Method and device for determining measurement point, electronic equipment and storage medium

Abstract

The application discloses a kind of determination methods, devices, electronic equipment and storage medium of measuring point position.The method comprises: obtaining the image of wafer to be measured, the position information of anchor point in the image of wafer to be measured is determined;The position information of anchor point in template wafer image is obtained, and the wafer geometric transformation model is generated based on the position information of anchor point in template wafer image and the position information of anchor point in the image of wafer to be measured, the position information of measuring point in template wafer image is input into wafer geometric transformation model, and the position information of measuring point in the image of wafer to be measured is obtained.The above technical solution, by constructing wafer geometric transformation model based on anchor point in the image of wafer to be measured and anchor point in template wafer image, the determination of the geometric transformation relationship of wafer is realized, and then the measuring point in template wafer image is mapped using wafer geometric transformation model, the position of measuring point in the image of wafer to be measured is automatically calculated, and the determination efficiency of measuring point position and the reusability of method are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a method, apparatus, electronic device, and storage medium for determining measurement points. Background Technology

[0002] In semiconductor manufacturing, the accurate measurement of parameters such as film thickness and critical dimension (CD) depends on accurate and stable measurement points.

[0003] Currently, common methods for establishing or determining measurement points include manual setting or template import. However, in multi-product, multi-batch mixed production environments, existing methods for determining measurement points suffer from problems such as low efficiency and poor reusability. Summary of the Invention

[0004] This invention provides a method, apparatus, electronic device, and storage medium for determining measurement points, so as to improve the efficiency of determining measurement points and the reusability of the method for determining measurement points.

[0005] According to one aspect of the present invention, a method for determining the location of a measurement point is provided, comprising:

[0006] Acquire an image of the wafer to be tested, and determine the position information of the anchor points in the image of the wafer to be tested;

[0007] Obtain the position information of anchor points in the template wafer image, and generate a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested;

[0008] The position information of the measurement points in the template wafer image is obtained, and the position information of the measurement points in the template wafer image is input into the wafer geometric transformation model to obtain the position information of the measurement points in the wafer image to be measured.

[0009] According to another aspect of the present invention, a device for determining the location of a measurement point is provided, comprising:

[0010] An anchor point position determination module in the wafer image under test is used to acquire the wafer image under test and determine the position information of the anchor points in the wafer image under test;

[0011] The wafer geometry transformation model generation module is used to obtain the position information of anchor points in the template wafer image and generate a wafer geometry transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested.

[0012] The module for determining the position of measurement points in the image of the wafer under test is used to obtain the position information of measurement points in the template wafer image, input the position information of measurement points in the template wafer image into the wafer geometric transformation model, and obtain the position information of measurement points in the image of the wafer under test.

[0013] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0014] At least one processor;

[0015] and a memory communicatively connected to the at least one processor;

[0016] The memory stores a computer program that can be executed by the at least one processor, which is then executed by the at least one processor to enable the at least one processor to perform the measurement point determination method according to any embodiment of the present invention.

[0017] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the method for determining measurement points according to any embodiment of the present invention.

[0018] The technical solution of this invention involves acquiring an image of the wafer under test and determining the position information of anchor points in that image; acquiring the position information of anchor points in a template wafer image; generating a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the image of the wafer under test; acquiring the position information of measurement points in the template wafer image; and inputting the position information of measurement points in the template wafer image into the wafer geometric transformation model to obtain the position information of measurement points in the image of the wafer under test. This technical solution, by constructing a wafer geometric transformation model based on anchor points in the image of the wafer under test and anchor points in the template wafer image, determines the geometric transformation relationship of the wafer. Furthermore, the wafer geometric transformation model is used to map measurement points in the template wafer image, automatically calculating the position of measurement points in the image of the wafer under test, effectively improving the speed of measurement point determination and the reusability of the method.

[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a flowchart of a method for determining measurement points according to Embodiment 1 of the present invention;

[0022] Figure 2 This is a schematic diagram of an anchor point in a wafer according to an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of a key graphic provided according to an embodiment of the present invention;

[0024] Figure 4 This is a flowchart of a method for determining measurement points according to Embodiment 2 of the present invention;

[0025] Figure 5 This is a flowchart of a method for determining measurement points according to Embodiment 3 of the present invention;

[0026] Figure 6 This is a schematic diagram of the structure of a measuring point determination device according to Embodiment 4 of the present invention;

[0027] Figure 7 This is a schematic diagram of the structure of an electronic device that implements the measurement point determination method of the present invention. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0029] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices. The acquisition, storage, use, and processing of data in the technical solutions of this application all comply with the relevant provisions of national laws and regulations.

[0030] Example 1

[0031] Figure 1 This is a flowchart of a method for determining measurement points according to Embodiment 1 of the present invention. This embodiment is applicable to the situation where wafer measurement points are automatically determined through wafer images. This method can be executed by a measurement point determination device, which can be implemented in hardware and / or software and can be configured in electronic devices such as computers. Figure 1 As shown, the method includes:

[0032] S110. Obtain an image of the wafer to be tested and determine the position information of the anchor points in the image of the wafer to be tested.

[0033] The wafer image to be measured refers to an image containing information about the wafer surface that is used to determine the measurement points.

[0034] For example, the wafer can be photographed in real time by a camera to obtain an image of the wafer under test, or the image of the wafer under test can be read from a preset storage path on a computer, without any specific limitation.

[0035] An anchor point is a reference point on the wafer surface, which may include the intersection of wafer scribe lines and / or the center point of the wafer electrode connection area (PAD).

[0036] For example, Figure 2 This is a schematic diagram of an anchor point in a wafer according to an embodiment of the present invention. Figure 2In the image, anchor point 1 is the intersection of the wafer scribe lines, and anchor point 2 is the center point of the wafer electrode connection area (PAD). Specifically, anchor point identification can be performed on the wafer image under test using one or more image recognition algorithms such as edge detection, corner extraction, morphological analysis, and feature matching to obtain the position information of the anchor points in the wafer image. The position information can be the coordinates of the anchor point in the image or other information that can characterize the position.

[0037] In some embodiments, the image of the wafer under test can be processed by grayscale conversion, noise reduction, and edge enhancement to improve the clarity of the image. Then, the position information of the anchor points in the image of the wafer under test can be determined by an image recognition algorithm to improve the accuracy of the position information of the anchor points in the image of the wafer under test.

[0038] S120. Obtain the position information of anchor points in the template wafer image, and generate a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested.

[0039] The template wafer image refers to the image corresponding to the template wafer. The template wafer is a standard wafer. In other words, the template wafer image is a standard image without distortion. Therefore, the template wafer image can be used as a comparison standard for the image of the wafer under test. Then, a wafer geometric transformation model can be established based on the template wafer image and the image of the wafer under test.

[0040] For example, anchor point identification can be performed on the template wafer using one or more image recognition algorithms such as edge detection, corner extraction, morphological analysis, and feature matching, thereby obtaining the anchor point location information in the template wafer image; the anchor point location information in the template wafer image can also be read from a preset storage path on the computer, without specific limitations.

[0041] The wafer geometric transformation model is a model of the geometric transformation relationship between the wafer under test and the template wafer. Geometric transformations include, but are not limited to, rotation, translation, and scaling.

[0042] For example, the position information of anchor points in the template wafer image can be compared with the position information of anchor points in the wafer image to be tested, and information such as the overall deviation, rotation angle and size scaling ratio of the wafer can be calculated. Then, a geometric transformation relationship model can be established based on the information such as the overall deviation, rotation angle and size scaling ratio of the wafer.

[0043] S130. Obtain the position information of the measurement points in the template wafer image, and input the position information of the measurement points in the template wafer image into the wafer geometric transformation model to obtain the position information of the measurement points in the wafer image to be measured.

[0044] The measurement point location information refers to the measurement point position on the wafer. The measurement point position can be customized by the user. There can be one or more measurement points. For example, the measurement point position can be the position 1mm to the right of the cross intersection of each PAD on the wafer.

[0045] For example, by using a wafer geometric transformation model, the coordinates of the measurement points in the image of the wafer to be measured can be automatically calculated based on the coordinates of the measurement points in the template wafer image, which effectively improves the efficiency of determining the measurement point location.

[0046] Based on the above embodiments, optionally, determining the position information of anchor points in the wafer image to be tested includes: performing corner detection, edge detection, or morphological analysis on the wafer image to be tested to obtain structural information of key graphics in the wafer image to be tested, wherein the key graphics are used to locate anchor points; and determining the position information of anchor points in the wafer image to be tested based on the structural information of key graphics in the wafer image to be tested.

[0047] The key graphic element can be a rectangle, cross, and / or other symmetrical structure, which can be used to locate anchor points. For example, Figure 3 This is a schematic diagram of a key graphic provided according to an embodiment of the present invention, such as... Figure 3 As shown, key graphics can be shapes such as symmetrical crosses, diagonal crosses, or combinations of rectangles. The structural information of key graphics refers to their position in the image, which can be the coordinates of all pixels of the key graphics or the coordinates of the key graphics' outline.

[0048] Based on the above embodiments, optionally, determining the position information of anchor points in the wafer image under test based on the structural information of key graphics in the wafer image under test includes: determining the position information of the center point of the key graphics in the wafer image under test and / or the position information of the corner points of the key graphics in the wafer image under test based on the structural information of the key graphics in the wafer image under test; and determining the position information of anchor points in the wafer image under test based on the position information of the center point of the key graphics in the wafer image under test and / or the position information of the corner points of the key graphics in the wafer image under test.

[0049] In some implementations, edge detection can be performed on the wafer image to obtain the coordinates of the outline of the key graphic in the wafer image. Then, the coordinates of the center point of the key graphic can be calculated based on the coordinates of the outline of the key graphic in the wafer image, and the coordinates of the center point of the key graphic can be used as the position information of the anchor point in the wafer image.

[0050] In some embodiments, corner detection can be performed on the wafer image to be tested to obtain the coordinates of the corner points of key graphics in the wafer image to be tested, and then the coordinates of the corner points of key graphics in the wafer image to be tested can be used as the position information of anchor points in the wafer image to be tested.

[0051] The technical solution of this invention involves acquiring an image of the wafer under test and determining the position information of anchor points in that image; acquiring the position information of anchor points in a template wafer image; generating a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the image of the wafer under test; acquiring the position information of measurement points in the template wafer image; and inputting the position information of measurement points in the template wafer image into the wafer geometric transformation model to obtain the position information of measurement points in the image of the wafer under test. This technical solution, by constructing a wafer geometric transformation model based on anchor points in the image of the wafer under test and anchor points in the template wafer image, determines the geometric transformation relationship of the wafer. Furthermore, the wafer geometric transformation model is used to map measurement points in the template wafer image, automatically calculating the position of measurement points in the image of the wafer under test, effectively improving the speed of measurement point determination and the reusability of the method.

[0052] Example 2

[0053] Figure 4 This is a flowchart of a method for determining measurement points according to Embodiment 2 of the present invention. The method of this embodiment can be combined with various optional schemes in the method for determining measurement points provided in the above embodiments. The method for determining measurement points provided in this embodiment has been further optimized. Optionally, generating a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested includes: constructing a system of linear equations for the template wafer image and the wafer image to be tested; inputting the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested into the system of linear equations for solving the system of linear equations for the template wafer image and the wafer image to be tested to obtain the geometric transformation parameters of the template wafer image and the wafer image to be tested; and establishing a wafer geometric transformation model based on the geometric transformation parameters of the template wafer image and the wafer image to be tested.

[0054] like Figure 4 As shown, the method includes:

[0055] S210. Obtain an image of the wafer to be tested and determine the position information of the anchor points in the image of the wafer to be tested.

[0056] S220. Obtain the position information of the anchor points in the template wafer image.

[0057] S230, a system of linear equations between the template wafer image and the image of the wafer to be tested.

[0058] Specifically, the position information of the anchor points in the template wafer image can be... The position information of the anchor point in the image of the wafer under test can be The linear equations between the template wafer image and the image of the wafer under test can be:

[0059]

[0060] in, This represents the x-coordinate of the i-th anchor point in the template wafer image. This represents the ordinate of the i-th anchor point in the template wafer image. This represents the x-coordinate of the i-th anchor point in the image of the wafer under test. Let represent the ordinate of the i-th anchor point in the image of the wafer to be tested, i = 1, 2, ..., N; N ≥ 3. a, b, c, d, e, and f represent the geometric transformation parameters between the template wafer image and the image of the wafer to be tested.

[0061] It should be noted that a, b, c, and d are used to control rotation, scaling, and shearing, while e and f represent translation amounts.

[0062] S240. Input the position information of the anchor points in the template wafer image and the position information of the anchor points in the wafer image to be tested into the linear equation system of the template wafer image and the wafer image to be tested for solving, and obtain the geometric transformation parameters of the template wafer image and the wafer image to be tested.

[0063] For example, the process of solving a system of linear equations includes:

[0064] Construct a coefficient matrix A with 2N rows and 6 columns, and a target vector B with 2N rows and 1 column.

[0065] The coefficient matrix A is:

[0066]

[0067] The target vector B is:

[0068]

[0069] That is, there exists: A×T≈B, where, Substitute the anchor point position information in the template wafer image and the anchor point position information in the wafer image to be tested into the above formula, and perform least squares solution to obtain the geometric transformation parameters: a, b, c, d, e and f.

[0070] S250. Establish a wafer geometric transformation model based on the geometric transformation parameters of the template wafer image and the wafer image to be tested.

[0071] For example, a wafer geometric transformation model can be established based on the geometric transformation parameters: a, b, c, d, e, and f. The wafer geometric transformation model can be:

[0072]

[0073] Where X1 and Y1 represent the coordinates of the measurement points in the template wafer image to be input, and X2 and Y2 represent the coordinates of the measurement points in the wafer image to be output.

[0074] S260. Obtain the position information of the measurement points in the template wafer image, and input the position information of the measurement points in the template wafer image into the wafer geometric transformation model to obtain the position information of the measurement points in the wafer image to be tested.

[0075] The technical solution of this invention constructs a system of linear equations between a template wafer image and a wafer image under test. The position information of anchor points in the template wafer image and the position information of anchor points in the wafer image under test are input into the system of linear equations between the template wafer image and the wafer image under test for solving. This yields the geometric transformation parameters of the template wafer image and the wafer image under test. Based on these geometric transformation parameters, a wafer geometric transformation model is established, providing a model basis for automatically calculating the measurement points in the wafer image under test.

[0076] Example 3

[0077] Figure 5 This is a flowchart of a method for determining measurement points according to Embodiment 3 of the present invention. The method of this embodiment can be combined with various optional schemes in the method for determining measurement points provided in the above embodiments. The method for determining measurement points provided in this embodiment has been further optimized. Optionally, after acquiring the image of the wafer to be tested, the method further includes: performing deformation detection on key graphics in the image of the wafer to be tested; if the detection result is that the graphics are deformed, performing nonlinear fitting based on the position information of the corner points of the key graphics in the template wafer image and the position information of the corner points of the key graphics in the image of the wafer to be tested to obtain a wafer image deformation fitting model; inputting the position information of the measurement points in the template wafer image into the wafer deformation fitting model to obtain the position information of the deformation-fitted measurement points in the image of the wafer to be tested.

[0078] like Figure 5 As shown, the method includes:

[0079] S310. Obtain an image of the wafer to be tested and determine the position information of the anchor points in the image of the wafer to be tested.

[0080] S320. Obtain the position information of anchor points in the template wafer image, and generate a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested.

[0081] S330. Obtain the position information of the measurement points in the template wafer image, and input the position information of the measurement points in the template wafer image into the wafer geometric transformation model to obtain the position information of the measurement points in the wafer image to be measured.

[0082] S340. Deformation detection is performed on the key graphics of the wafer image to be tested. If the detection result is that the graphics are deformed, nonlinear fitting is performed based on the corner position information of the key graphics in the template wafer image and the corner position information of the key graphics in the wafer image to be tested to obtain a wafer deformation fitting model.

[0083] Among them, pattern deformation refers to batch-to-batch deformation such as stretching and warping of the pattern. The wafer deformation fitting model can transform the measurement points in the template wafer image to the deformation-fitted measurement points in the image of the wafer to be tested.

[0084] Specifically, the root mean square (RMS) value of the anchor point position information in the image of the wafer under test can be calculated. If the RMS value of the anchor point position information in the image of the wafer under test is greater than a preset threshold, the detection result is determined to be graphic deformation. In the case of graphic deformation, the coordinates of the anchor points in multiple sets of template wafer images and the coordinates of the anchor points in the image of the wafer under test can be obtained for nonlinear fitting to obtain a wafer deformation fitting model. Thus, the wafer deformation fitting model can be used to achieve accurate correction of the entire wafer area, ensuring that even with graphic distortion, the accurate measurement points of the image of the wafer under test can be found.

[0085] S350. Input the position information of the measurement points in the template wafer image into the wafer deformation fitting model to obtain the position information of the measurement points after deformation fitting in the wafer image to be tested.

[0086] The wafer deformation fitting model can be a TPS (Thin-Plate Spline) fitting function. Nonlinear fitting methods can include B-spline or Thin-Plate Spline fitting algorithms, etc., without specific limitations.

[0087] For example, the TPS fitting function can be used to fit the image in both the X and Y directions, respectively, to solve for the x and y values ​​of the measurement points after deformation fitting in the image of the wafer under test. The non-wafer deformation fitting model can be:

[0088]

[0089] Where U(·) is the radial basis function of TPS, and the radial basis function of TPS can be U(r) = r 2 log(r 2 ), r = ||(x,y) - (x i ,y i )‖。 (x i ,y i ) represents the position information of the i-th measurement point in the template wafer image, w i The nonlinear weight of the i-th measurement point is represented by a1, a2 and a3, which are coefficients of the linear term. (x,y) represents the position information of the measurement point after deformation fitting in the image of the wafer to be measured.

[0090] The technical solution of this invention obtains a wafer deformation fitting model by performing nonlinear fitting based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested. Thus, the wafer deformation fitting model can be used to achieve accurate correction of the entire wafer area, ensuring that even if the image is distorted, the accurate measurement points of the wafer image to be tested can be found.

[0091] Example 4

[0092] Figure 6 This is a schematic diagram of a device for determining the location of a measurement point according to Embodiment 4 of the present invention. Figure 6 As shown, the device includes:

[0093] The anchor point position determination module 410 in the wafer image under test is used to acquire the wafer image under test and determine the position information of the anchor points in the wafer image under test.

[0094] The wafer geometry transformation model generation module 420 is used to obtain the position information of anchor points in the template wafer image and generate a wafer geometry transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested.

[0095] The module 430 for determining the position of measurement points in the image of the wafer under test is used to obtain the position information of measurement points in the template wafer image, input the position information of measurement points in the template wafer image into the wafer geometric transformation model, and obtain the position information of measurement points in the image of the wafer under test.

[0096] The technical solution of this invention involves acquiring an image of the wafer under test and determining the position information of anchor points in that image; acquiring the position information of anchor points in a template wafer image; generating a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the image of the wafer under test; acquiring the position information of measurement points in the template wafer image; and inputting the position information of measurement points in the template wafer image into the wafer geometric transformation model to obtain the position information of measurement points in the image of the wafer under test. This technical solution, by constructing a wafer geometric transformation model based on anchor points in the image of the wafer under test and anchor points in the template wafer image, determines the geometric transformation relationship of the wafer. Furthermore, the wafer geometric transformation model is used to map measurement points in the template wafer image, automatically calculating the position of measurement points in the image of the wafer under test, effectively improving the speed of measurement point determination and the reusability of the method.

[0097] In some alternative implementations, the anchor point includes the intersection of wafer scribe lines and / or the center point of the wafer electrode connection region.

[0098] In some optional implementations, the anchor point location determination module 410 in the wafer image under test includes:

[0099] The key graphic structure information determination unit is used to perform corner detection, edge detection or morphological analysis on the wafer image to be tested to obtain the structure information of key graphics in the wafer image to be tested, wherein the key graphics are used to locate anchor points;

[0100] The anchor point position information determination unit in the wafer image under test is used to determine the anchor point position information in the wafer image under test based on the structural information of the key graphics in the wafer image under test.

[0101] In some optional implementations, the anchor point location information determination unit in the wafer image under test can be specifically used for:

[0102] Based on the structural information of the key patterns in the image of the wafer under test, determine the position information of the center point of the key pattern in the image of the wafer under test and / or the position information of the corner point of the key pattern in the image of the wafer under test;

[0103] Based on the position information of the center point of the key graphic in the image of the wafer under test and / or the position information of the corner point of the key graphic in the image of the wafer under test, the position information of the anchor point in the image of the wafer under test is determined.

[0104] In some optional implementations, the wafer geometry transformation model generation module 420 can specifically be used for:

[0105] Construct a system of linear equations between the template wafer image and the image of the wafer to be tested;

[0106] The position information of the anchor points in the template wafer image and the position information of the anchor points in the wafer image to be tested are input into the linear equation system of the template wafer image and the wafer image to be tested for solving, so as to obtain the geometric transformation parameters of the template wafer image and the wafer image to be tested.

[0107] A wafer geometric transformation model is established based on the geometric transformation parameters of the template wafer image and the wafer image to be tested.

[0108] In some optional embodiments, the linear equations between the template wafer image and the wafer image to be tested are:

[0109]

[0110] in, This represents the x-coordinate of the i-th anchor point in the template wafer image. This represents the ordinate of the i-th anchor point in the template wafer image. This represents the x-coordinate of the i-th anchor point in the image of the wafer under test. Let represent the ordinate of the i-th anchor point in the image of the wafer to be tested, and let a, b, c, d, e, and f represent the geometric transformation parameters between the template wafer image and the image of the wafer to be tested.

[0111] In some optional embodiments, the device for determining the measurement point location further includes:

[0112] The wafer deformation fitting model generation module is used to detect the deformation of key graphics in the image of the wafer to be tested. When the detection result is that the graphics are deformed, nonlinear fitting is performed based on the corner position information of the key graphics in the template wafer image and the corner position information of the key graphics in the image of the wafer to be tested to obtain a wafer deformation fitting model.

[0113] The deformation-fitted measurement point position prediction module is used to input the position information of the measurement points in the template wafer image into the wafer deformation fitting model to obtain the position information of the deformation-fitted measurement points in the wafer image to be tested.

[0114] The measurement point determination device provided in the embodiments of the present invention can execute the measurement point determination method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0115] Example 5

[0116] Figure 7A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0117] like Figure 7 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded into the RAM 13 from storage unit 18. The RAM 13 can also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An I / O interface 15 is also connected to the bus 14.

[0118] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0119] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as a method for determining measurement points, which includes:

[0120] Acquire an image of the wafer to be tested, and determine the position information of the anchor points in the image of the wafer to be tested;

[0121] Obtain the position information of anchor points in the template wafer image, and generate a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested;

[0122] The position information of the measurement points in the template wafer image is obtained, and the position information of the measurement points in the template wafer image is input into the wafer geometric transformation model to obtain the position information of the measurement points in the wafer image to be measured.

[0123] In some embodiments, the method for determining the measurement points may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the method for determining the measurement points described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the method for determining the measurement points by any other suitable means (e.g., by means of firmware).

[0124] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), system-on-a-chip (SoCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0125] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0126] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0127] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0128] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0129] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0130] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0131] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for determining the location of a measurement point, characterized in that, include: Acquire an image of the wafer to be tested and determine the location information of anchor points in the image of the wafer to be tested; wherein, the anchor points include the intersection of wafer scribe lines and / or the center point of the wafer electrode connection area; Obtain the position information of anchor points in the template wafer image, and generate a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested; The position information of the measurement points in the template wafer image is obtained, and the position information of the measurement points in the template wafer image is input into the wafer geometric transformation model to obtain the position information of the measurement points in the wafer image to be measured. Deformation detection is performed on key graphics in the image of the wafer to be tested. If the detection result is that the graphics are deformed, nonlinear fitting is performed based on the position information of the corner points of the key graphics in the template wafer image and the position information of the corner points of the key graphics in the image of the wafer to be tested to obtain a wafer deformation fitting model. The position information of the measurement points in the template wafer image is input into the wafer deformation fitting model to obtain the position information of the measurement points after deformation fitting in the wafer image to be tested.

2. The method according to claim 1, characterized in that, Determining the position information of the anchor points in the image of the wafer under test includes: Corner detection, edge detection, or morphological analysis are performed on the image of the wafer under test to obtain the structural information of key graphics in the image of the wafer under test, wherein the key graphics are used to locate anchor points; The location information of anchor points in the image of the wafer under test is determined based on the structural information of key graphics in the image of the wafer under test.

3. The method according to claim 2, characterized in that, The step of determining the anchor point position information in the image of the wafer under test based on the structural information of key patterns in the image of the wafer under test includes: Based on the structural information of the key patterns in the image of the wafer under test, determine the position information of the center point of the key pattern in the image of the wafer under test and / or the position information of the corner point of the key pattern in the image of the wafer under test; Based on the position information of the center point of the key graphic in the image of the wafer under test and / or the position information of the corner point of the key graphic in the image of the wafer under test, the position information of the anchor point in the image of the wafer under test is determined.

4. The method according to claim 1, characterized in that, The step of generating a wafer geometric transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the image of the wafer to be tested includes: Construct a system of linear equations between the template wafer image and the image of the wafer to be tested; The position information of the anchor points in the template wafer image and the position information of the anchor points in the wafer image to be tested are input into the linear equation system of the template wafer image and the wafer image to be tested for solving, so as to obtain the geometric transformation parameters of the template wafer image and the wafer image to be tested. A wafer geometric transformation model is established based on the geometric transformation parameters of the template wafer image and the wafer image to be tested.

5. The method according to claim 4, characterized in that, The linear equations between the template wafer image and the wafer image to be tested are as follows: ； in, This represents the x-coordinate of the i-th anchor point in the template wafer image. This represents the ordinate of the i-th anchor point in the template wafer image. This represents the x-coordinate of the i-th anchor point in the image of the wafer under test. Let represent the ordinate of the i-th anchor point in the image of the wafer to be tested, and let a, b, c, d, e, and f represent the geometric transformation parameters between the template wafer image and the image of the wafer to be tested.

6. A device for determining the location of a measurement point, characterized in that, include: An anchor point position determination module in the wafer image under test is used to acquire the wafer image under test and determine the position information of the anchor points in the wafer image under test; wherein, the anchor points include the intersection of wafer scribe lines and / or the center point of the wafer electrode connection area; The wafer geometry transformation model generation module is used to obtain the position information of anchor points in the template wafer image and generate a wafer geometry transformation model based on the position information of anchor points in the template wafer image and the position information of anchor points in the wafer image to be tested. The module for determining the position of measurement points in the image of the wafer under test is used to obtain the position information of measurement points in the template wafer image, input the position information of measurement points in the template wafer image into the wafer geometric transformation model, and obtain the position information of measurement points in the image of the wafer under test. The wafer deformation fitting model generation module is used to detect the deformation of key graphics in the image of the wafer to be tested. When the detection result is that the graphics are deformed, nonlinear fitting is performed based on the corner position information of the key graphics in the template wafer image and the corner position information of the key graphics in the image of the wafer to be tested to obtain a wafer deformation fitting model. The deformation-fitted measurement point position prediction module is used to input the position information of the measurement points in the template wafer image into the wafer deformation fitting model to obtain the position information of the deformation-fitted measurement points in the wafer image to be tested.

7. An electronic device, characterized in that, The electronic device includes: At least one processor; and a memory communicatively connected to the at least one processor; The memory stores a computer program that can be executed by the at least one processor, which is then executed by the at least one processor to enable the at least one processor to perform the method for determining the measurement point location according to any one of claims 1-5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the method for determining the measurement point position according to any one of claims 1-5.

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