Integration of radio frequency front end for size reduction and performance improvement

Abstract

A radio frequency package for electronic devices with reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies, and at least one antenna array providing wireless communication functionality for the radio frequency package. The front-end package includes radio frequency front-end dies and at least one power control die connected to an insulating film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Patent Application No. 18 / 092,683, filed January 3, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to packaging technologies, and more specifically to the integration of radio frequency front-ends for size reduction and performance improvement. Background Technology

[0004] Generally, radio frequency (RF) devices may include packages such as system-in-package (SIP). A SIP combines a substrate, die, multiple integrated circuits, and / or passive devices into a single package. A SIP may be made of semiconductor materials such as silicon. For example, the substrate and die may include silicon on which integrated circuits are fabricated. The substrate, die, and devices may be coupled by leads bonded to the package or by solder joints (e.g., solder balls or pads). By way of example, dies may be stacked (e.g., 2.5D or 3D stacked structures) to combine dies into the same package instead of placing them on a printed circuit board. In some cases, a SIP may also include multiple packages that are stacked (e.g., using stacked packaging technology) or have dies embedded in a substrate.

[0005] For example, radio frequency (RF) devices supporting communication over millimeter-wave (mmWave) frequencies typically provide support at frequencies of 30 GHz or close to 30 GHz. In some cases, RF devices may also support mmWave communication via additional mmWave bands for a wider frequency coverage range (such as 30 GHz–300 GHz). Multiple antennas (e.g., antenna arrays) of the RF device can transmit signals that are combined to form a beam (e.g., beamforming signal) for communication over mmWave. To achieve consistent coverage (e.g., from base stations associated with mmWave communication), the RF device may include multiple antenna arrays located in different parts of the RF device. However, assembling these multiple antenna arrays in a system-in-package (SIIP) of the RF device can consume space and undesirably increase the size of the RF device. Summary of the Invention

[0006] Embodiments of this disclosure relate to a radio frequency (RF) package for an electronic device that features reduced size and improved performance. The RF package includes a front-end package, an antenna array, and a plurality of transceiver dies. The antenna array and the plurality of transceiver dies provide wireless communication functionality for the electronic device. The front-end package includes an RF front-end die and a power control die connected to an insulating film substrate via a first connector. Each of the transceiver dies is connected to the antenna array using a second connector.

[0007] Embodiments of this disclosure further relate to an RF package including a front-end package, a plurality of antenna arrays, and a plurality of transceiver dies. The front-end package includes an RF front-end die and a power control die connected to an insulating film substrate via a first connector. The antenna arrays and the transceiver dies provide wireless communication functionality for the electronic device. Each of the transceiver dies is connected to a corresponding antenna array using a second connector.

[0008] Embodiments of this disclosure further relate to an RF package including an antenna array and a plurality of transceiver dies configured to provide wireless communication functionality to an electronic device integrating the RF package. Each of these transceiver dies is connected to the antenna array via a first connector. The RF package may also include an RF front-end die, at least one power control die, and a mold (e.g., a stepped mold with portions of different heights). The mold may be placed onto the antenna array, and each of the transceiver dies may be integrated into the mold. Attached Figure Description

[0009] Figure 1A It is a high-level diagram of an electronic device according to an implementation plan.

[0010] Figure 1B It means Figure 1A A perspective view of a notebook computer as an implementation scheme for an electronic device.

[0011] Figure 1C It is a representation based on an implementation plan. Figure 1A A front view of a handheld device in another embodiment of an electronic device.

[0012] Figure 1D It is a representation based on an implementation plan. Figure 1A A front view of another handheld device in another embodiment of the electronic device.

[0013] Figure 1E It is a representation based on an implementation plan. Figure 1A A front view of a desktop computer in another embodiment of an electronic device.

[0014] Figure 1F It is a representation based on an implementation plan. Figure 1A Front and side views of another embodiment of the wearable electronic device.

[0015] Figure 2 It is based on an implementation plan. Figure 1A A schematic diagram of the system package of an electronic device.

[0016] Figure 3 This is a schematic diagram of a first radio frequency package according to one implementation scheme.

[0017] Figure 4A This is a schematic diagram of a second radio frequency package according to one implementation scheme.

[0018] Figure 4B This is a schematic diagram of a third radio frequency package according to one implementation scheme.

[0019] Figure 5A This is a schematic diagram of a fourth radio frequency package according to one implementation scheme.

[0020] Figure 5B This is a schematic diagram of a fifth radio frequency package according to one implementation scheme.

[0021] Figure 6 This is a schematic diagram of a sixth radio frequency package according to one implementation scheme.

[0022] The accompanying drawings depict and describe in detail various non-limiting embodiments, which are merely illustrative. Detailed Implementation

[0023] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings. Numerous specific details are set forth in the following detailed description to provide a full understanding of the various described embodiments. However, the described embodiments may be implemented without these specific details. In other cases, well-known methods, processes, components, circuits, and networks are not described in detail so as not to unnecessarily obscure the various aspects of the embodiments.

[0024] Embodiments of this disclosure relate to an RF package for an electronic device having components of a front-end die integrated with one or more antenna arrays to achieve size reduction and improved performance. The RF package may include a front-end package, a multilayer board, multiple transceiver dies, and an antenna array module. The front-end package may include a scaled-down front-end die connected to an insulating film substrate (e.g., Ajinomoto multilayer film) via a first array of connectors (e.g., solder ball connectors) and at least one power management unit die. The insulating film substrate may be connected to the top side of the multilayer board using a second array of connectors (e.g., solder ball connectors). The transceiver dies may be placed on top of the antenna array module and integrated into the antenna substrate (e.g., a die). The front-end package may include a scaled-down front-end die because the specific functionality of the front-end die is offloaded to the transceiver die directly coupled to the antenna array module. The antenna array module may be coupled to the multilayer board using via connectors. In some embodiments, the antenna array module is divided into multiple antenna array sub-modules, and the antenna substrate is divided into multiple antenna substrate portions (e.g., multiple die portions) with space between each pair of adjacent antenna substrate portions. Each transceiver die can be connected to the corresponding antenna array submodule via a third array of connectors (e.g., solder ball connectors). Each transceiver die can also be integrated into the corresponding antenna substrate portion (e.g., the corresponding die).

[0025] Exemplary electronic devices

[0026] This document describes implementations of electronic devices, user interfaces for such devices, and associated processes for using such devices. In some implementations, the device is a portable communication device, such as a mobile phone, that also includes other functionalities such as a personal digital assistant (PDA) and / or music player functionality. Exemplary implementations of portable multi-functional devices include, but are not limited to, those from Apple Inc. (Cupertino, California). Devices, iPod Devices, Apple Equipment and Device. Alternatively, other portable electronic devices, such as wearable devices, laptops, or tablets, may be used. In some embodiments, the device is not a portable communication device, but a desktop computer or other computing device not designed for portable use. In some embodiments, the disclosed electronic device may include a touch-sensitive surface (e.g., a touchscreen display and / or touchpad). The example electronic device described below in conjunction with FIG1 (e.g., electronic device 100) may include a touch-sensitive surface for receiving user input. The electronic device may also include one or more other physical user interface devices, such as a physical keyboard, mouse, and / or joystick.

[0027] Figure 1A This is a high-level diagram of an electronic device 100 according to one embodiment. The electronic device 100 may include one or more processors 102, memory 104, non-volatile storage device 106, display 108, input structure 112, input / output (I / O) interface 114, network interface 116, power supply 118, and transceiver 110, as well as other components. Figure 1A The various functional blocks shown may include hardware elements (including circuits), software elements (including computer code stored on a computer-readable medium), or a combination of both hardware and software elements. It should be noted that... Figure 1A This is merely one example of a specific implementation and is intended to illustrate the types of components that may exist in electronic device 100.

[0028] For example, electronic device 100 may represent Figure 1B The notebook computer described in the article Figure 1C The handheld device depicted in the article Figure 1D The handheld device depicted in the article Figure 1E The desktop computer depicted in the article Figure 1F The diagram depicts a wearable electronic device or similar device. It should be noted that... Figure 1A The processor 102 and other related items herein may generally be referred to as "data processing circuitry". This data processing circuitry may be embodied, in whole or in part, in software, hardware, or any combination thereof. Furthermore, Figure 1A The processor 102 and other related items may be a single included processing module, or may be fully or partially integrated into any of the other elements within the electronic device 100.

[0029] exist Figure 1AIn the electronic device 100, a processor 102 may be operatively coupled to a memory 104 and a non-volatile storage device 106 to execute various algorithms. For example, an algorithm for adjusting the input / output power of an antenna may be stored in the memory 104 and / or the non-volatile storage device 106. Such algorithms or instructions executed by the processor 102 may be stored in any suitable article of manufacture including one or more tangible computer-readable media. Furthermore, an antenna gain lookup table for determining the total transmit gain and / or total receive gain may be stored in the memory 104 and / or the non-volatile storage device 106. Specifically, one or more codebooks may be stored in the memory 104 and / or the non-volatile storage device 106. The tangible computer-readable medium may include the memory 104 and / or the non-volatile storage device 106, individually or collectively, to store algorithms or instructions. The memory 104 and the non-volatile storage device 106 may include any suitable article of manufacture for storing data and executable instructions, such as random access memory, read-only memory, rewritable flash memory, hard disk drive, and optical disk. Additionally, programs (e.g., operating systems) encoded on such computer program products may also include instructions that can be executed by processor 102 to enable electronic device 100 to provide various functions.

[0030] In some embodiments, display 108 may be a liquid crystal display (LCD) that allows a user to view images generated on electronic device 100. In some embodiments, display 108 may include a touchscreen that allows a user to interact with the user interface of electronic device 100. Furthermore, it should be understood that in some embodiments, display 108 may include one or more light-emitting diode (LED) displays, organic light-emitting diode (OLED) displays, active-matrix organic light-emitting diode (AMOLED) displays, or some combination of these and / or other display technologies.

[0031] The input structure 112 of electronic device 100 allows a user to interact with electronic device 100 (e.g., pressing a button to increase or decrease the volume level). Like network interface 116, I / O interface 114 enables electronic device 100 to interact with various other electronic devices. Network interface 116 may include one or more interfaces, for example, for personal area networks (PANs) such as... Networks, local area networks (LANs), or wireless local area networks (WLANs) such as 802.11x Networks, and / or wide area networks (WANs) such as 3rd generation (3G) cellular networks, Universal Mobile Telecommunications System (UMTS), 4th generation (4G) cellular networks, Long Term Evolution (LTE) Cellular networks, Long Term Evolution License Assisted Access (LTE-LAA) cellular networks, 5G cellular networks, and / or New Radio (NR) cellular networks. Specifically, network interface 116 may include, for example, one or more interfaces for using Release-15 cellular communication standards that include millimeter wave (mmWave) frequency ranges (e.g., 30 GHz–300 GHz) of 5G specifications. Transceiver 110 of electronic device 100, including a transmitter and a receiver, may allow communication over the aforementioned networks (e.g., 5G, Wi-Fi, LTE-LAA, etc.).

[0032] Network interface 116 may also include one or more interfaces for, for example, a broadband fixed wireless access network (e.g., Mobile broadband wireless network (mobile) Asynchronous digital subscriber lines (e.g., ADSL, VDSL) and terrestrial digital video broadcasting Network and its extension DVB handheld devices Networks, ultra-broadband (UWB) networks, alternating current (AC) power lines, etc.

[0033] In some implementations, electronic device 100 uses transceiver 110 to communicate via the aforementioned wireless network (e.g., move 4G The transceiver 110 may include circuitry for both wirelessly receiving received signals at the receiver and wirelessly transmitting transmitted signals (e.g., data signals, wireless data signals, wireless carrier signals, radio frequency signals) from the transmitter. In some embodiments, the transceiver 110 may include a transmitter and receiver combined into a single unit, or in other embodiments, the transceiver 110 may include a transmitter separate from the receiver. The transceiver 110 may transmit and receive radio frequency signals to support wireless applications such as, for example, PAN networks (e.g., 5G, etc.). ), WLAN networks (e.g., 802.11x) ), WAN networks (e.g., 3G, 4G, 5G, NR and (and LTE-LAA cellular network) Network, Mobile Network, ADSL and VDSL networks, and Voice and / or data communication in networks, UWB networks, etc. As further illustrated, electronic device 100 may include power supply 118. Power supply 118 may include any suitable power source, such as a rechargeable lithium polymer (Li-poly) battery and / or an alternating current (AC) power converter.

[0034] In some embodiments, electronic device 100 may take the form of a computer, portable electronic device, wearable electronic device, or other type of electronic device. Such a computer may be a typically portable computer (such as a laptop, notebook, or tablet computer) or a computer typically used in one location (such as a desktop computer, workstation, and / or server). In some embodiments, electronic device 100 in the form of a computer may be purchased from Apple Inc. (Cupertino, California). Pro, MacBook mini or Mac Model number. By way of example, according to one embodiment of this disclosure, in... Figure 1B An electronic device 100 in the form of a notebook computer 120 is illustrated. The notebook computer 120 may include a casing or housing 122, a display 108, input structures 112, and ports for I / O interfaces 114. In one embodiment, the input structures 112 (such as a keyboard and / or touchpad) can be used to interact with the computer 120, such as to launch, control, or operate a graphical user interface (GUI) or applications running on the computer 120. For example, the keyboard and / or touchpad can allow a user to navigate the user interface and / or application interface displayed on the display 108.

[0035] Figure 1C A front view of a handheld device 130 is depicted, representing one embodiment of electronic device 100. Handheld device 130 may represent, for example, a portable telephone, media player, personal data manager, handheld gaming platform, or any combination of such devices. By way of example, handheld device 130 may be purchased from Apple Inc. (Cupertino, California). Model. Handheld device 130 may include a housing 122 to protect internal components from physical damage and / or shield these internal components to avoid electromagnetic interference. Housing 122 may surround display 108. I / O interface 114 may be opened through housing 122 and may include, for example, I / O ports for hardwired connections for charging and / or content manipulation using standard connectors and protocols such as the Lightning connector provided by Apple Inc. (Cupertino, California), Universal Serial Bus (USB), or other similar connectors and protocols. Interface 114 may be associated with wiring and connectors within the RF package of electronic device 100. Wiring and connectors allow specific areas within the system package of electronic device 100 to be used for placement of components that facilitate support for various wireless communication protocols and capabilities. By way of example, if handheld device 130 is positioned upward along the positive portion of the z-axis and facing the positive portion of the y-axis, the antenna array on the right side panel of handheld device 130 may be configured and transmit signals in the positive portion of the x-axis. Similarly, the antenna array on the left side panel can be configured to transmit signals in the negative portion of the x-axis, the antenna array on the front glass panel (e.g., the front surface panel) can be configured to transmit signals in the positive portion of the y-axis, and the antenna array on the rear glass panel (e.g., the rear surface panel) can be configured to transmit signals in the negative portion of the y-axis.

[0036] Input structure 112, in conjunction with display 108, allows a user to control handheld device 130. For example, input structure 112 can activate or deactivate handheld device 130, navigate the user interface to the home screen, a user-configurable application screen, and / or activate voice recognition features of handheld device 130. Other input structures 112 may provide volume control or switch between vibration and ringtone modes. Input structure 112 may also include a microphone capable of acquiring user voice for various voice-related features, and a speaker that enables audio playback and / or certain telephone capabilities. Input structure 112 may also include a headphone input that provides connectivity to external speakers and / or headphones.

[0037] Figure 1D A front view of another handheld device 140 is depicted, representing another embodiment of electronic device 100. Handheld device 140 may represent, for example, a tablet computer, or one of various portable computing devices. By way of example, handheld device 140 may be a tablet-sized embodiment of electronic device 100, which may be, for example, purchased from Apple Inc. (Cupertino, California). model.

[0038] Go to Figure 1E Computer 150 can represent Figure 1AAnother embodiment of the electronic device 100. The computer 150 can be any computer, such as a desktop computer, server, or laptop computer, but can also be a standalone media player or video game console. For example, the computer 150 could be from Apple Inc. (Cupertino, California). Or other similar devices. It should be noted that computer 150 may also refer to a personal computer (PC) from another manufacturer. A similar housing 122 may be provided to protect and enclose the internal components of computer 150, such as monitor 108. In some embodiments, a user of computer 150 may interact with computer 150 using various peripheral input structures 112 that can be connected to computer 150, such as keyboard 152 or mouse 154 (e.g., input structure 112).

[0039] Similarly, Figure 1F A wearable electronic device 160, representing another embodiment of electronic device 100, is depicted. This wearable electronic device can be configured to operate using the techniques described herein. By way of example, the wearable electronic device 160, which may include a wristband 162, could be an Apple product of Apple Inc. (Cupertino, California). However, in other embodiments, the wearable electronic device 160 may include any wearable electronic device, such as, for example, a wearable motion monitoring device (e.g., a pedometer, accelerometer, heart rate monitor), or other devices from another manufacturer. The display 108 of the wearable electronic device 160, surrounded by the housing 122, may include a touchscreen display 108 (e.g., an LCD, LED display, OLED display, AMOLED display, etc.) and an input structure 112 that allows a user to interact with the user interface of the wearable electronic device 160.

[0040] Figure 2 yes Figure 1A A schematic diagram of a system package 200 for an electronic device 100. Although the depicted embodiment shows multiple panels on different sides and on the same layer of the electronic device 100, the system described herein is also applicable to stacked panels, such as three-dimensional (3D) stacks of printed circuit boards. That is, one or more panels may be positioned on top of or below one or more other panels. Furthermore, at least one panel may include a redistribution printed circuit board that provides connectivity between panels coupled to the redistribution printed circuit board.

[0041] In the depicted embodiments, system package 200 includes packages for a front glass panel 232 (e.g., a front surface panel or cover glass panel), a main logic board 233 having a rear glass panel 234, a left side panel 236, and a right side panel 238. Although the following description depicts panels 232, 234, 236, and 238 as being disposed on the front, rear, left, and right sides of electronic device 100, respectively, representing a particular embodiment, system package 200 described herein may additionally or alternatively include panels disposed in other areas of electronic device 100 that may include one or more antennas. For example, system package 200 may also include a top side panel or a bottom side panel, respectively disposed on the top or bottom of electronic device 100, adjacent to left side panel 236 and right side panel 238. Furthermore, although the following description describes an antenna array, representing a particular embodiment, system package 200 described herein may additionally or alternatively include multiple antenna arrays.

[0042] The main logic board 233 may include a rear glass panel 234, power management circuitry 239, transceiver 110, antenna array selector 237, application processor 235, and a first antenna array 250A. The application processor 235 may be coupled to the power management circuitry 239 to control power functions, including power functions related to wireless communication. The power management circuitry 239 may include one or more integrated circuits and controls the power supplied to the main logic board 233 and / or components of the electronic device 100 (including, for example, transceiver 110 and / or antenna array selector 237) (e.g., via processor 102). By way of example, the power management circuitry 239 may control the following processes: supplying power to the main logic board 233; supplying power to components, panels 232, 234, 236, and / or 238 on or coupled to the main logic board 233; selecting power; power sequencing; converting direct current (DC) for specific power-related functions; charging the battery of the electronic device 100, etc.

[0043] As shown in the figure, transceiver 110 is coupled to antenna array selector 237, first antenna array 250A of rear glass panel 234, and components of front glass panel 232. Antenna array 250A includes multiple antennas that transmit and / or receive wireless signals, and can form a directional beam using signals transmitted by each antenna. As previously mentioned... Figure 1AThe transceiver 110 discussed herein is a device that includes a transmitter and a receiver in a single package and can transmit and receive data via wireless signals transmitted on a specific radio frequency using an antenna in a first antenna array 250A. Specifically, transceiver 110 may include a transmitter and a receiver that include components facilitating the transmission and reception of wireless signals, such as those used for transmission and reception between electronic devices 100 using mmWave communication technology or any other suitable communication protocol. When communicating on mmWave frequencies, electronic devices 100 may utilize beamforming techniques to form directional beams, as previously mentioned. The transmitter of transceiver 110 may include one or more phase shifters, a transmitter power detector, and a power amplifier. The transmitter phase shifter may modulate (e.g., phase-shift) the transmitted signal (e.g., a wireless signal transmitted from an antenna in the first antenna array 250A) and may form a beam that can be manipulated in a particular direction (e.g., a directional beam), such as toward another electronic device (e.g., another electronic device 100 or a base station). The power amplifier may amplify the power level of the transmitted signal. Specifically, a power amplifier supply voltage can be supplied to the power amplifier to control the amplification provided by the power amplifier (e.g., increasing or decreasing the amplification, which can affect the antenna gain at the corresponding antenna). The transmitter power detector can measure the power of the transmitted signal transmitted from the antenna in the first antenna array 250A.

[0044] The receiver of transceiver 110 may include one or more receiver phase shifters, low-noise amplifiers, and receiver power detectors. The receiver phase shifters and receiver power detectors may operate similarly to those of transmitter phase shifters and transmitter power detectors. The low-noise amplifier may amplify the power level of the received signal (e.g., a wireless signal received at an antenna in the first antenna array 250A). Additional components in the transmitter and / or receiver may include (but are not limited to) filters, mixers, and / or attenuators.

[0045] An antenna array selector 237, which can be coupled to transceiver 110, can activate or enable communication from one or more antennas in antenna array 250 (such as first antenna array 250A). For example, antenna array selector 237 can selectively enable multiple antennas to adapt to data throughput. As shown, first antenna array 250A is disposed at rear glass panel 234. Rear glass panel 234 may include one or more printed circuit boards coupled to the rear surface (e.g., rear glass) of electronic device 100. As shown, first antenna array 250A may include an M×N array of first band antenna 251 (band 1), second band antenna 253 (band 2), and third band antenna 255 (band 3). M×N array may refer to M rows (e.g., one or more rows) and N columns (e.g., one or more columns) of antennas, wherein the number of antennas in rows, columns, and / or rows and columns may include any number of antennas suitable for a particular application (e.g., communication via mmWave). Additionally, although the following description depicts an antenna array 250 having a specific number of first band antennas 251, second band antennas 253, and third band antennas 255, representing a particular embodiment, the antenna array 250 may include any one or more of the first band antennas 251, second band antennas 253, and / or third band antennas 255. The first band antenna 251 enables communication in a first band or frequency range, the second band antenna 253 enables communication in a second band or frequency range, and the third band antenna 255 enables communication in a third band or frequency range. In some embodiments, the first, second, and third bands may include different frequency ranges. By way of example, the first band may include low-frequency band frequencies such as 700 MHz to 1.0 GHz, the second band antenna 253 may enable communication in mid-frequency band frequencies (such as 1.8 GHz to 2.2 GHz), and the third band antenna 255 may enable communication in high-frequency band frequencies (such as 20 GHz to 80 GHz).

[0046] Additionally, transceiver 110 may be coupled to a power management module (PMM) 241 and an amplifier radio frequency integrated circuit (RFIC) 242 on the front glass panel 232. The power management module 241 provides power to the power amplifier of transceiver 110 to amplify the power of the transmitted signal. The amplifier RFIC 242 provides mixer circuitry to demodulate the radio frequency signal received by transceiver 110 and modulate the intermediate frequency signal into a radio frequency signal for transmission from transceiver 110.

[0047] In some embodiments, application processor 235 may control antenna array selector 237 and / or transceiver 110 (e.g., via antenna array selector 237), and by extension, control antenna arrays 250 of front glass panel 232, rear glass panel 234, left side panel 236, and / or right side panel 238. That is, antenna array selector 237 may enable one or more antennas in one or more antenna arrays 250 (e.g., antenna arrays 250A, 250B, 250C, 250D) to transmit or receive wireless signals via transceiver 110. In some embodiments, antenna array selector 237 may enable the antenna of right side panel 238 to transmit signals that contribute to beamforming signals directed to the right relative to electronic device 100. For example, if Figure 1C If the electronic device 130 is positioned upwards in the positive portion of the z-axis and facing the positive portion of the y-axis, then the right panel 238 can be positioned and transmit signals in the positive portion of the x-axis. The application processor 235 is also communicatively coupled to the power management circuitry 239 of each of the front glass panel 232, main logic board 233, rear glass panel 234, left panel 236, and right panel 238 to control power-related functions for each panel.

[0048] Application processor 235 may include one or more microprocessors, one or more "general purpose" microprocessors, one or more special purpose microprocessors, and / or one or more application-specific integrated circuits (ASICs), or some combination thereof. For example, application processor 235 may include one or more Reduced Instruction Set Computing (RISC) processors. In some cases, application processor 235 may perform processing for specific functions, such as specific wireless communication-related functions (e.g., executing software programs and / or instructions). Specific functions may include receiving or generating wireless signals, using antenna array selector 237 to select a specific antenna for transmitting or receiving signals, using power management circuitry 239 to select amplification levels to amplify transmitted signals, determining the gain of wireless signals transmitted and / or received from a specific transmitter and / or receiver associated with a specific antenna of antenna array 250, etc. In some cases, application processor 235 may be integrated with processor 102 and perform additional functions related to wireless communication, such as functions related to display 108, adjusting bandwidth consumption, etc.

[0049] In some implementations, the application processor 235 may be connected to one or more memory devices ( Figure 2 (not shown in the image) (such as...) Figure 1AThe memory device 104 communicates with the application processor 235 to process instructions for performing functions related to wireless communication. The memory device may store information such as control software, configuration information, etc. In some embodiments, the application processor 235 and the memory device may be external to the main logic board 233 and / or system package 230. The memory device may include tangible, non-transitory machine-readable media, such as volatile memory (e.g., random access memory (RAM)) and / or non-volatile memory (e.g., read-only memory (ROM)). The memory device can store a variety of information and can be used for a variety of purposes. For example, the memory device may store machine-readable and / or processor-executable instructions (e.g., in the form of software or computer programs) for execution by the application processor 235, such as instructions for implementing communication from a specific antenna that transmits or receives signals contributing to beamforming signals transmitted or received at a specific frequency in a specific beam direction. The memory device may include one or more storage devices (e.g., non-volatile storage devices) that may include ROM, flash memory, hard disk drives, or any other suitable optical, magnetic, or solid-state storage media or combinations thereof.

[0050] As shown in the figure, the system package 230 also includes a front glass panel 232, which may include one or more printed circuit boards coupled to a cover glass associated with the display 108. The front glass panel 232 may include a second antenna array 250B having M×N first-band antennas 251, M×N second-band antennas 253, and / or M×N third-band antennas 255. The antennas in the second antenna array 250B operate similarly to the antennas in the first antenna array 250A of the main logic board 233. That is, by way of example, the first-band antennas 251 may transmit wireless signals at low-frequency bands (e.g., 700 MHz to 1.0 GHz), the second-band antennas 253 may transmit wireless signals at mid-frequency bands (e.g., 1.8 GHz to 2.2 GHz), and the third-band antennas 255 may transmit wireless signals at high-frequency bands (e.g., 20 GHz to 80 GHz).

[0051] The front glass panel 232 may also include an amplifier RFIC 242 (e.g., a low-noise amplifier (LNA) and a power amplifier (PA) radio frequency integrated circuit (RFIC)) and a power management module 241. The amplifier RFIC 242 may include circuitry between an antenna and a mixer circuitry that processes the signal, for example, before it is converted or demodulated to a lower intermediate frequency (IF) for processing (e.g., from RF to IF). By way of example, the amplifier RFIC 242 may include a processor 102 that processes instructions for functions performed by the amplifier RFIC 242 (e.g., instructions related to frequency conversion, transmitting a signal from a particular antenna with a particular amplification, receiving a signal at a particular antenna, etc.) and / or a memory 104 that stores instructions related to the functions performed by the amplifier RFIC 242. In some implementations, amplifier RFIC 242 may include a bandpass filter that allows frequencies within a specific range to pass through and / or a bandstop filter that filters out frequencies from that specific range, a low-noise amplifier that increases the signal strength of the incoming signal, a local oscillator that generates an RF signal offset from the incoming signal to mix with the incoming signal, and / or a mixer that mixes the incoming signal with a signal from the local oscillator to convert the incoming signal to an intermediate frequency. The power converter (e.g., a DC-DC converter) of power management module 241 may supply power to the power amplifier of electronic device 100, for example, for amplifying the transmitted signal. Therefore, dynamically changing the supply voltage from the power converter can correspondingly change the amplification of the transmitted signal from the power amplifier. Furthermore, the average power tracking (APT) of power management module 241 may vary the DC supply voltage based on the output power level to maintain the linearity of the power amplifier while improving efficiency (e.g., reducing unnecessary power consumption of the power amplifier).

[0052] As illustrated, system package 200 also includes a left side panel 236, which may include one or more printed circuit boards connected to the left side of electronic device 100. Left side panel 236 may also include power management circuitry 239, transceiver 110, and a third antenna array 250C. Similarly, system package 200 includes a right side panel 238. Right side panel 238 may also include power management circuitry 239, transceiver 110, and a fourth antenna array 250D. Power management circuitry 239, transceiver 110, and antenna arrays 250C, 250D may operate and function similarly to power management circuitry 239, transceiver 110, and first antenna array 250A as discussed with respect to main logic board 233. As shown, the third antenna array 250C and fourth antenna array 250D include M×N first-band antennas 251, second-band antennas 253, and third-band antennas 255. As previously mentioned, by way of example, the first band antenna 251 can transmit wireless signals at low frequency bands, the second band antenna 253 can transmit wireless signals at mid frequency bands, and the third band antenna 255 can transmit wireless signals at high frequency bands.

[0053] As previously discussed, integrating the antenna, transceiver 110, and power management circuitry 239 of antenna array 250 into the same specific area within the panel package of system package 200 can be challenging. Specifically, transceiver 110 and antenna array 250 may be co-located (e.g., close to each other in the same or substantially the same area) within the package, allowing transceiver 110 to effectively control the amplification, phase, gain, etc., of the wireless signal while minimizing signal loss and noise that might otherwise result from a longer communication path (e.g., not co-located) between transceiver 110 and antenna array 250. Similarly, power management circuitry 239 may be co-located with transceiver 110 and antenna array 250, allowing transceiver 110 to effectively control the power-related functions of the wireless signal from the antenna of antenna array 250 while also minimizing signal loss and noise. Furthermore, electronics 100 may include additional antennas to achieve higher data throughput via the antenna and / or provide higher gain of the wireless signal from the antenna. In some implementations, electronic device 100 includes additional components and / or additional antennas to accommodate carrier aggregation specific to a particular wireless carrier. System package 200 can effectively accommodate co-located components, additional antennas, other components, and / or package specifications while reducing footprint (or maintaining the initial system package 200 size after adding additional components and antennas). Although the following description describes space-saving packaging techniques applied to specific panels of system package 200, these techniques can also be applied to other panels of system package 200. By way of example, the description of space-saving packaging techniques applied to front glass panel 232 can also be applied to main logic board 233, rear glass panel 234, left side panel 236, and / or right side panel 238. About Figures 3 to 6 Provides details on various space-saving packaging technologies for integration in RF packaging.

[0054] Example RF package

[0055] Figure 3This is a schematic diagram of an RF package 300 that can be integrated into an electronic device 100 according to one embodiment. The RF package 300 may be a system package integrated into a front glass panel 232, a main logic board 233, a rear glass panel 234, a left side panel 236, or a right side panel 238. The RF package 300 may include a front-end package 302, a multilayer board 320 (e.g., a printed circuit board), an antenna array 324, and a transceiver die 330. The front-end package 302 may include an RF front-end die 304 and a power control die 306 connected to an insulating film substrate 316 via a connector 314. The connector 314 may be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The insulating film substrate 316 may be implemented as, for example, an insulating multilayer material. Alternatively, the insulating film substrate 316 may be replaced with an interposer. The power control die 306 may provide power control for, for example, the RF front-end die 304. The power control die 306 may be stacked onto the insulating film substrate 316 via the connector 314. The power control die 306 may be an implementation of the power management circuitry 239 and / or the power management module 241. The front-end package 302 may also include at least one passive element 308 (e.g., a capacitor) stacked on the insulating film substrate 316. The RF package 300 may also include passive elements 310 (e.g., capacitors, inductors, or resistors) and / or passive elements 312 (e.g., capacitors, inductors, or resistors) placed on the top side of the multilayer board 320.

[0056] Antenna array 324 and transceiver die 330 provide wireless communication functionality for RF package 300 and electronic device 100 integrated with RF package 300. Each transceiver die 330 can be connected to antenna array 324 using connector 326. Connector 326 can be, for example, a solder ball connector, microbump, some other type of connector, or some combination thereof. Passive components 328 (e.g., capacitors) can be stacked on antenna array 324, and each passive component 328 can be positioned adjacent to a corresponding transceiver die 330. In one or more embodiments, at least one additional tuning component ( Figure 3 (Not shown in the image) are stacked onto antenna array 324.

[0057] A multilayer board 320 may be placed between the front-end package 302 and the antenna array 324. An insulating film substrate 316 may be connected to the multilayer board 320 using a connector 318. The connector 318 may be, for example, a solder ball connector, a microbump, some other type of connector, or a combination thereof. The multilayer board 320 may be replaced by a flexible board 320. Alternatively, the multilayer board 320 may be replaced by a board 320 having at least one embedded component. The antenna array 324 may be connected to the multilayer board 320 using a via connector 332. The via connector 332 may carry signals between the transceiver die 330 / antenna array 324 and one or more components of the front-end package 302. The via connector 332 may be, for example, a plated via, a copper-filled via, some other type of via, or a combination thereof. The RF package 300 may also include a mold 322 (e.g., an antenna substrate) placed on the antenna array 324. The transceiver die 330 and the connector 326 may be integrated into the mold 322. When the mold 322 is included in the RF package 300, the multilayer board 320 can be placed between the front-end package 302 and the mold 322.

[0058] Figure 4A This is a schematic diagram of an RF package 400 that can be integrated into an electronic device 100 according to one embodiment. The RF package 400 may be a system package integrated into a front glass panel 232, a main logic board 233, a rear glass panel 234, a left side panel 236, or a right side panel 238. The RF package 400 may include an antenna array 412 and a plurality of transceiver dies 420 that together provide wireless communication functionality for the RF package 400 and the electronic device 100 integrating the RF package 400. Each transceiver die 420 may be connected to the antenna array 412 using a connector 424. The connector 424 may be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof.

[0059] The RF package 400 may also include a stepped die 414 (e.g., a stepped antenna substrate) with portions of varying heights placed on the antenna array 412. Each transceiver die 420 may be integrated into the stepped die 414. The RF package 400 may also include an RF front-end die 416 integrated into the stepped die 414, and at least one power control die 428. The at least one power control die 428 may provide power control for, for example, the RF front-end die 416 and / or the transceiver die 420. The at least one power control die 428 may be integrated into the stepped die 414 and mounted to the multilayer board 410 via a connector 432. The connector 432 may be, for example, a pad grid array connector, a ball grid array connector, a microbump, some other type of connector, or some combination thereof. The at least one power control die 428 may be an implementation of power management circuitry 239 and / or power management module 241. A stepped die 414 may be used to include at least one shielding layer in the RF package 400. Additionally or alternatively, the stepped die 414 may be used to include at least one heat-dissipating material in the RF package 400. The RF package 400 may also include passive components 426 (e.g., capacitors, inductors, and / or resistors) integrated into the stepped die 414 and stacked on the antenna array 412. Each passive component 426 may be positioned adjacent to a corresponding transceiver die 420. In one or more embodiments, at least one additional tuning component ( Figure 4A (Not shown in the image) are stacked onto antenna array 412.

[0060] The RF package 400 may also include a multilayer board 410 (e.g., a printed circuit board). A first (e.g., bottom) surface of the multilayer board 410 may be connected to an RF front-end die 416 and at least one power control die 428 using a connector 418. The connector 418 may be, for example, a pad grid array connector, a ball grid array connector, a microbump, some other type of connector, or some combination thereof. An antenna array 412 may be connected to the multilayer board 410 using a via connector 430. The via connector 430 may carry signals between components on a first surface (e.g., top surface) of the multilayer board 410 and components on a second surface (e.g., bottom surface) of the multilayer board 410 opposite to the first surface. The via connector 430 may be, for example, a plated via, a copper-filled via, some other type of via, or some combination thereof. The RF package 400 may also include passive components 402, 404, 406, 408 (e.g., capacitors, inductors, and / or resistors) stacked at the same or different heights on a second (e.g., top) surface of the multilayer board 410. The multilayer board 410 can be replaced by a flexible board 410. Alternatively, the multilayer board 410 can be replaced by a board 410 having at least one embedded member.

[0061] Figure 4B This is a schematic diagram of an RF package 450 that can be integrated into an electronic device 100 according to one embodiment. The RF package 450 may be a system package integrated into a front glass panel 232, a main logic board 233, a rear glass panel 234, a left side panel 236, or a right side panel 238. The RF package 450 may include a multilayer board 410 (e.g., a printed circuit board), an RF front-end die 416, at least one power control die 428, a transceiver die 420, an antenna array 412, and a pair of passive components 452, 454.

[0062] Transceiver die 420 and antenna array 412 together provide wireless communication functionality for RF package 450 and electronic device 100 integrated with RF package 450. Each transceiver die 420 can be connected to antenna array 412 using connector 424. Antenna array 412 can be connected to multilayer board 410 using via connector 430. Via connector 430 can carry signals between components at a first surface (e.g., top surface) of multilayer board 410 and components at a second surface (e.g., bottom surface) of multilayer board 410 opposite to the first surface. The first surface of multilayer board 410 can be connected to RF front-end die 416 and at least one power control die 428 using connectors 418 and 432, respectively. Multilayer board 410 can be replaced with flexible board 410. Alternatively, multilayer board 410 can be replaced with board 410 having at least one embedded component.

[0063] The RF package 450 may also include a mold 458 placed on at least a portion of the antenna array 412. Each transceiver die 420 may be integrated into the mold 458. The RF package 450 may also include passive components 426 (e.g., capacitors, inductors, and / or resistors) integrated into the mold 458 and stacked on the antenna array 412. Each passive component 426 may be positioned adjacent to a corresponding transceiver die 420. In one or more embodiments, at least one additional tuning component ( Figure 4B (Not shown in the image) are stacked onto antenna array 412.

[0064] The RF package 450 may also include passive elements 452 (e.g., capacitors, inductors, or resistors) and / or passive elements 454 (e.g., capacitors, inductors, or resistors) coupled to a first (e.g., bottom) surface of the multilayer board 410. The passive elements 452, 454 may be isolated from other components of the RF package 450 using a shielding layer 456, for example, to mitigate signal interference. The shielding layer 456 may at least partially surround the passive elements 452, 454. Each passive element 452, 454 may be... Figure 4AAn embodiment of at least one of passive components 402, 404, 406, and 408 in the RF package 400. By placing some or all of the passive components 402, 404, 406, and 408 on the bottom surface of the multilayer board 410, the thickness of the RF package 450 can be reduced relative to the thickness of the RF package 400.

[0065] Figure 5A This is a schematic diagram of an RF package 500 that can be integrated into an electronic device 100 according to one embodiment. The RF package 500 may be a system package integrated into a front glass panel 232, a main logic board 233, a rear glass panel 234, a left side panel 236, or a right side panel 238. The RF package 500 may include a front-end package 502, a multilayer board 520 (e.g., a printed circuit board), an antenna array 524, and a transceiver die 530. The front-end package 502 may include an RF front-end die 504 and a power control die 506 connected to an insulating film substrate 516 via a connector 514. The connector 514 may be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The insulating film substrate 516 may be implemented as, for example, an insulating multilayer material. Alternatively, the insulating film substrate 516 may be replaced with an interposer. The power control die 506 may provide power control for, for example, the RF front-end die 504. The power control die 506 may be stacked onto the insulating film substrate 516 via the connector 514. The power control die 506 may be an implementation of the power management circuitry 239 and / or the power management module 241. The front-end package 502 may also include at least one passive element 508 (e.g., a capacitor) stacked on an insulating film substrate 516. The RF package 500 may also include passive elements 510 (e.g., capacitors, inductors, or resistors) and / or passive elements 512 (e.g., capacitors, inductors, or resistors) disposed on the top side of the multilayer board 520.

[0066] Antenna array 524 and transceiver die 530 together provide wireless communication functionality for RF package 500 and electronic device 100 integrated with RF package 500. Each transceiver die 530 can be connected to a corresponding antenna array 524 using connector 526. Connector 526 can be, for example, a pad grid array connector, ball grid array connector, microbump, some other type of connector, or some combination thereof. Corresponding passive components 528 (e.g., capacitors) can be stacked on the corresponding antenna array 524. Each passive component 528 can be positioned adjacent to the corresponding transceiver die 530. Available space 534 may exist between every two adjacent antenna arrays 524. Each available space 534 can be used to integrate one or more additional components into RF package 500, for example, to provide improved performance.

[0067] A multilayer board 520 may be placed between the front-end package 502 and the antenna array 524. An insulating film substrate 516 may be connected to the multilayer board 520 using a connector 518. The connector 518 may be, for example, a solder ball connector, a microbump, some other type of connector, or a combination thereof. The corresponding antenna array 524 may be connected to the multilayer board 520 using a via connector 532. The via connector 532 may carry signals between the transceiver die 530 / antenna array 524 and one or more components of the front-end package 502. The via connector 532 may be, for example, a plated via, a copper-filled via, some other type of via, or a combination thereof. The multilayer board 520 may be replaced by a flexible board 520. Alternatively, the multilayer board 520 may be replaced by a board 520 having at least one embedded component. The RF package 500 may also include a die 522 (e.g., an antenna substrate), and each die 522 may be placed onto the corresponding antenna array 524. Each transceiver die 530 and each passive component 528 may be integrated into a corresponding die 522. When the die 522 is included in the RF package 500, a multilayer board 520 may be placed between the front-end package 502 and the die 522. Each die 522 (along with the integrated corresponding transceiver die 530) and the corresponding antenna array 524 may be protected from one or more adjacent components (e.g., to mitigate interference with wireless signals) using a shielding layer 536. The shielding layer 536 may be placed on the side edges of the die 522 and the corresponding antenna array 524.

[0068] Figure 5B This is a schematic diagram of an RF package 550 that can be integrated into an electronic device 100 according to one embodiment. The RF package 550 may be a system package integrated into a front glass panel 232, a main logic board 233, a rear glass panel 234, a left side panel 236, or a right side panel 238. The RF package 550 may include a front-end package 502, a multilayer board 520 (e.g., a printed circuit board), an antenna array 524, and a transceiver die 530. The front-end package 502 may include an RF front-end die 504 and a power control die 506 connected to an insulating film substrate 516 via a connector 514. The front-end package 502 may also include at least one passive element 508 (e.g., a capacitor) stacked on the insulating film substrate 516. The RF package 550 may also include passive elements 510 (e.g., capacitors, inductors, or resistors) and / or passive elements 512 (e.g., capacitors, inductors, or resistors) placed on the top side of the multilayer board 520.

[0069] Antenna array 524 and transceiver die 530 together provide wireless communication functionality for RF package 550 and electronic device 100 integrating RF package 550. Each transceiver die 530 can be connected to a corresponding antenna array 524 using connector 526. Corresponding passive components 528 (e.g., capacitors) can be stacked on the corresponding antenna array 524. Each passive component 528 can be positioned adjacent to the corresponding transceiver die 530. Available space 552 may exist between every two adjacent antenna arrays 524. Each available space 552 can be used to integrate one or more additional components into RF package 550, for example, to provide improved performance.

[0070] A multilayer board 520 may be placed between the front-end package 502 and the antenna array 524. An insulating film substrate 516 may be connected to the multilayer board 520 using a connector 518. A corresponding antenna array 524 may be connected to the multilayer board 520 using a via connector 532. The via connector 532 may carry signals between the transceiver die 530 / antenna array 524 and one or more components of the front-end package 502. The multilayer board 520 may be replaced by a flexible board 520. Alternatively, the multilayer board 520 may be replaced by a board 520 having at least one embedded component. The RF package 550 may also include a mold 522 (e.g., an antenna substrate), and each mold 522 may be placed on a corresponding antenna array 524. Each transceiver die 530 and each passive component 528 may be integrated into a corresponding mold 522. When a mold 522 is included in the RF package 550, the multilayer board 520 may be placed between the front-end package 502 and the mold 522.

[0071] A pair of transceiver dies 530 and a corresponding pair of antenna arrays 524 can be rotated by a defined angle about the vertical axis (e.g., the z-axis) of the RF package 550, for example, to improve the coverage of the transmitted / received wireless signals. By rotating the pair of antenna arrays 524 about the vertical axis of the RF package 550, the directionality and spatial coverage of the transmitted / received communication signals can be improved relative to the vertical axis of the RF package 550. Figure 5AThe RF package 500 is improved (e.g., omnidirectionality is enabled). When the die 522 is included in the RF package 550, a corresponding pair of dies 522 can also rotate together with a pair of transceiver dies 530 and a corresponding pair of antenna arrays 524. A corresponding substrate 554 can be placed between each rotating structure (e.g., the die 522 with the transceiver die 530 and the antenna array 524) and the multilayer board 520. Furthermore, the corresponding rotating antenna array 524 can be coupled to the front-end package 502 using a via connector 532, which is connected to the multilayer board 520 using a corresponding inner connector 556 and a corresponding outer connector 558. The inner connector 556 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. Similarly, the outer connector 558 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. Each rotating structure including the die 522, the transceiver die 530, and the antenna array 524 can be assembled first. Subsequently, each assembly structure can be mounted onto a corresponding inner connector 556 and outer connector 558 of a specific length (e.g., height), such that the assembly structure can be tilted at a defined angle relative to the vertical axis of the RF package 550. Each rotating structure can be securely mounted to the inner connector 556 and outer connector 558 using a corresponding through-hole connector 532. The substrate 554 can be an injection-molded part formed as needed and plated with, for example, conductive pillars. In one embodiment, the substrate 554 is realized as a three-dimensional printed plastic having metal inserts or connector-type components (e.g., inner connector 556 and outer connector 558). In another embodiment, the substrate 554 is realized as a stamped plastic using laser direct imaging to define vias (e.g., via 532) and conductors (e.g., inner connector 556 and outer connector 558).

[0072] Figure 6This is a schematic diagram of an RF package 600 that can be integrated into an electronic device 100 according to one embodiment. The RF package 600 may be a system package integrated into a front glass panel 232, a main logic board 233, a rear glass panel 234, a left side panel 236, or a right side panel 238. The RF package 600 may include a front-end package 602, a multilayer board 620 (e.g., a printed circuit board), an antenna array 624, and a transceiver die 630. The front-end package 602 may include an RF front-end die 604 and a power control die 606 connected to an insulating film substrate 616 via a connector 614. The connector 614 may be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The insulating film substrate 616 may be implemented as, for example, an insulating multilayer material. Alternatively, the insulating film substrate 616 may be replaced with an interposer. The power control die 606 may provide power control for, for example, the RF front-end die 604. The power control die 606 may be stacked onto the insulating film substrate 616 via the connector 614. The power control die 606 may be an implementation of the power management circuitry 239 and / or the power management module 241. The front-end package 602 may also include at least one passive element 608 (e.g., a capacitor) stacked on the insulating film substrate 616. The RF package 600 may also include passive elements 610 (e.g., capacitors, inductors, or resistors) and / or passive elements 612 (e.g., capacitors, inductors, or resistors) disposed on the top side of the multilayer board 620.

[0073] Antenna array 624 and transceiver die 630 together provide wireless communication functionality for RF package 600 and electronic device 100 integrated with RF package 600. Each transceiver die 630 can be connected to a corresponding antenna array 624 using connector 626. Connector 626 can be, for example, a pad grid array connector, ball grid array connector, microbump, some other type of connector, or some combination thereof. Corresponding passive components 628 (e.g., capacitors) can be stacked onto the corresponding antenna array 624. Each passive component 628 can be positioned adjacent to the corresponding transceiver die 630. Available space 634 may exist between some adjacent antenna arrays 624. Each available space 634 can be used to integrate one or more additional components into RF package 600, for example, to provide improved performance.

[0074] A multilayer board 620 may be placed between a front-end package 602 and some antenna arrays 624. An insulating film substrate 616 may be connected to the multilayer board 620 using a connector 618. The connector 618 may be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The respective antenna arrays 624 may be connected to the multilayer board 620 using a via connector 632. The via connector 632 may carry signals between the transceiver die 630 / antenna array 624 and one or more components of the front-end package 602. The via connector 632 may be, for example, a plated via, a copper-filled via, some other type of via, or some combination thereof. The multilayer board 620 may be replaced by a flexible board 620. Alternatively, the multilayer board 620 may be replaced by a board 620 having at least one embedded component. The RF package 600 may also include a die 622 (e.g., an antenna substrate), and each die 622 may be placed on a respective antenna array 624. Each transceiver die 630 and each passive component 628 can be integrated into a corresponding die 622. When the die 622 is included in the RF package 600, a multilayer board 620 can be placed between the front-end package 602 and some dies 622.

[0075] The RF package 600 may also include an adhesive 640 (e.g., a flexible adhesive or a rigid-flex adhesive) coupled to the multilayer board 620 using a pair of connectors 638. The connectors 638 may be, for example, solder ball connectors, microbumps, some other type of connector, or some combination thereof. Instead of being located at the top surface and / or bottom surface of the multilayer board 620, at least one connector 638 may be positioned between the adhesive 640 and a side surface of the multilayer board 620. At least one antenna array 642 and at least one transceiver die 648 (which may optionally be integrated into the die 636 along with passive components 646) may be connected to the multilayer board 620 using a via connector 650 connected to the adhesive 640. The via connector 650, together with the connectors 638, may carry signals between the transceiver die 648 / antenna array 642 and one or more components of the front-end package 602. The via connector 650 may be, for example, plated vias, copper-filled vias, some other type of via, or some combination thereof. Each structure, including mold 636, transceiver die 648, and antenna array 642, can be assembled first. Then, each assembled structure can be attached to adhesive 640, which is then attached to a pair of connectors 638. In this way, the wireless communication performance of the RF package 600 can be improved as wireless signals are transmitted / received in more directions.

[0076] While specific implementations and applications have been illustrated and described, it should be understood that the invention is not limited to the precise constructions and components disclosed herein, and various modifications, alterations, and variations that will be apparent to those skilled in the art to the arrangement, operation, and details of the methods and apparatus disclosed herein may be made without departing from the spirit and scope of this disclosure.

Claims

1. A radio frequency package, comprising: Multilayer board; An insulating film substrate, the insulating film substrate being placed on the multilayer board; A front-end package, the front-end package including a radio frequency (RF) front-end die and a power control die connected to the insulating film substrate via a first plurality of connectors; An antenna array, which is placed on the multilayer board and configured to provide wireless communication functionality; A mold, which is placed on the antenna array; Multiple via connectors, the multiple via connectors extending vertically through the mold and connecting the antenna array to the multilayer board; and Multiple transceiver dies, each of which is connected to the antenna array via a second plurality of connectors.

2. The RF package according to claim 1, wherein the plurality of transceiver dies and the plurality of connectors are integrated into the mold.

3. The radio frequency package of claim 1, wherein the insulating film substrate is connected to the multilayer board via a third plurality of connectors.

4. The radio frequency package of claim 1, wherein the front-end package further comprises at least one passive component, the at least one passive component being stacked on the insulating film substrate.

5. The RF package of claim 1, wherein the first plurality of connectors comprises a first plurality of solder ball connectors, and wherein the second plurality of connectors comprises a second plurality of solder ball connectors.

6. The radio frequency package of claim 1, wherein the insulating film substrate comprises an insulating multilayer material.

7. The RF package of claim 1, wherein a plurality of passive components are stacked on the antenna array, each of the plurality of passive components being positioned adjacent to a corresponding transceiver die among the plurality of transceiver dies.

8. A radio frequency package, comprising: Multilayer board; An insulating film substrate, the insulating film substrate being placed on the multilayer board; A front-end package, the front-end package including a radio frequency (RF) front-end die and a power control die connected to the insulating film substrate via a first plurality of connectors; Multiple antenna arrays, each of which is configured to provide wireless communication functionality; Multiple transceiver dies, each of the multiple transceiver dies being connected to a corresponding antenna array in the multiple antenna arrays via a second plurality of connectors; Multiple molds, wherein each of the multiple molds is placed on a corresponding antenna array of the multiple antenna arrays, and wherein each of the multiple transceiver dies is placed in a corresponding mold of the multiple molds; and Multiple via connectors extend vertically through the multiple molds and connect the multiple antenna arrays to the multilayer board.

9. The RF package of claim 8, wherein each of the plurality of transceiver dies is integrated into a corresponding mold in the plurality of molds.

10. The radio frequency package of claim 8, wherein the insulating film substrate is connected to the multilayer board via a third plurality of connectors.

11. The radio frequency package of claim 8, wherein the shielding layer is placed on the side edges of the respective mold and the respective antenna array.

12. The radio frequency package of claim 8, wherein there is a space between every two adjacent antenna arrays in the plurality of antenna arrays.

13. The RF package of claim 8, wherein a pair of transceiver dies and a corresponding pair of antenna arrays rotate about the vertical axis of the RF package.

14. The radio frequency package according to claim 8, The multilayer board is connected to the insulating film substrate via a third or more connectors; and It also includes an adhesive coupled to the multilayer board via a pair of connectors, and at least one of the plurality of antenna arrays and at least one of the plurality of transceiver dies are connected to the multilayer board via a via connector connected to the adhesive.

15. The RF package of claim 8 further includes a plurality of passive components, wherein each of the plurality of passive components is positioned between a corresponding transceiver die in the plurality of transceiver dies and a corresponding via connector in the plurality of via connectors.

16. The radio frequency package according to claim 8, further comprising: A first connector, the first connector having a first height, wherein the first through-hole connector of the plurality of through-hole connectors is connected to the multilayer board via the first connector; and The second connector includes a second height lower than the first height, wherein the second via connector of the plurality of via connectors is connected to the multilayer board via the second connector.

17. A radio frequency package, comprising: An antenna array configured to provide wireless communication functionality; A stepped mold, which is placed on the antenna array; A front-end package, the front-end package including a radio frequency (RF) front-end die and a power control die placed in the stepped mold; and Multiple transceiver dies, each of the multiple transceiver dies being connected to the antenna array via a first plurality of connectors.

18. The radio frequency package according to claim 17, Each of the plurality of transceiver dies is integrated into the stepped mold.

19. The RF package of claim 17 further includes a multilayer board, wherein the bottom surface of the multilayer board is connected to the RF front-end die and the power control die via a second plurality of connectors, and wherein the antenna array is connected to the multilayer board via a plurality of via connectors.

20. The radio frequency package of claim 19, further comprising at least one passive element placed on the bottom surface of the multilayer board, the at least one passive element being at least partially surrounded by a shielding layer.

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