includes a light source emitter 100, an optical fiber coupler 200, a first lens assembly 300, a second lens assembly 400, a total reflection mirror 500, and a controller 600.

[0057] It should be noted that the first lens assembly 300 in the embodiments of this application includes a first lens, and the second lens assembly 400 includes a second lens and a third lens.

[0058] In this embodiment, the light source emitter 100 emits weak coherent light. The weak coherent light emitted by the light source emitter 100 is split by the fiber optic coupler 200. One path passes through the first lens assembly 300 and is projected onto the total reflection mirror 500 to form a reference light. The other path passes through the second lens assembly 400 and is projected onto the adhesive dot to be tested, so that the light passes through the second lens and the third lens in the second lens assembly 400 and is focused on the adhesive dot to be tested to become a signal light.

[0059] Since the scattered signals from different depths of the adhesive dots under test have different phase delays, at a certain position of the reference arm, only the scattered signal from a specific depth of the sample can interfere with the reference light. Because the phase length of the light source is very short, interference signals can only be generated when the signal light and the reference light are at approximately equal optical paths, that is, when the optical path difference is no greater than the coherence length of the light source, so that the system imaging can have high resolution.

[0060] The light source devices described in the embodiments of the present invention are for the purpose of more clearly illustrating the technical solutions of the embodiments of the present invention, and do not constitute a limitation on the technical solutions provided in the embodiments of the present invention. As those skilled in the art will know, with the evolution of light source devices and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present invention are also applicable to similar technical problems.

[0061] It will be understood by those skilled in the art that Figure 1 The light source device shown does not constitute a limitation on the embodiments of the present invention, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0062] Reference Figure 2 , Figure 2 This is a flowchart illustrating a specific method for detecting adhesive dots thickness provided in an embodiment of this application. In some embodiments, the adhesive dot thickness detection method is applied to, but is not limited to, specific methods. Figure 1 The light source device in the process, the method includes but is not limited to steps S101 to S103.

[0063] Step S101: Control the light source emitter 100 to emit the target light source, so that the target light source is split by the fiber optic coupler 200 to the first lens assembly 300 and the second lens assembly 400 to obtain reference light and signal light. The reference light is used to illuminate the total reflection mirror 500, and the signal light is used to illuminate the adhesive dot to be tested.

[0064] In step S101 of some embodiments, the light source emitter 100 is controlled to emit a target light source, so that the target light source is split into a first lens assembly 300 and a second lens assembly 400 through the fiber optic coupler 200. The light passing through the first lens assembly 300 returns after passing through the total reflection mirror 500, and the light passing through the second lens assembly 400 illuminates the adhesive point to be tested and returns, thus obtaining reference light and signal light.

[0065] Step S102: Set multiple reference points to move the first lens assembly 300 to the reference points, and receive the interference signal sent by the fiber optic coupler 200 at each reference point. The interference signal is obtained by combining the reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot to be tested through the fiber optic coupler 200.

[0066] In step S102 of some embodiments, since the phase length of the light source is very short, interference signals can only be generated when the signal light and the reference light are at approximately equal optical paths, that is, when the optical path difference is not greater than the coherence length of the light source. Therefore, in this embodiment, multiple reference points are set to move the first lens assembly 300 to the reference points, and the interference signal sent by the fiber coupler 200 is received at each reference point. By changing the length of the reference arm, the optical path difference between the sample arm and the reference arm is adjusted, thereby realizing the scanning of the sample depth, which is convenient for subsequent tomographic imaging in the depth direction.

[0067] Step S103: Determine the phase delay of all interference signals, and determine the thickness of the adhesive dot to be tested based on all phase delays.

[0068] In step S103 of some embodiments, the phase delay of all interference signals is determined, thereby enabling the depth information of the adhesive dot to be tested to be determined through the phase delay, and the thickness of the adhesive dot to be tested to be determined based on all phase delays. This achieves non-destructive and high-precision detection of the adhesive dot thickness, eliminating the need to continuously adjust the test using multiple items of different heights, making the operation convenient, improving detection efficiency, and ensuring the accuracy of the detection results.

[0069] Reference Figure 3 , Figure 3 This is a flowchart illustrating the specific process of obtaining reference light and signal light according to embodiments of this application. In some embodiments, the method includes, but is not limited to, steps S201 to S202.

[0070] Step S201: Control the light source emitter 100 to emit the target light source so that the target light source passes through the fiber optic coupler 200 to obtain the first beam and the second beam.

[0071] In step S202, the first beam is controlled to illuminate the total reflection mirror 500 through the first lens assembly 300 to obtain the reference light, and the second beam is controlled to illuminate the adhesive dot to be tested through the second lens assembly 400 to obtain the signal light.

[0072] In steps S201 to S202 of some embodiments, during the process of controlling the light source emitter 100 to emit the target light source so that the target light source is split into the first lens assembly 300 and the second lens assembly 400 through the fiber optic coupler 200, the present application embodiment controls the light source emitter 100 to emit the target light source so that the target light source forms two beams of light through the fiber optic coupler 200, resulting in a first beam and a second beam. Then, the first beam is controlled to pass through the first lens assembly 300 to illuminate the total reflection mirror 500 to obtain reference light, and the second beam is controlled to pass through the second lens assembly 400 to illuminate the adhesive point to be tested to obtain signal light, thereby realizing the illumination of the first total reflection mirror 500 and the adhesive point to be tested.

[0073] Reference Figure 4, Figure 4 This is a flowchart illustrating the specific process of receiving the interference signal transmitted by the fiber optic coupler 200 at each reference point, as provided in an embodiment of this application. In some embodiments, the method includes, but is not limited to, steps S401 to S404.

[0074] It should be noted that the reference points include the first reference point, the second reference point, and the third reference point, and the distances between the first reference point, the second reference point, and the third reference point and the fiber optic coupler 200 increase sequentially.

[0075] Step S401: Move the first lens assembly 300 to the first reference point so that the fiber optic coupler 200 combines the first reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot to be tested to generate the first interference signal.

[0076] In step S402, the first lens assembly 300 is moved to the second reference point so that the fiber optic coupler 200 combines the second reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot to be tested to generate a second interference signal.

[0077] In step S403, the first lens assembly 300 is moved to the third reference point so that the fiber optic coupler 200 combines the third reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot to be tested to generate a third interference signal.

[0078] Step S404: Receive the first interference signal generated by the fiber optic coupler 200 at the first reference point, the second interference signal generated at the second reference point, and the third interference signal generated at the third reference point.

[0079] In steps S401 to S404 of some embodiments, this application embodiment obtains interference signals under different reference arms by changing the optical path of the reference arm. Specifically, this application embodiment first moves the first lens assembly 300 to the first reference point so that the fiber coupler 200 combines the first reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot to be tested, generating a first interference signal. Then, the optical path of the reference arm is changed, and the first lens assembly 300 is moved to the second reference point so that the fiber coupler 200 combines the second reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot to be tested, generating a second interference signal. Finally, the first lens assembly 300 is moved to the third reference point so that the fiber coupler 200 combines the first reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot to be tested, generating a second interference signal. The third reference light reflected by the total reflection mirror 500 and the signal light reflected by the adhesive dot under test are combined to generate a third interference signal. This allows the fiber coupler 200 to receive interference signals with different optical path differences. The fiber coupler 200 then receives the first interference signal generated at the first reference point, the second interference signal generated at the second reference point, and the third interference signal generated at the third reference point. In this embodiment, the optical path difference between the sample arm and the reference arm is adjusted by changing the length of the reference arm, thereby enabling the scanning of the sample depth and facilitating subsequent tomographic imaging in the depth direction.

[0080] Reference Figure 5 , Figure 5 This is a flowchart illustrating the determination of the phase delay of all interfering signals according to an embodiment of this application. In some embodiments, the method includes, but is not limited to, steps S501 to S502.

[0081] Step S501: Obtain the wavelength and bandwidth of the target light source.

[0082] Step S502: For each interference signal, the phase difference of the interference signal is detected according to the wavelength and bandwidth of the light source to obtain the phase delay of the interference signal.

[0083] In steps S501 to S502 of some embodiments, during the process of determining the phase delay of all interference signals, since the signal light will be reflected back after passing through the colloid, but the thickness of each colloid is different, the reflection time will be different. In this embodiment, the wavelength and bandwidth of the target light source are first obtained. For each interference signal, the phase difference of the interference signal is detected according to the wavelength and bandwidth of the light source, thereby obtaining the phase delay of the interference signal. Thus, the depth information of the glue point to be tested can be determined by the phase delay, and the thickness of the glue point to be tested can be further measured.

[0084] Reference Figure 6 , Figure 6This is a flowchart illustrating the determination of the adhesive dot thickness based on all phase delays according to an embodiment of this application. In some embodiments, the method includes, but is not limited to, steps S601 to S604.

[0085] Step S601: Determine the tomographic image corresponding to the interference signal based on the phase delay.

[0086] Step S602: Obtain the transverse and longitudinal scan images of the adhesive dots to be tested using a preset optical coherence tomography technique, and extract the transverse feature descriptors of the transverse scan image and the longitudinal feature descriptors of the longitudinal scan image according to a preset feature detection algorithm.

[0087] Step S603: Perform matching calculations on the horizontal and vertical feature descriptors to obtain the fused image.

[0088] Step S604: Determine the thickness of the adhesive dot to be tested based on the fused image and the tomographic image.

[0089] In steps S601 to S604 of some embodiments, during the process of determining the thickness of the adhesive dot to be tested based on all phase delays, this embodiment first determines the tomographic image corresponding to the interference signal based on the phase delay to achieve dynamic detection of the adhesive dot to be tested, improve the image resolution, and make finer structures visible. Then, the lateral and longitudinal scan images of the adhesive dot to be tested are obtained through a preset optical coherence tomography technique, thereby quickly acquiring the three-dimensional morphological information of the sample. The lateral feature descriptors of the lateral scan image and the longitudinal feature descriptors of the longitudinal scan image are extracted according to a preset feature detection algorithm to achieve accurate feature extraction and avoid interference from redundant information. After that, the lateral and longitudinal feature descriptors are matched and calculated to obtain a fused image. By fusing images from different perspectives or under different imaging conditions, the image quality and information content can be improved, making the image clearer and more detailed. Then, the thickness of the adhesive dot to be tested is determined based on the fused image and the tomographic image, realizing non-destructive and high-precision detection of the adhesive dot thickness. It does not require continuous adjustment of the experiment using multiple objects of different heights, making the operation convenient, improving detection efficiency, and ensuring the accuracy of the detection results.

[0090] It should be noted that the feature detection algorithm in this embodiment can be the ORB (Oriented FAST and Rotated BREF) algorithm. During the matching calculation of horizontal and vertical feature descriptors, this embodiment can use BFMatcher (Brute-Force Matcher) for brute-force matching and employ K-nearest neighbor ratio testing to filter matches, thereby improving matching accuracy.

[0091] Reference Figure 7 , Figure 7 This is a flowchart illustrating the determination of the tomographic image corresponding to the interference signal based on the phase delay, according to an embodiment of this application. In some embodiments, the method includes, but is not limited to, steps S701 to S702.

[0092] Step S701: Extract the depth information of the adhesive spot to be tested from the interference signal based on the phase delay.

[0093] Step S702: Phase calculation of depth information is performed using a preset image processing algorithm to obtain a tomographic image.

[0094] In steps S701 to S702 of some embodiments, in the process of determining the tomographic image corresponding to the interference signal based on the phase delay, the embodiments of this application first extract the depth information of the adhesive point to be tested from the interference signal based on the phase delay to obtain the fine structure of the adhesive point to be tested, and then perform phase calculation on the depth information through a preset image processing algorithm. Specifically, the embodiments of this application can perform phase calculation on the depth information through an eight-step phase shifting method to reconstruct a better two-dimensional image, obtain a tomographic image, realize the dynamic detection of the adhesive point to be tested, and detect the real-time imaging of the adhesive point to be tested.

[0095] It should be noted that in the process of performing phase calculation on depth information using the eight-step phase shifting method, the embodiments of this application first use the eight-step phase shifting method to calculate the phase information of each pixel in the depth information, and then reconstruct the tomographic image of the sample based on the phase information, thereby improving the resolution of the image and making finer structures visible.

[0096] Reference Figure 8 , Figure 8 This is a flowchart illustrating the specific process of determining the thickness of an adhesive dot based on a fused image and a tomographic image, according to an embodiment of this application. In some embodiments, the method includes, but is not limited to, steps S801 to S803.

[0097] Step S801: Preprocess the tomographic image and the fused image.

[0098] Step S802: Perform structural analysis on the preprocessed fused image to obtain the three-dimensional structure of the adhesive dots to be tested.

[0099] Step S803: Determine the thickness of the adhesive dot to be tested based on the preprocessed tomographic image and three-dimensional structure.

[0100] In steps S801 to S803 of some embodiments, during the process of determining the thickness of the adhesive dot to be tested based on the fused image and the tomographic image, the embodiments of this application first preprocess the tomographic image and the fused image. Specifically, the preprocessing operations of the tomographic image and the fused image include, but are not limited to, denoising, contrast enhancement, etc., to improve image quality. Then, structural analysis is performed on the preprocessed fused image. Specifically, the fused image is scanned, multiple pixels within the fused image are analyzed, a descriptor with rotation invariance is generated, and then matching is performed through Hamming distance to obtain the three-dimensional structure of the adhesive dot to be tested, realizing real-time tracking of the target. Afterwards, the thickness of the adhesive dot to be tested is determined based on the preprocessed tomographic image and the three-dimensional structure. Specifically, the optical amplitude information in the tomographic image is used as weights to realize the centroid positioning of sample defects and each boundary, and the system axial pixel resolution corresponding to the intensity centroid method is calibrated to achieve non-destructive high-precision measurement of the optical thickness between defects and each boundary of the transparent medium sample. Finally, based on OCT (Optical Coherence Theory), the thickness is determined. Tomography (Optical Coherence Tomography) detects the ray model and optical thickness of the sample to restore the physical thickness of the sample, achieving non-destructive and high-precision detection of adhesive dot thickness. It eliminates the need for constant adjustments using multiple objects of different heights, making it easy to operate, improving detection efficiency, and ensuring the accuracy of detection results.

[0101] Please see Figure 9 , Figure 9 The hardware structure of the controller 600 provided in this application embodiment is illustrated. The controller includes:

[0102] The processor 901 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0103] The memory 902 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 902 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 902 and called and executed by the processor 901 using the adhesive dot thickness detection method of the embodiments of this application.

[0104] The input / output interface 903 is used to implement information input and output;

[0105] The communication interface 904 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0106] Bus 905 transmits information between various components of the device (e.g., processor 901, memory 902, input / output interface 903, and communication interface 904);

[0107] The processor 901, memory 902, input / output interface 903, and communication interface 904 are connected to each other within the device via bus 905.

[0108] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described adhesive dot thickness detection method.

[0109] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0110] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0111] It will be understood by those skilled in the art that Figure 1-9 The technical solutions shown do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0112] The system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0113] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0114] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0115] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0116] In the embodiments provided in this application, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between systems or units may be electrical, mechanical, or other forms.

[0117] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0118] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0119] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0120] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A method for detecting adhesive dot thickness, characterized in that, The method is applied to a light source device, the light source device including a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly, and a total reflection mirror; the method includes: The light source emitter is controlled to emit a target light source, which is then split by the fiber optic coupler and directed to the first lens assembly and the second lens assembly to obtain a reference light and a signal light. The reference light is used to illuminate the total reflection mirror, and the signal light is used to illuminate the adhesive dot to be tested. Multiple reference points are set to move the first lens assembly to the reference points, and interference signals sent by the fiber coupler are received at each reference point. The interference signals are obtained by combining the reference light reflected by the total internal reflection mirror and the signal light reflected by the adhesive dot to be tested through the fiber coupler. Determine the phase delay of all the interference signals, and determine the glue dot thickness of the glue dot to be tested based on all the phase delays; The step of determining the adhesive dot thickness based on all the phase delays includes: The tomographic image corresponding to the interference signal is determined based on the phase delay; The transverse and longitudinal scan images of the adhesive dots to be tested are obtained by using a preset optical coherence tomography technique, and the transverse feature descriptors of the transverse scan image and the longitudinal feature descriptors of the longitudinal scan image are extracted according to a preset feature detection algorithm. The horizontal and vertical feature descriptors are matched and calculated to obtain a fused image; The thickness of the adhesive dot to be tested is determined based on the fused image and the tomographic image.

2. The method for detecting adhesive dot thickness according to claim 1, characterized in that, The control of the light source emitter to emit a target light source, so that the target light source is split by the fiber optic coupler to the first lens assembly and the second lens assembly to obtain reference light and signal light, includes: The light source emitter is controlled to emit a target light source, so that the target light source passes through the fiber optic coupler to obtain a first beam and a second beam; The first light beam is controlled to illuminate the total reflection mirror through the first lens assembly to obtain a reference light, and the second light beam is controlled to illuminate the adhesive point to be tested through the second lens assembly to obtain a signal light.

3. The method for detecting adhesive dot thickness according to claim 1, characterized in that, The reference points include a first reference point, a second reference point, and a third reference point, with the distances from the first reference point, the second reference point, and the third reference point to the fiber coupler increasing sequentially. The step of setting multiple reference points to move the first lens assembly to the reference points and receiving interference signals transmitted by the fiber coupler at each reference point includes: The first lens assembly is moved to the first reference point so that the fiber coupler combines the first reference light reflected by the total reflection mirror and the signal light reflected by the adhesive dot to be tested to generate a first interference signal. The first lens assembly is moved to the second reference point so that the fiber coupler combines the second reference light reflected by the total reflection mirror and the signal light reflected by the adhesive dot under test to generate a second interference signal. The first lens assembly is moved to the third reference point so that the fiber coupler combines the third reference light reflected by the total reflection mirror and the signal light reflected by the adhesive dot to be tested to generate a third interference signal. The system receives a first interference signal generated by the fiber optic coupler at the first reference point, a second interference signal generated at the second reference point, and a third interference signal generated at the third reference point.

4. The method for detecting adhesive dot thickness according to claim 1, characterized in that, Determining the phase delay of all the interference signals includes: Obtain the wavelength and bandwidth of the target light source; For each interference signal, the phase difference of the interference signal is detected based on the wavelength and bandwidth of the light source to obtain the phase delay of the interference signal.

5. The method for detecting adhesive dot thickness according to claim 1, characterized in that, The step of determining the tomographic image corresponding to the interference signal based on the phase delay includes: The depth information of the adhesive dot to be tested is extracted from the interference signal based on the phase delay; A tomographic image is obtained by performing phase calculation on the depth information using a preset image processing algorithm.

6. The method for detecting adhesive dot thickness according to claim 1, characterized in that, Determining the thickness of the adhesive dot to be tested based on the fused image and the tomographic image includes: The tomographic image and the fused image are preprocessed; Structural analysis was performed on the preprocessed fused image to obtain the three-dimensional structure of the adhesive dots to be tested; The thickness of the adhesive dot to be tested is determined based on the preprocessed tomographic image and the three-dimensional structure.

7. A controller, characterized in that, The controller includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the adhesive dot thickness detection method as described in any one of claims 1 to 6.

8. A light source device, characterized in that, The light source device includes a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly, a total reflection mirror, and a controller as described in claim 7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the adhesive dot thickness detection method as described in any one of claims 1 to 6.

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