A circuit board having a metal-based structure and a method of manufacturing the same

Abstract

The application discloses a circuit board with a metal base structure and a preparation method thereof, and comprises the following steps: providing a first metal base structure and a second metal base structure, forming a first insulating medium layer and a second insulating medium layer in the first metal base structure, forming a third insulating medium layer in the second metal base structure, opening a first opening in the first insulating medium layer, providing an upper layer substrate and a lower layer substrate; laminating and compression bonding the upper layer substrate, the first metal base structure, the second metal base structure and the lower layer substrate, forming a first metal hole penetrating through the second insulating medium layer and a second metal hole penetrating through the first insulating medium layer, forming a multilayer substrate, forming a circuit pattern on the surface of the multilayer substrate, and obtaining the circuit board with the metal base structure. The volume of the power module is reduced, the cost is lowered, and the preparation process is simplified. The insulating medium layer is arranged to prevent short circuit during shunting, and the reliability of the circuit board is ensured.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing, and more particularly to a circuit board with a metal-based structure and its preparation method. Background Technology

[0002] As power electronic devices evolve towards higher power density and higher current carrying capacity, traditional printed circuit boards (PCBs) face severe challenges in terms of heat dissipation performance and current carrying capacity. PCBs made from conventional substrates are prone to localized hot spots under high current conditions due to the low thermal conductivity of the resin substrate, leading to problems such as insulation aging and copper foil peeling, which seriously restricts system reliability.

[0003] Existing JZ power modules can be divided into busbars, busbars, control circuit boards, and resistors, capacitors, and control chips mounted on each module. The low-voltage, high-current output from the generator is shunted through various busbars. The busbars are connected to each other via busbars. The control circuit board and related devices control each busbar to achieve circuit switching and current distribution.

[0004] After coating the surface of the busbars with insulating material, they are pressed together to form a busbar board. A separate conventional control circuit board is also fabricated. The control circuit board and the busbar board are stacked from top to bottom and then pressed together to achieve the current splitting function. A single JZ power module requires multiple control circuit boards and multiple busbar boards, resulting in a large overall size, complex assembly process, and high cost, which does not meet the requirements of current integrated and modular design. Summary of the Invention

[0005] This invention provides a circuit board with a metal-based structure and its manufacturing method to solve the problems of large size, high cost and complex assembly of existing power modules with shunt function.

[0006] To achieve the above objectives, in one embodiment, a method for manufacturing a circuit board with a metal substrate structure is provided, comprising: A first metal base structure and a second metal base structure are provided, wherein the first metal base structure and the second metal base structure have opposite polarities, a first protrusion is provided on the first metal base structure, and a second protrusion is provided on the second metal base structure; A first insulating dielectric layer is formed in a first groove of the first metal substrate structure, and a second insulating dielectric layer is formed in a second groove of the first metal substrate structure, thereby obtaining a first metal substrate structure provided with the first insulating dielectric layer and the second insulating dielectric layer; A third insulating dielectric layer is formed in the third groove of the second metal base structure to obtain a second metal base structure in which the third insulating dielectric layer is disposed; A first opening is formed in the second insulating dielectric layer, and an upper substrate having a second opening and a third opening and a lower substrate without openings are provided. The upper substrate, the first metal base structure, the second metal base structure and the lower substrate are stacked and pressed together, so that the first protrusion is located in the second opening and the second protrusion is located in the first opening and the third opening, to obtain a multilayer substrate after pressing. A first metal hole and a second metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the third insulating dielectric layer, and the second metal hole penetrates the first insulating dielectric layer, thus obtaining a multilayer substrate with metal holes. A circuit pattern is formed on the surface of the multilayer substrate in which the metal holes are formed, to obtain the circuit board with the metal base structure.

[0007] In one embodiment, a first insulating dielectric layer is formed in a first groove of the first metal substrate structure, and a second insulating dielectric layer is formed in a second groove of the first metal substrate structure, resulting in a first metal substrate structure disposed of the first insulating dielectric layer and the second insulating dielectric layer, comprising: The first metal base structure is slotted to obtain the first groove and the second groove. The first tank and the second tank are subjected to a blackening treatment to obtain a blackened first tank and a blackened second tank. An insulating medium is filled into the first and second tanks after the blackening treatment to obtain a first metal base structure with the first insulating medium layer and the second insulating medium layer.

[0008] In one embodiment, the upper surface of the circuit board with the metal base structure has a general opening of the first metal base structure, an upper opening of the first metal base structure, a general opening of the second metal base structure, and an upper opening of the second metal base structure; the lower surface of the circuit board with the metal base structure has a lower opening of the first metal base structure and a lower opening of the second metal base structure. The total opening of the first metal base structure is used to shunt the collected first polarity current through the upper opening and the lower opening of the first metal base structure, and the total opening of the second metal base structure is used to shunt the collected second polarity current through the upper opening and the lower opening of the second metal base structure.

[0009] In one embodiment, a first metal hole and a second metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the third insulating dielectric layer, and the second metal hole penetrates the first insulating dielectric layer, resulting in a multilayer substrate with metal holes, comprising: The laminated multilayer substrate is drilled to obtain a first through hole and a second through hole; Electroplating is performed on the first through hole and the second through hole to obtain a first through hole with an electroplated layer and a second through hole with an electroplated layer. An insulating material is filled into the first through hole with the electroplated layer to obtain the first metal hole, and an insulating material is filled into the second through hole with the electroplated layer to obtain the second metal hole.

[0010] In one embodiment, a circuit board with a metal base structure is provided, comprising: an upper substrate, a first metal base structure, a second metal base structure, and a lower substrate arranged sequentially from top to bottom. Circuit patterns are provided on the surfaces of the upper substrate and the lower substrate. A first protrusion is provided on the first metal base structure, and a second protrusion is provided on the second metal base structure. The first metal base structure and the second metal base structure have opposite polarities. A first insulating dielectric layer is further provided in a first groove of the first metal base structure, a second insulating dielectric layer is further provided in a second groove of the first metal base structure, and a third insulating dielectric layer is further provided in a third groove of the second metal base structure.

[0011] In one embodiment, the upper substrate has a general opening of the first metal base structure, an upper opening of the first metal base structure, a general opening of the second metal base structure, and an upper opening of the second metal base structure; the lower substrate has a lower opening of the first metal base structure and a lower opening of the second metal base structure, wherein... The total opening of the first metal base structure is used to shunt the collected first polarity current through the upper opening and the lower opening of the first metal base structure, and the total opening of the second metal base structure is used to shunt the collected second polarity current through the upper opening and the lower opening of the second metal base structure.

[0012] In one embodiment, the third insulating dielectric layer is further included: a first metal hole and a second metal hole, the first metal hole penetrating the third insulating dielectric layer, the first metal hole including first electroplated metal layers on both sides and a first insulating material in the middle, the second metal hole penetrating the first insulating dielectric layer, the second metal hole including second electroplated metal layers on both sides and a second insulating material in the middle.

[0013] In one embodiment, a method for fabricating a circuit board having a metal substrate structure is provided, comprising: The system provides a first metal base structure, a second metal base structure, an upper substrate having a second opening and a third opening, and a lower substrate without openings. The first metal base structure and the second metal base structure have opposite polarities. The first metal base structure has a first protrusion, and the second metal base structure has a second protrusion. The upper substrate, the first metal base structure, the second metal base structure, and the lower substrate are laminated together such that the first protrusion is located in the second opening, the third protrusion is located in the second opening, and the first metal base structure and the second metal base structure are arranged adjacent to each other to obtain a laminated multilayer substrate. A first metal hole, a second metal hole, and a third metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the first metal base structure, the second metal hole penetrates the second metal base structure, and the third metal hole penetrates the upper substrate, thus obtaining a multilayer substrate with metal holes. A circuit pattern is formed on the surface of the multilayer substrate with the metal holes to obtain the circuit board with the metal base structure.

[0014] In one embodiment, a circuit board with a metal base structure is provided, comprising an upper substrate, a metal base layer, and a lower substrate arranged sequentially from top to bottom. Circuit patterns are provided on the surfaces of the upper substrate and the lower substrate. The metal base layer includes a first metal base structure and a second metal base structure, wherein the first metal base structure and the second metal base structure are arranged adjacent to each other. A first protrusion is provided on the first metal base structure, and a second protrusion is provided on the second metal base structure. The polarities of the first metal base structure and the second metal base structure are opposite.

[0015] In one embodiment, the upper substrate has a general opening of the first metal base structure, an upper opening of the first metal base structure, a general opening of the second metal base structure, an upper opening of the second metal base structure, and a control interface; the lower substrate has a lower opening of the first metal base structure and a lower opening of the second metal base structure, wherein... The total opening of the first metal base structure is used to shunt the collected first polarity current through the upper opening and the lower opening of the first metal base structure, and the total opening of the second metal base structure is used to shunt the collected second polarity current through the upper opening and the lower opening of the second metal base structure.

[0016] The aforementioned circuit board with a metal-based structure and its fabrication method involve bonding a first metal-based structure and a second metal-based structure into a multilayer substrate to form a busbar. A circuit pattern is then formed on the surfaces of the upper and lower substrates to create a control circuit board. This integrates the busbar, busbar, and control circuit board onto a single circuit board, reducing the size of the power module, lowering costs, and simplifying the fabrication process. Forming first and second metal vias on the multilayer substrate ensures that both are insulated from the second metal substrate, preventing short circuits during current shunting and guaranteeing the reliability of the circuit board. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart of a method for preparing a circuit board with a metal-based structure according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the first metal-based structure and the second metal-based structure in one embodiment of the present invention; Figure 3 This is a schematic diagram of a first insulating dielectric layer and a second insulating dielectric layer in one embodiment of the present invention; Figure 4 This is a schematic diagram of a third insulating dielectric layer in one embodiment of the present invention; Figure 5 This is a schematic diagram showing the first opening, the second opening, and the third opening in one embodiment of the present invention; Figure 6 This is a schematic diagram of a multilayer substrate after lamination and bonding in one embodiment of the present invention; Figure 7 This is a schematic diagram of a first metal hole and a second metal hole in one embodiment of the present invention; Figure 8 This is a schematic diagram of a circuit layer disposed on the surface of a multilayer substrate in one embodiment of the present invention; Figure 9 This is a flowchart of forming a first insulating dielectric layer and a second insulating dielectric layer in one embodiment of the present invention; Figure 10 This is a schematic diagram of the first metal base structure of the first and second tanks obtained in one embodiment of the present invention; Figure 11 This is a flowchart of another method for preparing a circuit board with a metal-based structure according to one embodiment of the present invention; Figure 12 This is a schematic diagram of an upper substrate and a lower substrate provided in one embodiment of the present invention; Figure 13 This is a schematic diagram of another multilayer substrate after lamination processing in one embodiment of the present invention; Figure 14 This is a schematic diagram showing the first metal hole, the second metal hole, and the third metal hole in one embodiment of the present invention; Figure 15 This is a schematic diagram of a circuit layer disposed on the surface of another multilayer substrate in one embodiment of the present invention.

[0019] Reference numerals: 1. First metal substrate structure; 101. First insulating dielectric layer; 102. Second insulating dielectric layer; 103. First opening; 104. First groove; 105. Second groove; 106. General opening of the first metal substrate structure; 107. Upper opening of the first metal substrate structure; 108. Lower opening of the first metal substrate structure; 2. Second metal substrate structure; 201. Third insulating dielectric layer; 202. General opening of the second metal substrate structure; 203. Upper opening of the second metal substrate structure; 204. Lower opening of the second metal substrate structure; 3. Upper substrate; 301. Second opening; 302. Third opening; 31. First upper substrate; 32. Second upper substrate; 4. Lower substrate; 401. First lower substrate; 402. Second lower substrate; 403. Third lower substrate; 5. Prepreg; 6. First metal hole; 7. Second metal hole; 8. Third metal hole; 9. Control interface. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be understood that the invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0022] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0023] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0024] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0025] To fully understand this invention, detailed structures and steps will be presented in the following description to illustrate the technical solution proposed by this invention. Preferred embodiments of the invention are described in detail below; however, in addition to these detailed descriptions, the invention may have other embodiments.

[0026] In one embodiment, such as Figure 1As shown, a method for fabricating a circuit board with a metal-based structure is provided, comprising: S101, a first metal base structure and a second metal base structure are provided, the first metal base structure and the second metal base structure have opposite polarities, the first metal base structure is provided with a first protrusion, and the second metal base structure is provided with a second protrusion; Among them, such as Figure 2 As shown, both the first metal base structure 1 and the second metal base structure 2 are copper plates. The first metal base structure 1 is provided with a first protrusion, and the second metal base structure 2 is provided with a second protrusion. When the first metal base structure 1 is a positive electrode metal base, the second metal base structure 2 is a negative electrode metal base; when the first metal base structure 1 is a negative electrode metal base, the second metal base structure 2 is a positive electrode metal base.

[0027] S102, a first insulating dielectric layer is formed in the first groove of the first metal base structure, and a second insulating dielectric layer is formed in the second groove of the first metal base structure, thereby obtaining a first metal base structure provided with the first insulating dielectric layer and the second insulating dielectric layer; Among them, such as Figure 3 As shown, the first tank 104 of the first metal base structure 1 contains a first insulating dielectric layer 101, and the second tank 105 contains a second insulating dielectric layer 102. The materials of the first insulating dielectric layer 101 and the second insulating dielectric layer 102 can be resin, epoxy board, or other substances with insulating properties, all of which are within the protection scope of this application.

[0028] S103, a third insulating dielectric layer is formed in the third groove of the second metal base structure to obtain a second metal base structure in which the third insulating dielectric layer is disposed; Among them, such as Figure 4 As shown, the third groove of the second metal base structure 2 contains a third insulating dielectric layer 201, the material of which can be resin, epoxy board, or other materials with insulating properties, all of which are within the protection scope of this application.

[0029] S104, a first opening is formed in the second insulating dielectric layer, and an upper substrate having a second opening and a third opening and a lower substrate without opening are provided. Among them, such as Figure 5 As shown, a first opening 103 is provided in the second insulating dielectric layer 102, and an upper substrate 3 with a second opening 301 and a third opening 302 and a lower substrate 4 without openings are provided. The upper substrate 3 and the lower substrate 4 are both conventional circuit boards, which include, from top to bottom, a copper layer, a substrate and a copper layer. The substrate can be FR4 substrate, polytetrafluoroethylene (PTFE) or ceramic substrate, or other types of substrates, all of which are within the protection scope of this application.

[0030] S105, the upper substrate, the first metal base structure, the second metal base structure and the lower substrate are stacked and pressed together, so that the first protrusion is located in the second opening and the second protrusion is located in the first opening and the third opening, to obtain the pressed multilayer substrate. Among them, such as Figure 6 As shown, the upper substrate 3, the first metal base structure 1, the second metal base structure 2, and the lower substrate 4 are stacked and pressed together. During stacking, prepregs 5 are provided on the contact surfaces between the upper substrate 3 and the first metal base structure 1, the first metal base structure 1 and the second metal base structure 2, and the second metal base structure 2 and the lower substrate 4. Both the upper substrate 3 and the lower substrate 4 can be one or more substrates. The upper substrate 3 can be configured according to the thickness of the first protrusion of the first metal base structure 1 and the second protrusion of the second metal base structure 2. The lower substrate 4 can also be configured as needed. If both the upper substrate 3 and the lower substrate 4 are multilayer substrates, a control circuit layer can be provided on the upper substrate 3 and the lower substrate 4 before pressing. In this embodiment, the upper substrate 3 has two layers: the first upper substrate 31 and the second upper substrate 32. The lower substrate 4 has three layers: the first lower substrate 401, the second lower substrate 402, and the third lower substrate 403.

[0031] S106, a first metal hole and a second metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the third insulating dielectric layer, and the second metal hole penetrates the first insulating dielectric layer, thereby obtaining a multilayer substrate with metal holes. Among them, such as Figure 7 As shown, the first metal hole 6 penetrates the third insulating dielectric layer 201 and the first metal base structure 1, serving as a current shunt port of the first metal base structure 1 and maintaining insulation between it and the second metal base structure 2. The second metal hole 7 penetrates the first insulating dielectric layer 101 and the second metal base structure 2, serving as a current shunt port of the second metal base structure 2 and maintaining insulation between it and the first metal base structure 1.

[0032] S107, a circuit pattern is formed on the surface of the multilayer substrate in which the metal holes are formed, to obtain the circuit board with the metal base structure.

[0033] Among them, such as Figure 8 As shown, after forming the circuit pattern, a circuit board with a metal base structure is obtained.

[0034] In this embodiment, a busbar is formed by laminating a first metal base structure and a second metal base structure onto a multilayer substrate. A circuit pattern is formed on the surfaces of the upper and lower substrates to create a control circuit board. Integrating the busbar, busbar, and control circuit board onto a single circuit board reduces the size of the power module, lowers costs, and simplifies the manufacturing process. Forming first and second metal vias on the multilayer substrate ensures that both are insulated from the second metal base structure, preventing short circuits during current shunting and guaranteeing the reliability of the circuit board.

[0035] In one embodiment, such as Figure 9 As shown, a first insulating dielectric layer is formed in a first groove of the first metal substrate structure, and a second insulating dielectric layer is formed in a second groove of the first metal substrate structure, resulting in a first metal substrate structure having the first insulating dielectric layer and the second insulating dielectric layer disposed thereon, comprising: S201, The first metal base structure is slotted to obtain the first groove and the second groove; Among them, such as Figure 10 As shown, after slotting the first metal base structure 1, a first groove 104 and a second groove 105 are obtained.

[0036] S202, blacken the first tank and the second tank to obtain the blackened first tank and the second tank. Among them, blackening treatment is a surface treatment technology that uses a chemical solution to carry out an oxidation-reduction reaction on the first metal substrate structure to generate a black copper oxide film, thereby increasing the surface roughness of the first metal substrate structure so that the insulating medium can be more firmly attached to the copper surface of the first metal substrate structure.

[0037] S203, filling the first and second tanks after the blackening treatment with an insulating medium to obtain a first metal base structure with the first insulating medium layer and the second insulating medium layer.

[0038] Among them, such as Figure 2 As shown, insulating medium is filled into the first tank 104 and the second tank 105 after blackening to obtain the first insulating medium layer 101 and the second insulating medium layer 102.

[0039] In this embodiment, by slotting, blackening and filling the first metal base structure, a first insulating dielectric layer and a second insulating dielectric layer are set on the first metal base structure, so that the first metal base structure is insulated from the second metal base structure, and the first metal base structure is insulated from the second metal hole, ensuring that no short circuit will be caused when a large current is shunt, thus improving the reliability of the circuit board with the metal base structure.

[0040] In one embodiment, the upper surface of the circuit board with the metal base structure has a general opening of the first metal base structure, an upper opening of the first metal base structure, a general opening of the second metal base structure, and an upper opening of the second metal base structure; the lower surface of the circuit board with the metal base structure has a lower opening of the first metal base structure and a lower opening of the second metal base structure. The total opening of the first metal base structure is used to shunt the collected first polarity current through the upper opening and the lower opening of the first metal base structure, and the total opening of the second metal base structure is used to shunt the collected second polarity current through the upper opening and the lower opening of the second metal base structure.

[0041] When the first metal base structure 1 is used as the positive metal base, the total opening 106 of the first metal base structure receives the positive current and shunts the positive current through the upper opening 107 and the lower opening 108 of the first metal base structure. At this time, the second metal base structure 2 is used as the negative metal base, the total opening 202 of the second metal base structure receives the negative current and shunts the negative current through the upper opening 203 and the lower opening 204 of the second metal base structure. When the first metal base structure 1 is used as the negative electrode metal base, the total opening 106 of the first metal base structure receives the negative electrode current and shunts the negative electrode current through the upper opening 107 and the lower opening 108 of the first metal base structure. At this time, the second metal base structure 2 is used as the positive electrode metal base. The total opening 202 of the second metal base structure receives the positive electrode current and shunts the positive electrode current through the upper opening 203 and the lower opening 204 of the second metal base structure.

[0042] In this embodiment, a first metal base structure general opening, a first metal base structure upper and lower openings, a second metal base structure general opening, and a second metal base structure upper and lower openings are formed on the upper and lower surfaces of the circuit with the metal base structure. This allows the positive and negative maximum currents to flow through the general opening to the upper and lower openings, thereby achieving current shunting and improving the current carrying capacity of the circuit board, and realizing reasonable current distribution of the power module.

[0043] In one embodiment, such as Figure 11 As shown, a first metal hole and a second metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the third insulating dielectric layer, and the second metal hole penetrates the first insulating dielectric layer, resulting in a multilayer substrate with metal holes, comprising: S401, Drilling is performed on the laminated multilayer substrate to obtain a first through hole and a second through hole; During the drilling process, both the first and second through holes penetrate the entire laminated multilayer substrate. Simultaneously, the first metal hole also penetrates the third insulating dielectric layer through the first metal base structure, and the second metal hole also penetrates the first insulating dielectric layer through the second metal base structure. The sizes of the first and second through holes can be calculated and set according to the magnitude of the current.

[0044] S402, electroplating is performed on the first through hole and the second through hole to obtain a first through hole with an electroplated layer and a second through hole with an electroplated layer. During the electroplating process, an electroplated copper layer is formed on the surfaces of the first and second through holes. This can be calculated using corresponding simulation software, such as Saturn PCB Design Toolkit, Sierra Circuits online calculation tool, ProPCB, etc. The area of ​​the safe current-carrying surface can be automatically calculated by inputting the current. The area of ​​the electroplated copper layer is obtained by subtracting the area of ​​the through hole from the area of ​​the metal hole. The thickness of the electroplated copper layer is then obtained based on the area of ​​the electroplated copper layer.

[0045] S403, fill the first through hole with the electroplated layer with insulating material to obtain the first metal hole, and fill the second through hole with the electroplated layer with insulating material to obtain the second metal hole.

[0046] Among them, such as Figure 7 As shown, both the first metal hole 6 and the second metal hole 7 have electroplated copper layers on both sides and an insulating material filled in the middle, wherein the insulating material is a pore-sealing resin.

[0047] In this embodiment, an electroplated copper layer is provided in the first through hole and the second through hole so that the first through hole and the second through hole can conduct electricity and shunt current. An insulating material is provided to ensure the long-term reliability of the metal hole. The insulating material is filled into the through hole with the electroplated layer, which increases the connection of the surface (soldering surface) of the multilayer substrate, enables rapid heat dissipation, extends the service life of the circuit board, and improves the current carrying capacity.

[0048] In one embodiment, such as Figure 8As shown, a circuit board with a metal base structure is provided, comprising: an upper substrate 3, a first metal base structure 1, a second metal base structure 2, and a lower substrate 4 arranged sequentially from top to bottom. Circuit patterns are provided on the surfaces of the upper substrate 3 and the lower substrate 4. A first protrusion is provided on the first metal base structure 1, and a second protrusion is provided on the second metal base structure 2. The polarities of the first metal base structure 1 and the second metal base structure 2 are opposite. A first insulating dielectric layer 101 is also provided in the first groove of the first metal base structure 1, a second insulating dielectric layer 102 is also provided in the second groove of the first metal base structure 1, and a third insulating dielectric layer 201 is also provided in the third groove of the second metal base structure 2.

[0049] Among them, such as Figure 2 As shown, a first protrusion is provided on the first metal base structure 1, and a second protrusion is provided on the second metal base structure 2. Both the first metal base structure 1 and the second metal base structure 2 are copper plates. When the first metal base structure 1 is a positive electrode metal base, the second metal base structure 2 is a negative electrode metal base; when the first metal base structure 1 is a negative electrode metal base, the second metal base structure 2 is a positive electrode metal base.

[0050] Circuit patterns are formed on the surfaces of the upper substrate 3 and the lower substrate 4. Both the upper substrate 3 and the lower substrate 4 can be one or more substrates. The upper substrate 3 can be configured according to the thickness requirements of the first protrusion of the first metal base structure 1 and the second protrusion of the second metal base structure 2. The lower substrate 4 can also be configured as needed. Figure 8 As shown. Both the upper substrate 3 and the lower substrate 4 are multilayer substrates. The upper substrate 3 has two layers, namely the first upper substrate 31 and the second upper substrate 32. The lower substrate 4 has three layers, namely the first lower substrate 401, the second lower substrate 402 and the third lower substrate 403. Control circuit layers can be provided on the upper substrate 3 and the lower substrate 4 as needed.

[0051] In this embodiment, a circuit diagram is formed on the surface of the upper substrate and the lower substrate to form a control circuit board, integrating the various parts of the power module onto a single circuit board, thereby reducing the size of the power module and lowering the cost.

[0052] In one embodiment, such as Figure 8 As shown, the upper substrate 3 is provided with a total opening 106 of the first metal base structure, an upper opening 107 of the first metal base structure, a total opening 202 of the second metal base structure, and an upper opening 203 of the second metal base structure; the lower substrate 4 is provided with a lower opening 108 of the first metal base structure and a lower opening 204 of the second metal base structure. The total opening 106 of the first metal base structure is used to shunt the collected first polarity current through the upper opening 107 and the lower opening 108 of the first metal base structure, and the total opening 202 of the second metal base structure is used to shunt the collected second polarity current through the upper opening 203 and the lower opening 204 of the second metal base structure.

[0053] When the first metal base structure 1 is used as the positive metal base, the total opening 106 of the first metal base structure receives the positive current and shunts the positive current through the upper opening 107 and the lower opening 108 of the first metal base structure. At this time, the second metal base structure 2 is used as the negative metal base, the total opening 202 of the second metal base structure receives the negative current and shunts the negative current through the upper opening 203 and the lower opening 204 of the second metal base structure. When the first metal base structure 1 is used as the negative electrode metal base, the total opening 106 of the first metal base structure receives the negative electrode current and shunts the negative electrode current through the upper opening 107 and the lower opening 108 of the first metal base structure. At this time, the second metal base structure 2 is used as the positive electrode metal base. The total opening 202 of the second metal base structure receives the positive electrode current and shunts the positive electrode current through the upper opening 203 and the lower opening 204 of the second metal base structure.

[0054] In this embodiment, the total opening of the first metal base structure, the upper and lower openings of the first metal base structure, the total opening of the second metal base structure, and the upper and lower openings of the second metal base structure on the upper and lower surfaces of the circuit with the metal base structure allow the positive and negative maximum currents to flow through the total opening to the upper and lower openings, thereby achieving current shunting of the large current, improving the current carrying capacity of the circuit board, and realizing reasonable current distribution of the power module.

[0055] In one embodiment, such as Figure 8 As shown, it also includes: a first metal hole 6 and a second metal hole 7. The first metal hole 6 penetrates the third insulating dielectric layer 201. The first metal hole 6 includes a first electroplated metal layer on both sides and a first insulating material in the middle. The second metal hole 7 penetrates the first insulating dielectric layer 101. The second metal hole 7 includes a second electroplated metal layer on both sides and a second insulating material in the middle.

[0056] The first and second electroplated metal layers are both electroplated copper layers, and the first and second insulating materials are both pore-sealing resins.

[0057] In this embodiment, the first electroplated metal layer and the second electroplated metal layer enable the first metal hole and the second metal hole to conduct electricity and shunt current, and the first insulating material and the second insulating material ensure the long-term reliability of the metal hole, extend the service life of the circuit board, and improve the current carrying capacity.

[0058] In one embodiment, such as Figure 12 As shown, a method for fabricating a circuit board with a metal-based structure is provided, comprising: S801, provides a first metal base structure, a second metal base structure, an upper substrate having a second opening and a third opening, and a lower substrate without openings, wherein the first metal base structure and the second metal base structure have opposite polarities, the first metal base structure has a first protrusion, and the second metal base structure has a second protrusion. Among them, such as Figure 2 As shown, the first metal substrate structure 1 has a first protrusion, the second metal substrate structure 2 has a second protrusion, and the upper substrate 3 has a second opening 301 and a third opening 302. When the first metal substrate structure 1 is a positive electrode metal substrate, the second metal substrate structure 2 is a negative electrode metal substrate; when the first metal substrate structure 1 is a negative electrode metal substrate, the second metal substrate structure 2 is a positive electrode metal substrate. Figure 12 As shown, both the upper substrate 3 and the lower substrate 4 are conventional circuit boards, which include, from top to bottom, a copper layer, a substrate and a copper layer. The substrate can be FR4 substrate, polytetrafluoroethylene (PTFE) or ceramic substrate, or other types of substrate, all of which are within the scope of protection of this application.

[0059] S802, the upper substrate, the first metal base structure, the second metal base structure and the lower substrate are laminated together, such that the first protrusion is located in the second opening and the second protrusion is located in the third opening, and the first metal base structure and the second metal base structure are arranged adjacent to each other, to obtain the laminated multilayer substrate; Among them, such as Figure 13As shown, the first protrusion of the first metal base structure 1 is located in the second opening 301, and the second protrusion of the second metal base structure 2 is located in the third opening 302. When the first metal base structure 1 and the second metal base structure 2 are arranged adjacent to each other, an insulating material is provided in the middle to insulate the first metal base structure 1 and the second metal base structure 2. Prepregs 5 are provided on the contact surfaces of the upper substrate 3 and the first metal base structure 1, the first metal base structure 1 and the second metal base structure 2, and the second metal base structure 2 and the lower substrate 4. The upper substrate 3 and the lower substrate 4 can be one or more substrates. The number of upper substrates 3 can be set according to the thickness of the first protrusion of the first metal base structure 1 and the second protrusion of the second metal base structure 2, and the number of lower substrates 4 can also be set as needed. If both the upper substrate 3 and the lower substrate 4 are multilayer substrates, a control circuit layer can be provided on the upper substrate 3 and the lower substrate 4 before lamination. In this embodiment, the upper substrate 3 has two layers, namely the first upper substrate 31 and the second upper substrate 32, and the lower substrate 4 has a bright layer, namely the first lower substrate 401 and the second lower substrate 402.

[0060] S803, a first metal hole, a second metal hole, and a third metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the first metal base structure, the second metal hole penetrates the second metal base structure, and the third metal hole penetrates the upper substrate, thereby obtaining a multilayer substrate with metal holes. Among them, such as Figure 14 As shown, when forming the first metal hole 6, the second metal hole 7, and the third metal hole 8, the multilayer substrate after lamination is first drilled. The first through hole and the second through hole penetrate the entire multilayer substrate after lamination, and the third through hole penetrates the upper substrate 3. At the same time, the first metal hole 6 also penetrates the third insulating dielectric layer 201 through the first metal base structure 1, and the second metal hole 7 also penetrates the first insulating dielectric layer 101 through the second metal base structure 2. The size of the first through hole and the second through hole can be calculated and set according to the magnitude of the current.

[0061] S804, a circuit pattern is formed on the surface of the multilayer substrate with the metal holes to obtain the circuit board with the metal base structure.

[0062] Among them, such as Figure 15 As shown, after forming the circuit pattern, a circuit board with a metal base structure is obtained.

[0063] In this embodiment, a busbar is formed by bonding a first metal base structure and a second metal base structure together in a multilayer substrate. A circuit diagram is then formed on the surfaces of the upper and lower substrates to create a control circuit board, integrating the power module onto a single circuit board. This reduces the size of the power module, lowers costs, and simplifies the manufacturing process. First and second metal vias are formed on the multilayer substrate, ensuring that both are insulated from each other, preventing short circuits during current shunting and guaranteeing the reliability of the circuit board.

[0064] In one embodiment, such as Figure 15 As shown, a circuit board with a metal base structure is provided, including an upper substrate 3, a metal base layer, and a lower substrate 4 arranged sequentially from top to bottom. Circuit patterns are provided on the surfaces of the upper substrate 3 and the lower substrate 4. The metal base layer includes a first metal base structure 1 and a second metal base structure 2, which are arranged adjacent to each other. A first protrusion is provided on the first metal base structure 1, and a second protrusion is provided on the second metal base structure 2. The polarities of the first metal base structure 1 and the second metal base structure 2 are opposite.

[0065] Among them, such as Figure 2 As shown, a first protrusion is provided on the first metal base structure 1, and a second protrusion is provided on the second metal base structure 2. Both the first metal base structure 1 and the second metal base structure 2 are copper plates. When the first metal base structure 1 is a positive electrode metal base, the second metal base structure 2 is a negative electrode metal base; when the first metal base structure 1 is a negative electrode metal base, the second metal base structure 2 is a positive electrode metal base.

[0066] Circuit patterns are formed on the surfaces of the upper substrate 3 and the lower substrate 4. Both the upper substrate 3 and the lower substrate 4 can be one or more substrates. The upper substrate 3 can be configured according to the thickness requirements of the first protrusion of the first metal base structure 1 and the second protrusion of the second metal base structure 2. The lower substrate 4 can also be configured as needed. Figure 8 As shown. Both the upper substrate 3 and the lower substrate 4 are multilayer substrates. The upper substrate 3 has two layers, namely the first upper substrate 31 and the second upper substrate 32. The lower substrate 4 has two layers, namely the first lower substrate 401 and the second lower substrate 402. Control circuit layers can be provided on the upper substrate 3 and the lower substrate 4 as needed.

[0067] In this embodiment, a circuit diagram is formed on the surface of the upper substrate and the lower substrate to form a control circuit board, integrating the various parts of the power module onto a single circuit board, thereby reducing the size of the power module and lowering the cost.

[0068] In one embodiment, such as Figure 15As shown, the upper substrate 3 is provided with a total opening 106 of the first metal base structure, an upper opening 107 of the first metal base structure, a total opening 202 of the second metal base structure, an upper opening 203 of the second metal base structure, and a control interface 9. The lower substrate 4 is provided with a lower opening 108 of the first metal base structure and a lower opening 204 of the second metal base structure. The total opening 106 of the first metal base structure is used to shunt the collected first polarity current through the upper opening 107 and the lower opening 108 of the first metal base structure, and the total opening 202 of the second metal base structure is used to shunt the collected second polarity current through the upper opening 203 and the lower opening 204 of the second metal base structure.

[0069] When the first metal base structure 1 is used as the positive metal base, the total opening 106 of the first metal base structure receives the positive current and shunts the positive current through the upper opening 107 and the lower opening 108 of the first metal base structure. At this time, the second metal base structure 2 is used as the negative metal base, the total opening 202 of the second metal base structure receives the negative current and shunts the negative current through the upper opening 203 and the lower opening 204 of the second metal base structure. When the first metal base structure 1 is used as the negative electrode metal base, the total opening 106 of the first metal base structure receives the negative electrode current and shunts the negative electrode current through the upper opening 107 and the lower opening 108 of the first metal base structure. At this time, the second metal base structure 2 is used as the positive electrode metal base. The total opening 202 of the second metal base structure receives the positive electrode current and shunts the positive electrode current through the upper opening 203 and the lower opening 204 of the second metal base structure.

[0070] Control interface 9 can adjust the current shunt path via external signals.

[0071] In this embodiment, a first metal base structure general opening, a first metal base structure upper and lower openings, a second metal base structure general opening, a second metal base structure upper and lower openings, and a control interface are formed on the upper and lower surfaces of the circuit with the metal base structure. This allows the positive and negative maximum currents to flow through the general opening to the upper and lower openings to achieve current shunting, thereby improving the current carrying capacity of the circuit board and realizing reasonable current distribution of the power module.

[0072] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for fabricating a circuit board with a metal-based structure, characterized in that, include: A first metal base structure and a second metal base structure are provided, wherein the first metal base structure and the second metal base structure have opposite polarities, a first protrusion is provided on the first metal base structure, and a second protrusion is provided on the second metal base structure; A first insulating dielectric layer is formed in a first groove of the first metal substrate structure, and a second insulating dielectric layer is formed in a second groove of the first metal substrate structure, thereby obtaining a first metal substrate structure provided with the first insulating dielectric layer and the second insulating dielectric layer; A third insulating dielectric layer is formed in the third groove of the second metal base structure to obtain a second metal base structure in which the third insulating dielectric layer is disposed; A first opening is formed in the second insulating dielectric layer, and an upper substrate having a second opening and a third opening and a lower substrate without openings are provided. The upper substrate, the first metal base structure, the second metal base structure and the lower substrate are stacked and pressed together, such that the first protrusion is located in the second opening and the second protrusion is located in the first opening and the third opening, to obtain a multilayer substrate after pressing. A first metal hole and a second metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the third insulating dielectric layer, and the second metal hole penetrates the first insulating dielectric layer, thus obtaining a multilayer substrate with metal holes. A circuit pattern is formed on the surface of the multilayer substrate in which the metal holes are formed, to obtain the circuit board with the metal base structure.

2. The preparation method according to claim 1, characterized in that, A first insulating dielectric layer is formed in a first groove of the first metal substrate structure, and a second insulating dielectric layer is formed in a second groove of the first metal substrate structure, thereby obtaining a first metal substrate structure having the first insulating dielectric layer and the second insulating dielectric layer disposed thereon, comprising: The first metal base structure is slotted to obtain the first groove and the second groove. The first tank and the second tank are subjected to a blackening treatment to obtain a blackened first tank and a blackened second tank. An insulating medium is filled into the first and second tanks after the blackening treatment to obtain a first metal base structure with the first insulating medium layer and the second insulating medium layer.

3. The preparation method according to claim 2, characterized in that, The upper surface of the circuit board with the metal base structure has a general opening of the first metal base structure, an upper opening of the first metal base structure, a general opening of the second metal base structure, and an upper opening of the second metal base structure. The lower surface of the circuit board with the metal base structure has a lower opening of the first metal base structure and a lower opening of the second metal base structure. The total opening of the first metal base structure is used to shunt the collected first polarity current through the upper opening and the lower opening of the first metal base structure, and the total opening of the second metal base structure is used to shunt the collected second polarity current through the upper opening and the lower opening of the second metal base structure.

4. The preparation method according to claim 3, characterized in that, A first metal hole and a second metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the third insulating dielectric layer, and the second metal hole penetrates the first insulating dielectric layer, resulting in a multilayer substrate with metal holes, comprising: The laminated multilayer substrate is drilled to obtain a first through hole and a second through hole; Electroplating is performed on the first through hole and the second through hole to obtain a first through hole with an electroplated layer and a second through hole with an electroplated layer. An insulating material is filled into the first through hole with the electroplated layer to obtain the first metal hole, and an insulating material is filled into the second through hole with the electroplated layer to obtain the second metal hole.

5. A circuit board having a metal-based structure, characterized in that, include: The upper substrate, the first metal base structure, the second metal base structure, and the lower substrate are arranged sequentially from top to bottom. The surfaces of the upper substrate and the lower substrate are provided with circuit patterns. The first metal base structure has a first protrusion, and the second metal base structure has a second protrusion. The polarities of the first metal base structure and the second metal base structure are opposite. A first insulating dielectric layer is provided in the first groove of the first metal base structure, a second insulating dielectric layer is provided in the second groove of the first metal base structure, and a third insulating dielectric layer is provided in the third groove of the second metal base structure. A first opening is formed in the second insulating dielectric layer, and a second opening and a third opening are formed on the upper substrate. No opening is formed on the lower substrate. The first protrusion is located in the second opening, and the second protrusion is located in the first opening and the third opening. A first metal hole penetrating the third insulating dielectric layer is formed in the third insulating dielectric layer, and a second metal hole penetrating the first insulating dielectric layer is formed in the first insulating dielectric layer.

6. The circuit board according to claim 5, characterized in that, The upper substrate has a main opening of the first metal base structure, an upper opening of the first metal base structure, a main opening of the second metal base structure, and an upper opening of the second metal base structure. The lower substrate has a lower opening of the first metal base structure and a lower opening of the second metal base structure. The total opening of the first metal base structure is used to shunt the collected first polarity current through the upper opening and the lower opening of the first metal base structure, and the total opening of the second metal base structure is used to shunt the collected second polarity current through the upper opening and the lower opening of the second metal base structure.

7. The circuit board according to claim 6, characterized in that, Also includes: A first metal hole and a second metal hole, wherein the first metal hole penetrates the third insulating dielectric layer and includes a first electroplated metal layer on both sides and a first insulating material in the middle; and the second metal hole penetrates the first insulating dielectric layer and includes a second electroplated metal layer on both sides and a second insulating material in the middle.

8. A method for fabricating a circuit board with a metal-based structure, characterized in that, include: The system provides a first metal base structure, a second metal base structure, an upper substrate having a second opening and a third opening, and a lower substrate without openings. The first metal base structure and the second metal base structure have opposite polarities. The first metal base structure has a first protrusion, and the second metal base structure has a second protrusion. The upper substrate, the first metal base structure, the second metal base structure, and the lower substrate are laminated together such that the first protrusion is located in the second opening, the second protrusion is located in the third opening, and the first metal base structure and the second metal base structure are arranged adjacent to each other to obtain a laminated multilayer substrate. A first metal hole, a second metal hole, and a third metal hole are formed on the laminated multilayer substrate. The first metal hole penetrates the first metal base structure, the second metal hole penetrates the second metal base structure, and the third metal hole penetrates the upper substrate, thus obtaining a multilayer substrate with metal holes. A circuit pattern is formed on the surface of the multilayer substrate with the metal holes to obtain the circuit board with the metal base structure.

9. A circuit board having a metal-based structure, characterized in that, The system comprises an upper substrate, a metal base layer, and a lower substrate arranged sequentially from top to bottom. Circuit patterns are formed on the surfaces of the upper and lower substrates. The upper substrate has a second opening and a third opening, while the lower substrate has no opening. The metal base layer includes a first metal substrate structure and a second metal substrate structure, which are adjacent to each other. The first metal substrate structure has a first protrusion, and the second metal substrate structure has a second protrusion. The polarities of the first and second metal substrate structures are opposite. The first protrusion is located in the second opening, and the second protrusion is located in the third opening. A first metal hole penetrating the first metal substrate structure is formed, and a second metal hole penetrating the second metal substrate structure is formed. A third metal hole penetrating the upper substrate is formed.

10. The circuit board according to claim 9, characterized in that, The upper substrate has a main opening of the first metal base structure, an upper opening of the first metal base structure, a main opening of the second metal base structure, an upper opening of the second metal base structure, and a control interface. The lower substrate has a lower opening of the first metal base structure and a lower opening of the second metal base structure. The total opening of the first metal base structure is used to shunt the collected first polarity current through the upper opening and the lower opening of the first metal base structure, and the total opening of the second metal base structure is used to shunt the collected second polarity current through the upper opening and the lower opening of the second metal base structure.

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