Battery assembly and method of making the same

Abstract

The application discloses a battery assembly and a manufacturing method thereof. The battery assembly comprises a battery piece and a wire. The wire comprises a conductive layer and an insulating layer sleeved outside the conductive layer. The battery piece has a light-receiving surface and a back surface opposite to the light-receiving surface. A plurality of P-zone fine grids and a plurality of N-zone fine grids are alternately arranged on the back surface of the battery piece. The wire comprises a first wire and a second wire. The insulating layer of the wire in a region corresponding to the P-zone fine grids is slotted to form the first wire, and the insulating layer of the wire in a region corresponding to the N-zone fine grids is slotted to form the second wire. The first wire is used for electrically connecting the plurality of P-zone fine grids, and the second wire is used for electrically connecting the plurality of N-zone fine grids. In this way, the manufacturing cost of the battery assembly can be reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to battery components and methods for their fabrication. Background Technology

[0002] Back-contact solar cells are a type of solar cell. It's a novel solar cell technology characterized by placing both the positive and negative electrodes on the back side of the cell, rather than the traditional light-receiving side. This design eliminates the obstruction of metal grid lines on the front of the cell, maximizing the utilization of incident light, reducing optical losses, and improving the cell's photoelectric conversion efficiency. However, back-contact solar modules face challenges in production due to high silver paste consumption leading to high costs and low yield rates. Summary of the Invention

[0003] The embodiments of this application provide battery components that can reduce the manufacturing cost of battery components.

[0004] In a first aspect, embodiments of this application provide a method for manufacturing a battery assembly. The method includes:

[0005] Prepare solar cells and wires. The solar cells have light-receiving and back-light-receiving surfaces on opposite sides. Multiple P-area grids and multiple N-area grids are alternately arranged on the back-light-receiving surface of the solar cells. The wires include a conductive layer and an insulating layer that is sleeved outside the conductive layer.

[0006] Grooving on a conductor includes grooving the insulation layer of a conductor in a region corresponding to the fine grid of the P region to form a first conductor, and grooving the insulation layer of a conductor in a region corresponding to the fine grid of the N region to form a second conductor.

[0007] The process involves stacking the fine grid in the P region to contact and stack the first conductive wire, stacking the fine grid in the N region to contact and stack the second conductive wire, and stacking an adhesive film and a light-transmitting element on one side of the light-receiving surface of the solar cell, and stacking an adhesive film and a backsheet on one side of the backlight surface of the solar cell.

[0008] Lamination involves laminating the stacked battery components.

[0009] Optionally, in the lamination process, the lamination temperature is between 140℃ and 160℃, and the lamination time is between 20 min and 30 min.

[0010] Optionally, in the stacking step, the first conductor is connected to the N-region fine grid with insulating adhesive, and the second conductor is connected to the P-region fine grid with insulating adhesive.

[0011] Optionally, the step of slotting the conductor includes slotting the insulation layer of the conductor in the region corresponding to the fine grid of the P region by laser ablation or chemical etching, and slotting the insulation layer of the conductor in the region corresponding to the fine grid of the N region by laser ablation or chemical etching.

[0012] Optionally, in the step of slotting the wires, the width of the slot on the first wire is 40μm-60μm, and the width of the slot on the second wire is 40μm-60μm.

[0013] Secondly, embodiments of this application provide a battery assembly. The battery assembly is manufactured using the method described above. The battery assembly includes battery cells and wires. The battery cells have a light-receiving surface and a back-lighting surface on opposite sides, and a plurality of P-region fine grids and a plurality of N-region fine grids are alternately arranged on the back-lighting surface of the battery cells. The wires include a first wire and a second wire, the first wire being used to electrically conduct the plurality of P-region fine grids, and the second wire being used to electrically conduct the plurality of N-region fine grids.

[0014] Optionally, the first conductor is connected to the N-region fine grid with insulating adhesive, and the second conductor is connected to the P-region fine grid with insulating adhesive.

[0015] Optionally, the first conductor includes a first conductive layer and a first insulating layer sleeved outside the first conductive layer; the fine grid of the P region passes through the first insulating layer and is electrically connected to the first conductive layer; the fine grid of the N region is connected to the first insulating layer by insulating adhesive.

[0016] The second conductor includes a second conductive layer and a second insulating layer sleeved outside the second conductive layer. The fine grid in the N region passes through the second insulating layer and is electrically connected to the second conductive layer; the fine grid in the P region is connected to the second insulating layer by insulating adhesive.

[0017] Optionally, the first conductive layer includes a first core layer and a first coating layer disposed on the first core layer, wherein the melting point of the first coating layer is lower than that of the first core layer;

[0018] The second conductive layer includes a second core layer and a second coating layer disposed on the second core layer, wherein the melting point of the second coating layer is lower than that of the second core layer.

[0019] Optionally, the diameter of the first core layer is 0.2 mm to 0.4 mm, the thickness of the first coating layer is 10 μm to 30 μm, and the thickness of the first insulating layer is 5 μm to 15 μm.

[0020] The diameter of the second core layer is 0.2 mm to 0.4 mm, the thickness of the second coating layer is 10 μm to 30 μm, and the thickness of the second insulating layer is 5 μm to 15 μm.

[0021] Optionally, the battery assembly also includes an adhesive film and a light-transmitting element stacked sequentially on the light-receiving side, and an adhesive film and a backsheet stacked sequentially on the backlight side.

[0022] Optionally, the width of the fine gate in the P-region is 20μm to 40μm, and the height of the fine gate in the P-region is 5μm to 15μm;

[0023] The width of the N-region fine gate is 20μm to 40μm, and the height of the N-region fine gate is 5μm to 15μm.

[0024] Optionally, the grid on the back surface of the solar cell is provided with only P-region fine grids and N-region fine grids; the solar cell is a back contact cell with hybrid passivated contacts.

[0025] Optionally, the backplate is a light-transmitting material or a fluorinated polymer material.

[0026] The beneficial effects of this application are as follows: Unlike the prior art, by setting a first wire to connect the P-region fine grid in series and setting a second wire to connect the N-region fine grid in series, the battery module can collect current and lead it to an external circuit even without a main grid. Eliminating the main grid reduces the use of grid material, thereby lowering the manufacturing cost of the battery module. Furthermore, this application achieves battery module manufacturing by slotting the wires and then laminating the materials. This method reduces the technical problems of microcracks and cell breakage caused by high-temperature welding of wires in the prior art, which is beneficial to improving the yield rate. The wires are slotted only at the locations where they are electrically connected to the corresponding fine grids. Therefore, only local areas require the removal of the insulation layer to form exposed areas, while the non-electrically connected locations of the wires are still insulated by the external insulation layer. This prevents short circuits between different conductive areas caused by the first wire being electrically connected to the N-region fine grid or the second wire being electrically connected to the P-region fine grid. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of an embodiment of the battery module of this application;

[0028] Figure 2 This is a cross-sectional structural diagram of an embodiment of the battery module of this application;

[0029] Figure 3 This is a schematic diagram of the structure of the wire embodiment in the battery assembly of this application;

[0030] Figure 4 This is a schematic diagram of the structure connecting the first wire to the fine grid in the P-region in the battery assembly embodiment of this application;

[0031] Figure 5 This is a schematic diagram of the structure connecting the second wire to the N-region fine grid in the battery assembly embodiment of this application;

[0032] Figure 6 This is a schematic diagram of the structure connecting the first wire to the N-region fine grid in the battery assembly embodiment of this application;

[0033] Figure 7 This is a schematic diagram of the structure connecting the second wire to the fine grid in the P-region in the battery assembly embodiment of this application;

[0034] Figure 8 This is a flowchart illustrating the manufacturing method of the battery assembly in this application. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0036] Back-contact solar cells are a type of solar cell. It's a novel solar cell technology characterized by placing both the positive and negative electrodes on the back side of the cell, rather than the traditional front side. This design eliminates the obstruction of metal grid lines on the front, maximizing the utilization of incident light, reducing optical losses, and improving the cell's photoelectric conversion efficiency. Back-contact solar cells (BC cells) are increasingly popular in the market due to their high conversion efficiency. There are several types of back-contact solar cells, primarily including TBC cells based on a tunneling oxide layer + polycrystalline silicon passivation contact structure, HBC cells based on intrinsic amorphous silicon + doped amorphous / microcrystalline passivation contact structure, and HTBC cells based on a hybrid structure of tunneling oxide layer + polycrystalline silicon passivation contact and intrinsic amorphous silicon + doped amorphous / microcrystalline passivation contact. In related technologies, the fabrication of back-contact solar cells requires the use of low-temperature silver paste to form various types of grids. The large consumption of low-temperature silver paste leads to high costs. Furthermore, single-sided welding during the fabrication of back-contact solar cells causes severe bending and deformation of the cells, resulting in increased defects such as fragmentation and microcracks. These unfavorable factors have significantly hampered the progress of large-scale industrialization of back-contact battery modules. To improve the aforementioned technical problems, this application can provide the following embodiments.

[0037] Combination Figure 1 and Figure 2 This application provides a battery assembly 1. The battery assembly 1 includes battery cells 10 and wires 20. The battery cells 10 have a light-receiving surface and a backlighting surface on opposite sides. The light-receiving surface of the battery cells 10 can directly receive sunlight, thereby absorbing photons and generating electron-hole pairs within the battery cells 10, and generating current through photoelectric conversion. The backlighting surface of the battery cells 10 can be used to form the positive and negative electrodes of the battery cells 10 or various types of gates.

[0038] Specifically, the back surface of the solar cell 10 has alternating arrangements of multiple P-region fine grids 11 and multiple N-region fine grids 12. The solar cell 10 forms alternating P-type and N-type doped regions by diffusing impurities such as phosphorus or boron. For back-contact type solar cells 10, the P-type and N-type doped regions can be arranged alternately in an interdigitated structure. The P-region fine grids 11 and N-region fine grids 12 correspond to the P-type and N-type doped regions, respectively.

[0039] Combination Figure 1 and Figure 2 , Figure 2 The cross-sectional view shown illustrates an example where the first conductor 21 connects to the P-region fine grid 11 while being insulated from the N-region fine grid. The conductor 20 includes a first conductor 21 and a second conductor 22. The first conductor 21 electrically conducts multiple P-region fine grids 11, and the second conductor 22 electrically conducts multiple N-region fine grids 12. The first conductor 21 and the second conductor 22 can collect photogenerated carriers transmitted from the P-region fine grids 11 and N-region fine grids 12, thereby concentrating the current generated by the battery cell 10 and allowing the current to be led out to an external circuit. By setting the first conductor 21 to connect the P-region fine grids 11 in series and the second conductor 22 to connect the N-region fine grids 12 in series, the battery assembly 1 can concentrate the current and lead it to an external circuit even without a main grid. Eliminating the main grid reduces the use of grid material, thereby reducing the manufacturing cost of the battery assembly 1.

[0040] In some embodiments, the P-region fine grid 11 and the N-region fine grid 12 can be made of lower-cost materials such as low-temperature silver-coated copper paste or low-temperature copper paste, thereby further reducing the manufacturing cost of the battery assembly 1.

[0041] In some embodiments, the gate on the back surface of the solar cell 10 is provided with only P-region fine grids 11 and N-region fine grids 12. This eliminates the need for a main grid in the solar cell assembly 1, thereby reducing the manufacturing cost of the solar cell assembly 1. The solar cell 10 is a hybrid passivated contact back contact battery (HTBC).

[0042] Combination Figure 6 and Figure 7In some embodiments, the first conductor 21 is connected to the N-region fine grid 12 via insulating adhesive 30, and the second conductor 22 is connected to the P-region fine grid 11 via insulating adhesive 30. The first conductor 21 can connect the P-region fine grids 11 in series, and the second conductor 22 can connect the N-region fine grids 12 in series. However, the normal operation of the battery assembly 1 requires insulation between the first conductor 21 and the N-region fine grid 12, and insulation between the second conductor 22 and the P-region fine grid 11. By using insulating adhesive 30 to bond the first conductor 21 and the N-region fine grid 12, and to bond the second conductor 22 and the P-region fine grid 11, the first conductor 21 and the second conductor 22 can be fixed in place, reducing the offset of the first conductor 21 and the second conductor 22, and enhancing the insulation effect between the first conductor 21 and the second conductor 22 and the N-region fine grid 12 and the P-region fine grid 11, respectively. Optionally, the insulating adhesive 30 is a UV insulating adhesive 30, which is an adhesive that can cure rapidly under UV irradiation and has excellent insulation properties.

[0043] Combination Figure 3 , Figure 4 and Figure 6 In some embodiments, the first conductor 21 includes a first conductive layer 211 and a first insulating layer 212 sleeved outside the first conductive layer 211. The P-region fine gate 11 passes through the first insulating layer 212 and is electrically connected to the first conductive layer 211. The N-region fine gate 12 is connected to the first insulating layer 212 by insulating adhesive 30. The first insulating layer 212 of the first conductor 21 can insulate the first conductive layer 211 from the outside. When it is necessary for the first conductor 21 to be electrically connected to the P-region fine gate 11, a slot can be made at the corresponding position where the first insulating layer 212 and the P-region fine gate 11 will be connected, the insulating layer can be removed to expose the conductive layer, and the P-region fine gate 11 can be electrically connected to the first conductive layer 211 at the slot. The N-region fine gate 12 is connected to the first insulating layer 212 by insulating adhesive 30, which can make the first conductor 21 and the N-region fine gate 12 have a double-layer insulation effect, which can improve the reliability of the insulation between the first conductor 21 and the N-region fine gate 12.

[0044] Combination Figure 5 and Figure 7The second conductor 22 includes a second conductive layer 221 and a second insulating layer 222 sleeved outside the second conductive layer 221. The N-region fine grid 12 passes through the second insulating layer 222 and is electrically connected to the second conductive layer 221. The P-region fine grid 11 is connected to the second insulating layer 222 by insulating adhesive 30. The second insulating layer 222 of the second conductor 22 can insulate the second conductive layer 221 from the outside. When it is necessary for the second conductor 22 to be electrically connected to the N-region fine grid 12, a slot can be made at the corresponding position where the second insulating layer 222 and the N-region fine grid 12 are connected to remove the insulating layer and expose the conductive layer. At the slot, the N-region fine grid 12 can be electrically connected to the second conductive layer 221. The P-region fine grid 11 is connected to the second insulating layer 222 by insulating adhesive 30, which enables the second conductor 22 and the P-region fine grid 11 to have a double-layer insulation effect, which can improve the reliability of the insulation between the second conductor 22 and the P-region fine grid 11.

[0045] Combination Figures 3 to 7 In some embodiments, the first conductive layer 211 includes a first core layer 2111 and a first coating layer 2112 disposed on the surface of the first core layer 2111, wherein the melting point of the first coating layer 2112 is lower than that of the first core layer 2111. The second conductive layer 221 includes a second core layer 2211 and a second coating layer 2212 disposed on the surface of the second core layer 2211, wherein the melting point of the second coating layer 2212 is lower than that of the second core layer 2211. By setting the melting point of the first coating layer 2112 to be lower than that of the first core layer 2111 and the melting point of the second coating layer 2212 to be lower than that of the second core layer 2211, during the process of connecting the first conductor 21 to the P-region fine gate 11 and the second conductor 22 to the N-region fine gate 12, since the first coating layer 2112 and the second coating layer 2212 contain low-melting-point metal components, good ohmic contact can be formed between the first coating layer 2112 and the P-region fine gate 11 and between the second coating layer 2212 and the N-region fine gate 12 at high temperatures in the subsequent lamination process.

[0046] In some embodiments, the conductive materials of the first core layer 2111 and the second core layer 2211 can be copper wire or aluminum wire, etc., which have good conductivity and low cost. The materials of the first coating 2112 and the second coating 2212 can be tin-bismuth alloy or tin-bismuth-silver alloy.

[0047] In some embodiments, the diameter of the first core layer 2111 is 0.2 mm to 0.4 mm, for example, 0.25 mm, 0.3 mm, or 0.35 mm. The thickness of the first coating layer 2112 is 10 μm to 30 μm, for example, 15 μm, 20 μm, or 25 μm. The thickness of the first insulating layer 212 is 5 μm to 15 μm, for example, 8 μm, 10 μm, or 12 μm.

[0048] The diameter of the second core layer 2211 is 0.2 mm to 0.4 mm, for example, 0.25 mm, 0.3 mm, or 0.35 mm. The thickness of the second coating layer 2212 is 10 μm to 30 μm, for example, 15 μm, 20 μm, or 25 μm. The thickness of the second insulating layer 222 is 5 μm to 15 μm, for example, 8 μm, 10 μm, or 12 μm.

[0049] Combination Figure 2 In some embodiments, the battery assembly 1 further includes an adhesive film 40 and a light-transmitting element 50 stacked sequentially on the light-receiving side, and an adhesive film 40 and a backplate 60 stacked sequentially on the backlight side.

[0050] The light-transmitting element 50 can be tempered glass with a thickness of 4 mm or less. Specifically, it can be 4.0 mm, 3.2 mm, 2.5 mm, 2.0 mm, or even thinner. The surface of the light-transmitting element 50 is coated with an anti-reflective film, which can be a silicon oxide thin film. In some embodiments, the 2.0 mm coated glass has a transmittance of >94% in the 380–1100 nm range.

[0051] The adhesive film 40, disposed on both the light-receiving side and the back-light-receiving side of the solar cell 10, can be a light-transfer film. It is typically made of polyethylene-polyvinyl acetate copolymer (EVA) or polyolefin elastomer (POE) doped with light-transfer elements. The thickness of the adhesive film 40 is 0.4 mm to 0.6 mm, for example, 0.45 mm, 0.5 mm, or 0.55 mm. The adhesive film 40 can convert ultraviolet light into long-wavelength light, with an ultraviolet light conversion efficiency >95%, reducing damage to the film layer of the solar cell 10 from ultraviolet light and improving the conversion efficiency and reliability of the solar cell 10.

[0052] The backsheet 60 is made of a light-transmitting material or a fluorinated polymer material, such as glass. For double-glass modules, the backsheet 60 can be made of glass with a thickness of 4mm or less, specifically 4.0mm, 3.2mm, 2.5mm, 2.0mm, or thinner, without any coating. The 2.0mm glass has a transmittance >92% in the 380–1100nm range. For single-glass modules, the backsheet 60 can be made of a fluorinated polymer material, including coated photovoltaic backsheets 60 or composite photovoltaic backsheets 60, with a thickness of 280μm–320μm, exhibiting excellent weather resistance, barrier properties, and heat resistance.

[0053] In some embodiments, the width of the P-region fine gate 11 is 20μm to 40μm, for example, 25μm, 30μm, or 35μm. The height of the P-region fine gate 11 is 5μm to 15μm, for example, 8μm, 10μm, or 12μm. The width of the N-region fine gate 12 is 20μm to 40μm, for example, 25μm, 30μm, or 35μm. The height of the N-region fine gate 12 is 5μm to 15μm, for example, 8μm, 10μm, or 12μm. Optionally, the P-region fine gate 11 and the N-region fine gate 12 can be fabricated by screen printing or laser transfer.

[0054] Further integration Figure 8 This application provides a method for manufacturing a battery assembly 1. The method includes:

[0055] S10: Prepare the solar cell 10 and the wires 20. The back-contact solar cell 10 has a light-receiving surface and a back-receiving surface on opposite sides. The light-receiving surface of the solar cell 10 can directly receive sunlight, thereby absorbing photons and generating electron-hole pairs within the solar cell 10, which then generate current through photoelectric conversion. The back-receiving surface of the solar cell 10 can be used to form the positive and negative electrodes of the solar cell 10 or various types of grids. Multiple P-region fine grids 11 and multiple N-region fine grids 12 are alternately arranged on the back-receiving surface of the solar cell 10.

[0056] The conductor 20 includes a conductive layer and an insulating layer surrounding the conductive layer. The conductor 20 can be connected in series with the P-region fine grid 11 or the N-region fine grid 12 by slotting.

[0057] S20: Slotting the wire 20. This step includes slotting the insulating layer of the corresponding region where the wire 20 and the P-region fine grid 11 are to be connected, forming a first wire 21. And / or, slotting the insulating layer of the corresponding region where the wire 20 and the N-region fine grid 12 are to be connected, forming a second wire 22. In other words, the wire 20 connected in series with the P-region fine grid 11 is the first wire 21, and the wire 20 connected in series with the N-region fine grid 12 is the second wire 22. The slots in the first wire 21 and the second wire 22 are located at different positions. The first wire 21 and the second wire 22 can collect photogenerated carriers transmitted from the P-region fine grid 11 and the N-region fine grid 12, thereby concentrating the current generated by the battery cell 10 and enabling the current to be led out to an external circuit. By setting the first wire 21 to connect the P-region fine grid in series and setting the second wire 22 to connect the N-region fine grid 12 in series, the battery assembly 1 can concentrate the current and lead it out to an external circuit even without a main grid. By not setting a main grid, the use of grid material can be reduced, thereby reducing the manufacturing cost of battery assembly 1.

[0058] In some embodiments, the insulation layer of the conductor in the region corresponding to the fine grid 11 in the P region is slotted by laser ablation or chemical etching, and the insulation layer of the conductor in the region corresponding to the fine grid 12 in the N region is slotted by laser ablation or chemical etching. Specifically, laser can precisely ablate the slotting location to create the corresponding slot. Laser slotting offers high precision and can remove the insulation layer more cleanly, allowing the corresponding fine grid to better contact the conductive layer. Chemical etching can also cleanly remove the insulation layer. Chemical etching may involve creating a mask layer on the conductor, etching the insulation layer, and cleaning the mask layer. The mask layer blocks the areas that do not need to be slotted, while exposing the areas that need to be slotted. Subsequently, the exposed insulation layer can be etched using chemical etching. By controlling the etching time or changing the etching material, the degree of insulation layer removal can be continuously improved, which is beneficial for better contact between the conductor layer and the fine grid. After chemical etching, the mask layer can be removed, thus forming the first wire 21 and the second wire 22 with grooves.

[0059] In some embodiments, the width of the slot on the first conductor 21 is 40μm-60μm, for example, 45μm, 50μm, or 55μm. The width of the slot on the second conductor 22 is 40μm-60μm, for example, 45μm, 50μm, or 55μm.

[0060] S30: Stacking, including:

[0061] The fine grid 11 in the P region is brought into contact with and stacked with the first conductor 21, the fine grid 12 in the N region is brought into contact with and stacked with the second conductor 22, and an adhesive film 40 and a light-transmitting element 50 are stacked on one side of the light-receiving surface of the cell, and an adhesive film 40 and a backplate 60 are stacked on one side of the backlight surface of the cell 10.

[0062] By contacting the P-region fine gate 11 with the conductive layer (first conductive layer 211) of the first conductor 21, and through subsequent lamination processes, an ohmic contact can be formed between the P-region fine gate 11 and the conductive layer. Optionally, the first conductive layer 211 includes a first core layer 2111 and a first coating layer 2112 disposed on the surface of the first core layer 2111, wherein the melting point of the first coating layer 2112 is lower than that of the first core layer 2111. Since the first coating layer 2112 contains a low-melting-point metal component, a good ohmic contact can be formed between the first coating layer 2112 and the P-region fine gate 11 during the subsequent high-temperature lamination process.

[0063] By contacting the N-region fine gate 12 with the conductive layer (second conductive layer 221) of the second conductor 22, and through subsequent lamination processes, an ohmic contact can be formed between the N-region fine gate 12 and the conductive layer. Optionally, the second conductive layer 221 includes a second core layer 2211 and a second coating layer 2212 disposed on the surface of the second core layer 2211, wherein the melting point of the second coating layer 2212 is lower than that of the second core layer 2211. Because the second coating layer 2212 contains low-melting-point metal components, a good ohmic contact can be formed between the second coating layer 2212 and the N-region fine gate 12 during the subsequent high-temperature lamination process.

[0064] In the stacking step, the first conductor 21 is connected to the N-region fine grid 12 by insulating adhesive 30, and the second conductor 22 is connected to the P-region fine grid 11 by insulating adhesive 30.

[0065] By connecting the first conductor 21 to the N-region fine grid 12 with insulating adhesive 30, the first conductor 21 can be fixed in place, reducing its offset. Furthermore, this enhances the insulation effect between the first conductor 21 and the N-region fine grid 12. Additionally, the first conductor 21 can be connected to the insulating adhesive 30 via an insulating layer (first insulating layer 212), forming a double-layer insulation effect and improving the reliability of the insulation.

[0066] By connecting the second conductor 22 to the fine grid 11 in the P-region using insulating adhesive 30, the second conductor 22 can be fixed in place, reducing its offset. This also enhances the insulation effect between the second conductor 22 and the fine grid 11. Furthermore, the second conductor 22 can be connected to the insulating adhesive 30 via an insulating layer (second insulating layer 222), forming a double-layer insulation effect and improving the reliability of the insulation.

[0067] S40: Lamination, including lamination of the stacked battery module 10.

[0068] It should be noted that in step S30, the P-region fine grid 11 can be connected first via the first wire 21, or the N-region fine grid 12 can be connected first via the second wire 22; no specific limitation is made here. Optionally, the connection of the first wire 21 to the P-region fine grid 11 and the connection of the second wire 22 to the N-region fine grid 12 can be performed simultaneously. On the other hand, the connection of the first wire 21 to the N-region fine grid 12 via insulating adhesive 30, and the connection of the second wire 22 to the P-region fine grid 11 via insulating adhesive 30, can also be performed simultaneously with the connection of the first wire 21 to the P-region fine grid 11 and the connection of the second wire 22 to the N-region fine grid 12.

[0069] In some embodiments, the lamination temperature in the lamination process is between 140°C and 160°C, for example, 145°C, 150°C, or 155°C. The lamination time is between 20 min and 30 min, for example, 23 min, 25 min, or 28 min.

[0070] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for manufacturing a battery assembly, characterized in that, include: Prepare a battery cell and a wire. The battery cell has a light-receiving surface and a back-lighting surface on opposite sides. Multiple P-area fine grids and multiple N-area fine grids are alternately arranged on the back-lighting surface of the battery cell. The wire includes a conductive layer and an insulating layer sleeved outside the conductive layer. Grooving on a conductor includes slotting the insulation layer of a conductor in the region corresponding to the fine grid of the P region to form a first conductor, and slotting the insulation layer of a conductor in the region corresponding to the fine grid of the N region to form a second conductor. The process involves stacking the P-region fine grid with the first conductive wire, stacking the N-region fine grid with the second conductive wire, and stacking an adhesive film and a light-transmitting element on one side of the light-receiving surface of the battery cell, and stacking an adhesive film and a backsheet on one side of the backlight surface of the battery cell. Lamination involves laminating the stacked battery components.

2. The method according to claim 1, characterized in that: In the lamination process, the lamination temperature is between 140℃ and 160℃, and the lamination time is between 20 min and 30 min.

3. The method according to claim 1, characterized in that: In the stacking step, the first conductor is connected to the N-region fine grid with insulating adhesive, and the second conductor is connected to the P-region fine grid with insulating adhesive.

4. The method according to claim 1, characterized in that: The step of slotting the conductor includes slotting the insulation layer of the conductor in the region corresponding to the fine grid of the P region by laser ablation or chemical etching, and slotting the insulation layer of the conductor in the region corresponding to the fine grid of the N region by laser ablation or chemical etching.

5. The method according to claim 1, characterized in that: In the step of slotting the wire, the width of the slot on the first wire is 40μm-60μm, and the width of the slot on the second wire is 40μm-60μm.

6. A battery assembly, characterized in that, The method described in any one of claims 1-5 is used to prepare the product, comprising: The battery cell has a light-receiving surface and a back-lighting surface on opposite sides, and multiple P-area fine grids and multiple N-area fine grids are alternately arranged on the back-lighting surface of the battery cell. The conductor includes a first conductor and a second conductor, wherein the first conductor is used to conduct electricity to the plurality of P-region fine gates, and the second conductor is used to conduct electricity to the plurality of N-region fine gates.

7. The battery assembly according to claim 6, characterized in that: The first conductor is connected to the N-region fine grid with insulating adhesive, and the second conductor is connected to the P-region fine grid with insulating adhesive.

8. The battery assembly according to claim 7, characterized in that: The first conductor includes a first conductive layer and a first insulating layer sleeved outside the first conductive layer. The P-region fine grid is electrically connected to the first conductive layer. The N-region fine grid is connected to the first insulating layer by insulating adhesive. The second conductor includes a second conductive layer and a second insulating layer sleeved outside the second conductive layer. The N-region fine grid is electrically connected to the second conductive layer. The P-region fine grid is connected to the second insulating layer by insulating adhesive.

9. The battery assembly according to claim 8, characterized in that: The first conductive layer includes a first core layer and a first coating layer disposed on the first core layer, wherein the melting point of the first coating layer is lower than that of the first core layer; The second conductive layer includes a second core layer and a second coating layer disposed on the second core layer, wherein the melting point of the second coating layer is lower than that of the second core layer.

10. The battery assembly according to claim 9, characterized in that: The diameter of the first core layer is 0.2 mm to 0.4 mm, the thickness of the first coating layer is 10 μm to 30 μm, and the thickness of the first insulating layer is 5 μm to 15 μm. The diameter of the second core layer is 0.2 mm to 0.4 mm, the thickness of the second coating layer is 10 μm to 30 μm, and the thickness of the second insulating layer is 5 μm to 15 μm.

11. The battery assembly according to any one of claims 6 to 10, characterized in that: The battery assembly also includes an adhesive film and a light-transmitting element that are sequentially stacked on one side of the light-receiving surface, and an adhesive film and a backplate that are sequentially stacked on one side of the backlight surface.

12. The battery assembly according to claim 6, characterized in that: The width of the fine gate in the P region is 20μm to 40μm, and the height of the fine gate in the P region is 5μm to 15μm; The width of the N-region fine gate is 20μm to 40μm, and the height of the N-region fine gate is 5μm to 15μm.

13. The battery assembly according to claim 6, characterized in that: The gate on the back surface of the battery cell is provided with only the P-region fine gate and the N-region fine gate; the battery cell is a back contact battery with hybrid passivated contact.

14. The battery assembly according to claim 11, characterized in that: The back panel is made of a light-transmitting material or a fluorine-containing polymer material.

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