Electronic device

Abstract

The application discloses an electronic device, and belongs to the technical field of energy recovery of electronic devices. The electronic device comprises a device shell, a functional element, a heat dissipation fan and an energy conversion module, the functional element, the heat dissipation fan and the energy conversion module are arranged in the device shell, the device shell is provided with an air inlet and an air outlet, the air outlet side of the heat dissipation fan faces the air outlet, the functional element is located on the side of the heat dissipation fan away from the air outlet, and the energy conversion module is located on the side of the heat dissipation fan facing the air outlet. The energy conversion module comprises at least one of a piezoelectric conversion module and a thermoelectric conversion module. In the case that the heat dissipation fan works, the airflow entering the device shell from the air inlet flows through the functional element, the heat dissipation fan and the energy conversion module in sequence and flows out from the air outlet, the piezoelectric conversion module is used for converting the kinetic energy of the airflow into electric energy, and the thermoelectric conversion module is used for converting the heat of the airflow into electric energy. In this way, the energy generated by the electronic device is recovered, and the energy consumption of the electronic device is reduced.

Description

Technical Field

[0001] This application belongs to the field of energy recovery technology for electronic devices, and specifically relates to an electronic device. Background Technology

[0002] With the rapid development of electronic devices, their power consumption has gradually increased, making energy recovery an important research topic.

[0003] Many electronic devices (computers, air conditioner compressors, servers, base stations, etc.) contain numerous functional components. These components generate heat while performing their functions, and cooling fans are used to dissipate heat from them. However, the energy generated by these components and cooling fans during operation is wasted, resulting in high energy consumption in electronic devices. Summary of the Invention

[0004] The purpose of this application is to provide an electronic device that can at least solve the problem of wasted energy generated by electronic devices during operation in related technologies.

[0005] This application provides an electronic device, including a device housing, functional components, a cooling fan, and an energy conversion module, wherein: The functional component, the cooling fan, and the energy conversion module are all housed within the device housing. The device housing has an air inlet and an air outlet. The exhaust side of the cooling fan faces the air outlet. The functional component is located on the side of the cooling fan facing away from the air outlet. The energy conversion module is located on the side of the cooling fan facing the air outlet. The energy conversion module includes at least one of a piezoelectric conversion module and a thermoelectric conversion module. When the cooling fan is working, the airflow entering the device housing through the air inlet flows sequentially through the functional element, the cooling fan, and the energy conversion module, and flows out through the air outlet. The piezoelectric conversion module is used to convert the kinetic energy of the airflow into electrical energy, and the thermoelectric conversion module is used to convert the heat of the airflow into electrical energy.

[0006] In this embodiment, the electronic device utilizes a cooling fan to dissipate heat from functional components. When the cooling fan operates, the airflow generated by the fan possesses kinetic energy. As the airflow passes through the functional components, it carries the heat generated by the components, thus possessing both kinetic and thermal energy. An energy conversion module is added internally to the electronic device. The airflow sequentially passes through the functional components, the cooling fan, and the energy conversion module. Therefore, the airflow can transfer the heat generated by the functional components during operation to the energy conversion module. The energy conversion module includes at least one of a piezoelectric conversion module and a thermoelectric conversion module. The piezoelectric conversion module converts the kinetic energy of the airflow into electrical energy, preventing the kinetic energy generated by the cooling fan from being wasted; the thermoelectric conversion module converts the heat of the airflow into electrical energy, preventing the heat generated by the functional components from being wasted.

[0007] Therefore, the energy conversion module converts at least one of the kinetic energy and thermal energy of the airflow into electrical energy, realizing energy recovery. The recovered energy can be further supplied to functional components and cooling fans, which helps to reduce the energy consumption of electronic devices. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of the electronic device disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of the terminal block and piezoelectric conversion module disclosed in the embodiments of this application; Figure 3 This is a top view of the terminal block and piezoelectric conversion module disclosed in the embodiments of this application; Figure 4 This is a schematic diagram of the terminal block and thermoelectric conversion module disclosed in the embodiments of this application; Figure 5 This is a top view of the terminal block and thermoelectric conversion module disclosed in the embodiments of this application; Figure 6 This is a schematic diagram of the mating structure of the terminal block and the energy conversion module disclosed in the embodiments of this application; Figure 7 This is a top view of the terminal block and energy conversion module disclosed in the embodiments of this application; Figure 8 This is a partial structural schematic diagram of the electronic device disclosed in the embodiments of this application; Figure 9 This is a top view of the electronic device disclosed in the embodiments of this application; Figure 10 This is a schematic diagram of the terminal block structure disclosed in the embodiments of this application; Figure 11 This is a front view of the terminal block disclosed in the embodiments of this application; Figure 12 This is a front view of the bottom shell disclosed in the embodiments of this application; Figure 13This is a schematic diagram of the bottom shell structure disclosed in the embodiments of this application; Figure 14 This is a schematic diagram of the top shell structure disclosed in the embodiments of this application; Figure 15 This is a schematic diagram of the structure of the functional elements disclosed in the embodiments of this application; Figure 16 This is a schematic diagram of the structure of the heat dissipation component disclosed in the embodiments of this application; Figure 17 This is a front view of the heat dissipation component and the heat-conducting layer disclosed in the embodiments of this application; Figure 18 This is a schematic diagram of the cooperation between the heat sink and the cooling fan disclosed in the embodiments of this application.

[0009] Explanation of reference numerals in the attached figures: 100 - Equipment housing, 110 - Top shell, 111 - Air outlet, 120 - Bottom shell, 121 - Support protrusion, 122 - Air inlet, 101 - Air inlet, 102 - Air outlet 200 - Functional components, 210 - Circuit boards, 220 - Electronic devices 300- Cooling Fan 400 - Energy conversion module, 410 - Piezoelectric conversion module, 411 - Piezoelectric conversion device, 412 - First conductive wire, 420 - Thermoelectric conversion module, 421 - Thermoelectric conversion device, 422 - Second conductive wire. A - First direction, B - Second direction 500 - Terminal block, 510 - First insulation sealing structure, 520 - Second insulation sealing structure 600 - Heat sink, 610 - Heat sink base plate, 620 - Heat sink fin 601 - Heat dissipation channel, 601a - First heat dissipation channel, 601b - Second heat dissipation channel 700 - Thermal conductive layer. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0013] Please refer to Figures 1-18 The electronic device disclosed in this application includes a device housing 100, a functional element 200, a cooling fan 300, and an energy conversion module 400.

[0014] The device housing 100 is the outer shell of the electronic device, used to protect the functional element 200, the cooling fan 300, the energy conversion module 400, and other components. The functional element 200 can be a circuit board 210, a sensor, or other electrical device that can perform functions, and the functional element 200 generates heat when it is working. The cooling fan 300 is used to dissipate the heat generated by the functional element 200. The energy conversion module 400 is used to convert the energy of the airflow generated by the cooling fan 300 into electrical energy for recovery.

[0015] Specifically, refer to Figure 1 As shown, the functional element 200, the cooling fan 300, and the energy conversion module 400 are all disposed within the device housing 100. Optionally, the housings of the functional element 200, the cooling fan 300, and the energy conversion module 400 can be directly disposed within the device housing 100, or the housings of the functional element 200, the cooling fan 300, and the energy conversion module 400 can be indirectly disposed within the device housing 100 via other components. In short, the functional element 200, the cooling fan 300, and the energy conversion module 400 are all located within the device housing 100.

[0016] The equipment housing 100 is provided with an air inlet 101 and an air outlet 102. Optionally, the equipment housing 100 includes a connected top shell 110 and a bottom shell 120. A structural schematic diagram of the top shell 110 can be found in the following figure. Figure 14 As shown, the air outlet 102 is located on the top shell 110. A structural diagram of the bottom shell 120 can be found in the diagram. Figure 13As shown, the air inlet 101 is located on the bottom shell 120; the bottom shell 120 and the top shell 110 can be fixedly connected by means of snap-fit, bolt connection, welding, adhesive bonding, etc. refer to Figure 1 As shown, the exhaust side of the cooling fan 300 faces the exhaust port 102. External air enters the device housing 100 through the intake port 101, forms an airflow through the cooling fan 300, and flows out through the exhaust port 102. Optionally, the intake side of the cooling fan 300 may face the intake port 101, or the intake side of the cooling fan 300 may not face the intake port 101. In short, the external air entering the device housing 100 through the intake port 101 can flow through the cooling fan 300.

[0017] Furthermore, since the functional element 200 is located on the side of the cooling fan 300 facing away from the air outlet 102, that is, the functional element 200 is located on the air intake side of the cooling fan 300, the airflow carries the heat generated by the functional element 200 as it flows through the cooling fan 300, causing the airflow temperature to rise. Optionally, the functional element 200 and the cooling fan 300 can be in direct contact, or they can be in non-direct contact.

[0018] Optionally, refer to Figure 1 and Figure 15 As shown, the functional element 200 may include a circuit board 210 and electronic devices 220. The electronic devices 220 are disposed on the circuit board 210, which is used to supply power to the electronic devices 220 and control their operating states. The electronic devices 220 may include sensors and other devices, and are located on the side of the circuit board 210 facing the cooling fan 300. This facilitates airflow in carrying away heat from both the circuit board 210 and the electronic devices 220. Of course, the functional element 200 may also include other devices besides the circuit board 210 and electronic devices 220.

[0019] The energy conversion module 400 is located on the side of the cooling fan 300 facing the air outlet 102. That is, the energy conversion module 400 is located between the air outlet 102 and the cooling fan 300. So, as the airflow flows out of the device housing 100, the airflow passes through the energy conversion module 400, which allows the energy conversion module 400 to recover the energy of the airflow.

[0020] The energy conversion module 400 includes at least one of a piezoelectric conversion module 410 and a thermoelectric conversion module 420. When the cooling fan 300 is operating, the airflow entering the device housing 100 through the air inlet 101 flows sequentially through the functional element 200, the cooling fan 300, and the energy conversion module 400, and flows out through the air outlet 102. The piezoelectric conversion module 410 is used to convert the kinetic energy of the airflow into electrical energy, and the thermoelectric conversion module 420 is used to convert the heat of the airflow into electrical energy.

[0021] Specifically, the piezoelectric conversion module 410 uses the piezoelectric effect to achieve energy conversion, and the thermoelectric conversion module 420 uses the thermoelectric effect to achieve energy conversion. When the cooling fan 300 is working, one of the surfaces of the thermoelectric conversion module 420 comes into contact with the airflow and heats up, resulting in a temperature difference between the two opposite sides of the thermoelectric conversion module. An electromotive force is generated in the circuit of the thermoelectric conversion module, thereby converting heat into electrical energy.

[0022] Optionally, the energy conversion module 400 may include only the piezoelectric conversion module 410, in which case the energy conversion module 400 converts only the kinetic energy of the airflow into electrical energy; or, the energy conversion module 400 may include only the thermoelectric conversion module 420, in which case the energy conversion module 400 converts only the heat of the airflow into electrical energy; of course, the energy conversion module 400 may also include both the piezoelectric conversion module 410 and the thermoelectric conversion module 420, in which the energy conversion module 400 converts both the kinetic energy and heat of the airflow into electrical energy.

[0023] In this embodiment, the electronic device uses a cooling fan 300 to dissipate heat from the functional component 200. When the cooling fan 300 is working, the airflow generated by the cooling fan 300 has kinetic energy. After flowing through the functional component 200, the airflow carries the heat generated by the functional component 200, thus possessing both kinetic and thermal energy. An energy conversion module 400 is added inside the electronic device. The airflow flows sequentially through the functional component 200, the cooling fan 300, and the energy conversion module 400. Therefore, the airflow can transfer the heat generated by the functional component 200 during operation to the energy conversion module 400. The energy conversion module 400 includes at least one of a piezoelectric conversion module 410 and a thermoelectric conversion module 420. The piezoelectric conversion module 410 can convert the kinetic energy of the airflow into electrical energy, avoiding waste of the kinetic energy generated by the cooling fan 300; the thermoelectric conversion module 420 can convert the heat of the airflow into electrical energy, avoiding waste of the heat generated by the functional component 200.

[0024] Therefore, the energy conversion module 400 converts at least one of the kinetic energy and thermal energy of the airflow into electrical energy, realizing energy recovery. The recovered energy can be further supplied to the functional element 200 and the cooling fan 300, which helps to reduce the energy consumption of electronic devices.

[0025] In the scheme of this application, reference is made to Figure 2 and Figure 3As shown, the piezoelectric conversion module 410 includes multiple spaced-apart piezoelectric conversion devices 411 and multiple first conductive lines 412. The piezoelectric conversion devices 411 can utilize ceramic piezoelectric materials, polymer piezoelectric materials, single-crystal piezoelectric materials, etc., to achieve the piezoelectric conversion process. The first conductive lines 412 are used to achieve electrical connections between the piezoelectric conversion devices 411. Adjacent piezoelectric conversion devices 411 are connected through the first conductive lines 412. Specifically, in two adjacent piezoelectric conversion devices 411, the first end of the first conductive line 412 is electrically connected to one of the piezoelectric conversion devices 411, and the second end of the first conductive line 412 is electrically connected to the other piezoelectric conversion device 411. The same piezoelectric conversion device 411 can be electrically connected to different first conductive lines 412. The electrical connection method can be, but is not limited to, welding, plugging, etc.

[0026] Thus, when the airflow passes through the piezoelectric conversion module 410, the airflow acts on each piezoelectric conversion device 411, the piezoelectric conversion device 411 deforms under force and performs piezoelectric conversion, and the converted electrical energy can be transmitted through the first conductive wire 412.

[0027] The gaps between each piezoelectric conversion device 411 allow airflow to pass through. Optionally, the first conductive wire 412 can be an electrical connection wire. The multiple piezoelectric conversion devices 411 can be evenly or unevenly distributed. The multiple piezoelectric conversion devices 411 and the multiple first conductive wires 412 form a mesh structure, and the gaps between any two adjacent piezoelectric conversion devices 411 allow airflow to pass through, avoiding obstruction of airflow.

[0028] In this embodiment, the number of piezoelectric conversion devices 411 is relatively large, and multiple piezoelectric conversion devices 411 perform the piezoelectric conversion process simultaneously, which is beneficial to improving the efficiency of kinetic energy recovery from the airflow. Moreover, since there are gaps between each piezoelectric conversion device 411 for airflow to pass through, the airflow is not easily affected. Therefore, while ensuring smooth airflow, the distribution area of ​​the piezoelectric conversion devices 411 can be larger, and their number can be increased, which is beneficial to further improving the energy conversion efficiency.

[0029] Of course, in other embodiments, the number of piezoelectric conversion devices 411 can be one.

[0030] In a further embodiment, the first conductive wire 412 is a flexible structure. That is, the first conductive wire 412 is deformable. Optionally, the first conductive wire 412 can be a flexible structure. The first conductive wire 412 can deform under the force of airflow. After the force of airflow disappears, the first conductive wire 412 can return to its original shape or close to its original shape. The deflection of the first conductive wire 412 can be adjusted as needed. Specifically, the corresponding material is selected to adjust to the required deflection to adapt to different airflow forces, so that the deformation of the piezoelectric conversion device 411 is greater, which is beneficial to improving the piezoelectric conversion efficiency.

[0031] In this embodiment, when the airflow passes through the piezoelectric conversion module 410, the first conductive wire 412 deforms and pulls the piezoelectric conversion device 411 to deform smoothly, so that the overall structure of the piezoelectric conversion module 410 deforms, which is beneficial to improve the piezoelectric conversion efficiency and avoids the first conductive wire 412 restraining the piezoelectric conversion device 411 and affecting the deformation process of the piezoelectric conversion device 411.

[0032] Of course, in other embodiments, the first conductive wire 412 may not adopt a flexible structure, and only the piezoelectric conversion device 411 itself can deform during the piezoelectric conversion process.

[0033] In the alternative solutions of this application, refer to Figure 4 and Figure 5 As shown, the thermoelectric conversion module 420 includes multiple spaced-apart thermoelectric conversion devices 421 and multiple second conductive lines 422. The thermoelectric conversion devices 421 can be made of bismuth telluride, which has high thermoelectric conversion efficiency at room temperature. The second conductive lines 422 are used to achieve electrical connection between the thermoelectric conversion devices 421. Adjacent thermoelectric conversion devices 421 are connected through the second conductive lines 422. Specifically, in two adjacent thermoelectric conversion devices 421, the first end of the second conductive line 422 is electrically connected to one of the thermoelectric conversion devices 421, and the second end of the second conductive line 422 is electrically connected to the other thermoelectric conversion device 421. The same thermoelectric conversion device 421 can be electrically connected to different second conductive lines 422. The electrical connection method can be, but is not limited to, welding, plugging, etc.

[0034] Thus, when the airflow passes through the thermoelectric conversion module 420, the airflow acts on the surface of each thermoelectric conversion device 421 facing the cooling fan 300. The surface of the thermoelectric conversion device 421 facing the cooling fan 300 absorbs the heat of the airflow and its temperature rises. Therefore, the temperature difference between the surface of the thermoelectric conversion device 421 facing the cooling fan 300 and the surface facing away from the cooling fan 300 increases. An electromotive force is generated in the circuit of the thermoelectric conversion device 421, thereby converting heat into electrical energy. The converted electrical energy can be transmitted through the second conductive wire 422.

[0035] The gaps between the thermoelectric conversion devices 421 allow airflow to pass through. Optionally, the second conductive wire 422 can be an electrical connection wire. The multiple thermoelectric conversion devices 421 can be evenly or unevenly distributed, forming a mesh structure with the multiple thermoelectric conversion devices 421 and the multiple second conductive wires 422. The gaps between any two adjacent thermoelectric conversion devices 421 allow airflow to pass through, avoiding obstruction of airflow. In this embodiment, the number of thermoelectric conversion devices 421 is relatively large, and multiple thermoelectric conversion devices 421 perform thermoelectric conversion processes simultaneously, which is beneficial to improving the heat recovery efficiency of the airflow. Moreover, since there are gaps between each thermoelectric conversion device 421 for airflow to pass through, the airflow is not easily affected. Therefore, while ensuring smooth airflow, the distribution area of ​​the thermoelectric conversion devices 421 can be larger, and the number can be increased, which is beneficial to further improving the energy conversion efficiency.

[0036] Of course, in other embodiments, the number of thermoelectric conversion devices 421 is one.

[0037] In an optional embodiment, refer to Figure 3 and Figure 5 As shown, at least one of the piezoelectric conversion device 411 and the thermoelectric conversion device 421 is arranged in an array. That is, at least one of the piezoelectric conversion device 411 and the thermoelectric conversion device 421 is arranged according to a predetermined trajectory. Optionally, at least one of the piezoelectric conversion device 411 and the thermoelectric conversion device 421 can be arranged in a linear array, a circular array, a square array, a triangular array, an irregular array, etc. The embodiments of this application do not limit the specific array form.

[0038] In a further embodiment, the array orientation of at least one of the piezoelectric conversion device 411 and the thermoelectric conversion device 421 includes at least two directions, which are different directions, i.e., the at least two directions intersect.

[0039] Optionally, at least one of the piezoelectric conversion device 411 and the thermoelectric conversion device 421 may be arranged in a square array. The array direction may include a first direction A and a second direction B, where the first direction A intersects the second direction B. Further optionally, the first direction A and the second direction B are perpendicular. Of course, in other embodiments, the first direction A and the second direction B may intersect but not be perpendicular, and both the first direction A and the second direction B are parallel to the rotation plane of the cooling fan 300. Alternatively, the first direction A and the second direction B may also intersect the rotation plane of the cooling fan 300.

[0040] Of course, the array direction can include at least three directions, including other directions besides the first direction A and the second direction B.

[0041] In this embodiment, at least one of the piezoelectric conversion device 411 and the thermoelectric conversion device 421 is arrayed in different directions. Therefore, the number of at least one of the piezoelectric conversion device 411 and the thermoelectric conversion device 421 is greater and the distribution area is larger. This is more conducive to the piezoelectric conversion device 411 and the thermoelectric conversion device 421 being in full contact with the airflow, which is beneficial to further improving the energy conversion efficiency.

[0042] Of course, in other embodiments, the array direction of both the piezoelectric conversion device 411 and the thermoelectric conversion device 421 is the same. The array direction can be either the first direction A or the second direction B mentioned above. That is, both the piezoelectric conversion device 411 and the thermoelectric conversion device 421 adopt a linear array form.

[0043] In an optional embodiment, refer to Figure 6 and Figure 7 As shown, the thermoelectric conversion device 421 and the piezoelectric conversion device 411 are staggered along the airflow direction.

[0044] Optionally, the thermoelectric conversion module 420 may be located on the side of the piezoelectric conversion module 410 facing the cooling fan 300, and the piezoelectric conversion module 410 may be located on the side of the thermoelectric conversion module 420 facing the cooling fan 300. Along the airflow direction, at least a portion of the thermoelectric conversion device 421 and the piezoelectric conversion device 411 are offset, that is, the entire thermoelectric conversion device 421 and the entire piezoelectric conversion device 411 may be completely offset, or a portion of the thermoelectric conversion device 421 and the piezoelectric conversion device 411 may be offset.

[0045] In this embodiment, the thermoelectric conversion device 421 and the piezoelectric conversion device 411 are staggered, which facilitates the airflow to fully contact the thermoelectric conversion device 421 and the piezoelectric conversion device 411 respectively. This avoids the thermoelectric conversion device 421 blocking the airflow from contacting the piezoelectric conversion device 411, and also avoids the piezoelectric conversion device 411 blocking the airflow from contacting the thermoelectric conversion device 421. This helps to improve the piezoelectric conversion efficiency and the thermoelectric conversion efficiency, and improve the energy recovery efficiency.

[0046] Of course, in other embodiments, the thermoelectric conversion device 421 and the piezoelectric conversion device 411 can be directly opposite each other along the direction of airflow.

[0047] In the scheme of this application, reference is made to Figure 8 and Figure 14As shown, the device housing 100 includes an air outlet 111, with multiple air outlets 102 spaced apart. The air outlets 102 can be square, circular, etc., and the specific shape of the air outlets 102 is not limited in this embodiment. Optionally, the air outlet 111 can be part of the top shell 110, and the air outlets 102 can be arranged in an array, specifically a square array, which helps improve the appearance of the device housing 100. The thermoelectric conversion module 420 is opposite to the air outlet 111, and the piezoelectric conversion module 410 is located on the side of the thermoelectric conversion module 420 facing the cooling fan 300. Furthermore, the surface of each thermoelectric conversion device 421 is in contact with the inner wall surface of the air outlet 111.

[0048] The device housing 100 is typically made of metal, plastic, or similar materials. In general, the temperature of the device housing 100 is relatively low (lower than the temperature of its internal functional components 200). Therefore, in this embodiment, by having the surface (i.e., the low-temperature surface) of the thermoelectric conversion device 421 contact the air outlet 111, the air outlet 111 can cool the low-temperature surface of the thermoelectric conversion device 421, thereby increasing the temperature difference between the high-temperature and low-temperature surfaces of the thermoelectric conversion device 421. This generates a larger electromotive force inside the thermoelectric conversion device 421, which is beneficial for improving thermoelectric conversion efficiency and energy conversion efficiency.

[0049] Of course, in other embodiments, the thermoelectric conversion device 421 is separated from the air outlet 111, that is, the surface of the thermoelectric conversion device 421 is not in contact with the inner wall surface of the air outlet 111.

[0050] In the scheme of this application, reference is made to Figure 14 As shown, the device housing 100 includes an air outlet 111, with a plurality of air outlets 102 spaced apart. Optionally, the air outlet 111 may be part of the top housing 110. (Reference) Figure 8 and Figure 9 As shown, along the axial direction of the air outlet 102, the orthographic projection of the air outlet 102 lies within the orthographic projection of the gap between each thermoelectric conversion device 421. Optionally, the flow area of ​​the gap between each thermoelectric conversion device 421 can be equal to the flow area of ​​the air outlet 102, or the flow area of ​​the gap between each thermoelectric conversion device 421 can be greater than the flow area of ​​the air outlet 102. In short, the airflow through the gap between each thermoelectric conversion device 421 can quickly pass through the air outlet 102.

[0051] In this embodiment, the orthographic projection of the air outlet 102 lies within the orthographic projection of the gaps between each thermoelectric conversion device 421. This ensures that the airflow passing through the gaps between the thermoelectric conversion devices 421 can quickly and smoothly flow out through the air outlet 102, preventing the air outlet 111 from obstructing the airflow. This promotes the circulation of airflow between the inside and outside of the equipment housing 100, and further improves energy conversion efficiency. Moreover, it ensures that the surfaces of the thermoelectric conversion devices 421 are in full contact with the inner wall of the air outlet 111, increasing the temperature difference between the thermoelectric conversion devices 421 and improving thermoelectric conversion efficiency.

[0052] Of course, in other embodiments, in the axial direction of the air outlet 102, a portion of the orthographic projection of the air outlet 102 may be located within the orthographic projection of the gap between each thermoelectric conversion device 421, and another portion of the orthographic projection of the air outlet 102 may be located within the orthographic projection of the thermoelectric conversion device 421.

[0053] In the alternative solutions of this application, refer to Figure 1 As shown, the electronic device also includes a terminal block 500. The terminal block 500 has internal wires for recovering electrical energy converted by the energy conversion module 400. Specifically, the terminal block 500 is disposed between the cooling fan 300 and the inner wall of the device housing 100. Optionally, the terminal block 500 is located between the cooling fan 300 and the air outlet 111. Furthermore, the terminal block 500 surrounds the energy conversion module 400, and the energy conversion module 400 is electrically connected to the terminal block 500. Optionally, the terminal block 500 has a ring-shaped structure, specifically a square ring structure, a circular ring structure, etc. The structure of the terminal block 500 is referenced... Figure 10 As shown, it is adapted to the mesh structure formed by the piezoelectric conversion module 410 and the thermoelectric conversion module 420.

[0054] Optionally, among the plurality of first conductive lines 412 of the piezoelectric conversion module 410, a portion of the first conductive lines 412 are used to electrically connect two adjacent piezoelectric conversion devices 411, and another portion of the first conductive lines 412 are used to electrically connect the piezoelectric conversion device 411 and the terminal block 500; similarly, among the plurality of second conductive lines 422 of the thermoelectric conversion device 421, a portion of the second conductive lines 422 are used to electrically connect two adjacent thermoelectric conversion devices 421, and another portion of the second conductive lines 422 are used to electrically connect the thermoelectric conversion device 421 and the terminal block 500, thereby realizing the electrical connection between the energy conversion module 400 and the terminal block 500.

[0055] In this embodiment, the electronic device is equipped with a terminal block 500, which receives electrical energy generated by the energy conversion module 400, further facilitating the terminal block 500 to supply electrical energy to other electrical devices.

[0056] Of course, in other embodiments, the electronic device may not have a terminal block 500, and the first conductive line 412 of the piezoelectric conversion module 410 and the second conductive line 422 of the thermoelectric conversion module 420 may be directly electrically connected to other electrical devices.

[0057] In a further embodiment, reference is made to... Figures 10-11 As shown, the terminal block 500 has a first insulating sealing structure 510 on the side facing the cooling fan 300. The first insulating sealing structure 510 is made of insulating material and has sealing performance. The terminal block 500 and the cooling fan 300 are sealed together through the first insulating sealing structure 510. Optionally, the first insulating sealing structure 510 can be a first rubber layer, with the terminal block 500 and the cooling fan 300 in close contact with the first rubber layer. Of course, the first insulating sealing structure 510 can also be other structures with insulating and sealing effects. This configuration, with the addition of a first insulating sealing structure 510, helps to seal the gap between the terminal block 500 and the cooling fan 300, preventing airflow from leaking out through the gap. This facilitates accurate airflow through the energy conversion module 400, improving energy conversion efficiency. Furthermore, when the housing of the cooling fan 300 is made of a conductive structure such as metal, the first insulating sealing structure 510 prevents electrical connection between the terminal block 500 and the cooling fan 300.

[0058] Of course, in other embodiments, the first insulating sealing structure 510 may not be provided on the side of the terminal block 500 facing the cooling fan 300, and the terminal block 500 may be in direct and tight contact with the cooling fan 300.

[0059] In a further embodiment, reference is made to... Figures 10-11 As shown, a second insulating sealing structure 520 is provided on the side of the terminal block 500 facing away from the cooling fan 300. The second insulating sealing structure 520 is made of insulating material and has sealing performance. The terminal block 500 and the inner wall surface of the equipment housing 100 are sealed together through the second insulating sealing structure 520. Optionally, the second insulating sealing structure 520 can be a second rubber layer, with the terminal block 500 and the inner wall surface of the equipment housing 100 respectively in close contact with the second rubber layer. Of course, the second insulating sealing structure 520 can also be other structures with insulating and sealing effects.

[0060] This configuration, with the addition of a second insulating sealing structure 520, helps to seal the gap between the terminal block 500 and the inner wall of the equipment housing 100, preventing airflow from leaking out through the gap. This facilitates accurate airflow through the energy conversion module 400, improving energy conversion efficiency. Furthermore, when the equipment housing 100 is a conductive structure such as metal, the second insulating sealing structure 520 can prevent electrical connection between the terminal block 500 and the equipment housing 100.

[0061] Of course, in other embodiments, the second insulating sealing structure 520 may not be provided on the side of the terminal block 500 facing away from the cooling fan 300, and the terminal block 500 may be in direct and tight contact with the device housing 100.

[0062] In the scheme of this application, reference is made to Figure 1 As shown, the electronic device also includes a heat sink 600, which is disposed between the cooling fan 300 and the functional element 200. The heat sink 600 and the functional element 200 are thermally connected. Optionally, the heat sink 600 and the functional element 200 can be in direct contact to achieve thermal connection, or the heat sink 600 and the functional element 200 can be thermally connected by welding, thermally conductive adhesive, or other methods. In this way, the heat generated by the functional element 200 can be transferred to the heat sink 600.

[0063] Furthermore, the heat sink 600 is provided with a heat dissipation channel 601. The inlet end of the heat dissipation channel 601 is connected to the air inlet 101. Optionally, the inlet end of the heat dissipation channel 601 can directly face the air inlet 101, allowing the airflow entering the equipment housing 100 from the air inlet 101 to directly enter the heat dissipation channel 601. Alternatively, the inlet end of the heat dissipation channel 601 may not face the air inlet 101, allowing the airflow entering the equipment housing 100 from the air inlet 101 to pass through the gap between the equipment housing 100 and other components before entering the heat dissipation channel 601. The outlet end of the heat dissipation channel 601 is opposite to the cooling fan 300, so that the airflow flowing through the heat dissipation channel 601 directly passes through the cooling fan 300.

[0064] In this embodiment, the electronic device is equipped with a heat sink 600, which allows the heat of the functional component 200 to be dissipated into the airflow flowing through the heat sink 600 as quickly as possible, which is beneficial to improving the heat dissipation efficiency of the functional component 200. At the same time, the heat sink 600 has a heat dissipation channel 601, and the gas flows through the heat dissipation channel 601 and the cooling fan 300 in sequence, so that the airflow can fully carry the heat, improve the thermoelectric conversion efficiency, and thus improve the energy conversion efficiency.

[0065] Of course, in other embodiments, the electronic device may not have a heat sink 600, and the cooling fan 300 and the functional element 200 may be in direct contact.

[0066] In an optional embodiment, refer to Figure 16 and Figure 17 As shown, the heat sink 600 includes a heat sink substrate 610 and a plurality of heat sinks 620. The heat sink substrate 610 can be a square plate, a circular plate, etc. Both the heat sink substrate 610 and the heat sinks 620 have thermal conductivity. Along the circumference of the heat sink substrate 610, the heat sinks 620 are spaced apart on the heat sink substrate 610. The heat sinks 620 have a strip structure, and each heat sink 620 extends radially along the heat sink substrate 610.

[0067] The heat dissipation substrate 610 is thermally connected to the functional component 200, and each heat sink 620 is connected to the cooling fan 300. The heat dissipation substrate 610 and the heat sink 620 form a heat dissipation channel 601. Optionally, the heat dissipation substrate 610 can be in contact with the functional component 200 to achieve a thermally conductive connection; or, the heat sink 620 and the cooling fan 300 can be connected by welding or other methods. Optionally, the plane of the heat dissipation substrate 610 is parallel to the rotation plane of the cooling fan 300, the circumferential direction of the heat dissipation substrate 610 is the circumferential direction of the cooling fan 300, and the radial direction of the heat dissipation substrate 610 is the radial direction of the cooling fan 300.

[0068] In this embodiment, the heat sink 600 is provided with multiple heat sinks 620. The multiple heat sinks 620 have a large contact area with the airflow. Therefore, the heat sink 600 has a large contact area with the airflow, which is more conducive to the heat of the functional element 200 being dissipated into the airflow flowing through the heat sink 600 as quickly as possible, thereby further improving the heat dissipation efficiency of the functional element 200.

[0069] Of course, in other embodiments, the heat sink 600 may adopt a structure other than the heat sink substrate 610 and the plurality of heat sinks 620.

[0070] In a further embodiment, the heat dissipation channel 601 includes a first heat dissipation channel 601a and a second heat dissipation channel 601b that are connected to each other. A first heat dissipation channel 601a is formed between two adjacent heat sinks 620. Each first heat dissipation channel 601a extends radially along the heat dissipation substrate 610. Furthermore, all heat sinks 620 together surround and form the second heat dissipation channel 601b, which is opposite to the cooling fan 300. Thus, referring to... Figure 18 As shown, the airflow entering through the air inlet 101 is split into different first heat dissipation channels 601a from different directions, and then flows to the central area of ​​the heat sink 600, where it gathers in the second heat dissipation channel 601b and flows further through the cooling fan 300.

[0071] In this embodiment, the heat sink 620 forms multiple first heat dissipation channels 601a. ​​Therefore, multiple airflows flow through each of the first heat dissipation channels 601a and then converge in the second heat dissipation channel 601b. Each airflow makes full contact with the heat sink 600, further increasing the contact area between the heat sink 600 and the airflow, which is more conducive to the airflow carrying heat and improving the thermoelectric conversion efficiency. At the same time, the heat sinks 620 surround to form the second heat dissipation channel 601b. The second heat dissipation channel 601b is conducive to the accurate passage of multiple airflows through the cooling fan 300 after they fully converge, promoting airflow circulation and facilitating the accurate flow of airflow through the energy conversion module 400, thereby improving the energy conversion efficiency.

[0072] Of course, in other embodiments, the ends of each heat sink 620 can be directly connected, that is, the heat dissipation channel 601 includes only a plurality of first heat dissipation channels 601a, and the outlet end of each first heat dissipation channel 601a is directly opposite to the cooling fan 300.

[0073] In an optional embodiment, refer to Figure 17 As shown, a thermally conductive layer 700 is provided on the surface of the heat sink 600 facing the functional element 200, and the heat sink 600 and the functional element 200 are thermally connected through the thermally conductive layer 700. Optionally, the thermally conductive layer 700 is provided on the surface of the heat sink facing the functional element 200. The thermally conductive layer 700 has a thermal conductivity effect and can be made of a metal material. The specific material of the thermally conductive layer 700 is not limited in this embodiment. Further optionally, the thermally conductive layer 700 is in contact with the electronic device 220 disposed on the circuit board 210.

[0074] In this embodiment, a heat-conducting layer 700 is added on the basis of the heat sink 600. The heat-conducting layer 700 enables the heat of the functional component 200 to be quickly transferred to the heat sink 600, which is beneficial to further improve the heat conduction efficiency and thus improve the thermoelectric conversion efficiency.

[0075] In the alternative solutions of this application, refer to Figure 12 and Figure 13 As shown, the equipment housing 100 includes an air inlet 122, which has air inlets 101. Optionally, the air inlet 122 can be part of the bottom housing 120. Multiple air inlets 101 are spaced apart. (Refer to...) Figure 13 As shown, the air inlet 122 is provided with multiple rows of air inlets 101, and each row of air inlets 101 is provided with multiple air inlets 101 at intervals along the same direction.

[0076] The outer wall surface of the air inlet 122 is provided with at least one support protrusion 121. Optionally, the number of support protrusions 121 is one, the support protrusion is a strip-shaped structure, and extends along the direction of the edge of the equipment housing 100; or, the number of support protrusions 121 is multiple, the support protrusions 121 are distributed at intervals at the corner positions of the air inlet 122, and each support protrusion 121 can be a square protrusion, a cylindrical protrusion, etc. The specific structure of the support protrusion is not limited in the embodiments of this application.

[0077] In this way, by using the support protrusion 121 to support the electronic device, there is a gap between the electronic device and the external device supporting the electronic device to allow airflow to pass through, so as to ensure that the air inlet 101 can smoothly enter the air and avoid the external device directly supporting the air inlet 122, which would affect the air intake effect of the air inlet 101. This is conducive to promoting the smooth circulation of airflow inside and outside the device housing 100.

[0078] In summary, when the electronic device is operating, the cooling fan 300 starts working as the functional component 200 heats up. Cool air continuously enters the device housing 100 through the air inlet 101. The cool air flows sequentially through the first heat dissipation channel 601a, the second heat dissipation channel 601b of the heat sink 600, and the cooling fan 300. The cool air carries heat, and the cooling fan 300 creates an airflow. This airflow causes the piezoelectric converter 411 to vibrate periodically, thereby generating an electric current. Simultaneously, the airflow contacts the surface of the thermoelectric converter 421 facing the cooling fan 300, raising the temperature of this surface. At the same time, the surface of the thermoelectric converter 421 facing away from the cooling fan 300 contacts the inner wall of the device housing 100, lowering the temperature of this surface. The increased temperature difference between these two surfaces generates an electromotive force and an electric current within the thermoelectric converter 421.

[0079] After the electronic device is working stably, the power consumption of the functional component 200 tends to stabilize. At this time, the airflow circulation, the wind speed and air pressure of the cooling fan 300 also tend to be balanced. By setting the deflection of the first electrical connection line, the deformation of the piezoelectric conversion device 411 is made larger, and the current generated by the piezoelectric conversion module 410 is made larger and tends to be stable. At this time, by setting the relative positions of the air outlet 102, the piezoelectric conversion device 411 and the thermoelectric conversion device 421, the temperature difference between the two sides of the thermoelectric conversion device 421 is made larger and tends to be stable, and the current generated by the thermoelectric conversion device 421 is made larger and tends to be stable. The terminal block 500 outputs a stable current.

[0080] For electronic devices with a power consumption of 8W, such as micro projectors, the solution in this application embodiment can recover 5% of the energy; for electronic devices with a power consumption of 50W, such as laptops, the solution can recover 8% of the energy; for electronic devices with a power consumption of 250W, such as desktop computers, the solution can recover 7%-10% of the energy; and for electronic devices with a power consumption of 3000W, such as air conditioner compressors and 5G base stations, the solution can recover 9%-11% of the energy. Therefore, the solution in this application embodiment is beneficial for improving the energy efficiency of electronic devices, saving electricity costs, and has high practical value.

[0081] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, It includes a device housing (100), functional components (200), a cooling fan (300), and an energy conversion module (400), wherein: The functional element (200), the cooling fan (300), and the energy conversion module (400) are all disposed within the device housing (100). The device housing (100) has an air inlet (101) and an air outlet (102). The air outlet side of the cooling fan (300) faces the air outlet (102). The functional element (200) is located on the side of the cooling fan (300) facing away from the air outlet (102). The energy conversion module (400) is located on the side of the cooling fan (300) facing the air outlet (102). The energy conversion module (400) includes at least one of a piezoelectric conversion module (410) and a thermoelectric conversion module (420). When the cooling fan (300) is working, the airflow entering the device housing (100) through the air inlet (101) flows sequentially through the functional element (200), the cooling fan (300) and the energy conversion module (400) and flows out through the air outlet (102). The piezoelectric conversion module (410) is used to convert the kinetic energy of the airflow into electrical energy, and the thermoelectric conversion module (420) is used to convert the heat of the airflow into electrical energy. The piezoelectric conversion module (410) includes a plurality of spaced piezoelectric conversion devices (411) and a plurality of first conductive lines (412), with two adjacent piezoelectric conversion devices (411) connected by the first conductive lines (412), and the gap between each piezoelectric conversion device (411) is open to the airflow; and / or, the thermoelectric conversion module (420) includes a plurality of spaced thermoelectric conversion devices (421) and a plurality of second conductive lines (422), with two adjacent thermoelectric conversion devices (421) connected by the second conductive lines (422), and the gap between each thermoelectric conversion device (421) is open to the airflow.

2. The electronic device according to claim 1, characterized in that, At least one of the piezoelectric conversion device (411) and the thermoelectric conversion device (421) is arrayed.

3. The electronic device according to claim 1, characterized in that, Along the flow direction of the airflow, the thermoelectric conversion device (421) and the piezoelectric conversion device (411) are staggered.

4. The electronic device according to claim 1, characterized in that, The device housing (100) includes an air outlet (111), and the air outlet (111) is provided with a plurality of air outlets (102) at intervals. The thermoelectric conversion module (420) is opposite to the air outlet (111), and the surface of each thermoelectric conversion device (421) is in contact with the inner wall surface of the air outlet (111).

5. The electronic device according to claim 1, characterized in that, The device housing (100) includes an air outlet (111), and the air outlet (111) is provided with a plurality of air outlets (102) at intervals. In the axial direction of the air outlets (102), the orthographic projection of the air outlets (102) is located within the orthographic projection of the gap between each of the thermoelectric conversion devices (421).

6. The electronic device according to claim 1, characterized in that, The first conductive line (412) is a flexible structure.

7. The electronic device according to claim 1, characterized in that, The electronic device also includes a terminal block (500), which is disposed between the cooling fan (300) and the inner wall of the device housing (100), and the terminal block (500) surrounds the energy conversion module (400), and the energy conversion module (400) is electrically connected to the terminal block (500).

8. The electronic device according to claim 7, characterized in that, The terminal block (500) is provided with a first insulating sealing structure (510) on the side facing the cooling fan (300), and the terminal block (500) and the cooling fan (300) are sealed together through the first insulating sealing structure (510). And / or, the terminal block (500) is provided with a second insulating sealing structure (520) on the side opposite to the cooling fan (300), and the terminal block (500) is sealed to the inner wall of the device housing (100) through the second insulating sealing structure (520).

9. The electronic device according to claim 1, characterized in that, The electronic device further includes a heat sink (600), which is disposed between the cooling fan (300) and the functional element (200). The heat sink (600) is thermally connected to the functional element (200), and the heat sink (600) is provided with a heat dissipation channel (601). The inlet end of the heat dissipation channel (601) is connected to the air inlet (101), and the outlet end of the heat dissipation channel (601) is opposite to the cooling fan (300).

10. The electronic device according to claim 9, characterized in that, The heat sink (600) includes a heat sink substrate (610) and a plurality of heat sinks (620). The heat sinks (620) are spaced apart on the heat sink substrate (610) along the circumferential direction of the heat sink substrate (610), and each heat sink (620) extends radially along the heat sink substrate (610). The heat sink substrate (610) is thermally connected to the functional element (200), and each heat sink (620) is connected to the cooling fan (300). The heat sink substrate (610) and the heat sinks (620) form the heat dissipation channel (601).

11. The electronic device according to claim 10, characterized in that, The heat dissipation channel (601) includes a first heat dissipation channel (601a) and a second heat dissipation channel (601b) that are connected to each other. The first heat dissipation channel (601a) is formed between two adjacent heat sinks (620), and the heat sinks (620) together surround the second heat dissipation channel (601b). The second heat dissipation channel (601b) is opposite to the cooling fan (300).

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