A microwave device and transceiver assembly for dual-sided transmission

Abstract

This invention discloses a double-sided microwave device and transceiver assembly. The microwave device includes a component structure, a front microwave plate, a back microwave plate, and an insulator. The component structure has an opening, and the insulator is disposed at the opening. The component structure and the insulator form a front cavity on one side of the opening and a back cavity on the other side. The front cavity is used to house the front microwave plate and transmit front microwave signals. The back cavity is used to house the back microwave plate and transmit back microwave signals. Both the front and back microwave plates are interconnected with the insulator via gold wire bonding to enable microwave signal transmission between the front and back microwave plates.

Description

Technical Field

[0001] This invention relates to the field of microwave technology. More specifically, it relates to a microwave device and transceiver assembly for bidirectional transmission. Background Technology

[0002] As radar miniaturization and weight reduction become increasingly apparent, the integration of microwave components is becoming higher and higher, and the internal radio frequency interconnection methods of these components are gradually becoming more complex. Cross-planar radio frequency connections can reduce the component area and are becoming increasingly common in practical engineering applications. However, cross-planar radio frequency connections are difficult to design, have high electrical connection costs between the front and back microwave components, and affect microwave signal transmission, resulting in poor signal stability. Summary of the Invention

[0003] The present invention provides a microwave device and transceiver assembly for bidirectional transmission to solve at least one of the problems existing in the prior art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] The first aspect of this invention provides a double-sided microwave device, comprising a component structure, a front microwave plate, a back microwave plate, and an insulator, wherein...

[0006] The component structure has an opening, and the insulator is disposed at the opening of the component structure. The component structure and the insulator form a front cavity on one side of the opening and a back cavity on the other side.

[0007] The front cavity is used to house the front microwave plate and transmit front microwave signals;

[0008] The reverse cavity is used to house the reverse microwave plate and transmit reverse microwave signals;

[0009] Both the front microwave plate and the back microwave plate are interconnected with the insulator via gold wire bonding, which enables the transmission of microwave signals between the front microwave plate and the back microwave plate.

[0010] Optionally, the insulator includes a front pin and a back pin.

[0011] Optionally, the front microwave board includes a matching structure with gold wire bonding of the front microstrip line and a front microwave signal transmission line, and the front pin of the insulator is bonded to the matching structure with gold wire bonding of the front microstrip line.

[0012] Optionally, the reverse microwave board includes a matching structure with gold wire bonding of the reverse microstrip line and a reverse microwave signal transmission line, and the reverse pin of the insulator is bonded to the matching structure with gold wire bonding of the reverse microstrip line.

[0013] Optionally, the surface of the front pin away from the insulator is flush with the surface of the front microwave plate near the insulator, and the surface of the back pin away from the insulator is flush with the surface of the back microwave plate away from the insulator.

[0014] Optionally, the front microwave plate is brazed to the front of the component structure.

[0015] Optionally, the reverse microwave plate is brazed to the reverse side of the component structure.

[0016] Optionally, the front microwave plate and the back microwave plate are symmetrically arranged on both sides of the insulator.

[0017] Optionally, both the front microwave plate and the back microwave plate are single-layer plates.

[0018] A second aspect of the present invention provides a transceiver assembly, characterized in that it includes a transmitting device, a receiving device, a control device, and a microwave device for bidirectional transmission as described in the first aspect of the present invention.

[0019] The transmitting device is used to generate the first microwave signal during the transmission phase of the transceiver assembly;

[0020] The receiving device is used to receive the second microwave signal sent by the antenna to the transceiver component, preprocess the second microwave signal, and output the preprocessed second microwave signal.

[0021] The microwave device is used to control the transmission of the first microwave signal and the preprocessed second microwave signal between the front and back sides of the transceiver assembly.

[0022] The control device is used to supply power to the transceiver assembly and to control and adjust the phase and amplitude of the first microwave signal and the preprocessed second microwave signal.

[0023] The beneficial effects of this invention are as follows:

[0024] This invention separates the front cavity from the back cavity using structural components, thus blocking signal interference between the front and back microwave boards. In this invention, both the front and back microwave boards are interconnected with insulators via gold wire bonding, enabling mutual transmission of microwave signals between the front and back sides. This achieves good microwave signal transmission while reducing the risk of microstrip line contamination. Attached Figure Description

[0025] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0026] Figure 1 A schematic diagram of a microwave device for bidirectional transmission is shown in an embodiment of the present invention;

[0027] Figure 2 This is a front view of a microwave device with bidirectional transmission in an embodiment of the present invention;

[0028] Figure 3 A reverse schematic diagram of a microwave device for bidirectional transmission in an embodiment of the present invention is shown. Detailed Implementation

[0029] To more clearly illustrate the present invention, the following description, in conjunction with preferred embodiments and accompanying drawings, further explains the invention. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of the present invention.

[0030] One embodiment of the present invention provides a double-sided microwave device, including a front microwave plate, a back microwave plate, and an insulator as component structural parts, wherein,

[0031] The component structure has an opening, and the insulator is disposed at the opening of the component structure. The component structure and the insulator form a front cavity on one side of the opening and a back cavity on the other side.

[0032] The front cavity is used to house the front microwave plate and transmit front microwave signals;

[0033] The reverse cavity is used to house the reverse microwave plate and transmit reverse microwave signals;

[0034] Both the front microwave plate and the back microwave plate are interconnected with the insulator via gold wire bonding, which enables the transmission of microwave signals between the front microwave plate and the back microwave plate.

[0035] The bifacial microwave transmission device provided in this embodiment places insulators at the openings of the component structure. The component structure and insulators divide the cavity into a front cavity and a back cavity. A front microwave plate is placed on the front cavity to form the front microwave cavity, transmitting front microwave signals; a back microwave plate is placed on the back cavity to form the back microwave cavity, transmitting back microwave signals. The component structure and insulators isolate signal interference between the front and back cavities. In this embodiment, both the front and back microwave plates are connected to the insulators using gold wire bonding. This allows for the transmission of front microwave signals to the back microwave plate, and thus to the back cavity, or vice versa, achieving connection between the front and back microwave signals. This not only ensures good microwave signal transmission but also reduces the risk of microstrip line contamination. The bifacial microwave transmission device provided in this embodiment has a simple structure, is easy to design, and can be widely used in bifacial microwave components.

[0036] In a specific example, for example Figure 1 The aforementioned double-sided microwave transmission device includes a structural component assembly 101, a front cavity 102, a back cavity 103, an insulator 104, a front microwave plate 105, and a back microwave plate 106, wherein...

[0037] The component structure 101 is used to carry a microwave functional component capable of transmitting microwave signals. This microwave functional component includes, but is not limited to, a front cavity 102, a back cavity 103, an insulator 104, a front microwave plate 105, and a back microwave plate 106. Other microwave functional components can be added as needed in this example. The component structure 101 has an opening, and the insulator 104 is disposed at the opening. The component structure 101 and the insulator 104 form a front cavity 102 on one side of the opening and a back cavity 103 on the other side. Figure 1 As shown, the front cavity 102 is the upper cavity of the component structure 101 and the insulator 104, and the back cavity 103 is the lower cavity of the component structure 101 and the insulator 104. The microwave signal is transmitted vertically between the front cavity 102 and the back cavity 103. The component structure 101 and the insulator 104 separate the front cavity 102 and the back cavity 103, isolating the microwave signal interference between the front microwave plate 105 and the back microwave plate 106, thus improving the insulation performance of the device. The insulator is placed in the cavity of the component structure to improve the reliability of the microwave component.

[0038] The front cavity 102 is used to house the front microwave plate 105, forming a front microwave cavity for transmitting front microwave signals; the back cavity 103 is used to house the back microwave plate 106, forming a back microwave cavity for transmitting back microwave signals. The component structure 101 and the insulator 104 separate the front cavity 102 and the back cavity 103 to block signal interference between the front microwave plate 105 and the back microwave plate 106. The insulator 104 is located at the opening of the component structure 101 and includes a front pin 1041 and a back pin 1042. The front microwave plate 105 and the back microwave plate 106 are symmetrically arranged on both sides of the insulator 104, which isolates the front microwave plate 105 and the back microwave plate 106 to prevent interference between front and back microwave signals. Both the front microwave board 105 and the back microwave board 106 are connected to the insulator 104 via gold wire bonding. This allows the front microwave signal from the front microwave board 105 to be transmitted to the back microwave board 106. The front microwave signal on the front microwave board 105 is then transmitted to the insulator 104 via the front-bonded gold wires. The insulator 104 then transmits the front microwave signal to the back microwave board 106 via the back-bonded gold wires, thus achieving a front-to-back microwave signal connection. Alternatively, the back microwave signal from the back microwave board 106 can be transmitted to the front microwave board 105 via the insulator 104. The back microwave signal on the back microwave board 106 is then transmitted to the insulator 104 via the back-bonded gold wires. The insulator 104 then transmits the back microwave signal to the front microwave board 105 via the front-bonded gold wires, thus achieving a back-to-front microwave signal connection.

[0039] In one possible implementation, the insulator includes a front pin and a back pin.

[0040] Continuing with the previous example, for example Figure 1 As shown, the insulator 104 includes a front pin 1041 and a back pin 1042, which are symmetrically arranged about the insulator 104.

[0041] In one possible implementation, the front microwave board includes a matching structure for front microstrip gold wire bonding and a front microwave signal transmission line, wherein the front pin of the insulator is bonded to the matching structure for front microstrip gold wire bonding.

[0042] In a specific example, for example Figure 2As shown, the front microwave board 105 includes a matching structure 1051 with gold wire bonding of the front microstrip line and a front microwave signal transmission line 1052. The matching structure 1051 and the front microwave signal transmission line 1052 are connected by a microstrip line 1053 and are fixedly mounted on the front cavity 102. The front pin of the insulator 104 is bonded to the matching structure 1051 with gold wire bonding of the front microstrip line, transmitting the front microwave signal to the insulator 104, thereby improving the reliability and stability of the device components. The front microwave signal on the front microwave board 105 is transmitted to the matching structure 1051 with gold wire bonding of the front microstrip line through the front cavity and the front microwave signal transmission line 1052. The matching structure 1051 with gold wire bonding of the front microstrip line transmits the front microwave signal to the insulator 104 through the gold wires bonded on the front. The matching structure 1051 of the front microstrip gold wire bonding and the front microwave signal transmission line 1052 are also used to receive the reverse microwave signal in the insulator 104. The reverse microwave signal is transmitted to the matching structure 1051 of the front microstrip gold wire bonding through the front pin of the insulator 104. The reverse microwave signal is then transmitted to the front cavity by the front microwave signal transmission line 1052 through the matching structure 1051 of the front microstrip gold wire bonding, thereby realizing the vertical electrical transmission of the reverse-to-front microwave signal and improving the reliability and stability of the microwave components of the device.

[0043] In one possible implementation, the reverse microwave board includes a matching structure with reverse microstrip gold wire bonding and a reverse microwave signal transmission line, and the reverse pin of the insulator is bonded to the matching structure with reverse microstrip gold wire bonding.

[0044] In a specific example, for example Figure 3 As shown, the reverse microwave board 106 includes a reverse microstrip gold wire bonding matching structure 1061 and a reverse microwave signal transmission line 1062. The reverse microstrip gold wire bonding matching structure 1061 and the reverse microwave signal transmission line 1062 are connected by a microstrip line 1063 and are fixedly mounted on the reverse cavity 103. The reverse pin of the insulator 104 is bonded to the reverse microstrip gold wire bonding matching structure 1061, which is used to transmit the reverse microwave signal through the reverse microwave signal transmission line 1062 to the reverse microstrip gold wire bonding matching structure 1061, and the reverse microstrip gold wire bonding matching structure 1061 transmits the reverse microwave signal to the insulator 104. The matching structure 1061 of the reverse microstrip gold wire bonding and the reverse microwave signal transmission line 1062 are also used to transmit the front microwave signal transmitted from the front cavity to the insulator 104 to the matching structure 1061 of the reverse microstrip gold wire bonding. After passing through the matching structure 1061 of the reverse microstrip gold wire bonding, the front microwave signal is transmitted to the reverse cavity 103 by the reverse microwave signal transmission line 1062, realizing the vertical electrical transmission of the front-to-back microwave signal and improving the reliability and stability of the microwave component.

[0045] In one possible implementation, the surface of the front pin away from the insulator is flush with the surface of the front microwave plate near the insulator, and the surface of the back pin away from the insulator is flush with the surface of the back microwave plate away from the insulator.

[0046] Continuing with the previous example, for example Figure 1 As shown, the insulator 104 includes a front pin 1041 and a back pin 1042, which are symmetrically arranged about the insulator 104. The front pin 1041 is lower than the front microwave plate 105, and the back pin 1042 is horizontally aligned with the back microwave plate 106. Specifically, the surface of the front pin 1041 furthest from the insulator 104 is horizontally aligned with the surface of the front microwave plate 105 closest to the insulator 104, reducing electromagnetic wave reflection and scattering on the insulator surface, thereby reducing electromagnetic interference; and increasing the contact area between the insulator and the front microwave plate, enhancing stability. The back pin 1042 is horizontally aligned with the back microwave plate 106, meaning the surface of the back pin 1042 furthest from the insulator 104 is horizontally aligned with the surface of the back microwave plate 106 furthest from the insulator 104, reducing reflection and interference during microwave signal transmission, improving signal integrity and transmission quality; reducing electromagnetic wave leakage, lowering electromagnetic interference, and improving the electromagnetic compatibility of the device.

[0047] In one possible implementation, the front microwave plate is brazed to the front of the component structure, and the back microwave plate is brazed to the back of the component structure.

[0048] Continuing with the previous example, for example Figure 1 As shown, the front microwave plate 105 is located inside the front cavity 102 and brazed to the front of the component structure 101, used to transmit front microwave signals; the back microwave plate 106 is located inside the back cavity 103 and brazed to the back of the component structure 101, used to receive the front microwave signals transmitted by the front microwave plate 105 and transmit the back microwave signals. In this example, the front microwave plate 105 and the back microwave plate 106 are brazed to the front and back of the component structure 101 respectively. The brazing temperature is lower than the melting point of the component structure, resulting in relatively small stress and deformation, and minimal impact on the component structure; moreover, the welding equipment is simple and the production efficiency is high.

[0049] Continuing with the previous example, for example Figure 2As shown, the front microstrip gold wire bonding matching structure 1051 and the front microwave signal transmission line 1052 are disposed on the front microwave board 105. The front microwave signal is transmitted to the front microstrip gold wire bonding matching structure 1051 through the front microwave signal transmission line 1052, and then transmitted to the insulator 104 by the front microstrip gold wire bonding matching structure 1051 through gold wire bonding. For example Figure 3 As shown, the matching structure 1061 of the reverse microstrip gold wire bonding and the reverse microwave signal transmission line 1062 are disposed on the reverse microwave board 106. The reverse microstrip gold wire bonding matching structure 1061 receives the front microwave signal and transmits the front microwave signal to the reverse microwave signal transmission line 1062. The reverse microwave signal transmission line 1062 then transmits the front microwave signal to the reverse cavity 103, realizing the vertical transmission of the front-to-reverse microwave signal.

[0050] For example Figure 3 As shown, the reverse microwave signal is transmitted to the gold wire bonded matching structure 1061 of the reverse microstrip line via the reverse microwave signal transmission line 1062. The reverse microwave signal is then transmitted to the insulator 104 via gold wire bonding through the gold wire bonded matching structure 1061. For example... Figure 2 As shown, the insulator 104 transmits the reverse microwave signal to the matching structure 1051 of the front microstrip line gold wire bonding through gold wire bonding. The matching structure 1051 of the front microstrip line gold wire bonding transmits the reverse microwave signal to the front microwave signal transmission line 1052. The front microwave signal transmission line 1052 transmits the reverse microwave signal to the front cavity 102, realizing the vertical transmission of the reverse-to-front microwave signal.

[0051] In one possible implementation, the front microwave plate and the back microwave plate are symmetrically arranged on both sides of the insulator.

[0052] Continuing with the previous example, for example Figure 1As shown, component structure 101 divides the device into a front cavity 102 and a back cavity 103. Front microwave plate 105 and back microwave plate 106 are respectively disposed on the front cavity 102 and back cavity 103. Front microwave plate 105 and back microwave plate 106 are symmetrically disposed on both sides of insulator 104, separating them to facilitate vertical interconnection via gold wire bonding. Specifically, the surface of front microwave plate 105 near the insulator is flush with the surface of front pin 1041 away from the insulator, and the surface of back microwave plate 106 away from the insulator is flush with the surface of back pin 1042 away from the insulator. The separation of front microwave plate 105 and back microwave plate 106 by insulator 104 isolates interference between front and back microwave signals during transmission, improving signal transmission quality and stability, and ensuring normal device operation.

[0053] In one possible implementation, both the front microwave plate and the back microwave plate are single-layer plates.

[0054] Continuing with the previous example, for example Figure 1 As shown, both the front microwave board 105 and the back microwave board 106 are single-layer boards. Compared with the microwave assembly using a mixed-press board form on the back microwave board, they are easier to manufacture, reduce costs, and minimize the impact of differences in board material properties.

[0055] This embodiment separates the front and back cavities using a component structure. A front microwave board is placed in the front cavity to form the front microwave cavity, transmitting front microwave signals; a back microwave board is placed in the back cavity to form the back microwave cavity, transmitting back microwave signals. The component structure has cavities, and insulators are placed in the cavities to isolate the front and back microwave boards. Both the front and back microwave boards are connected to the insulators via gold wire bonding to enable microwave signal transmission between them. Through simulation optimization, good impedance matching is ensured, achieving good transmission of front-to-back and back-to-front microwave signals. In this embodiment, both the front and back microwave boards are single-layer boards, which is easier to manufacture and reduces costs compared to microwave components using a mixed-pressure plate for the back microwave board. This embodiment can also be widely applied to double-sided microwave components.

[0056] Another embodiment of the present invention provides a transceiver assembly, including a transmitting device, a receiving device, a control device, and a microwave device for bidirectional transmission as described above.

[0057] The transmitting device is used to generate the first microwave signal during the transmission phase of the transceiver assembly;

[0058] The receiving device is used to receive the second microwave signal sent by the antenna to the transceiver component, preprocess the second microwave signal, and output the preprocessed second microwave signal.

[0059] The microwave device is used to control the transmission of the first microwave signal and the second microwave signal between the front and back sides of the transceiver component, so as to realize the bi-directional vertical transmission of the first microwave signal and the preprocessed second microwave signal.

[0060] The control device is used to supply power to the transceiver assembly and to control and adjust the phase and amplitude of the first microwave signal and the preprocessed second microwave signal.

[0061] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0062] It should also be noted that in the description of this invention, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0063] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A microwave device for double-sided transmission, characterized in that, This includes structural components, a front microwave plate, a back microwave plate, and insulators, among which, The component structure has an opening, and the insulator is disposed at the opening of the component structure. The component structure and the insulator form a front cavity on one side of the opening and a back cavity on the other side. The front cavity is used to house the front microwave plate and transmit front microwave signals; The reverse cavity is used to house the reverse microwave plate and transmit reverse microwave signals; Both the front microwave plate and the back microwave plate are interconnected with the insulator via gold wire bonding, which enables the transmission of microwave signals between the front microwave plate and the back microwave plate. The insulator includes a front pin and a back pin; The front microwave board includes a matching structure with gold wire bonding of the front microstrip line and a front microwave signal transmission line. The front pin of the insulator is bonded to the matching structure with gold wire bonding of the front microstrip line. The reverse microwave board includes a matching structure with gold wire bonding of the reverse microstrip line and a reverse microwave signal transmission line. The reverse pin of the insulator is bonded to the matching structure with gold wire bonding of the reverse microstrip line. The surface of the front pin away from the insulator is flush with the surface of the front microwave plate near the insulator, and the surface of the back pin away from the insulator is flush with the surface of the back microwave plate away from the insulator.

2. The apparatus according to claim 1, characterized in that, The front microwave plate is brazed to the front of the component structure.

3. The apparatus according to claim 1, characterized in that, The reverse microwave plate is brazed to the reverse side of the component structure.

4. The apparatus according to claim 1, characterized in that, The front microwave plate and the back microwave plate are symmetrically arranged on both sides of the insulator.

5. The apparatus according to claim 1, characterized in that, Both the front microwave plate and the back microwave plate are single-layer plates.

6. A transceiver component, characterized in that, Includes a transmitting device, a receiving device, a control device, and a microwave device for bidirectional transmission as described in any one of claims 1-5. The transmitting device is used to generate the first microwave signal during the transmission phase of the transceiver assembly; The receiving device is used to receive the second microwave signal sent by the antenna to the transceiver component, preprocess the second microwave signal, and output the preprocessed second microwave signal. The microwave device is used to control the transmission of the first microwave signal and the preprocessed second microwave signal between the front and back sides of the transceiver assembly. The control device is used to supply power to the transceiver assembly and to control and adjust the phase and amplitude of the first microwave signal and the preprocessed second microwave signal.

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