一种PCB板阶梯槽制备工艺
By using segmented pressure stacking and step-by-step mechanical milling processes, combined with high-frequency vibration and copper plating, the problems of low precision and efficiency in the traditional PCB stepped groove manufacturing process have been solved, achieving high-precision and high-quality stepped groove processing, which is suitable for high-frequency and high-density electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NIPPON (BOLUO) ELECTRONICS CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional PCB stepped groove manufacturing processes suffer from poor precision, low yield, and low efficiency, making it difficult to meet the demands of high-frequency, high-density, and high-performance electronic devices.
The process combines segmented pressure stacking, step-by-step mechanical milling, and precision milling, including pretreatment, stacking, primary and secondary mechanical depth control milling, and final mechanical depth control precision milling. Combined with high-frequency vibration and copper plating, the machining accuracy and structural strength of the stepped groove are optimized.
The depth and position accuracy of the stepped grooves were improved, while surface roughness and burr rate were reduced, resulting in a high-quality groove surface that meets the requirements of high-speed signal transmission.