An online solution preparation etching device for semiconductor wafer fabrication

Abstract

This application relates to the field of semiconductor manufacturing and discloses an online solution-dispensing etching device for semiconductor wafer fabrication. The device includes an outer casing, with an etching tank and a cleaning tank inside. An exhaust gas collection box is located on the outside of the outer casing, and a geared motor is mounted on the back of the outer casing. A swing arm is connected to the output shaft of the geared motor. A movable plate is rotatably mounted on the front of the swing arm, and multiple sets of support columns are fixedly mounted on the bottom of the movable plate. A connecting block has multiple sets of support grooves on its top outer edge, and the support columns are movably fitted into the support grooves, providing lifting support for the connecting block. This device has been redesigned to utilize vibration to quickly dissipate residual etching solution in the etching area on the lower surface of the wafer, achieving synchronized contact and reaction time between different parts of the lower surface of the wafer and the etching solution, thereby improving the etching accuracy of the device.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to an online liquid preparation etching apparatus for semiconductor wafer fabrication. Background Technology

[0002] Semiconductor wafers often undergo photolithography, etching, and packaging processes during fabrication. A thin film is typically coated on the wafer's surface. A photolithography machine engraves patterns on this film, and then etches the removed portion of the wafer surface to form a circuit pattern. Existing technologies include wet etching and dry etching, with wet etching being the first method developed. However, as wafer processing precision requirements have increased, wet etching has gradually become insufficient. This is because wet etching essentially uses a high-strength concentrated acid (such as hydrofluoric acid) to react with and etch the pre-engraved circuit patterns on the wafer surface. The photolithography machine first removes part of the thin film covering the wafer surface, exposing only the portion where the circuit pattern needs to be drawn, thus exposing the wafer surface for subsequent etching. However, because the etching solution material is isotropic, with identical chemical properties in all parts, the etching rate is the same in all directions. This can easily result in a deep groove being etched, thus severely limiting the maximum precision of wet etching. Summary of the Invention

[0003] This application proposes an online solution-dispensing etching device for semiconductor wafer fabrication, which has the advantage of high etching precision, thereby solving the problem of uneven corrosion caused by the isotropic nature of the etching material in the prior art.

[0004] To achieve the above objectives, this application adopts the following technical solution: an online solution preparation and etching device for semiconductor wafer fabrication, comprising...

[0005] The outer casing has an etching tank and a cleaning tank inside, an exhaust gas collection box on the outside of the outer casing, and a geared motor installed on the back of the outer casing.

[0006] A swing arm is connected to the output shaft of the geared motor. A movable plate is rotatably mounted on the front of the swing arm, and multiple sets of support columns are fixedly mounted on the bottom of the movable plate.

[0007] The connecting block has multiple sets of support grooves on its outer edge at the top. The support column is movably sleeved inside the support groove and provides hoisting support for the connecting block. A spring is movably sleeved inside the support groove.

[0008] The mounting disk is configured in multiple sets and fixedly connected to the bottom of the connecting block. Multiple sets of vacuum suction cups are fixedly installed on the top of the inner wall of the mounting disk, and the bottom of the vacuum suction cups is vacuum-adsorbed with wafers.

[0009] The reciprocating mechanism includes a frame one and a frame two fixedly installed at the bottom of a movable plate. A cam one and a cam two are rotatably installed inside the frame one and frame two, respectively. A power motor is installed on the back of the frame one, and the output shaft of the power motor is connected to the cam one and cam two in a transmission connection.

[0010] Preferably, a support shaft is fixedly connected to the bottom of the front of the swing arm, and an adapter sleeve is movably sleeved on the outer surface of the support shaft. The bottom of the adapter sleeve is fixedly connected to the moving plate.

[0011] Preferably, the etching tank and the cleaning tank are located on the left and right sides of the inner wall of the outer casing, respectively. The bottom of the inner wall of the outer casing is equipped with an etching fluid circulation tank and a cleaning fluid circulation tank located below the etching tank and the cleaning tank, respectively. The etching tank and the etching fluid circulation tank are circulated and connected through pipes. The cleaning tank and the cleaning fluid circulation tank are circulated and connected through pipes. The exhaust gas collection box is fixedly installed on the left side of the outer casing and is connected to the inner cavity of the outer casing through a pipe.

[0012] Preferably, the first cam and the second cam have the same shape and size, and the first cam and the second cam are symmetrically distributed vertically.

[0013] Preferably, the bottom of the outer surface of the first cam abuts against the top of the connecting block, the distance from the bottom of the first cam to its center is greater than the distance from the top of the first cam to its center, and a clearance groove is provided on the front side of the top of the connecting block, located directly below the second cam.

[0014] Preferably, the axial cross-sectional shape of the support column is "T" shaped, and the protruding part of the support column is upside down on the top of the inner wall of the support groove.

[0015] Preferably, the bottom end of the support column is provided with a slot, and the upper and lower ends of the spring are elastically connected to the slot and the support groove, respectively.

[0016] Preferably, a sealing ring is fixedly connected to the bottom of the inner wall of the mounting disk, and the top of the wafer abuts against the sealing ring.

[0017] Preferably, the bottom of the movable plate is fixedly connected to multiple sets of guide cylinders, the inside of the guide cylinders is provided with guide grooves, and the inner wall of the guide cylinders is adapted to the outer side of the connecting block.

[0018] Preferably, the number of mounting discs is five groups, with the first group of mounting discs located directly below the connecting block, and the remaining four groups of mounting discs distributed equidistantly in a circle on the outer edge of the bottom of the connecting block.

[0019] The beneficial effects of this invention are as follows:

[0020] This device has been redesigned to use vibration to quickly shake off residual etching solution in the etching area on the lower surface of the wafer, thereby synchronizing the contact and reaction time between different parts of the lower surface of the wafer and the etching solution, thus improving the etching accuracy of the device.

[0021] 1. First, multiple sets of mounting pads for fixing the wafer are set up and fixed on a horizontal plane using connecting blocks. For wafers that only need to be etched on one side, a support groove is opened on the top of the connecting block, and the support groove is fitted into it. The support groove can provide lifting support for the connecting block, mounting pad, and wafer, and the mounting pad can drive the connecting block to move upward and reset relative to the support column. Then, a spring is installed inside the support groove, and the spring force can drive the connecting block, mounting pad, and wafer to move upward as a whole. When the moving plate drives the mounting pad and wafer away from the surface of the etching solution, the spring pulls the connecting block, mounting pad, and wafer upward, so that the etching solution remaining on the lower surface of the wafer remains in place under the action of inertia, thereby quickly detaching from the lower surface of the wafer and reducing the corrosive effect of the etching solution remaining on the lower surface of the wafer.

[0022] 2. Then, a reciprocating mechanism pushes the connecting block downwards to its lowest position, allowing it room to move upwards. Due to the spring, the connecting block always has an upward tendency. This device uses a cam with its protruding part to press the connecting block downwards to its lowest position. A motor drives the cam to rotate, gradually reducing the downward pressure on the connecting block as it rotates between 0° and 180°. Simultaneously, the spring moves the connecting block upwards to compensate for the downward pressure. As the cam rotates between 180° and 360°, the downward pressure on the connecting block increases or decreases. The process involves moving the connecting block downwards. After using inertia to remove most of the residual moisture on the lower surface of the wafer, the power motor drives the cam to move in one cycle. This allows the connecting block, mounting plate, and wafer to move rapidly up and down, thus throwing out the etching solution residue and reaction products remaining in the grooves formed by the etching on the lower surface of the wafer. This ensures that the wafer completely detaches from the etching solution as soon as it leaves the surface, allowing all parts of the lower surface of the wafer to simultaneously come into contact with and detach from the etching solution, maintaining the consistency of the reaction and greatly improving the etching accuracy of the device.

[0023] 3. Finally, by utilizing the symmetrically distributed cam 2 and cam 1 mounted on the output shaft of the power motor, the centrifugal forces generated by cam 1 and cam 2 when driven by the power motor to rotate cancel each other out, thus avoiding the centrifugal force affecting the overall horizontal state of the moving plate, connecting block, and mounting plate. Since the protruding parts of cam 1 and cam 2 are symmetrically distributed vertically and centrally symmetrically about the axis of the power motor, when the power motor drives cam 1 to rotate, the whole will generate a centrifugal force along the axis of the power motor to the protruding side of cam 1 or cam 2. Since the protruding parts of cam 1 and cam 2 are symmetrical vertically, the two sets of centrifugal forces with opposite directions and the same magnitude cancel each other out, effectively improving the stability of the device. Attached Figure Description

[0024] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0025] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:

[0026] Figure 1 This is a partial separation diagram of the overall structure of the present invention;

[0027] Figure 2 This is a front view diagram of the overall structure of the present invention;

[0028] Figure 3 This is a schematic diagram of the internal structure of the outer casing of the present invention;

[0029] Figure 4 This is a partial cross-sectional view of the overall structure of the present invention from the front.

[0030] Figure 5 For the present invention Figure 4 Enlarged schematic diagram of the structure at point A;

[0031] Figure 6 This is a schematic diagram showing the separation of the geared motor, swing arm, support shaft, adapter cylinder, moving plate, guide cylinder, connecting block and reciprocating mechanism of the present invention;

[0032] Figure 7 This is a side view of the moving plate, guide cylinder, connecting block, and reciprocating mechanism of the present invention;

[0033] Figure 8 This is a schematic diagram of the structure of the guide cylinder, connecting block, reciprocating mechanism, support column and mounting plate of the present invention.

[0034] The components are as follows: 1. Outer casing; 2. Gear motor; 3. Swing arm; 4. Support shaft; 5. Adapter cylinder; 6. Moving plate; 7. Guide cylinder; 8. Connecting block; 9. Reciprocating mechanism; 91. Frame 1; 92. Cam 1; 93. Frame 2; 94. Cam 2; 95. Power motor; 10. Clearance groove; 11. Support groove; 12. Support column; 13. Spring; 14. Mounting plate; 15. Sealing ring; 16. Vacuum suction cup; 17. Wafer; 18. Waste gas collection box; 19. Etching tank; 20. Etching fluid circulation tank; 21. Cleaning tank; 22. Cleaning fluid circulation tank; 23. Slot; 24. Guide groove. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0036] Please see Figures 1-8 This embodiment discloses an online solution preparation and etching apparatus for semiconductor wafer fabrication, including...

[0037] The outer casing 1 has an etching tank 19 and a cleaning tank 21 inside. The outer casing 1 has an exhaust gas collection box 18 on the outside. The outer casing 1 has a geared motor 2 installed on the back.

[0038] The swing arm 3 is connected to the output shaft of the geared motor 2. A movable plate 6 is rotatably mounted on the front of the swing arm 3, and multiple sets of support columns 12 are fixedly mounted on the bottom of the movable plate 6.

[0039] The connecting block 8 has multiple sets of support grooves 11 on its outer edge at the top. The support column 12 is movably sleeved inside the support groove 11 and provides hoisting support for the connecting block 8. A spring 13 is movably sleeved inside the support groove 11.

[0040] The mounting plate 14 is configured in multiple groups and fixedly connected to the bottom of the connecting block 8. Multiple sets of vacuum suction cups 16 are fixedly installed on the top of the inner wall of the mounting plate 14, and the bottom of the vacuum suction cups 16 vacuum adsorbs the wafer 17.

[0041] The reciprocating mechanism 9 includes a frame 1 91 and a frame 2 93 fixedly installed at the bottom of the movable plate 6. A cam 1 92 and a cam 2 94 are rotatably installed inside the frame 1 91 and the frame 2 93 respectively. A power motor 95 is installed on the back of the frame 1 91. The output shaft of the power motor 95 is connected to the cam 1 92 and the cam 2 94 in a transmission connection.

[0042] This device has been redesigned to use vibration to quickly shake off the residual etching solution in the etching area on the lower surface of wafer 17, thereby synchronizing the contact and reaction time between the various parts of the lower surface of wafer 17 and the etching solution, thus improving the etching accuracy of the device.

[0043] First, multiple sets of mounting pads 14 for fixing wafer 17 are set up and fixed on a horizontal plane using connecting blocks 8. For wafer 17 that only needs to be etched on one side, a support groove 11 is provided on the top of the connecting block 8. By fitting the support groove 11 into the groove, the support groove 11 can provide lifting support for the connecting block 8, mounting pads 14 and wafer 17, and the mounting pads 14 can drive the connecting block 8 to move upward and reset relative to the support column 12. Then, by installing a spring 13 inside the support groove 11, the elastic force of the spring 13 can drive the connecting block 8, mounting pads 14 and wafer 17 to move upward as a whole. When the moving plate 6 drives the mounting pads 14 and wafer 17 away from the surface of the etching solution, the spring 13 pulls the connecting block 8, mounting pads 14 and wafer 17 upward, so that the etching solution remaining on the lower surface of wafer 17 remains in place under the action of inertia, thereby quickly detaching from the lower surface of wafer 17 and reducing the corrosive effect of the etching solution remaining on the lower surface of wafer 17.

[0044] Then, the reciprocating mechanism 9 pushes the connecting block 8 downwards to its lowest position, giving it room to move upwards. Due to the spring 13, the connecting block 8 always has an upward tendency. This device uses a cam 92 with its protruding part to push the connecting block 8 downwards to its lowest position. The power motor 95 drives the cam 92 to rotate, gradually reducing the downward pressure on the connecting block 8 as it rotates between 0° and 180°. At the same time, the spring 13 moves the connecting block 8 upwards and fills the gap. When the cam 92 rotates between 180° and 360°, the downward pressure on the connecting block 8 increases or decreases. The connection block 8 moves downwards, thus removing most of the residual moisture on the lower surface of wafer 17 using inertia. Then, the power motor 95 drives the cam 92 to move cyclically, enabling the connection block 8, mounting plate 14, and wafer 17 to move rapidly up and down. This throws out the etching solution residue and reaction products remaining in the grooves formed by the etching on the lower surface of wafer 17, ensuring that wafer 17 completely detaches from the etching solution as soon as it leaves the surface. This allows all parts of the lower surface of wafer 17 to simultaneously contact and detach from the etching solution, maintaining the consistency of the reaction and greatly improving the etching accuracy of the device.

[0045] Finally, by utilizing the symmetrically distributed cam 2 94 and cam 1 92 mounted on the output shaft of the power motor 95, the centrifugal forces generated by cam 1 92 and cam 2 94 when driven by the power motor 95 to rotate cancel each other out, thus preventing the centrifugal force from affecting the overall horizontal state of the moving plate 6, connecting block 8, and mounting plate 14. Since the protruding parts of cam 1 92 and cam 2 94 are symmetrically distributed vertically and centrally symmetrically about the axis of the power motor 95, when the power motor 95 drives cam 1 92 to rotate, the whole will generate a centrifugal force along the axis of the power motor 95 to the protruding side of cam 1 92 or cam 2 94. Since the protruding parts of cam 1 92 and cam 2 94 are symmetrical vertically, the two sets of centrifugal forces with opposite directions and the same magnitude cancel each other out, effectively improving the stability of the device.

[0046] Among them, the bottom of the front of the swing arm 3 is fixedly connected to the support shaft 4, the outer surface of the support shaft 4 is movably sleeved with the adapter cylinder 5, and the bottom of the adapter cylinder 5 is fixedly connected to the moving plate 6.

[0047] When the geared motor 2 drives the swing arm 3 to rotate, it will drive the adapter cylinder 5 and the moving plate 6 to move up and down. Since the support shaft 4 and the adapter cylinder 5 are movably connected, the adapter cylinder 5 can keep the moving plate 6 horizontal as a whole under the weight of the moving plate 6, the guide cylinder 7 and the mounting plate 14.

[0048] The etching tank 19 and the cleaning tank 21 are located on the left and right sides of the inner wall of the outer casing 1, respectively. The bottom of the inner wall of the outer casing 1 is equipped with an etching liquid circulation tank 20 and a cleaning liquid circulation tank 22 located below the etching tank 19 and the cleaning tank 21, respectively. The etching tank 19 and the etching liquid circulation tank 20 are connected by a pipe, and the cleaning tank 21 and the cleaning liquid circulation tank 22 are connected by a pipe. The exhaust gas collection box 18 is fixedly installed on the left side of the outer casing 1 and is connected to the inner cavity of the outer casing 1 by a pipe.

[0049] The etching tank 19 is filled with etching solution and is responsible for wet etching of the wafer 17, while the cleaning tank 21 is filled with cleaning solution and is responsible for cleaning the etched wafer 17. The exhaust gas collection box 18 is responsible for absorbing harmful gases generated during the operation of the device.

[0050] Among them, Cam 1 92 and Cam 2 94 have the same shape and size, and Cam 1 92 and Cam 2 94 are symmetrically distributed vertically.

[0051] Since the protrusions of cam 92 and cam 94 are symmetrical vertically and centrally symmetrical about the axis of motor 95, when motor 95 drives cam 92 to rotate, the whole will generate centrifugal force along the axis of motor 95 to the protrusion side of cam 92 or cam 94. Since the protrusions of cam 92 and cam 94 are symmetrical vertically, the two sets of centrifugal forces with opposite directions and the same magnitude cancel each other out, effectively improving the stability of the device.

[0052] Among them, the bottom of the outer surface of cam 92 abuts against the top of the connecting block 8, the distance from the bottom of cam 92 to its center is greater than the distance from the top of cam 92 to its center, and a clearance groove 10 located directly below cam 94 is provided on the front side of the top of the connecting block 8.

[0053] Cam 92 has an eccentric protrusion design. Its protrusion can press down on the connecting block 8 and put the connecting block 8 at its lowest position, providing space for subsequent upward movement. Spring 13 can apply upward pressure to the connecting block 8 and drive the connecting block 8 to move upward.

[0054] The axial section of the support column 12 is "T" shaped, and the protruding part of the support column 12 is upside down on the top of the inner wall of the support groove 11.

[0055] like Figure 5 As shown, the "T"-shaped support column 12 can be hoisted and supported by its bottom protrusion and the matching connecting block 8 inside the support groove 11 through the inverted buckle, so that the connecting block 8 can move upward relative to the support column 12. At the same time, the support column 12 can also provide a guiding function for the vertical movement of the connecting block 8.

[0056] The bottom end of the support column 12 is provided with a slot 23, and the upper and lower ends of the spring 13 are elastically connected to the slot 23 and the support groove 11, respectively.

[0057] Spring 13 is located inside slot 23 and support slot 11. Spring 13 pulls the connecting block 8 upward, so that the connecting block 8 can move up and down reciprocally, thereby realizing the function of subsequent vibration to remove etching fluid residue.

[0058] Among them, a sealing ring 15 is fixedly connected to the bottom of the inner wall of the mounting plate 14, and the top of the wafer 17 abuts against the sealing ring 15.

[0059] After the vacuum chuck 16 adsorbs and fixes the wafer 17, the top of the wafer 17 can form a seal by abutting against the sealing ring 15, thereby preventing the etching solution from leaking into the upper surface of the wafer 17.

[0060] Among them, the bottom of the movable plate 6 is fixedly connected to multiple sets of guide cylinders 7, and the guide cylinder 7 has a guide groove 24 inside, and the inner wall of the guide cylinder 7 is adapted to the outer side of the connecting block 8.

[0061] The wafer 17 provides a synchronous guiding function for the up and down movement of the connecting block 8. Because the inner wall of the guide cylinder 7 and the outer surface of the connecting block 8 are fitted together, the opening of the guide groove 24 can avoid jamming between the guide cylinder 7 and the connecting block 8 during the up and down relative movement by making room.

[0062] There are five sets of mounting plates 14. The first set of mounting plates 14 is located directly below the connecting block 8, and the other four sets of mounting plates 14 are distributed in a circular pattern at equal intervals on the outer edge of the bottom of the connecting block 8.

[0063] The number of mounting pads 14 is five, meaning the device can process five sets of wafers 17 simultaneously. Since the five sets of mounting pads 14 are at the same height, the etchant residue on each set of wafers 17 can be approximately within a similar range.

[0064] Working principle:

[0065] When the device is in operation, firstly, etching solution is introduced into the etching tank 19 through the etching solution circulation tank 20, and cleaning solution is introduced into the cleaning tank 21 through the cleaning solution circulation tank 22. The wafer 17 is placed at the bottom of the mounting plate 14 and is adsorbed by the vacuum suction cup 16. The sealing ring 15 abuts against the wafer 17 to form a seal. The geared motor 2 is started and drives the swing arm 3 to rotate counterclockwise. At this time, the moving plate 6 and the mounting plate 14 are located above the etching tank 19. The swing arm 3 rotates downward counterclockwise and drives the adapter cylinder 5, the moving plate 6 and the mounting plate 14 to move into the interior of the etching tank 19 until the bottom of the wafer 17 contacts the etching solution. The geared motor 2 is stopped and the exhaust gas collection box 18 is started to adsorb any dangerous gases that may be generated.

[0066] Then, the bottom of wafer 17 reacts with the etching solution, creating multiple etched lines (circuit diagrams) on its lower surface. Subsequently, the reduction motor 2 is activated, causing the swing arm 3 to reverse, lifting wafer 17 upwards away from the interior of the etching tank 19. At the same time, the power motor 95 is activated, causing cam 1 92 and cam 2 94 to rotate simultaneously. When cam 1 92 rotates from 0-180°, its protruding portion gradually moves away from the upper surface of the connecting block 8, and the connecting block 8 is lifted upwards by the spring 13. When cam 1 92 rotates from 180-360°, its protruding portion gradually approaches the upper surface of the connecting block 8. The connecting block 8 is pushed down and reset under the action of the cam 92. That is, for every one rotation of the cam 92, the connecting block 8 moves up and down once. When the connecting block 8 moves upward, the etching solution attached to its lower surface will leave the surface of the connecting block 8 due to inertia. After multiple rotations of the cam 92, the connecting block 8 moves up and down multiple times when the wafer 17 leaves the etching solution, so that the wafer 17 will move up and down multiple times. That is, when the wafer 17 leaves the etching solution, the etching solution residue attached to its surface will be quickly thrown off, so that the lower surface of the wafer 17 stops reacting with the etching solution.

[0067] Finally, the geared motor 2 drives the swing arm 3 to rotate clockwise, and the adapter cylinder 5 is movably connected to the support shaft 4. Under the weight of the moving plate 6, guide cylinder 7, connecting block 8 and mounting plate 14, the adapter cylinder 5 rotates relative to the support shaft 4, so that the moving plate 6 remains horizontal. The mounting plate 14 and the wafer 17 are driven into the cleaning tank 21 to complete the cleaning.

[0068] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An online solution preparation and etching apparatus for semiconductor wafer fabrication, characterized in that, include The outer casing (1) has an etching groove (19) and a cleaning groove (21) inside. The outer casing (1) has an exhaust gas collection box (18) on the outside. The outer casing (1) has a geared motor (2) installed on the back. A swing arm (3) is connected to the output shaft of the geared motor (2) via a transmission. A movable plate (6) is rotatably mounted on the front of the swing arm (3). Multiple sets of support columns (12) are fixedly mounted on the bottom of the movable plate (6). The connecting block (8) has multiple sets of support grooves (11) on the outer edge of its top. The support column (12) is movably sleeved inside the support groove (11) and provides hoisting support for the connecting block (8). A spring (13) is movably sleeved inside the support groove (11). The mounting disk (14) is configured in multiple groups and fixedly connected to the bottom of the connecting block (8). Multiple sets of vacuum suction cups (16) are fixedly installed on the top of the inner wall of the mounting disk (14). The bottom of the vacuum suction cup (16) is vacuum-adsorbed with wafers (17). The reciprocating mechanism (9) includes a frame one (91) and a frame two (93) fixedly installed at the bottom of the moving plate (6). A cam one (92) and a cam two (94) are rotatably installed inside the frame one (91) and the frame two (93), respectively. A power motor (95) is installed on the back of the frame one (91). The output shaft of the power motor (95) is connected to the cam one (92) and the cam two (94) in a transmission connection. The bottom of the outer surface of the cam (92) abuts against the top of the connecting block (8), and the distance from the bottom of the cam (92) to its center is greater than the distance from the top of the cam (92) to its center.

2. The online solution preparation and etching equipment for semiconductor wafer fabrication according to claim 1, characterized in that, The bottom of the front of the swing arm (3) is fixedly connected to a support shaft (4), and an adapter sleeve (5) is movably sleeved on the outer surface of the support shaft (4). The bottom of the adapter sleeve (5) is fixedly connected to the moving plate (6).

3. The online solution preparation and etching equipment for semiconductor wafer fabrication according to claim 2, characterized in that, The etching tank (19) and cleaning tank (21) are located on the left and right sides of the inner wall of the outer box (1), respectively. The bottom of the inner wall of the outer box (1) is equipped with an etching liquid circulation tank (20) and a cleaning liquid circulation tank (22) located below the etching tank (19) and the cleaning tank (21), respectively. The etching tank (19) and the etching liquid circulation tank (20) are connected by a pipeline. The cleaning tank (21) and the cleaning liquid circulation tank (22) are connected by a pipeline. The exhaust gas collection box (18) is fixedly installed on the left side of the outer box (1) and is connected to the inner cavity of the outer box (1) by a pipeline.

4. The online solution preparation and etching equipment for semiconductor wafer fabrication according to claim 3, characterized in that, The first cam (92) and the second cam (94) have the same shape and size, and the first cam (92) and the second cam (94) are symmetrically distributed vertically.

5. The online solution preparation and etching equipment for semiconductor wafer fabrication according to claim 4, characterized in that, The front side of the top of the connecting block (8) is provided with a clearance groove (10) located directly below the second cam (94).

6. The online solution preparation and etching equipment for semiconductor wafer fabrication according to claim 5, characterized in that, The axial section of the support column (12) is "T" shaped, and the protruding part of the support column (12) is upside down on the top of the inner wall of the support groove (11).

7. The online solution preparation and etching equipment for semiconductor wafer fabrication according to claim 6, characterized in that, The bottom end of the support column (12) is provided with a slot (23), and the upper and lower ends of the spring (13) are elastically connected to the slot (23) and the support groove (11) respectively.

8. The online solution preparation and etching equipment for semiconductor wafer fabrication according to claim 7, characterized in that, A sealing ring (15) is fixedly connected to the bottom of the inner wall of the mounting plate (14), and the top of the wafer (17) abuts against the sealing ring (15).

9. An online solution preparation and etching apparatus for semiconductor wafer fabrication according to claim 8, characterized in that, The bottom of the movable plate (6) is fixedly connected to multiple sets of guide cylinders (7), and the guide cylinders (7) have guide grooves (24) inside, and the inner wall of the guide cylinders (7) is adapted to the outer side of the connecting block (8).

10. An online solution preparation and etching apparatus for semiconductor wafer fabrication according to claim 9, characterized in that, The number of mounting discs (14) is five groups. The first group of mounting discs (14) is located directly below the connecting block (8), and the other four groups of mounting discs (14) are distributed equidistantly in a circle on the outer edge of the bottom of the connecting block (8).

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