MEMS scanning mirror capable of preventing mirror surface deformation and preparation method

By setting a reinforcement frame on the four peripheral edges of the MEMS scanning mirror, the problem of mirror warping is solved, and the suppression of mirror deformation and quality improvement is achieved.

CN120559818APending Publication Date: 2025-08-29HUAZHONG UNIV OF SCI & TECH +1
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Patent Information

Application Number
CN202410212809.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-02-27
Publication Date
2025-08-29

AI Technical Summary

Technical Problem

The existing MEMS scanning mirror surface is warping and deformation due to the mismatch of stress of multiple layers of materials. The existing methods have design inconvenience and warping problems in increasing the thickness of the device layer or reinforcement structure.

Method used

The reinforcement frame is set up at the edges of the mirror surface, and the tensile stress is matched with the tensile stress of the mirror surface itself to suppress warping. During the preparation process, the thickness of the reinforcement frame can be adjusted to meet different stress requirements.

Benefits of technology

Effectively suppresses the warping and deformation of the mirror surface, improves the quality of the mirror surface, and is suitable for mirror designs with various stress requirements.

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Abstract

The invention provides an MEMS scanning mirror capable of preventing mirror surface deformation and a preparation method thereof. The preparation method comprises the following steps: preparing an SOI wafer; sequentially growing a bottom electrode layer and a PZT piezoelectric film layer on the upper surface of the device layer, sequentially etching the PZT piezoelectric film layer and the bottom electrode layer, and only reserving the PZT piezoelectric film layer and the bottom electrode layer corresponding to the piezoelectric driving beam; growing and etching a metal layer on the upper surface of the PZT piezoelectric film layer to serve as a top electrode layer and a mirror surface of the reflector; etching the device layer to prepare a reflecting mirror and the elastic piece; depositing a silicon nitride layer at the bottom of the bottom silicon layer and etching to realize patterning of the silicon nitride layer; etching the bottom silicon layer to form the reinforcing rib frame; and etching the buried oxide layer to expose the device layer. The reinforcing rib frame is arranged on the peripheral edge of the mirror surface, so that certain tensile stress can be generated to be matched with the tensile stress of the mirror surface, and the warping deformation of the mirror surface can be inhibited.
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