A loading and unloading mechanism for a wafer test fixture
CN120468466BActive Publication Date: 2026-08-28STELIGHT INSTR CO LTD
Patent Information
- Application Number
- CN202510721694.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-30
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2045-05-30
AI Technical Summary
Technical Problem
[0004]本发明的一个目的是要提供一种用于晶圆测试夹具的装拆机构，解决现有技术中晶圆测试夹具需要搬运进行装拆从而影响晶圆测试效率的技术问题
Benefits of technology
[0034]本发明通过第一顶升机构的第一驱动件带动承载平台向上移动，以与盖板组件抵接，并将晶圆测试夹具顶起，以脱离输送装置。另外利用第二顶升机构带动承托盘穿过承载平台的第一避让孔，从而对密封组件进行支撑，之后锁合机构对盖板组件和密封组件进行解锁。上述技术方案可以实现在输送装置处进行盖板组件和密封组件的解锁，不需要将晶圆测试夹具搬离输送装置采用独立布置的装拆机构进行解锁，可以提高晶圆的测试效率，并且节省了人工成本。
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Smart Images
Figure CN120468466B_ABST
Abstract
The application provides a mounting and dismounting mechanism for a wafer test clamp, and relates to the technical field of wafer testing. The first driving member of the first jacking mechanism drives the bearing platform to move upwards to abut against the cover plate assembly and jack up the wafer test clamp to be separated from the conveying device. In addition, the second jacking mechanism drives the supporting tray to pass through the first avoiding hole of the bearing platform to support the sealing assembly, and then the locking mechanism unlocks the cover plate assembly and the sealing assembly. The above technical scheme can realize unlocking of the cover plate assembly and the sealing assembly at the conveying device, and the wafer test clamp does not need to be moved away from the conveying device to be unlocked by the independently arranged mounting and dismounting mechanism, so that the wafer testing efficiency can be improved, and the labor cost is saved.
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Citation Information
Patent Citations
Wafer-level aging test device
CN118050619A
Wafer feeding and discharging equipment and control method
CN118387607A