Packaging circuit board and circuit board packaging method

Abstract

The invention discloses a packaged circuit board and a circuit board packaging method. The packaged circuit board comprises a substrate layer, an electromagnetic shielding layer, a signal transmission layer, a power distribution layer, a grounding layer, a thermal expansion buffer layer, a mechanical supporting layer, a chip interconnection layer, a silicon interposer, a thermal management layer, a stress adjusting layer and a welding layer which are connected in sequence. Wherein the adjacent structural layers realize interface coupling through a composite connecting layer, and the composite connecting layer comprises at least one connecting mode selected from bonding, sintering and bonding; and a three-dimensional vertical interconnection structure is formed between the power distribution layer and the grounding layer. Through cooperative use of the conical conductive through hole and the Ta / TiN diffusion barrier layer, low-loss transmission of a high-frequency signal is realized, the depth-to-width ratio of the conical conductive through hole optimizes current distribution, the influence of a skin effect is reduced, the insertion loss of a frequency band above 10GHz is reduced to below 0.2 dB / mm, and the insertion loss of the frequency band above 10GHz is reduced to below 0.2 dB / mm. The problems of impedance mismatch and signal reflection of the existing cylindrical through hole in high-frequency application are solved.

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