Low dielectric heat resistant oxidation resin composition and metal-clad laminate

Abstract

The application discloses a low-dielectric heat-resistant oxidation resin composition, characterized in that the composition comprises the following components: 40-70 parts of modified polyphenyl ether; 20-50 parts of modified styrene-butadiene block copolymer; 10-40 parts of modified maleimide resin; and 20-40 parts of a crosslinking aid. The application further discloses a nanofiber-filled resin composition and a metal-clad laminate. The metal-clad laminate with low Df change rate under extreme conditions for a long time can be obtained by modification without reducing other performances.

Claims

1. A low dielectric heat resistant oxidation resin composition, characterized by comprising: include: 40-70 parts of modified polyphenylene ether; 20-50 parts of modified styrene-butadiene block copolymer; 10-40 parts of modified maleimide resin; 20-40 parts of crosslinking agent; The modified polyphenylene ether is as shown in formula (2): Equation (2); Where m, n, x, and y are any integers between 1 and 50; Or the modified polyphenylene ether is as shown in formula (3): Equation (3); Where m, n, x, and y are any integers between 1 and 50; The modified polyphenylene ether has a weight-average molecular weight of 2000-40000; The modified styrene-butadiene block copolymer is a maleic anhydride-modified styrene-butadiene block copolymer; The modified maleimide resin is any one or a mixture of two of the following: diphenyl bismaleimide resin and biphenyl polymaleimide resin. The crosslinking agent is a crosslinking agent with carbon-carbon unsaturated double bonds in its molecule.

2. The low dielectric heat resistant oxidized resin composition according to claim 1, wherein The modified polyphenylene ether is prepared by reacting brominated polyphenylene ether with diallylamine, silanizing it with mercaptopropylsilane, and then adding chloromethylstyrene or methacrylamide chloride to generate the product.

3. The low dielectric heat-resistant oxidizing resin composition according to claim 1, characterized in that, The crosslinking agent is any one or more of the following: polyfunctional vinyl compounds, allyl compounds, acrylate compounds, triallenyl isocyanurate compounds, acenaphthene compounds, or polybutadiene.

4. A nanofiber filled resin composition characterized by, The nanofiber-filled resin composition is obtained by mixing the low-dielectric heat-resistant oxidizing resin composition as described in any one of claims 1-3 with the following other components in proportions using a solvent: 5-40 parts flame retardant; 70-200 parts of inorganic filler; Initiator 0.1-0.3 parts.

5. The nanofiber-filled resin composition according to claim 4, characterized in that, The flame retardant is a halogen-free flame retardant or a halogenated flame retardant; The inorganic filler is one or more of the following: aluminum nitride, aluminum borate, magnesium oxide, magnesium carbonate, cubic boron nitride, crystalline silicon dioxide, synthetic silicon dioxide, hollow silicon dioxide, spherical silicon dioxide, fused silicon dioxide, talc, aluminum oxide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, or titanium dioxide. The initiator is an organic peroxide free radical initiator; The solvent is any one or more of toluene, butanone, acetone, dimethylformamide, methyl ethyl ketone, or propylene glycol methyl ether.

6. A metal foil laminate, wherein the metal foil laminate is obtained by laminating a metal foil onto a prepreg prepared from a nanofiber-filled resin composition as described in any one of claims 4-5.

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