一种低应力玻璃基板与重布线层的封装结构
By setting stress relief grooves and local bridging structures on the glass substrate, the warping problem caused by the difference in thermal expansion coefficients is solved, achieving high stability and efficient signal transmission, and improving the reliability and yield of the packaging structure.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AALTOSEMI INC
- Filing Date
- 2025-06-06
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional packaging solutions suffer from warping due to the difference in thermal expansion coefficients between the substrate material and the metal wires, which affects transmission stability and signal efficiency. Furthermore, the multi-layer stacked structure results in low yield.
A combination structure of high-rigidity glass substrate and stress relief groove is adopted. By setting stress relief grooves with a width of 1 to 50 μm on the outside of the dielectric layer, thermal stress is dispersed, and the interconnection layer is simplified by using a local bridging structure.
It effectively reduces substrate warpage, improves signal transmission stability and efficiency, enhances packaging reliability and yield, and simplifies manufacturing processes.
Smart Images
Figure CN120565546B_ABST