一种导电银浆、片式聚合物叠层铝电容器及其制备方法
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN CAPCHEM TECH CO LTD
- Filing Date
- 2024-02-26
- Publication Date
- 2026-07-17
AI Technical Summary
Existing conductive silver pastes are insufficient to meet the requirements for further reductions in size and equivalent series resistance of chip polymer multilayer aluminum capacitors.
An acrylic-modified fluorinated epoxy resin containing epoxy groups, acryloyloxypropyl groups, and fluorinated alkyl groups is used as a thermosensitive organic resin to form an interpenetrating polymer network with silver powder, which promotes uniform dispersion of silver powder, improves the compatibility between the resin and silver powder, reduces impedance, and improves the tightness of the connection between capacitor chips through perfluoropolyether segments.
The low impedance and low volume characteristics of conductive silver paste in chip polymer multilayer aluminum capacitors were achieved, which improved the electrochemical performance.
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Figure BDA0004714615520000081