Wafer chuck

Abstract

The application discloses a wafer clamp, which comprises a loading disc, a sliding support frame is arranged at the bottom of the loading disc, the sliding support frame comprises a first rod and a second rod which are orthogonally crossed, the two rods are connected in a plane and orthogonally at a crossing point, and the two rods jointly form a cross-shaped main frame; the crossing point divides the two rods into four extension arm parts; a through sliding groove is formed in each extension arm part along the length direction, the sliding groove divides the extension arm part into two sliding support sub-rods which are arranged in parallel; a clamping assembly is arranged on each extension arm part and can axially move along the sliding support sub-rod. Through cooperation of the loading disc, the cross-shaped sliding support frame and the clamping assembly, the wafer clamp can simply and quickly clamp wafers and special-shaped wafers of different sizes without replacing the clamp of an ion implanter, the clamping operation is simple and reliable, the wafer clamp is convenient to use, and the wafer clamp is convenient to popularize and apply.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically to a wafer clamp. Background Technology

[0002] With the rapid development of semiconductor integrated circuit technology, ion implantation technology, as a key step in integrated circuit manufacturing, occupies an increasingly important position. The application areas of ion implantation technology have expanded accordingly, driving the rapid development of the ion implanter industry. The working principle of an ion implanter is to adjust process parameters such as implantation energy, implantation dose, and implantation beam current. The desired ions are obtained from the ion source, and through acceleration and guidance by the ion implanter, an ion beam with energy of several hundred kiloelectron volts is obtained. The ions to be doped are then implanted into the target material in the form of an ion beam, achieving precise control of doping and altering the device's performance. Ion implantation has several advantages, including relatively precise control of implantation energy and doping dose, good implantation uniformity, and low temperature.

[0003] Before implantation begins, the wafer needs to be clamped using the ion implanter's loading tray. Existing ion implanters use fixed-size clamps, requiring the replacement of the loading tray to clamp wafers of different sizes. This process is cumbersome, and using different sized trays increases equipment costs. More importantly, existing ion implanter clamps can only hold standard wafers and cannot directly handle irregularly shaped wafers. In practice, irregularly shaped wafers are typically attached to standard wafers using conductive adhesive or glue before the ion implanter's own clamps hold the standard wafer for implantation. The use of conductive adhesive and glue introduces contamination, significantly increasing the surface particle size of the wafer and negatively impacting its electrical properties and surface quality. Furthermore, the cumbersome process of attaching and removing adhesive further increases labor costs and reduces production efficiency. Additionally, the increased temperature during high-energy implantation can cause the adhesive tape and glue to fail, creating a risk of wafer cracking. For mass-production ion implanters, existing mass-production ion implanters cannot simultaneously accommodate loading disks of different sizes. This means that wafers of different sizes, even with the same implantation process parameters, need to be implanted in batches, reducing ion implantation efficiency. Furthermore, irregularly shaped wafers, which are glued to standard wafers, generate more contamination and are typically not implanted in the same batch as other standard wafers, further reducing ion implantation efficiency. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the existing technology, the purpose of the present invention is to provide a wafer clamp that solves the problem that the loading tray of the existing ion implanter can only clamp wafers of a certain standard size, making it difficult to simply and quickly clamp standard wafers of different sizes and irregularly shaped wafers.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A wafer clamp includes a loading tray with a sliding support frame mounted on its bottom. The sliding support frame includes a first and a second rod that intersect at an orthogonal point, forming a planar orthogonal connection to constitute a cross-shaped main frame. The intersection point divides the two rods into four extension arms, forming four working quadrants. Each extension arm has a through-slot along its length, which divides the extension arm into two parallel sliding support rods. A clamping assembly is mounted on each extension arm. The clamping assembly includes a fixed plate and a sliding block, which form a clamping pair. The lower surface of the fixed plate has a first clamping surface, and the upper surface of the sliding block has a second clamping surface corresponding to the first clamping surface. A wafer clamping area is formed between the first and second clamping surfaces. The top of the sliding block has two guide grooves that are adapted to the cross-sectional shape of the sliding support rod. The guide grooves penetrate the top of the sliding block vertically, and the sliding support rod is embedded in the guide grooves, allowing the sliding block to move axially along the sliding support rod. The fixed plate has threaded first mounting holes on both sides, and the sliding block has threaded second mounting holes at corresponding positions. Fasteners pass through the first and second mounting holes in sequence to lock the clamping distance.

[0006] Furthermore, the loading disc is a loading ring with a hollow center.

[0007] Furthermore, the bottom ends of the first and second rods are provided with protrusions with mounting threads, and a secondary stabilizing frame is connected to each protrusion by bolts. The secondary stabilizing frame includes the same cross-shaped frame structure as the sliding support frame and the two are directly opposite each other.

[0008] Furthermore, a guide block is fixedly connected to the bottom of the sliding block, and sliding grooves that slide with the guide block are provided on the four extended arms of the secondary stabilizing frame.

[0009] Furthermore, the loading disk, sliding support frame, and protrusion are integrally formed.

[0010] Furthermore, an elastic gasket is provided between the fixed plate and the sliding block, the outline of which matches the projection of the clamping surface of the fixed plate, and a third mounting hole is provided on the gasket corresponding to the position of the first mounting hole.

[0011] Furthermore, the first and second rods are provided with fourth mounting holes at both ends, and the two rods are fixedly connected to the loading disk through fasteners and the fourth mounting holes.

[0012] Furthermore, the fixing plate and the sliding block are U-shaped structures, with the opening of the U-shaped structure facing away from the intersection point.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention discloses a wafer clamping fixture. Through the cooperation of a loading tray, a cross-shaped sliding support frame, and clamping components, this fixture can easily and quickly clamp wafers of different sizes and irregularly shaped wafers without replacing the fixtures already installed in the ion implanter. This solves the problems of traditional ion implanter fixtures only being able to clamp wafers of fixed sizes, requiring the replacement of loading trays for different sizes, resulting in cumbersome operation and increased equipment costs due to the need for different sized loading trays. Furthermore, it addresses the issues of traditional ion implanters requiring conductive adhesive or glue to fix irregularly shaped wafers onto standard wafers, leading to significant contamination, impacting wafer performance, and the cumbersome processes of placement and adhesive removal, resulting in increased labor costs, reduced production efficiency, and the risk of wafer cracking due to adhesive failure.

[0014] 2. The wafer fixture of this invention is particularly suitable for mass production ion implanters, enabling simultaneous implantation of standard wafers and irregularly shaped wafers of different sizes. This shortens fixture changeover time, increases ion implantation efficiency, and reduces wafer fixture costs. It solves the problem that existing ion implanters cannot simultaneously implant wafers of multiple sizes and irregularly shaped wafers.

[0015] 3. The loading disk of the present invention adopts a hollow structure, which can reduce weight and effectively prevent wafer breakage during rotation. The hollow structure also helps to dissipate heat from the wafer during injection, reducing the risk of wafer breakage caused by the accumulation of thermal stress during injection. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the wafer clamp of the present invention; Figure 2 This is a schematic diagram of the structure of the clamping assembly of the present invention; Figure 3 This is a schematic diagram of the sliding support frame of the present invention; Figure 4 This is a schematic diagram of the structure of the wafer clamp of the present invention for holding a standard wafer; Figure 5 This is a schematic diagram of the structure of the wafer clamp of the present invention for holding irregularly shaped wafers; In the figure, there are: loading plate 1, sliding support frame 2, first rod 201, second rod 202, slide groove 203, fourth mounting hole 204, clamping assembly 3, fixing plate 301, sliding block 302, guide groove 303, first mounting hole 304, guide block 305, gasket 306, protrusion 4, and secondary stabilizing frame 5. Detailed Implementation

[0017] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. Example

[0018] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, the present invention provides a wafer clamp, including a loading tray 1. A sliding support frame 2 is installed at the bottom of the loading tray 1. The sliding support frame 2 includes a first rod 201 and a second rod 202 that intersect orthogonally. The two rods are connected in a plane orthogonal connection at the intersection point to form a cross-shaped main frame. The intersection point divides each rod into four extension arms, forming four working quadrants. Each extension arm has a through groove 203 along its length, which divides the extension arm into two parallel sliding support rods. A clamping assembly 3 is installed on each extension arm. The clamping assembly 3 includes a fixed plate 301 and a sliding block 302. The fixed plate 301 and the sliding block 302 form a clamping pair. The lower surface of the fixed plate 301 is provided with a first clamping surface, and the upper surface of the sliding block 302 is provided with a second clamping surface corresponding to the first clamping surface. A wafer clamping area is formed between the first clamping surface and the second clamping surface. The top of the sliding block 302 has two guide grooves 303 adapted to the cross-sectional shape of the sliding support rod. The guide grooves 303 penetrate the top of the sliding block 302 in a vertical direction. The sliding support rod is embedded in the guide grooves 303, so that the sliding block 302 can move along the axial direction of the sliding support rod. The fixed plate 301 has threaded first mounting holes 304 on both sides, and the sliding block 302 has threaded second mounting holes (not shown) at corresponding positions. Fasteners pass through the first mounting holes 304 and the second mounting holes in sequence to lock the clamping distance.

[0019] In practice, the loading disk 1 is a loading ring with a hollow center. The hollow structure of the loading disk 1 helps dissipate heat from the wafer during the injection process, mitigating the risk of wafer cracking caused by the accumulation of thermal stress during injection.

[0020] In specific implementation, the bottom ends of the first rod 201 and the second rod 202 are provided with protrusions 4 with mounting threads. Each protrusion 4 is connected to a secondary stabilizing frame 5 by bolts. The secondary stabilizing frame 5 includes the same cross-shaped frame structure as the sliding support frame 2, and the two are directly opposite each other. In this way, the clamping assembly 3 can be made more stable, reducing the risk of breakage.

[0021] In specific implementation, a guide block 305 is fixedly connected to the bottom of the sliding block 302, and sliding grooves that slide in cooperation with the guide block 305 are provided on the four extended arms of the secondary stabilizing frame 5. In this way, the secondary stabilizing frame 5 can be used to better limit and guide the movement, and improve the stability of the clamping assembly 3.

[0022] In a specific implementation, an elastic gasket 306 is provided between the fixing plate 301 and the sliding block 302. The gasket has a thickness of 0.5-1.2mm and its outline matches the projection of the clamping surface of the fixing plate 301. A third mounting hole (not shown) is provided on the gasket 306 at the position corresponding to the first mounting hole 304. When fixing the wafer, the gasket 306 can increase the friction and prevent the wafer from being scratched.

[0023] In practice, the fixing plate 301 and the sliding block 302 are U-shaped structures, with the opening of the U-shape facing away from the intersection. The U-shape structure is relatively smooth, which can help the wafer avoid sharp corners and reduce the risk of edge cracking.

[0024] In practice, the loading disk 1, sliding support frame 2, and protrusion 4 can be processed separately and then reassembled for fixation, or they can be directly formed as a single piece. When processed separately and then reassembled for fixation, the first rod 201 and the second rod 202 are provided with fourth mounting holes 204 at both ends, and the protrusion 4 is provided with a through threaded hole. The through threaded hole and the fourth mounting hole 204 are aligned. The secondary stabilizing frame 5 is fixedly connected to the protrusion 4, sliding support frame 2, and loading disk 1 in sequence by fasteners.

[0025] Instructions for use: When assembling the fixture, first, place the sliding support frame 2 at the bottom of the loading tray 1. Then, insert the sliding support rod into the guide groove 303 of the sliding block 302, so that the upper surface of the sliding support rod is flush with the upper surface of the sliding block 302. Next, place protrusions 4 at the bottom of both ends of the two rods. Secure the secondary stabilizer 5, protrusions 4, and sliding support frame 2 to the loading tray 1 in sequence using fasteners. At the same time, ensure that the guide block 305 below the sliding block 302 extends into the sliding groove of the secondary stabilizer 5 to achieve a sliding fit. Place the wafer fixture with the above structure into the ion implanter, and use the four-point clamping mechanism of the ion implanter to clamp and fix the edge of the loading tray. When installing the chip, first place the chip on the sliding support 2 and adjust it to a suitable position. Then slide the sliding block 302 to a suitable position below the chip, so that the sliding block 302 and the outer edge of the chip partially overlap and the chip does not block the mounting holes on the sliding block 302. Then place the shim 306 on top of the sliding block 302. The shim 306 covers the outer edge of the chip near the center. After the shim 306 is in place, place the fixing plate 301 on top of the shim 306. The chip is clamped by fasteners through the cooperation of the fixing plate 301, the shim 306 and the mounting holes on the sliding block 302.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of the present invention without departing from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A wafer clamp, comprising a loading tray, characterized in that, The bottom of the loading tray is equipped with a sliding support frame, which includes a first and a second rod that intersect orthogonally. The two rods are connected in a plane at the intersection point to form a cross-shaped main frame. The intersection point divides the two rods into four extension arms, forming four working quadrants. Each extension arm has a through-slot along its length, which divides the extension arm into two parallel sliding support rods. Each extension arm is equipped with a clamping assembly. The clamping assembly includes a fixed plate and a sliding block, which form a clamping pair. The lower surface of the fixed plate has a first clamping surface, and the upper surface of the sliding block has a second clamping surface corresponding to the first clamping surface. A wafer clamping area is formed between the first and second clamping surfaces. The top of the sliding block has two guide grooves that are adapted to the cross-sectional shape of the sliding support rod. The guide grooves penetrate the top of the sliding block vertically, and the sliding support rod is embedded in the guide grooves, allowing the sliding block to move axially along the sliding support rod. The fixed plate has threaded first mounting holes on both sides, and the sliding block has threaded second mounting holes at corresponding positions. Fasteners pass through the first and second mounting holes in sequence to lock the clamping distance.

2. The wafer clamp according to claim 1, characterized in that, The loading disc is a loading ring with a hollow center.

3. The wafer clamp according to claim 1, characterized in that, The first and second rods have protrusions with mounting threads at both ends. A secondary stabilizing frame is connected to each protrusion by bolts. The secondary stabilizing frame has the same cross-shaped frame structure as the sliding support frame and the two are directly opposite each other.

4. The wafer clamp according to claim 3, characterized in that, The bottom of the sliding block is fixedly connected to a guide block, and the four extended arms of the secondary stabilizing frame are provided with sliding grooves that slide in cooperation with the guide block.

5. The wafer clamp according to claim 3, characterized in that, The loading disk, sliding support frame, and protrusion are integrally formed.

6. The wafer clamp according to claim 1, characterized in that, An elastic gasket is provided between the fixed plate and the sliding block. Its outline matches the projection of the clamping surface of the fixed plate. A third mounting hole is provided on the gasket at the position corresponding to the first mounting hole.

7. The wafer clamp according to claim 1, characterized in that, The first and second rods are provided with fourth mounting holes at both ends, and the two rods are fixedly connected to the loading disk through fasteners and the fourth mounting holes.

8. The wafer clamp according to claim 1, characterized in that, The fixed plate and sliding block are U-shaped structures, with the opening of the U-shaped structure facing away from the intersection point.

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